KR101316287B1 - Process and apparatus for stacked camera - Google Patents

Abstract

The present invention relates to a laminated camera device and a manufacturing method, which is to complete the camera device by fabricating, stacking and cutting optical elements and sensor packages on a glass plate in the form of a wafer. The cost reduction and manufacturing time are reduced, and each lens is aligned by the high precision optical axis alignment implemented in the semiconductor process, thereby improving the performance of the camera, and making it consist of only minimal mechanical components. It is a very useful invention that enables the miniaturization of a camera.

Wafer, Diffraction Optical Element, Thin Film

Description

Stacked camera device and manufacturing method {Process and apparatus for stacked camera}

1 schematically shows the structure of a general camera device,

Figure 2 schematically shows a stacked camera device according to the present invention,

3 illustrates a first wafer and a first block of the stacked camera device according to the present invention.

4 illustrates a second wafer and a second block of the stacked camera device according to the present invention.

5 illustrates a third wafer and a third block of the stacked camera device according to the present invention.

6 illustrates a fourth wafer and a fourth block of the stacked camera device according to the present invention.

7 schematically illustrates a manufacturing process of the stacked camera device according to the present invention.

[Description of Drawings]

10: first wafer 11: first block

20: second wafer 21: second block

30: third wafer 31: third block

33: infrared cut film 40: fourth wafer

41: fourth block 42: image sensor

50: first aperture plate 51: first aperture

60: second aperture plate 61: second aperture

The present invention relates to a stacked camera device and a manufacturing method, and more particularly, to a miniature stacked camera device and a manufacturing method which can be applied to a portable device which is completed by manufacturing, stacking and cutting an optical element and a sensor package on a glass plate in a wafer form. It is to provide.

Recently, various functions have been added to mobile phones and portable electronic devices. Among them, camera functions, video recording and playback functions are essential elements, and demand is rapidly increasing. In particular, the demand for electronic devices with high capacity and high resolution image quality has been continuously demanded, and has been developed into Mega Pixels through CIF and VGA. There is a need for a compact camera device that can be miniaturized to be faithfully performed.

However, the camera device used in the prior art, as shown in Figure 1, was configured in the form of assembling a plurality of lenses in the barrel of the camera, the lens is both spherical or both sides, or includes an aspherical surface on one side or both sides. It was in the form, and was completed by the method of manufacturing and assembling each lens separately.

Such a camera device has a problem that many parts are required, and the configuration is complicated, so that miniaturization is not easy, and the manufacturing and assembly process is complicated, the cost is high, and manufacturing time is required.

Therefore, the present invention was created to solve the above problems, in the laminated camera device and manufacturing method, by applying a high-precision assembly process implemented in a semiconductor process, an optical element and a sensor package on a glass plate in the form of a wafer It is to provide a laminated camera device and a manufacturing method capable of mass production as well as simplified and miniaturized by manufacturing and cutting by laminating and then cutting, the purpose is to.

In the stacked camera device for achieving the above object, a first block of light transmitting material having a spherical surface having a positive refractive power is formed on an upper surface thereof, and a first diffractive optical element coupled to an aspherical surface on the spherical surface, and the first block. A second block of light transmission material aligned with the lower part of the block, the spherical surface having positive refractive power is formed on the lower surface, and the aspherical diffraction optical element coupled to the spherical surface, and between the first block and the second block. It is located, the first block and the second block is bonded, the first aperture with a light passing hole formed in the center, the light blocking material is aligned on the lower portion of the second block, the infrared cut film is coated on the upper surface A second aperture positioned between the third block, the second block, and the third block, the second block is joined to the second block and the third block, and has a light passage hole formed at the center thereof; Aligned and bonded to the third block Characterized in that comprising: a fourth block of the image sensor is mounted.

Preferably, at least one of the first block or the second block is coupled to a diffractive optical element having different radii of curvature and aspheric coefficients with respect to the vertical direction and the horizontal direction.

