KR101289343B1 - Substrate processing apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, comprising a body made of a single base material, a plurality of substrate seating portions provided on the upper side of the body, and recesses provided on the lower side of the body, and having irregularities provided in the substrate seating portion. Provided is a substrate processing apparatus including a portion. Through this, it is possible to solve the temperature nonuniformity of the substrate due to the temperature difference of the substrate mounting means, and to prevent the warpage of the substrate during the high temperature heating.

Chamber, substrate seating means, optical heating means, heat inducing means, radiant heat

Description

[0001] SUBSTRATE PROCESSING APPARATUS [0002]

1 is a cross-sectional conceptual view of a substrate processing apparatus according to an embodiment of the present invention.

2 is a perspective view of a substrate seating means according to the present embodiment;

3 is a plan view of the substrate seating means according to the present embodiment;

4 is a bottom view of the substrate seating means according to the present embodiment;

5 is a cross-sectional conceptual view of the substrate seating means according to the present embodiment;

6 to 8 are cross-sectional conceptual views of the substrate mounting means according to a modification of the present embodiment.

9 is a perspective conceptual view for explaining the optical heating means according to the present embodiment.

10 is a cross-sectional conceptual view for explaining an optical heating means according to the present embodiment.

11 is a perspective conceptual view of a part of heat inducing means according to the present embodiment;

12 is a plan view of a heat inducing means according to the present embodiment;

13 is a bottom view of the heat inducing means according to the present embodiment;

14 is a cross-sectional conceptual view of the heat inducing means according to the present embodiment;

<Explanation of symbols for the main parts of the drawings>

100: chamber 110: chamber lead

120: chamber main body 130: gas supply means

200: substrate mounting means 210: body

220: substrate seating portion 230: recessed portion

310: power transmission means 320: driving unit

400: heating means 410: lamp heater

500: heat inducing means 510: heat transmitting portion

520: heat shield 530: edge ring

610: baffle 620: exhaust means

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, wherein a substrate seating apparatus on which a plurality of substrates are seated is made of a single substrate having a high thermal conductivity, and a heating means is placed on the outside thereof so that the heating temperature difference between the plurality of substrates due to uneven heating of the heating means. It relates to a substrate processing apparatus that can reduce the.

When a plurality of substrates are processed simultaneously in a single chamber, it is difficult to maintain uniform processing conditions between the respective substrates, resulting in a problem of inferior uniformity between the substrates.

For example, in the case of thin film deposition, the substrate is heated to a constant temperature and then a process gas is supplied to grow the thin film on the substrate. At this time, the heating temperature of the substrate serves as a very important factor controlling the growth thickness of the thin film.

However, when a plurality of substrates are placed in a single chamber and then heated to deposit thin films, a problem arises in that the thicknesses of the thin films formed on the substrates are different due to different heating temperatures between the substrates. In addition, as the size of the substrate increases in recent years, this phenomenon becomes more severe. As the size of the substrate increases, the temperature difference occurs even in a single substrate, causing the substrate to bend or warp.

In addition to this, the heat of the heat source for heating the substrate is lost to the inner wall of the chamber, resulting in a problem that the efficiency is lowered. In addition, a problem occurs in that the heat source is exposed to the process gas to form a thin film on the surface thereof.

Therefore, in order to solve the above problems, the substrate seating means may be made of a single base material having excellent thermal conductivity to improve thermal conductivity inside the substrate seating means, thereby preventing a local temperature difference from occurring. It is an object of the present invention to provide a substrate processing apparatus capable of reducing the occurrence of a heating temperature difference between a plurality of substrates by first heating the substrate by uniformly heating the substrate seating means by means.

A chamber according to the present invention, a gas ejection means for injecting gas into the chamber, a substrate placing means disposed in the chamber and having a plurality of substrate seating portions thereon, wherein the substrate seating portion is provided with uneven portions having irregularities. It provides a substrate processing apparatus comprising.

Here, it is preferable that the substrate seating part is formed in a recessed groove shape in which a part of the body is recessed, and the uneven portion is formed in the groove. It is effective that the uneven portion is radially symmetrically formed at the center of the substrate seating portion. Preferably, the substrate seating portion is formed in a recessed recess shape in which a portion of the body is recessed, and recesses are formed in an edge region of the recessed recess.

Preferably, the substrate seating portion has a recess corresponding to the substrate edge region formed in the body.

In addition, at least one lift pin hole through which the lift pin for supporting the substrate is formed may be formed in the substrate seating portion, and the lift pin hole may be lifted up and down.

Of course, it is preferable to include heating means provided below the substrate seating means to heat the substrate seating means. It is effective that said heating means is optical heating means containing a some lamp heater. It is preferable to include heat inducing means for inducing heat of the above-described optical heating means to the substrate seating means.

The substrate placing means is effective to produce a single base material with excellent thermal conductivity.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Wherein like reference numerals refer to like elements throughout.

