KR101302496B1 - Multi broadband combiner and DC bypass structure applied therein - Google Patents

Abstract

The present invention discloses a multiple broadband combiner and a DC bypass structure applied thereto. According to an aspect of the present invention, there is provided a multiple broadband combiner comprising: a housing having an inner space; A plurality of band pass filter units installed in the longitudinal direction in the inner space of the housing; A low pass filter unit longitudinally adjacent to the band pass filter unit and installed in a longitudinal direction in an inner space of the housing; A cover coupled to the upper portion of the housing; And a dielectric substrate positioned in an inner space of the housing covered with the cover and formed to cross the input ends of the band pass filter part and the low pass filter part, and an input end of the band pass filter part and the low pass filter part under the dielectric substrate; It is characterized in that it comprises a DC bypass circuit portion connected to the bypass circuit for bypassing the DC power or low frequency signal applied to the input terminal of the band pass filter unit to the input terminal of the low pass filter unit.

Description

Multi broadband combiner and DC bypass structure applied therein}

The present invention relates to a multi-bandwidth combiner and a DC bypass structure applied thereto. More particularly, the present invention relates to a multi-bandwidth combiner having an extended bandwidth used for a base station of a mobile communication system and a DC bypass structure applied thereto. It is about.

In the current mobile communication environment, the mixing of mobile communication service frequency bands is increasing due to the introduction of the next generation 4G Long Term Evolution (LTE) system as well as the commercialization of 2G and 3G. Under these circumstances, base station sharing technology (Co-Site), which can operate several communication systems from a single base station, has been attracting attention for base station operators to reduce operating and facility investment costs.

A multi-band combiner, which is one of the core elements of the base station common technology, performs a function of combining a plurality of communication signals amplified in the output amplifiers for transmission to a transmission antenna. It has the function of separating the signal of a specific band or merging several signals by configuring (Cavity) in multiple stages according to frequency characteristics. A commonly used resonant cavity filter type is a band pass filter, which separates or merges specific 2G and 3G or 4G system signals. Therefore, the combiner can simultaneously support service frequency signals of several communication systems, thereby enabling the sharing of a communication cable (RF Feeder Cable) into one. This can reduce the length of the communication cable used, has the advantage of reducing the installation cost of the communication cable in the base station tower.

In addition to the RF signal, the communication cable is installed in a base station tower to provide stable DC power for active equipment such as a low noise amplifier (LNA) for amplifying a weak reception signal or a remote electrical tilting (RET) system for improving antenna beam coverage. And a low frequency control signal. Accordingly, the combiner also supports a function of transmitting a DC power supply and a low frequency control signal by constructing a DC bypass structure capable of transmitting DC power simultaneously with separation and merge transmission of RF signals.

However, as mentioned above, the service frequency range continues to increase in the presence of multiple communication systems such as 2G, 3G, and 4G. However, the conventional combiner technology mainly composed of a band pass filter type resonant cavity has a frequency. There is a limit to bandwidth expansion. In addition, since the size of the combiner increases as the frequency is expanded, a technique for minimizing the size is required.

In particular, as the 4G LTE system is recently introduced, it is necessary to expand the frequency band. Conventional combiners used in conventional 2G and 3G systems are known to extend to a 25% of the center frequency of the filter, which can be extended by a band pass filter type resonant filter.

By the way, the combiner using the conventional band pass filter was easy to expand the bandwidth in the high frequency band, but in the case of the low frequency band, the band pass filter can be extended to a bandwidth suitable for the 4G LTE system because the width of the band pass filter is smaller than the required bandwidth extension. There was a limit. Therefore, in order to support the service frequency bandwidth of the low frequency band, it is necessary to develop a new structure combiner, and even if the conventional band pass filter is extended, the resonator length is required by 1/4 of the frequency wavelength due to the filter resonance principle. The problem is that the height of the combiner increases by 20%.

