KR101301319B1 - Frame structure, test handler handling the same and method for testing a substrate - Google Patents

Abstract

The test handler includes a loading module, at least one test chamber and an unloading module. The loading module includes a frame formed to have an inner space and a bridge that connects at least one memory substrate to the frame in the inner space, and a fixing plate to which the memory substrate is fixed and a test pad part electrically connected to the memory substrate. The frame structure is loaded. The test chamber is arranged in-line at a location adjacent to the loading module to provide a space for testing the memory substrate and includes a pad connection to which the test pad is connected. The unloading module is disposed in-line at a location adjacent to the test chamber to unload the memory substrate.

Description

FRAME STRUCTURE, TEST HANDLER HANDLING THE SAME AND METHOD FOR TESTING A SUBSTRATE}

The present invention relates to a frame structure, a test handler for handling the same, and a method for testing a substrate thereby, and more particularly, to a frame structure that secures a memory substrate and a handle for handling the frame structure to test the memory substrate. A test handler and thereby a method of testing the memory substrate substantially.

Recently, memory boards (soiled state drives, SSDs) that store data only by electric signals on semiconductor chips have been in the spotlight in contrast to hard disk drives (HDDs) storing data on physically rotating disks.

Specifically, since the memory substrate does not include a motor and a mechanical driving device, which are essentially used for the hard disk driver, the memory board hardly generates heat and noise during operation, and is resistant to external shock, and the hard disk in terms of data transmission speed. It is several times better than the disk driver.

Such a memory substrate is manufactured by mounting a plurality of memory chips on a substrate on which a circuit is patterned, and the manufactured memory substrate is then tested for its electrical characteristics through an external test apparatus.

However, when the memory substrate is to be tested, as the specifications of the memory substrate are varied, an operator directly inserts the memory substrate into a test chamber connected to the test apparatus and connects it directly, thereby reducing the work speed. The productivity is also reduced.

It is an object of the present invention to provide a frame structure that is compatible with memory substrates of various specifications and can be connected to a test chamber.

Another object of the present invention is to provide a test handler for handling the above-described frame structure.

Still another object of the present invention is to provide a method for testing the substrate by the test handler described above.

In order to achieve the above object of the present invention, the frame structure according to one feature comprises a fixing plate and a test pad portion.

The fixing plate may include a frame formed to have an inner space and a bridge connecting at least one memory substrate to the frame in the inner space to fix the memory substrate.

The test pad unit is formed in the frame and is connected to an external test chamber in an electrically connected state with the memory substrate to inspect electrical characteristics of the memory substrate.

Thus, a plurality of memory substrates may be fixed to the fixing plate in a soft array form. In addition, the bridge may be configured to have a different length depending on the size of the memory substrates.

In order to achieve the above object of the present invention, a test handler according to one aspect includes a loading module, at least one test chamber and an unloading module.

The loading module includes a frame formed to have an internal space and a bridge connecting at least one memory substrate to the frame in the internal space, the fixing plate being fixed to the memory substrate and the frame and electrically connected to the memory substrate. The frame structure including the connected test pad portion is loaded.

The test chamber is arranged in-line at a position adjacent to the loading module to provide a space for testing the memory substrate, and includes a pad connection to which the test pad is connected.

The unloading module is disposed in-line at a position adjacent to the test chamber to unload the memory substrate.

In this case, the unloading module may include an individualization unit to cut the bridge to separate the memory substrate from the frame structure. In addition, the unloading module may include a sorting unit that classifies the memory substrate according to a result of the test in the test chamber.

Meanwhile, the test handler may include a plurality of test chambers coupled in an in-line form.

In addition, the test chamber may be provided with a connection driving unit for moving the frame structure to connect the test pad unit to the pad connection unit.

In order to achieve the above object of the present invention, a method of testing a substrate according to an aspect includes a frame formed to have an inner space and a bridge connecting at least one memory substrate to the frame in the inner space. Loading a frame structure including a fixing plate to which a memory substrate is fixed and a test pad part formed on the frame and electrically connected to the memory substrate, transferring the loaded frame structure to a test chamber, and transferring the transferred frame structure Testing the memory substrate by connecting a test pad of the test chamber to a pad connection of the test chamber, unloading a frame structure holding the tested memory substrate, and separating the memory substrate from the unloaded frame structure. The bridge Cutting a step.

Thus, after separating the memory substrate, the method may further include classifying the separated memory substrate by grade.