1 is a cross-sectional conceptual view of a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a substrate processing apparatus according to the present embodiment includes a chamber 100 having a reaction space, a substrate seating means 200 disposed in the reaction space and provided with a plurality of substrates 10, and the substrate. An optical heating means 400 provided below the seating means 200 for heating the substrate 10, and a heat inducing means 500 for inducing heat of the optical heating means 400 to the substrate seating means 200. It includes.

In addition, a power transmission means 310 for rotating or vertically moving the substrate seating means 200 and a driving unit 320 for supplying power to the power transmission means 310. A baffle 610 provided outside the substrate seating means 200 to exhaust the air in the chamber 100 to the outside, and the exhaust means 620 connected to the baffle 610 is further included. It further includes a gas supply means 130 provided on the substrate 10 to supply a process gas. In addition, a plasma generator (not shown) for generating plasma in the reaction space of the chamber 10 may be further provided.

The chamber 100 includes a chamber body 120 provided with a substrate seating means 200, an optical heating means 400, and a heat inducing means 500, and a chamber lid 110 covering the chamber body 120. do. As described above, the chamber 100 may be separated into two parts, and the parts of the chamber 100 may be manufactured in a detachable structure to easily perform maintenance of the chamber 100. Of course, the present invention is not limited thereto, and the chamber body 120 may be separated into a plurality of parts and manufactured. Here, the chamber body 120 is manufactured in a cylindrical shape having an upper portion as shown in the figure and having a reaction space therein. The chamber lid 110 covers the upper side of the chamber body 120 to seal the reaction space. In this case, a sealing member (not shown) including an O-ring may be provided between the chamber body 120 and the chamber lid 110, and may be sealingly coupled through a separate coupling member (not shown).

It is preferable that a through hole through which the power transmission means 310 penetrates is provided in the lower bottom area of the chamber body 120, and a discharge hole through which exhaust gas is discharged. In addition, an entrance (not shown) for accessing the substrate 10 is provided in the inner wall region of the chamber main body 120.

The chamber lid 110 is provided with a through hole through which a part of the gas supply means 130 passes. Here, it is preferable that the gas supply means 130 is fixedly mounted to the chamber lead 110. In addition, a shield plate (not shown) may be provided on the lower side of the chamber lid 110, that is, the lower portion of the chamber lid 110 exposed to the reaction space.

At this time, the chamber lid 110 is provided with a plurality of coupling members (not shown) for coupling and fixing the gas supply unit 130 and the shield plate. The chamber lid 110 according to the present embodiment is preferably manufactured to have a structure in which the coupling members are not exposed on the inner surface thereof, that is, the reaction space region.

As shown in FIG. 1, the gas supply means 130 includes a rotating body 131, a gas injector 132 provided at an end of the rotating body 131, and spraying a process gas, and the rotating body ( It includes a gas supply unit 133 through the 131 to supply a process gas to the gas injection unit 132. Although not shown, the rotating body 131 includes a housing fixed to the chamber lid 110 and a rotating shaft rotating inside the housing. It is preferable that a plurality of gas flow paths are provided in the housing and the rotating shaft so that the process gas is supplied into the rotating shaft through the housing. It is preferable that the gas injection part 132 is respectively connected to the end of the said rotating shaft, ie, the end of the some gas flow path in a rotating shaft. As a result, the gas injector 132 may rotate to inject the process gas onto the substrate 10. In this case, different process gases may be supplied to each gas injection unit 132. The gas supply unit 133 includes a plurality of injectors connected to the housing of the rotating body 131 to supply a process gas and gas storage tanks connected to the injectors, respectively. Of course, the gas supply means 130 may be manufactured in the form of a shower head.

In addition, a plasma generator may be provided inside the gas injection means 130 to supply a reaction gas activated by plasma into the chamber.

The above-described substrate seating means 200 is preferably made of a single body 210 and has a seating portion 220 on which the plurality of substrates 10 are seated.

Hereinafter, such a substrate mounting means will be described with reference to the drawings.

2 is a perspective view of the substrate seating means according to the present embodiment, FIG. 3 is a plan view of the substrate seating means according to the present embodiment, FIG. 4 is a bottom view of the substrate seating means according to the present embodiment, and FIG. It is a cross-sectional conceptual view of the board | substrate mounting means which concerns on an embodiment. 6 to 8 are cross-sectional conceptual views of a substrate seating means according to a modification of the present embodiment.

1 to 8, the substrate seating means 200 according to the present embodiment includes a body 210, a plurality of substrate seating portions 220 provided on an upper surface of the body 210, and a body 210. It includes a recess 230 provided on the lower side.