In addition, a DC bypass structure is essential for the combiner. In the conventional combiner structure, an inner cover including a tuning bolt is disposed on a housing in which a band pass filter is installed, and a dielectric substrate is installed on the inner cover. The DC bypass circuit was constructed. The DC bypass circuit is a pass line to an output port and a bypass circuit composed of a lumped element inductor and a capacitor for the purpose of bypassing a signal of 3 MHz or less flowing into an input port or DC power to an output port. It is composed. In addition, on the dielectric substrate, in order to enhance the electrical shielding characteristics of the lumped constant elements, a shielding cover is additionally constructed and a structure covering the outer cover to protect the appearance. However, such a conventional combiner structure requires a multi-stage DC bypass structure, which causes a problem of increasing the size and weight of the combiner.

As a technical document suggesting the configuration of such a conventional broadband combiner, there is US Patent Publication No. 2010-0278197, US Patent No. 7,388,458 and the like.

US Patent Publication No. 2010-0278197 discloses a dual band combiner of a band pass filter combination. This configuration is to construct a space to form a DC bypass circuit inside the housing where the band pass filter is installed, and to construct a DC pass line on the top of the inner cover to bypass the DC power to the output port. . However, in the case of U.S. Patent Publication No. 2010-0278197, although the DC bypass circuit was configured in the combiner housing, it was possible to realize the combiner size reduction and shielding characteristics compared with the prior art, but there is a problem in that a DC pass line should be additionally constructed. .

In addition, in US Patent No. 7,388,458, there is an advantage in manufacturing and mass production by simply implementing a DC bypass circuit as the same low pass filter instead of a lumped constant element, which also requires the construction of an additional DC pass line. There is this.

The present invention was devised to solve the problems of the prior art as described above, and comprises a combiner with a combination of a low pass filter and a plurality of band pass filters to enable a wider frequency width in a low frequency band, and a low pass. It is an object of the present invention to provide a multi-bandwidth combiner that can be structurally simple and can be reduced in size by using a filter unit as a DC bypass circuit and a DC bypass structure applied thereto.

According to an aspect of the present invention, there is provided a multiple broadband combiner comprising: a housing having an inner space; A plurality of band pass filter units installed in the longitudinal direction in the inner space of the housing; A low pass filter unit installed along the band pass filter unit in a longitudinal direction in an inner space of the housing; A cover coupled to the upper portion of the housing; And a dielectric substrate positioned in an inner space of the housing covered with the cover and formed to cross the input ends of the band pass filter part and the low pass filter part, and an input end of the band pass filter part and the low pass filter part under the dielectric substrate; It is characterized in that it comprises a DC bypass circuit portion connected to the bypass circuit for bypassing the DC power or low frequency signal applied to the input terminal of the band pass filter unit to the input terminal of the low pass filter unit.

Preferably, the bypass circuit of the DC bypass circuit unit may include a first bypass circuit connected to an input terminal of the band pass filter unit and formed of an inductor and a capacitor, and a second bypass formed of an inductor connected to an input terminal of the low pass filter unit. The first and second bypass circuits may be connected to the DC pass lines formed on the dielectric substrate and electrically connected to each other through via holes formed in the dielectric substrate.

Preferably, the low pass filter part is used as a transmission path of a DC power or low frequency signal bypassed from the input terminal of the band pass filter part through the DC bypass circuit part.

Preferably, the band pass filter part and the low pass filter part have an output terminal connected in common.

Preferably, at least two input ports connected to a band pass filter part and a low pass filter part are provided at one side of the housing, and an output port commonly connected to the band pass filter part and the low pass filter part is provided at the other side. It is provided.

Preferably, the housing has a partition wall formed between the band pass filter part and the low pass filter part in an inner space.

Preferably, the frequency band through the low pass filter is in the range of 450 ~ 960MHz, the frequency band through the band pass filter is in the range of 1710 ~ 2170MHz.

Preferably, the band pass filter unit is provided in at least one group having different output stages.