According to such a frame structure, a test handler for handling the same, and a method of testing a substrate thereby, a frame structure having a test pad electrically connected to the memory substrate while being able to fix the memory substrate by adjusting only the length of the bridge according to a specification. By using the above, the memory substrate can be connected to the test chamber regardless of the specification of the memory substrate. As a result, since a test process for memory substrates having various specifications can be performed without replacement of components, productivity can be improved by preventing work speed from being lowered. In addition, by continuously performing a test process on the memory substrate through a test handler in which an in-line system is constructed, productivity improvement may be further expected.

In addition, by easily adjusting the number of test chambers in which a substantial test process of the test handler is performed, it is possible to flexibly correspond to the number of tests of the memory substrate.

1 is a block diagram conceptually illustrating a test handler according to an exemplary embodiment of the present invention.
FIG. 2 is a diagram illustrating a frame structure used in the test handler shown in FIG. 1.
FIG. 3 is an enlarged view of a portion of the frame structure shown in FIG. 2.
4 is a view schematically illustrating the interior of a test chamber in the test handler shown in FIG. 1.
FIG. 5 is a diagram illustrating multiple test chambers of the test handler shown in FIG. 1.
FIG. 6 is a diagram conceptually embodying an unloading module of the test handler illustrated in FIG. 1.
FIG. 7 is a flowchart illustrating a test process using the test handler shown in FIG. 1.

Hereinafter, a frame structure according to an exemplary embodiment of the present invention, a test handler for handling the same, and a method of testing a substrate thereby will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a block diagram conceptually illustrating a test handler according to an embodiment of the present invention, FIG. 2 is a view illustrating a frame structure used in the test handler shown in FIG. 1, and FIG. 3 is a frame shown in FIG. 2. An enlarged view of a portion of the structure.

1, 2 and 3, the test handler 1000 according to an embodiment of the present invention includes a loading module 100, at least one test chamber 200, and an unloading module 300. .

The loading module 100 is loaded with a frame structure 10 to which a memory substrate (Solid State Drive, SSD) is fixed. The memory substrate (SSD) is a device that stores information using a semiconductor chip, the data transfer speed is faster than the hard disk driver (HDD) that stores data on a physically rotating disk, heat and noise It has been spotlighted recently because of its small size, small size, and light weight.

The frame structure 10 includes a fixing plate 20 that substantially fixes the memory substrate SSD and a test pad unit 30 for testing electrical characteristics of the memory substrate SSD.

The fixing plate 20 has a frame 22 formed to have an internal space and a bridge connecting the memory substrate SSD to the frame 22 to fix at least one memory substrate SSD in the internal space. 24).

In this case, a plurality of memory substrates SSD may be fixed to the fixing plate 20 in the form of a soft array as shown in FIG. 2. In addition, each of the plurality of memory substrates SSD may be electrically connected to the one test pad unit 30 through a wiring pattern 40.

Accordingly, by connecting the test pad unit 30 to the test chamber 200 to be described below, the electrical characteristics of the plurality of memory substrates SSD may be tested at a time. As a result, productivity can be expected by efficiently performing the process of testing the memory substrates. In this case, terminals 32 corresponding to the number of memory substrates SSDs that can be tested at one time may be formed in the test pad part 30.

In addition, when the size of the memory substrate SSD is changed, the length of the bridge 24 is adjusted to connect the memory substrate SSD to the frame 22, according to the specification of the memory substrate SSD. The need to change the frame 22 is eliminated.

Therefore, even when the size of the memory substrate SSD is changed, the test pad part 30 formed on the frame 22 may be used as it is to be connected to the test chamber 200 which will be described below without changing parts. As a result, it is possible to prevent the work speed from being lowered and to expect a significant productivity improvement.

The loading module 100 may further include a DC test unit (not shown) that tests a direct current (DC) of the memory substrate SSD. In this case, the loading module 100 may further include a loading stacking unit (not shown) for classifying and loading the memory substrate SSD into good or bad according to the test result of the DC test unit. In this case, the test process to be performed in the test chamber 200, which will be described below, may be performed on a memory substrate SSD that is substantially classified as a good product.

The test chamber 200 is disposed in-line at a position adjacent to the loading module 100. Hereinafter, the test chamber 200 will be described in more detail with reference to FIGS. 4 and 5.

4 is a view schematically illustrating the interior of a test chamber in the test handler illustrated in FIG. 1, and FIG. 5 is a diagram illustrating a plurality of test chambers of the test handler illustrated in FIG. 1.