The body 210 is manufactured in a circular plate shape consisting of a single base material as shown in the figure. Of course, not limited to this, the shape of the body 210 can be produced in a variety of shapes, such as oval, polygonal. The body 210 performs a rotational movement for mounting the plurality of substrates 10. This is because the entrance and exit portion of the substrate 10 is provided in one region of the chamber 100, the body 210 is rotated to seat the substrate 10 on each substrate seating portion 220 or the substrate seating portion 220 The substrate 10 of) should be discharged to the outside. Since the body 210 rotates in this way, the shape of the body 210 is effectively a circular or positive polygon.

In this embodiment, it is effective to indirectly heat the substrate seating means 200 through a heating means provided outside the substrate seating means 200. As a result, a heating means for heating the inside of the body 210 is not provided, and thus the manufacturing of the body 210 may be simplified. In addition, it is possible to uniformly heat the outside of the body 210 to prevent the temperature difference between the plurality of substrates. That is, when the heating means is provided in the body 210, when the non-uniform heating is generated by the heating means, the non-uniform heating is transferred to the substrate 10 through the body 210 as it is, so that the body 210. The temperature difference between the substrates 10 is caused by the temperature difference between the respective regions. However, in consideration of the case in which the optical heating means 400 is uniformly provided under the body 210 and the body 210 is heated through the same, the non-uniform heating by the heating means occurs. Since the non-uniform heating first heats the body 210 and then indirectly heats the substrate 10, the non-uniform heating may be first resolved by the body 210 to minimize the occurrence of a temperature difference between the substrates 10.

In addition, the body 210 is made of a single base material having a high thermal conductivity (50W / mk or more) of the material, the heat exchange is actively performed inside the body 210, and through the active heat exchange of the entire body 210 The temperature can be kept uniform. That is, the body 210 may be made of a single base material having high thermal conductivity so that heat of one region may be quickly conducted to another region, thereby minimizing the occurrence of a temperature difference in the body 210.

In particular, since the size of the substrate 10 gradually increases, and as a result, the size of the body 210 of the substrate seating means 200 gradually increases, it is difficult to uniformly heat the enlarged body 210 according to the related art. It was more difficult. However, in the present embodiment, the body 210 is made of a single base material having excellent thermal conductivity, and an optical heating means 400 separated from the body 210 is uniformly disposed under the body 210 to enlarge the body ( 210) The entire temperature can be kept uniform. Through this, the plurality of substrates 10 mounted on the substrate seating portion 220 of the body 210 may be uniformly heated at the same time.

As described above, the substrate seating means 200 according to the present exemplary embodiment minimizes the temperature difference caused by uneven heating of the heating means or heat loss caused by adjacent parts or spaces through the body 210 of the substrate seating means 200. Many substrates can be heated uniformly.

In the present embodiment, at least two or more substrate seating portions 220 are provided in the upper region of the body 210 to arrange at least two or more substrates 10 on the same plane. 2 and 3 illustrate that five substrate seating parts 220 are radially provided on the body 210.

The substrate seating part 220 may be manufactured in a concave groove shape in which a portion of the body 210 is recessed. As a result, the substrate 10 may be seated in the recess to fix the movement of the substrate 10. Therefore, the size of the recess is preferably equal to or slightly larger than the size of the substrate 10. In this case, the substrate 10 seated on the substrate mounting portion 220 may protrude from the upper surface of the body 210, may coincide with the surface, or may enter below the surface. Of course, the substrate seating unit 220 is not limited thereto, and various shapes that may fix the movement of the substrate 10 are possible. In addition, in order to prevent shaking of the substrate 10 during the process may further include a separate fixing means (not shown) for seating and fixing the substrate 10 in the substrate mounting portion 220.

In addition, a substrate lift hole 222 is formed in the substrate seating part 220, that is, the recess. In this case, the lift pins 240 pass through the lift holes 222 to facilitate loading and unloading of the substrate 10. That is, as shown in FIG. 5, the lift pins 240 are raised and lowered through the lift holes 222 to seat the external substrate 10 on the substrate seating part 220 or the substrate seating part 220. Lift the substrate 10 seated on the) may help discharge to the outside. Here, the lift pin 240 is preferably provided in the doorway area through which the substrate 10 enters and exits. One lift pin may sequentially pass through the lift holes 222 of the plurality of substrate seating parts 220 to load or unload the substrate. In the figure, one lift hole 222 is shown in the center of the substrate mounting part 220 and one lift pin 240 corresponding thereto is illustrated. However, the exemplary embodiment is not limited thereto, and the plurality of lift holes 222 may be provided at the center of the substrate seating part 220, and may include a plurality of lift pins 240 corresponding thereto.