According to another aspect of the invention, a dielectric substrate formed to cross the input end of the band pass filter portion and the low pass filter portion respectively connected to at least two input ports; And a bypass circuit connected to the input ends of the band pass filter part and the low pass filter part under the dielectric substrate to bypass a DC power or low frequency signal applied to the input end of the band pass filter part to the input end of the low pass filter part. A DC bypass structure of a multiple broadband combiner is provided.

According to the present invention, the combination of the low pass filter portion and the plurality of band pass filter portions to enable the frequency width expansion in the low frequency band, and by using the low pass filter portion as a DC bypass circuit, the DC structure with a simple structure Bypass circuits can be built, and combiner size reduction and shielding characteristics can be improved. In addition, it is possible to secure the electrical external interference and waterproof characteristics of the DC bypass without additional configuration. In addition, the size and weight of the combiner can be reduced, thereby reducing product size and manufacturing cost.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate preferred embodiments of the invention and, together with the description, And shall not be interpreted.
1 is a perspective view schematically showing the configuration of a multiple broadband combiner according to the present invention.
2 is a plan view of Fig.
FIG. 3 is a cross-sectional view showing the configuration of the DC bypass circuit section in the section II-II 'of FIG. 2.
FIG. 4 is a cross-sectional view showing the configuration of the DC bypass circuit section in the section III-III ′ of FIG. 2.
5 is a circuit diagram showing the configuration of a multiple broadband combiner according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately It should be interpreted in accordance with the meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined. Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.

1 is a perspective view schematically showing the configuration of a multi-bandwidth combiner according to the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a cross-sectional view taken along the line II-II ′ of FIG. 2. 4 is a cross-sectional view showing the configuration of the DC bypass circuit portion in the cross-section of the III-III 'line of Figure 2, Figure 5 is a circuit diagram showing the configuration of a multi-bandwidth combiner according to the present invention. .

1 and 2, the multi-bandwidth combiner 100 according to the present invention includes a housing 110 having an inner space and a plurality of bands installed in a lengthwise direction in an inner space of the housing 110. A filter unit 120, a low pass filter unit 130 installed in a longitudinal direction in the inner space of the housing 110 adjacent to the band pass filter unit 120 in parallel to each other, and a cover coupled to the upper portion of the housing (not shown). DC bypass circuit unit located in the inner space of the housing 110 covered with the cover and bypassing the DC power or low frequency signal applied to the band pass filter unit 120 to the low pass filter unit 130. 140.

The housing 110 is provided with the band pass filter 120 and the low pass filter 130 in the inner space, and serves to protect them and shield electromagnetic waves. The housing 110 is made of a metallic material such as aluminum, brass or iron, and may be used by plating a metal having excellent conductivity such as aluminum or silver on the surface thereof.

In addition, one side of the housing 110 is provided with input ports 111a and 111b respectively connected to the band pass filter 120 and the low pass filter 130. 1 and 2, an input port 111a connected to the band pass filter unit 120 and an input port 111b connected to the low pass filter unit 130 are illustrated as two in number. However, the present invention is not limited thereto, and when the band pass filter 120 is provided in one or more groups, the number of the input ports 111a and 111b corresponds to an increased group of the band pass filter 120. The number can be increased. The other side of the housing 110 is provided with an output port 112 that is commonly connected to an output terminal of the band pass filter 120 and the low pass filter 130.

In addition, the housing 110 is formed with a partition wall 113 that intersects between the band pass filter 120 and the low pass filter 130 installed in the inner space. The partition wall 113 blocks the band pass filter 120 and the low pass filter 130 to prevent interference between the two filters 120 and 130.

In addition, a cover (not shown) is coupled to an upper portion of the housing 110, and a tuning bolt (not shown) for tuning the band pass filter unit 120 may be coupled to the cover.