4 and 5, the test chamber 200 is loaded with the frame structure 10 on which the memory substrate SSD is fixed from the loading module 100 through the inlet 210.

In this case, the loaded frame structure 10 may be understood that the memory substrate SSD, which is determined to be good in the DC test unit of the loading module 100, is fixed. In addition, the frame structure 10 may be transferred from the loading module 100 to the test chamber 200 through various transfer means such as a conveyor (not shown) or a transfer robot (not shown).

The test chamber 200 provides a space for testing electrical characteristics of the memory substrate SSD. Thus, the test chamber 200 is connected to the substantial test device 50 of the memory substrate SSD. At this time, the test chamber 200 may be applied to the asynchronous test method that can receive and execute the next command even while one command is being executed.

The test chamber 200 includes a pad connection 230 electrically connected to the test device 50. Accordingly, the test pad part 30 of the frame structure 10 is connected to the pad connection part 230 in the test chamber 200 to thereby electrically connect the memory substrate SSD fixed to the frame structure 10. Test the specific characteristics.

In this case, as the test pad unit 30 has a predetermined shape regardless of the size and number of the memory substrate SSD in the test chamber 200, the frame structure 10 is moved to the test pad unit. A connection driver 250 may be installed to automatically connect the 30 to the pad connection unit 230.

Thus, by automatically connecting the test pad unit 30 and the pad connection unit 230 through the connection driving unit 250, the productivity improvement can be expected more, and the accuracy and precision of the connection can be improved. You can also trust the results.

The test chamber 200 may be arranged to be coupled to each other in an in-line form. The plurality of test chambers 200 may have an inlet 210 and an outlet 220 connected to each other in an in-line form. For example, as shown in FIG. 1, two may be arranged 2T in-line, or four may be arranged 4T in-line. On the contrary, the plurality of test chambers 200 also have a structure in which the inlet 210 and the outlet 220 can be easily separated.

Accordingly, the loaded frame structure 10 is transferred from the test chambers 200 through various transfer means such as a conveyor (not shown) or a transfer arm (not shown) to the user of the test chambers 200. The test process may be performed by connecting to one of the pad connectors 230 selected by the control program or by a predetermined control program.

As described above, when the number of the frame structures 10 increases or decreases according to the number of memory substrates SSDs to be tested, the number of the test chambers 200 is flexibly changed so that the test handler ( Maximum effect can be expected in terms of installation space of 1000).

The unloading module 300 is disposed in-line at a position adjacent to the test chamber 200. Specifically, the unloading module 300 may be disposed in-line with the test chamber 200 disposed at the rearmost portion of the plurality of test chambers 200 arranged in the in-line form.

Accordingly, the unloading module 300 is unloaded with the frame structure 10 on which the memory substrate SSDs tested in the test chambers 200 are fixed. In this case, the unloaded frame structure 10 may be unloaded through various transport means such as a conveyor (not shown) or a transfer arm (not shown). Hereinafter, the unloading module 300 will be described in more detail with reference to FIG. 6.

FIG. 6 is a diagram conceptually embodying an unloading module of the test handler illustrated in FIG. 1.

6, the unloading module 300 may include an individualization unit 310 and a selection unit 320.

The individualization unit 310 is located at the tip of the unloading module 300. The frame structure 10 to which the memory substrate SSD tested from the test chamber 200 is fixed is unloaded to the individualization unit 310. The individualization unit 310 cuts the bridge 24 connecting the memory substrate SSD to the frame 22 so as to separate the memory substrate SSD from the frame structure 10.

The selection unit 320 is connected to the individualization unit 310 in an in-line form. The individually separated memory substrates SSD are unloaded from the sorting unit 320. The sorting unit 320 classifies the memory substrates SSD into grades according to the test results of the test chamber 200.

In this case, in order to accurately identify the memory substrate SSD in the sorting unit 320, the memory chamber SSD is printed on the fixed frame structure 10 before the test is performed in the test chamber 200. An identification code, such as a bar code, may be recognized to prevent inconsistency between the test target memory substrate SSD and the test result.

In the present exemplary embodiment, the individualization unit 310 is positioned at the front end of the selection unit 320 so that the process is performed first. However, the selection unit 320 may be customized according to the characteristics of the memory substrate SSD. The process may be performed first by being located at the tip of the part 310.

As such, the loading module 100, the test chamber 200, and the unloading module 300 of the test handler 1000 are constructed in an in-line automated system as a whole to continuously perform a test process. More productivity can be expected.