In addition, according to the present invention, there is provided a method of manufacturing a stacked camera device, wherein a first curved surface having a positive refractive power is formed on an upper surface thereof, and a first block having an aspherical diffractive optical element coupled thereto is arranged. A second wafer of light transmitting material having a wafer and a curved surface having positive refractive power formed on the lower surface, a second block on which the aspherical diffractive optical element is coupled to the curved surface, and an infrared ray blocking film coated on the upper surface A first wafer of light transmissive material in which the blocks are arranged, a fourth wafer in which the block on which the image sensor is mounted, a first aperture plate in which a first aperture is formed in the center of the light passing hole, and a center A processing step of processing the second stopper plate on which the second stopper with the light passing hole is arranged; Inserting and aligning a first aperture plate between the first wafer and the second wafer, aligning by inserting a second aperture plate between the second wafer and the third wafer, and placing a fourth aperture below the third wafer A bonding step of aligning and bonding the wafers; A cutting step of cutting the bonded wafer; It is characterized in that it is prepared to include.

Preferably, the processing of the first wafer or the second wafer is characterized in that it comprises a step of forming a spherical surface by a method such as etching, injection or ultraviolet embossing on a wafer-shaped glass disc having a predetermined thickness.

Hereinafter, exemplary embodiments of a stacked camera device and a manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 shows an embodiment of the stacked camera device according to the present invention, wherein the first block 11 and the second block 21 on which the aspherical diffractive optical elements 13 and 23 are mounted, and the IR coating ( 32, a fourth block 41 on which the image sensor 42 is mounted, a first aperture 51 and a second aperture 61 are included.

The first block 11 and the second block 21 are made of a material such as glass having high light transmittance, and a spherical surface 12 having positive refractive power is formed on an upper surface of the first block 11. The spherical surface 12 has an aspherical diffraction optical element 13 coupled thereto, and the second block 21 has the same structure as the first block 11 and has a positive refractive power on the lower surface 22. Is formed, and an aspherical diffraction optical element 23 is coupled to the spherical surface. The diffraction optical elements 13 and 23 have different radii of curvature and aspheric coefficients in the vertical and horizontal directions to solve the problem that light is vertically emitted when the light is incident at a certain viewing angle and consumes light. It is configured to have.

On the other hand, between the first block 11 and the second block 21, a first stop 51 having a light passing hole 52 in the center is inserted. The first aperture 51 may be replaced by a thin film piece of a material having light absorption. The light passing hole 52 is positioned on the same axis as the diffractive optical elements 13 and 23 coupled to the first block 11 and the second block 21, and the light passing through the first aperture 51 is performed. Since light passes only through the hole 52, the amount of incident light can be adjusted by adjusting the size of the light passing hole 52.

In addition, the light passing through the light passing hole 52 and the second block 21 of the first block 11, the first thin film piece 51 proceeds to the third block 31, and the third block 31. An infrared blocking film 32 is coated on the upper surface of 31 so that light having a wavelength in the infrared region is blocked, and only light having a wavelength in the visible region is transmitted, so that light suitable for imaging can be obtained. .

In addition, a second stop 61 having a light passing hole 62 in the center may be inserted between the second block 21 and the third block 31. The second stop 16 may be replaced with a thin film piece of light absorbing material, and the second stop 61 blocks light that spreads to the surroundings from the light passing through the second block 31. It also serves as a field stop to prevent the flow into the image sensor 42.

By passing through the light passage hole 62 and the third block 31 of the second aperture 61, the incident light is much improved in the imaging characteristics, the image sensor 42 mounted on the fourth block 41 It is possible to make a clear image on the imaging surface of) and to realize a clear high quality screen desired by the user.

On the other hand, Figure 7 shows an embodiment of the manufacturing method of the stacked camera device as described above, and comprises a processing step, assembly step, cutting step of the wafer and thin film.

First, the processing steps of the wafer and the thin film will be described.

The processing of the first wafer 10 and the second wafer 20 is performed in a processing method such as etching, injection or UV embossing on a wafer-shaped glass disc having a predetermined thickness, as shown in FIGS. 3 and 4. Aspheric diffractive optical elements having different curvature radii and aspherical coefficients in the vertical and horizontal directions on the spherical surfaces 12 and 22 after forming an array of spherical surfaces 12 and 22 having positive refractive power It is achieved by the method of combining (13, 23).

In addition, processing of the third wafer 30 is achieved by a method of applying the infrared ray blocking film 32 to the upper surface of the wafer-shaped glass disc having a predetermined thickness, as shown in FIG. As shown in FIG. 6, the processing of the wafer 40 includes assembling the image sensor 42 on the wafer, supplying driving power, connecting control signals, and wiring for transmitting the image signal output from the sensor. It is achieved by having.