The band pass filter 120 is a filter that accurately passes only signals of a desired frequency band and has a structure in which a plurality of cavity type resonators 121 are arranged in a line. The resonator 121 may be formed of a metal material or a dielectric material, and the resonator 121 of the metal or dielectric material may be selectively used according to the progress mode of the RF signal. In addition, the resonators 121 of the band pass filter unit 120 may be integrally manufactured with the housing 110 or may be coupled to the bottom surface of the housing 110 by screwing after the housing 110 is manufactured. . Meanwhile, although the number of resonators 121 of the band pass filter unit 120 is illustrated in FIG. 1 and FIG. 2, the present invention is not limited thereto, and the number and diameter of the resonators 121 are desired frequencies. Various changes can be made depending on the response characteristics.

In addition, the band pass filter unit 120 has a frequency band in the range of 1710 to 2170 MHz, and supports signal processing of the corresponding frequency band. 1 and 2, the band pass filter 120 is illustrated as being provided as a single group, but the present invention is not limited thereto, and the output terminals may be provided as at least one group different from each other. For example, the band pass filter 120 may be divided into a group supporting a frequency band of 1710 to 1880 MHz and a group supporting a frequency band of 1920 to 2170 MHz.

The low pass filter 130 is a filter for passing only a low frequency signal below a specific frequency, and the narrow portion 131 serving as an inductor on the coaxial line and the wide portion 132 serving as a capacitor are alternately repeated. Has a formed structure. However, the present invention is not limited by the shape of the low pass filter unit 130.

Meanwhile, in the present invention, the low pass filter 130 is applied to signal processing in the low frequency band in order to compensate for the limitation of the frequency expansion in the low frequency band because the conventional multi-bandwidth combiner is composed of only the band pass filter. Accordingly, a wideband characteristic capable of supporting all low frequency bands of 960 MHz or less can be realized. That is, the low pass filter 130 has a frequency band in the range of 450 to 960 MHz, and can support signal processing of the corresponding frequency band.

In addition, at the output terminal of the low pass filter unit 130, a resonance matching unit for varying the capacitance of the low pass filter unit 130 to perform impedance matching between the band pass filter unit 120 and the low pass filter unit 130 ( May be additionally provided.

The DC bypass circuit unit 140 is located at an input terminal of the band pass filter unit 120 and the low pass filter unit 130 to output a DC power or low frequency signal applied to the band pass filter unit 120 to the low pass filter unit. It bypasses the input terminal 130.

The DC bypass circuit unit 140 is positioned in the inner space of the housing 110 covered with the cover and is formed to cross the input terminals of the band pass filter unit 120 and the low pass filter unit 130. And a DC power or low frequency signal connected to an input terminal of the band pass filter unit 120 and the low pass filter unit 130 below the dielectric substrate 141 and applied to the input terminal of the band pass filter unit 120. By bypass circuits 145a and 145b for bypassing the input to the low pass filter 130.

As shown in FIG. 3, the bypass circuits 145a and 145b of the DC bypass circuit unit 140 are connected to the input terminal of the band pass filter unit 120 and are connected to the inductor L and the capacitor C elements. As shown in FIG. 4, the first bypass circuit 145a and the second bypass circuit 145b connected to the input terminal of the low pass filter unit 130 and made of an inductor (L) element are divided. Is done. In addition, the first and second bypass circuits 145a and 145b are connected to the DC pass line 143 formed on the dielectric substrate 141 through the via holes 142 formed in the dielectric substrate 141. Is connected. 5 is a circuit diagram illustrating a circuit configuration of the multiple broadband combiner 100 to which the DC bypass circuit unit 140 according to the present invention is applied.

In detail, the DC bypass circuit unit 140 may include a first bypass circuit 145a connected to an input terminal of the band pass filter unit 120 and applied to an input port 111a connected to the band pass filter unit 120. The DC power or low frequency signal is separated and transmitted to the DC pass line 143 on the upper surface of the dielectric substrate 141 through the via hole 142, and the second bypass circuit 145b bypasses the first bypass circuit 145a. The passed DC power or low frequency signal is applied to the input of the low pass filter 130. Then, the low pass filter unit 130 merges the input signal applied to the input port 111b connected thereto and the DC power or low frequency signal bypassed through the DC bypass circuit unit 140 to the output port 112 together. Will be sent.