In addition, it is preferable that a plurality of uneven parts 221 are provided inside the substrate seating part 220. In order to heat the substrate 10 to a high temperature, first, the body 210 provided with the substrate mounting portion 220 on which the substrate 10 is mounted is heated. At this time, when the heating of the body 210 is not uniform or the contact between the substrate 10 and the substrate mounting portion 220 is not uniform, the substrate 10 is distorted. Therefore, in the present exemplary embodiment, in order to make contact between the substrate seating portion 220 and the substrate 10 uniform, a plurality of uneven parts 221 may be disposed inside the substrate seating portion 220, that is, on the surface on which the substrate 10 is seated. ). Through this, the contact between the substrate 10 and the substrate mounting portion 220 may be uniform, and the substrate 10 may be uniformly heated.

The shape of the uneven portion 221 is preferably formed symmetrically radially from the center of the substrate mounting portion 220. That is, in this embodiment, as shown in FIGS. 2 and 3, a plurality of irregularities are provided in a circular ring shape in the circular substrate seating portion 220. Of course, the present invention is not limited thereto, and the shape and pattern of the concave-convex portion 221 may be variously changed according to the contact area of the substrate 10 contacting the inner surface of the substrate seating portion 220 and the heating temperature of the substrate 10. have. The uneven portion 221 may also be formed on the lift pin 240 penetrating the substrate seating portion 220.

At this time, the height of the uneven portion 221 is preferably formed to be 1mm or less. By placing the uneven parts 221 as described above in the substrate mounting part 220, damage to the substrate 10 (eg, warpage of the substrate) by heat can be reduced.

The substrate seating part 220 according to the present embodiment is not limited to the above description, and various modifications are possible. As shown in FIG. 6, the uneven parts 221 may not be formed. That is, the concave-convex portion 221 may be omitted so that the lower surface of the substrate 10 is completely in contact with the substrate seating portion 220. In addition, as shown in FIGS. 7 and 8, concave recesses 223 may be formed in the region of the substrate mounting portion 220 corresponding to both edges of the substrate 10. Of course, on the contrary, a protruding convex portion may be formed in an area of the substrate seating portion 220 except for the edge of the substrate 10. As shown in FIG. 7, when the substrate seating part 220 is manufactured as a recess in which a part of the body 210 is recessed, a recess 223 may be formed in an edge region of the recess. As shown in FIG. 8, when the substrate seating part 220 is manufactured in the same manner as the upper surface of the body 210, the recess 223 may be formed at the edge of the surface thereof. When the substrate 10 is seated on the substrate seating portion 220 and a thin film is formed thereon, the thin film may also be formed on the substrate seating portion 220 in the edge region of the substrate 10. This thin film prevents the substrate from being seated in the substrate seat 220 during subsequent processing. Therefore, in the present modified example, the recess 223 may be disposed on the substrate seating portion 220 corresponding to the edge of the substrate, thereby solving this problem.

In this embodiment, the body 210 is rotated to seat the substrate 10 on the plurality of substrate seating parts 220. That is, one substrate is seated on one substrate seat and then the body is rotated, and another substrate is seated on another substrate seat. To this end, a recess 230 is provided in the lower center area of the body 210, and a power transmission means 310 is mounted on the recess 230. In this case, the concave portion 230 may be power connected without using a bolt through a coupling structure for inserting and coupling the power transmission means 310. That is, the power of the power transmission means 310 can be supplied to the body 210 only by the coupling by the mechanical structure.

The recess 230 is recessed inward from the lower center area (center point area) of the body 210 and is preferably manufactured in the shape of a pentagonal plate having a rounded side as shown in FIG. 4. Of course, the shape of the upper region of the power transmission means 310 introduced into the recess 230 is also preferably the same shape as the recess 230. The shape of the recess 230 and the power transmission means 310 is not limited to the above description can be produced in a polygonal shape, an elliptic shape and the like.

In addition, it is preferable that a plurality of fixing grooves 231 are provided on the inner side of the recess 230 and the upper portion of the power transmission means 310. A fixing pin (not shown) is provided between the fixing grooves 231 to prevent the recess 230 and the power transmitting means 310 from twisting, and the power of the power transmitting means 310 is transferred to the body 210. You can also pass it on.

The power transmission means 310 is preferably rotated by the lower drive unit 320 as shown in FIG. Therefore, it is preferable that the power transmission means 310 be manufactured in a circular shaft shape except for the upper region. And, it is effective that the power transmission means 310 is assembled into a plurality of parts separated. In the case of the upper region connecting to the substrate seating means 200, a temperature difference may be prevented from occurring in the body 210 by manufacturing a material having the same thermal conductivity as that of the body 210 of the substrate seating means 200. . In addition, the lower region connected to the driving unit 320 may be made of a material having excellent heat shielding properties such that heat inside the chamber 100 is not transferred to the driving unit 320. In addition, the power transmission means 310 may perform a vertical movement to move the substrate seating means 200 up and down.

The substrate seating means 200 described above is heated by the optical heating means 400 provided below. Hereinafter, this optical heating means is demonstrated with reference to drawings.

9 is a perspective conceptual view for explaining the optical heating means according to the present embodiment. 10 is a cross-sectional conceptual view for explaining the optical heating means according to the present embodiment.