On the other hand, by arranging the diaphragm on the disc so that the light passing holes 52 and 62 correspond to the diffractive optical elements 13 and 23 of the aspherical surface coupled to the first wafer 10 and the second wafer 20, The first aperture plate 50 and the second aperture plate 60 are processed.

Next, the assembly step and the cutting step of the wafer and the thin film will be described.

The first aperture plate 50 is inserted between the first wafer 10 and the second wafer 20, and the second aperture plate 60 is the second wafer 20 and the third wafer 30. The fourth wafer 40 is attached to the lower portion of the third wafer 30, the first aperture plate 50 and the second aperture plate 60 is inserted into the first wafer (10). ) And the wafer and the diaphragm plate are assembled by aligning and bonding the diffraction optical elements 13 and 23 coupled to the second wafer 20 on the same axis so as to assemble the wafer and the diaphragm plate. Assembly of the wafer takes place.

The cutting step is a step of cutting the bonded wafer along a line constituting the block with a cutter, whereby a plurality of completed camera devices can be obtained.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. , Alteration, substitution, addition, or the like.

Laminated camera apparatus and manufacturing method according to the present invention for achieving the above object is to complete the camera device by cutting the optical device and the sensor package on the glass plate in the form of a wafer and then laminated, cutting several cameras at the same time It can be processed to reduce the cost and manufacturing time by mass production, and to improve the performance of the camera by aligning each lens by high-precision optical axis alignment implemented in the semiconductor process. It is a very useful invention to enable the miniaturization of the camera to be composed only of parts.

Claims (15)