In the present invention, through the configuration of the DC bypass circuit unit 140 can simplify the DC bypass structure that was separately installed and operated in the conventional combiner, there is an advantage that does not need to build a DC pass line through the cover Have In addition, since all of the DC bypass circuit unit 140 is located inside the cover, the electrical shielding characteristics are excellent as well as the volume can be reduced compared to the prior art even without a separate shielding means.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood that various modifications and changes may be made without departing from the scope of the appended claims.

100: multiple broadband combiners
110 housing 120 band pass filter
130: low pass filter unit 140: DC bypass circuit unit

Claims (11)

A housing provided with an inner space;
A plurality of band pass filter units installed in the longitudinal direction in the inner space of the housing;
A low pass filter unit longitudinally adjacent to the band pass filter unit and installed in a longitudinal direction in an inner space of the housing;
A cover coupled to the upper portion of the housing; And
A dielectric substrate positioned in an inner space of the housing covered by the cover and formed to cross the input ends of the band pass filter part and the low pass filter part, and connected to an input end of the band pass filter part and the low pass filter part under the dielectric substrate; And a DC bypass circuit portion provided with a bypass circuit for bypassing a DC power or low frequency signal applied to an input end of the band pass filter part to an input end of the low pass filter part. The method of claim 1,
The bypass circuit of the DC bypass circuit portion,
A first bypass circuit connected to an input end of the band pass filter part and composed of an inductor and a capacitor, and a second bypass circuit connected to an input end of the low pass filter part and formed of an inductor,
And the first and second bypass circuits are electrically connected to each other by being connected to DC pass lines formed on the dielectric substrate through via holes formed in the dielectric substrate. The method of claim 1,
And the low pass filter unit is used as a transmission path of a DC power or low frequency signal bypassed from an input terminal of a band pass filter unit through the DC bypass circuit unit. The method of claim 1,
The band pass filter unit and the low pass filter unit multiple broadband combiner, characterized in that the output terminal is commonly connected. 5. The method of claim 4,
At least two input ports connected to a band pass filter part and a low pass filter part are provided at one side of the housing, and an output port connected to the band pass filter part and the low pass filter part is provided at the other side. Multiple broadband combiners. The method of claim 5,
The housing is a multi-band broadband combiner characterized in that the partition wall is formed between the bandpass filter portion and the low pass filter portion formed in the interior space. The method of claim 1,
The frequency band through the low pass filter is in the range of 450 ~ 960MHz,
A frequency band through the band pass filter unit is a multiple broadband combiner, characterized in that in the range of 1710 ~ 2170MHz. The method of claim 1,
The band pass filter unit is a multiple broadband combiner, characterized in that the output stage is provided with at least one group different from each other. A dielectric substrate formed across the input ends of the band pass filter portion and the low pass filter portion, respectively, connected to the at least two input ports; And
A bypass circuit connected to an input end of a band pass filter part and a low pass filter part under the dielectric substrate to bypass a DC power or low frequency signal applied to an input end of the band pass filter part to an input end of the low pass filter part; DC bypass structure of multiple broadband combiners. 10. The method of claim 9,
The bypass circuit,
A first bypass circuit connected to an input end of the band pass filter part and composed of an inductor and a capacitor, and a second bypass circuit connected to an input end of the low pass filter part and formed of an inductor,
And the first and second bypass circuits are electrically connected to each other by being connected to DC pass lines formed on the dielectric substrate through via holes formed in the dielectric substrate. 10. The method of claim 9,
And the low pass filter unit is used as a transmission path of a DC power or low frequency signal bypassed from an input terminal of a band pass filter unit through the DC bypass circuit.

Images