1, 9, and 10, the optical heating means 400 according to the present embodiment heats the body 210 of the substrate mounting means 200 by radiant heat and rests on the substrate 10. ) Is indirectly heated.

The optical heating means 400 includes a plurality of lamp heaters 410 disposed along concentric circles, and power applying means (not shown) for applying electric power to the lamp heater 410. Here, each of the lamp heaters 410 includes a body 411 having an empty interior, a filament (not shown) provided in the body 411, and a power applying terminal provided at both ends of the body 411 to be connected to the filament. 412. At this time, the power applying terminal 412 is connected to the power applying means. The lamp heater 410 according to the present exemplary embodiment may heat the substrate mounting means 200 to a temperature in a range of 100 to 1200 degrees through radiant heat. Preferably, it is effective to heat the substrate mounting means 200 to a temperature of 300 to 1000 degrees. Each of the plurality of lamp heaters 410 described above may have the same or different maximum calorific value.

In the present embodiment, it is preferable that a plurality of lamp heaters 410 having different inner diameters are arranged along concentric circles on the same plane. The substrate mounting means 200 according to the present embodiment has a circular disk shape. Therefore, it is effective that the lamp heater 410 is arranged in a plurality of circles having a single center so as to be disposed under the circular substrate seating means 200 and uniformly heat it. Of course, the present invention is not limited thereto, and the arrangement shape of the lamp heater 410 may be variously changed according to the shape of the substrate seating means 200. As a result, when the substrate seating means 200 rotates, the same radius region at its center may be heated by the lamp heater 410 which generates the same radiant heat.

In addition, as the size of the substrate seating means 200 increases, it becomes difficult to arrange along the concentric circles of the lower portion of the substrate seating means 200 with a single lamp heater 410 in the edge region of the substrate seating means 200. do. That is, the more the circumference of the circle is located outside the concentric circle, the length of the body 411 of the lamp heater 410 corresponding to this becomes longer, making it difficult to manufacture the lamp heater 410. In addition, the length of the filament inside the body 411 also becomes a problem that the efficiency is lowered.

Therefore, as the distance from the center of the concentric circle, it is preferable to arrange the plurality of lamp heaters 410 in a circular shape in consideration of the length and heating capacity of the lamp heater body 411. In this embodiment, as shown in FIG. 9, a single circular circular lamp heater 410 is disposed in the inner concentric region, and two semicircular lamp heaters 410 are disposed in a circular shape in the outer concentric region. .

The optical heating means 400 according to the present exemplary embodiment may heat the substrate seating means 200 to different temperatures for each of a plurality of regions. To this end, it is preferable to perform independent temperature control for each unit including at least one lamp heater 410 among the plurality of lamp heaters 410 arranged in a concentric manner below the substrate seating means 200. As shown in FIGS. 9 and 10, it is preferable to separate two and three lamp heaters 410 into one group and to independently control their heating temperatures by applying different power to each group. . For example, two lamp heaters provided in the first two circles from the center region of the optical heating means 400 are the first group (a), and two lamp heaters provided in the two outer circles are second to the second. Let the group (b), three lamp heaters provided in the three outside of the circle to the third group (c), the three lamp heaters provided in the three circle outward to the fourth group (d) The four lamp heaters provided in two circles on the outside thereof as the fifth group (e), and the four lamp heaters provided in the two circles on the outside thereof as the sixth group (f); The four lamp heaters provided in the circle are separated into a seventh group g. As such, it is preferable to separate the plurality of lamp heaters 410 into a plurality of group units, and to drive each group unit independently.

Through this, the substrate seating means 200 provided above the optical heating means 400 may have a heating region defined for each group unit of the lamp heater 410, and the heating temperature of the heating region may be different from each other.

As described above, in the present embodiment, the substrate seating means 200 is separated into a plurality of heating regions, and the heating temperature of each heating region is changed as follows. As the size of the substrate 10 increases, the area of the substrate mounting means 200 for mounting the plurality of substrates 10 also increases. As a result, even if it is heated to the same temperature in the lower portion of the substrate mounting means 200 of the large area, a temperature difference is locally generated in the substrate mounting means 200 due to process causes and heat loss caused by peripheral devices. The temperature difference of the substrate 10 is generated by the temperature difference of the substrate mounting means 200. Therefore, as in the present embodiment, the substrate mounting means 200 is compensated for the heat loss by transferring more radiant heat by the temperature lowered by the heat loss to the region where the heat loss occurs by changing the heating temperature of each heating area. The temperature difference of the substrate 10 may be compensated for by compensating the temperature difference of the substrate 10. For example, local heat loss occurs in the edge region of the substrate seating means 200 under the influence of the chamber wall or the process gas exiting the vent. Therefore, a larger power is applied to the lamp heater 410 provided under the edge region of the substrate seating means 200 to compensate for the heat loss. The substrate seating means may be uniformly heated by preventing the temperature difference between the substrate seating means 200 through the heat loss compensation of the edge region of the substrate seating means 200. Accordingly, in the case of the plurality of lamp heaters 410, the output value thereof is preferably larger toward the edge region.