A first block made of a light transmitting material having a spherical surface having positive refractive power formed thereon and having an aspherical diffractive optical element coupled to the spherical surface; A second block of light transmission material aligned with a lower portion of the first block, a spherical surface having a positive refractive power formed on a lower surface thereof, and having a spherical diffraction optical element coupled to the spherical surface; A first aperture positioned between the first block and the second block and joined to the first block and the second block and having a light passing hole in a center thereof; A third block of light transmitting material aligned with a lower portion of the second block and coated with an infrared ray blocking film on an upper surface thereof; And a fourth block aligned with a lower portion of the third block and bonded to the third block, and equipped with an image sensor. The method of claim 1, The stacked camera device of claim 2, further comprising a second aperture positioned between the second block and the third block, the second block being joined to the second block and the third block, the light aperture being formed at the center thereof. A first block made of a light transmitting material having a spherical surface having positive refractive power formed thereon and having an aspherical diffractive optical element coupled to the spherical surface; A second block of light transmission material aligned with a lower portion of the first block, a spherical surface having a positive refractive power formed on a lower surface thereof, and having a spherical diffraction optical element coupled to the spherical surface; A first thin film piece of light absorbing material positioned between the first block and the second block and bonded to the first block and the second block, the light passing hole being formed in the center; A third block of light transmitting material aligned with a lower portion of the second block and coated with an infrared ray blocking film on an upper surface thereof; And a fourth block aligned with a lower portion of the third block and bonded to the third block, and equipped with an image sensor. The method of claim 3, And a second thin film piece of light absorbing material, which is disposed between the second block and the third block, is bonded to the second block and the third block and has a light passing hole in the center thereof. 5. The stacked camera device according to any one of claims 1 to 4, wherein at least one of the first block or the second block is combined with a diffractive optical element having different radii of curvature and aspheric coefficients with respect to the vertical direction and the horizontal direction. A first wafer made of a light transmitting material having a spherical surface having a positive refractive power formed on an upper surface thereof, and a first block having an aspherical diffractive optical element coupled to the spherical surface; A second wafer of light transmitting material having a spherical surface having a positive refractive power formed on a lower surface thereof, and a second block having an aspherical diffraction optical element coupled to the spherical surface; A third wafer made of a light transmitting material having a third block coated with an infrared ray blocking film on an upper surface thereof, A fourth wafer on which the fourth block on which the image sensor is mounted is arranged; A processing step of processing the first stopper plate on which the first stopper with the light passage hole formed in the center thereof is arranged; Insert and align the first aperture plate between the first wafer and the second wafer, arrange the third wafer below the second wafer, and align the fourth wafer below the third wafer. Bonding step of arranging and aligning after arranging; A cutting step of cutting the bonded wafer; Method of manufacturing a stacked camera device including. The method according to claim 6, The processing step may further include a process of processing the second stopper plate is arranged the second stopper is formed in the light passing hole in the center, The bonding step further comprises the step of aligning by inserting a second aperture plate between the second wafer and the third wafer. A first wafer made of a light transmitting material having a spherical surface having a positive refractive power formed on an upper surface thereof, and a first block having an aspherical diffractive optical element coupled to the spherical surface; A second wafer of light transmitting material having a spherical surface having a positive refractive power formed on a lower surface thereof, and a second block having an aspherical diffraction optical element coupled to the spherical surface; A third wafer made of a light transmitting material having a third block coated with an infrared ray blocking film on an upper surface thereof, A fourth wafer on which the fourth block on which the image sensor is mounted is arranged; Processing a first thin film plate on which a first thin film piece of light absorbing material having a light passing hole is formed in a center thereof; Insert and align the first thin film plate between the first wafer and the second wafer, arrange the third wafer below the second wafer, and align the fourth wafer below the third wafer. Bonding step of arranging and aligning after arranging; A cutting step of cutting the bonded wafer; Method of manufacturing a stacked camera device including. 9. The method of claim 8, The processing step may further include a process of processing a second thin film plate on which a second thin film piece of light absorbing material having a light passing hole formed at the center thereof is arranged, The bonding step further comprises the step of aligning by inserting a second thin film plate between the second wafer and the third wafer. The method according to any one of claims 6 to 9, wherein the processing of the first wafer or the second wafer is performed by a method such as etching, injection or ultraviolet embossing on a wafer-shaped glass disc having a predetermined thickness. Method of manufacturing a stacked camera device comprising a process. A first block of light transmitting material having positive refractive power on the upper surface and having aspherical diffraction optical irradiation; A second block of light transmitting material aligned with a lower portion of the first block and having a positive refractive power at a lower surface thereof and an aspherical surface; A first aperture positioned between the first block and the second block and bonded to the first block and the second block, the first aperture having a light passing hole in a center thereof; A third block of light transmitting material aligned with a lower portion of the second block and blocking infrared rays; And a fourth block aligned with a lower portion of the third block and bonded to the third block, and equipped with an image sensor. A first block of light transmitting material having a positive refractive power on the upper surface, A second block of light transmitting material aligned with a lower portion of the first block and having a positive refractive power at a lower surface thereof and having a diffractive optical element; A first thin film piece disposed between the first block and the second block and bonded to the first block and the second block, the first thin film piece having a light passing hole in a center thereof; A third block of light transmitting material aligned with a lower portion of the second block and blocking infrared rays; And a fourth block aligned with a lower portion of the third block and bonded to the third block, and equipped with an image sensor. A first wafer made of a light transmitting material having a positive refractive power on the upper surface and having a first block having a diffractive optical element arranged therein; A second wafer of light transmitting material having a refractive power on the lower surface and having a second block having a diffractive optical element arranged therein; A third wafer made of a light transmitting material having blocks arranged to block infrared rays, A fourth wafer in which blocks on which an image sensor is mounted are arranged; A processing step of processing the first aperture plate having a light passing hole formed in the center thereof; Insert and align the first aperture plate between the first wafer and the second wafer, arrange the third wafer below the second wafer, and align the fourth wafer below the third wafer. Bonding step of arranging and aligning after arranging; And a cutting step of cutting the bonded wafer. A first block of light transmitting material having a positive refractive power and having a diffractive optical element, A second block of light transmitting material aligned with a lower portion of the first block and having refractive power, A first thin film piece disposed between the first block and the second block and joined to the first block and the second block and having a light passing hole in a center thereof; A third block of light transmitting material aligned with a lower portion of the second block and blocking infrared rays; And a fourth block aligned with a lower portion of the third block and bonded to the third block, and equipped with an image sensor. A first block of light transmitting material having positive refractive power, A second block of light transmitting material aligned with a lower portion of the first block and having a refractive power and having a diffractive optical element; A first thin film piece disposed between the first block and the second block and joined to the first block and the second block and having a light passing hole in a center thereof; A third block of light transmitting material aligned with a lower portion of the second block and blocking infrared rays; And a fourth block aligned with a lower portion of the third block and bonded to the third block, and equipped with an image sensor.

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