Hereinafter, a process of testing the memory substrate SSD through the test handler 1000 described above will be described with reference to FIG. 7.

FIG. 7 is a flowchart illustrating a test process using the test handler shown in FIG. 1.

Referring to FIG. 7 further, in order to test the memory substrate SSD using the test handler 1000, the memory substrate SSD is first bridged to the frame 22 of the frame structure 10. Prepare by fixing the connection through.

Thereafter, the frame structure 10 on which the memory substrate SSD is fixed is loaded onto the loading module 100 (S10). In this case, the loading module 100 may perform a DC test. Subsequently, the loaded frame structure 10 is transferred to the test chamber 200 (20). In this case, as a result of performing a DC test in the loading module 100 to the frame structure 10 transferred to the test chamber 200, the memory substrate SSD determined as good quality may be fixed. In addition, the number of test chambers 200 may be flexibly adjusted according to the number of memory substrates SSD to be tested.

Subsequently, the test pad part 30 of the frame structure 10 is connected to the pad connection part 230 of the test chamber 200 connected to the test apparatus 50 to fix the memory substrate fixed to the frame structure 10 ( SSD) to test the electrical characteristics (S30).

Subsequently, the frame structure 10 to which the tested memory substrate SSD is fixed is unloaded to the individualization unit 310 of the unloading module 300 to remove the memory substrate SSD from the frame structure 10. Separately (S40). In detail, the bridges 24 connecting the frame 22 and the memory substrate SSD of the frame structure 10 are cut to separate the memory substrate SSDs.

Subsequently, the separated memory substrates SSD are classified according to the test result of the test chamber 200 (S50). In the present exemplary embodiment, the memory substrates SSD are first separated from the frame structure 10 and then divided into grades. However, the order of the memory substrates SSD may be changed depending on the characteristics of the memory substrate SSD. I can understand.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

SSD: memory substrate 10: frame structure
20: fixing plate 22: frame
24: bridge 30: test pad portion
50: test apparatus 100: loading module
200: test chamber 230: pad connection
250: connection driving unit 300: unloading module
310: individualization unit 320: selection unit
1000: test handler

Claims (10)

A fixing plate to which the memory substrates are fixed, including a frame formed to have an internal space and a bridge connecting the memory substrates arranged in a plurality of soft array forms in the internal space to the frame; And
A test pad unit formed in the frame and connected to an external test chamber in an electrically connected state with the memory substrates to inspect electrical characteristics of the memory substrates,
The bridge is a frame structure, characterized in that the length is configured differently according to the size of the memory substrates. delete delete A memory plate including a frame formed to have an internal space and a bridge connecting the memory substrates arranged in a plurality of soft array forms in the internal space to the frame, the fixing plate to which the memory substrates are fixed, and the memory substrates; A loading module loaded with a frame structure including a test pad part electrically connected thereto;
At least one test chamber disposed in an in-line form at a position adjacent to the loading module to provide a space for testing the memory substrates, the at least one test chamber including a pad connection portion to which the test pad portion is connected; And
An unloading module disposed in-line at a position adjacent to the test chamber to unload the memory substrates,
The bridge is a test handler, characterized in that the length is configured differently depending on the size of the memory substrates. 5. The test handler of claim 4 wherein the unloading module includes an individualization section for cutting the bridge to separate the memory substrates from the frame structure. The test handler of claim 4, wherein the unloading module includes a sorting unit that classifies the memory substrates according to a test result of the test chamber. 5. The test handler of claim 4 comprising a plurality of test chambers coupled in-line. 5. The test handler according to claim 4, wherein the test chamber is provided with a connection driver for moving the frame structure to connect the test pad part to the pad connection part. And a fixing plate to which the memory substrates are fixed, including a frame formed to have an internal space and a bridge connecting the plurality of memory substrates arranged in a plurality of soft array forms in the internal space to the frame, and the memory substrate being fixed to the memory substrate. Loading a frame structure including a test pad portion electrically connected to the fields;
Transferring the loaded frame structure to a test chamber;
Testing the memory substrates by connecting a test pad part of the transferred frame structure to a pad connection part of the test chamber;
Unloading a frame structure holding the tested memory substrates; And
Cutting the bridge to separate the memory substrates from the unloaded frame structure,
And wherein the bridge has a different length depending on the size of the memory substrates. 10. The method of claim 9, further comprising separating the memory substrates by grade after separating the memory substrates.

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