To this end, in this embodiment, it is preferable to provide a plurality of power applying means, and to apply power to the lamp heater 410 each of which is bundled for each predetermined unit (group). Of course, by using a single power applying means may adjust the power output from it to be supplied to the lamp heater 410 separated in each unit.

In this case, the lamp heater 410 bundled in each unit is effective that the power supply terminal 412 is disposed in the same position in order to receive the same power as shown in FIG. In addition, since different power is applied to each unit, it is effective to prevent the power applying terminals 412 of the lamp heaters 410 from overlapping with each other. That is, the problem may be minimized because the portion of the power applying terminal 412 is concentrated in one place so that the substrate seating means 200 of the corresponding region is not heated. In addition, it is possible to solve a short-term problem between terminals that may occur when the neighboring power supply terminals 412 overlap, and a change in the amount of power generated by interference caused by different power supplied to adjacent lamp heaters 410. Can be prevented.

The power transmission means 310 for rotating or lifting the substrate seating means 200 penetrates through the central region of the optical heating means 400. Therefore, the lamp heater 410 is disposed in an area except the through area of the power transmission means 310. In addition, it is effective that the optical heating means 400 is provided with a through area (see A of FIG. 9) through which the lift pin 240 to assist in mounting the substrate 10 is provided on the substrate mounting means 200. The through area A is preferably an area between the power application terminals 412 of the lamp heater 410. In order to form the through area A through which the lift pin 240 penetrates, as shown in FIG. 9, an area between the power applying terminals 412 of the lamp heater 410 in one unit is applied to the lamp heater 410 in another unit. It is desirable to be wider than the area between the terminals 412.

Since the lamp heater 410 of the optical heating means 400 described above emits radiant heat to all directions of the body 411, only a part of the radiant heat is applied to the substrate seating means 200, and the rest is applied to the peripheral components. . This may lower the efficiency of heating the substrate mounting means 200, and may cause thermal damage to the components around the heating means 400. Therefore, in the present embodiment, the heat supply apparatus capable of inducing the radiant heat of the optical heating means 400 to the substrate seating means 200 to increase the heating efficiency of the substrate seating means 200 and to prevent thermal damage of the substrate components. It is preferable to include the phosphorus heat inducing means 500. Hereinafter, the heat inducing means 500 will be described with reference to the drawings.

11 is a perspective conceptual view of a part of the heat induction means according to the present embodiment, FIG. 12 is a plan view of the heat induction means according to the present embodiment, FIG. 13 is a bottom view of the heat induction means according to the present embodiment, and FIG. 14 is a cross-sectional conceptual view of the heat inducing means according to the present embodiment.

1 and 11 to 14, the heat inducing means 500 according to the present embodiment is provided in the upper region of the optical heating means 400 and the heat transmitting portion 510 for transmitting the radiant heat of the heating means, and the optical It is provided in the lower region and the side region of the heating means 400 includes a heat shield 520 to prevent the transmission of the radiant heat. The edge ring 530 is further provided along a circumference of an upper edge of the heat transmitting part 510.

The heat transmitting part 510 is preferably made of a transparent material that can pass the radiant heat of the optical heating means 400. In this embodiment, it is effective to use quartz as the heat transmitting part 510. The heat transmitting part 510 may be manufactured to have a size larger than that of the substrate seating means 200 disposed thereon. In addition, an upper through hole 541 is formed in the central region of the heat transmitting part 510 through which the power transmission means 310 for rotating or lifting the substrate seating means 200. In addition, it is preferable that an upper pin through hole 551 through which the lift pin 240 penetrates is formed in one region of the heat transmitting part 510.

The heat transmitting part 510 includes a body part 511 provided above the optical heating means 400, and an extension part 512 extending to an area between the heat blocking part 520 and the edge ring 530. do. The body portion 511 is preferably manufactured in the same size and shape as the substrate mounting means 200, the thickness of the body portion 511 as shown in Figure 10 and 14 of the extension portion 512 Thicker than the thickness is effective. Of course, the thickness of the body portion 511 and the extension portion 512 may be the same. In addition, the heat transmitting part 510 may be fixedly mounted to the upper region of the heat shielding part 520 through the extension part 512. Here, the body portion 511 and the extension portion 512 is preferably manufactured from a single base material, but is not limited thereto and may be made of a base material having different characteristics.

The heat shield 520 includes a lower block 521 provided in the lower region of the optical heating means 400 and a side block 522 provided in the side region of the optical heating means 400.

The lower blocking portion 521 and the side blocking portion 522 prevent the radiant heat of the optical heating means 400 from being emitted to the lower region and the side region of the optical heating means 400. This protects the components or chamber walls adjacent to the optical heating means 400 from the radiant heat of the optical heating means 400.

The lower shielding portion 521 and the side shielding portion 522 are preferably made of an opaque material so that radiant heat of the optical heating means 400 does not transmit. In this embodiment, it is effective to use quartz having an opaque treatment of the inside of the lower blocking portion 521 and the side blocking portion 522. Of course, it can also be made of quartz and then its surface opaque. In addition, the reflective film may be formed by treating the inner surface of the lower blocking portion 521 and the side blocking portion 522 (that is, the surface area in contact with the heating means) with a material having excellent light reflection characteristics. Through this, as described above, the radiant heat of the optical heating means 400 may be efficiently transmitted to the substrate seating means 200, and the radiant heat may be minimized from being transferred to other components or the chamber walls.

Here, the lower blocking portion 521 is preferably manufactured in the same size and shape as the heat transmitting portion 510. A lower through hole 542 corresponding to the upper through hole 541 is provided in the center area of the lower blocking part 521. Through this, the power transmission means 310 is connected to the substrate mounting means 200 provided above the heat transmission part 510 through the lower through hole 542 and the upper through hole 541. A lower pin through hole 552 corresponding to the upper pin through hole 551 is provided in one region of the lower blocking part 521. Through this, the lift pin 240 may move up and down through the lower pin through hole 552 and the upper pin through hole 551. The lower blocking part 521 may be provided with a wiring through hole through which wiring for supplying power to the lamp heater 410 of the optical heating means 400 passes.

In this case, a separate blocking film (not shown) may be formed between the lower through hole 542 and the upper through hole 541 to block the radiant heat of the optical heating means 400 from being supplied to the power transmission means 310. have. In addition, a separate blocking film (not shown) may be formed between the lower pin through hole 552 and the upper pin through hole 551 to block radiant heat from being supplied to the lift pin 240.

The side blocking portion 522 is preferably provided in a ring shape in the edge region of the lower blocking portion 521. As shown in the figure, the side blocking portion 522 is disposed in a shape perpendicular to the lower blocking portion 521 so that the lower area and the upper area of the side blocking portion 522 are similar to the area of the substrate mounting means 200. It can be formed to have an area. The side blocking portion 522 may be disposed at the edge region of the substrate seating means 200. Of course, the present invention is not limited thereto, and the side blocking portion 522 may be formed in a shape having a predetermined slope with respect to the lower blocking portion 521 so that the lower side area and the upper side area of the side blocking part 522 may be different from each other. .

An edge ring 530 is installed in an upper region of the edge of the heat transmitting part 510. The edge ring 530 is preferably provided around the edge of the substrate seating means 200 in consideration of the vertical movement of the substrate seating means 200. That is, when the substrate mounting means 200 is raised, radiant heat of the optical heating means 400 may be conducted to the components or the chamber walls inside the chamber 100 through the rising area of the substrate mounting means 200 to damage them. . Therefore, in the present embodiment, the edge ring 530 is manufactured in consideration of the maximum rising height of the substrate seating means 200 and disposed around the edge of the substrate seating means 200. As a result, when the substrate mounting means 200 rises as illustrated in FIG. 14, it is possible to prevent a phenomenon in which radiant heat is emitted to the outside through the raised area. The edge ring 530 may be made of an opaque material, or the surface thereof may be opaque to prevent radiant heat from passing through. As described above, the radiant heat of the optical heating means 400 may be prevented from being transferred to the other regions except for the upper region of the heat inducing means 500 through the heat inducing means 500 according to the present embodiment. As a result, the upper region of the heat inducing means 500 in which the substrate seating means 200 is disposed may be thermally separated from other spaces in the chamber 100.

In the present embodiment, a portion of the heat transmitting part 510 extends between the edge ring 530 and the heat blocking part 520 to be fixed thereto, but the present invention is not limited thereto, and is separately fixed to one side of the heat blocking part 520. A member (not shown) may be provided to fix and support the heat transmitting part 510.

In the case of the heat transmitting part 510 and the heat shielding part 520, the size of the heat transmitting part 510 and the heat blocking part 520 are larger than those of the single base material. That is, for example, the heat transmitting part 510 and the heat blocking part 520 may be manufactured by dividing into 90 degrees (4 parts) or 120 degrees (3 parts) and assembling these parts.

As shown in FIG. 12, the heat transmitting part 510 is manufactured as a single circular body, and as shown in FIG. 13, the heat blocking part 521 is manufactured by separating the four parts 521a, 521b, 521c, and 521d into four parts. They can then be combined. In addition, the edge ring 530 may also be manufactured by separating it into a plurality of parts.

As described above, since the optical heating means 400 is housed inside the heat inducing means 500 according to the present embodiment, it is possible to prevent the phenomenon in which the optical heating means 400 is contaminated by the process gas. The optical heating means 400 according to the present embodiment heats the substrate mounting means 200 through radiant heat. Therefore, when unwanted contamination occurs on the radiation path, radiant heat does not reach the substrate seating means, thereby causing a problem that the substrate seating means 200 cannot be sufficiently heated. Accordingly, the inside of the heat inducing means 500 including the heat transmitting part 510 and the heat blocking part 520 may be manufactured in a sealed space to prevent contamination of the surface of the lamp heater 410 of the optical heating means 400. In addition, the non-reactive gas may be supplied to the upper surface of the heat transmission part 510 to prevent contamination of the upper surface of the heat transmission part 510. In addition, by supplying a non-reactive gas into the heat induction means 500, the pressure in the heat induction means 500 may be higher than the pressure in the reaction space to block the inflow of the process gas into the heat induction means 500. In order to supply the non-reactive gas, the non-reactive gas supply means may be provided outside the heat induction means 500, and a separate injection means may be provided to inject the non-reactive gas.

In addition, the heat induction means 500 according to the present embodiment is not limited to the above description, and manufactures the heat shield 520 in a circular cylindrical shape with an open top, and optical heating means in the lower region inside the heat shield 520. 400 may be disposed, and the substrate seating means 200 may be provided in the inner upper region. That is, the heat transmitting part 510 may be omitted, and the optical heating means 400 and the substrate mounting means 200 may be directly disposed in the upper region of the heat blocking part 520. Of course, in this embodiment, instead of the optical heating means 400, electrothermal heating means (resistive heating means) may be used.

The heat induction means 500 described above is preferably provided in the bottom region of the chamber 100, as shown in FIG. A baffle 610 for evacuation is provided between the heat inducing means 500 and the side wall of the chamber 100. Through this, the exhaust gas may be discharged to the edge region of the substrate seating means 200. The upper side of the baffle 610 is provided with an exhaust groove for sucking the exhaust gas. In addition, an exhaust unit 620 including an exhaust pump may be provided at one side of the baffle 610 to discharge the exhaust gas to the outside.

As described above, according to the present invention, the substrate seating means may be made of a single base material having excellent thermal conductivity, thereby improving thermal conductivity inside the substrate seating means, thereby preventing a locally generated temperature difference.

In addition, the heat of the heated substrate seating means can be uniformly supplied to the substrate by placing the uneven portion in the region of the substrate seating means on which the substrate is seated, thereby preventing the deformation of the substrate due to heat.

In addition, a plurality of lamp heaters may be placed under the substrate mounting means to uniformly heat the substrate mounting means, and each of the plurality of lamp heaters may be independently operated to compensate for heat loss of the substrate mounting means due to external factors.

In addition, the heating means provided below the substrate seating means can be separated from the process gas to prevent contamination by the process gas.

In addition, heat shields may be provided in the lower and sidewall areas of the heating means to prevent high temperature heat energy from being transferred to areas other than the upper portion of the heating means, thereby protecting the peripheral device and the chamber and increasing heating efficiency.

The present invention is not limited to the above-described embodiments, but may be embodied in various forms. In other words, the above-described embodiments are provided so that the disclosure of the present invention is complete, and those skilled in the art will fully understand the scope of the invention, and the scope of the present invention should be understood by the appended claims .

Claims (10)

chamber; Gas injection means for injecting gas into the chamber; A substrate placing means disposed in the chamber and including a body made of a single base material, a plurality of substrate seating portions provided on an upper surface of the body, each of which has a substrate seated thereon, and an uneven portion formed in the substrate seating portion; And A heating means separated from the body and provided below the body, And said heating means heats said body of said substrate mounting means by radiant heat to indirectly heat said substrate seated thereon. The method according to claim 1, And the substrate seating part is formed in a recessed recess shape in which a part of the body is recessed, and the recessed and projecting part is formed in the groove. The method according to claim 2, The uneven portion is a substrate processing apparatus formed radially symmetrical from the center of the substrate mounting portion. The method according to claim 1, And the substrate seating part is formed in a recessed recess shape in which a part of the body is recessed, and a recess is formed in an edge region of the recessed recess. The method according to claim 1, And a recessed portion corresponding to the substrate edge region is formed in the body. The method according to claim 1, And at least one lift pinhole through which a lift pin for supporting the substrate is mounted, and a lift pin configured to lift and lower the lift pinhole. The method according to claim 1, The heating means is a substrate processing apparatus for heating a plurality of regions having different inner diameters are arranged along concentric circles on the same plane, and heated at different temperatures for each of the plurality of regions. The method of claim 7, And said heating means is optical heating means comprising a plurality of lamp heaters. The method of claim 7, And heat inducing means for inducing heat of the heating means to the substrate seating means. The method according to claim 1, The substrate placing means is a substrate processing apparatus made of a single body.

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