KR101287991B1 - powder Coating with improved heat conduct - Google Patents

powder Coating with improved heat conduct Download PDF

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KR101287991B1
KR101287991B1 KR1020100114609A KR20100114609A KR101287991B1 KR 101287991 B1 KR101287991 B1 KR 101287991B1 KR 1020100114609 A KR1020100114609 A KR 1020100114609A KR 20100114609 A KR20100114609 A KR 20100114609A KR 101287991 B1 KR101287991 B1 KR 101287991B1
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powder
heat dissipating
heat
powder coating
coating
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KR1020100114609A
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Korean (ko)
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KR20120053368A (en
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박석형
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피켐스 주식회사
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03—Powdery paints
    • C09D5/033—Powdery paints characterised by the additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/045—Fullerenes

Abstract

본 발명은 방열성능이 우수하며, 환경친화적일 뿐만 아니라, 아울러 전기절연성 및 경도 및 내구성도 우수한 도막을 형성할 수 있는 방열성 분체도료 에 관한 것이다.
본 발명에 따르면, 수지와, 방열성 분말을 포함하며, 상기 방열성 분말은 천매암분말과, 풀러렌분말과, 알루미나분말을 포함하여 이루어진 것을 특징으로 하는 방열성 분체도료가 제공된다.The present invention relates to a heat dissipating powder coating which can form a coating film which is excellent in heat dissipation performance and is not only environmentally friendly, but also excellent in electrical insulation, hardness and durability.
According to the present invention, a resin and a heat dissipating powder are provided, and the heat dissipating powder is provided with a heat dissipating powder coating, characterized in that it comprises a natural rock powder, a fullerene powder, and an alumina powder.

Description

방열성 분체도료{powder Coating with improved heat conduct}Powder coating with improved heat conduct

본 발명은 방열성 분체도료에 관한 것으로서, 보다 상세하게는 방열성능이 우수하며, 환경친화적인 새로운 방열성 분체도료에 관한 것이다.
The present invention relates to a heat dissipating powder coating, and more particularly to a new heat dissipating powder coating which is excellent in heat dissipation performance and environmentally friendly.

IT제품이나 조명제품 등을 비롯하여 방열이 요구되는 제품은, 발열효율에 따라 제품의 수명이 많은 영향을 받기 때문에 방열성능을 높이기 위한 많은 노력이 이루어지고 있다. 이들 제품들의 방열성능을 높이기 위한 방안으로 제품의 외장도료로 방열성을 가지는 도료를 코팅하기도 한다. Products that require heat dissipation, including IT products and lighting products, have a lot of efforts to improve heat dissipation performance because the life of the product is greatly affected by the heat generation efficiency. In order to improve the heat dissipation performance of these products, the exterior coating of the product may be coated with heat dissipation.

한편, 액상도료는 용제에서 발생되는 휘발성 유기화합물에 의해 인체에 유해하여 아토피와 같은 피부질환이나 호흡기질환을 유발시키기도 하며, 대기도 오염시키는 단점이 있다. 이에 반해, 분체도료는 용제를 사용하지 않기 때문에 액상도료처럼 휘발성 유기화합물이 발생되지 않아 액상도료에 비해 친환경적이며, 인체에도 유해하지 않으며. 원하는 두께의 도막을 손쉽게 얻을 수 있는 장점이 있다. On the other hand, liquid paints are harmful to the human body by volatile organic compounds generated from solvents may cause skin diseases such as atopy or respiratory diseases, and also has the disadvantage of polluting the air. In contrast, powder coatings do not use solvents, so they do not generate volatile organic compounds like liquid paints, which are more environmentally friendly than liquid paints and are not harmful to humans. There is an advantage that can easily obtain a coating film of the desired thickness.

이러한 점으로 인해 최근에는 액상도료의 사용이 자제되고, 분체도료의 사용이 장려되고 있는 실정이다. 그러나 전술한 바와 같은 방열성 도료들은 거의 대부분 액상도료이며, 방열성을 가지는 분체도료가 몇몇 제안되기는 하였으나, 방열성이 미미하며, 도막의 강도 및 내구성도 만족스러운 수준을 제공하지 못하고 있다.
Due to this, in recent years, the use of liquid paint is refrained, and the use of powder coating is encouraged. However, the heat dissipating paints as described above are almost all liquid paints, although some powder coatings having heat dissipation have been proposed, the heat dissipation is insignificant, and the strength and durability of the coating film do not provide satisfactory levels.

본 발명은 상기의 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 방열성능이 우수하며, 환경친화적일 뿐만 아니라, 아울러 전기절연성 및 경도 및 내구성도 우수한 도막을 형성할 수 있는 방열성 분체도료를 제공하는 것이다.
The present invention is to solve the above problems, an object of the present invention is to provide a heat-dissipating powder coating that can form a coating film that is excellent in heat dissipation performance, environmentally friendly, and also excellent in electrical insulation and hardness and durability. will be.

본 발명의 일 특징에 따르면, 수지와, 방열성 분말을 포함하며, 상기 방열성 분말은 천매암분말과, 풀러렌분말과, 알루미나분말을 포함하여 이루어진 것을 특징으로 하는 방열성 분체도료가 제공된다.
According to an aspect of the present invention, a resin and a heat dissipating powder are provided, wherein the heat dissipating powder is provided with a heat dissipating powder coating comprising a natural rock powder, a fullerene powder, and an alumina powder.

본 발명의 다른 특징에 따르면, 상기 수지는 에폭시수지이며, 분체도료 100중량부에 대해 상기 에폭시수지가 35~65중량부, 상기 방열성 분말이 30~60중량부 포함된 것을 특징으로 하는 방열성 분체도료가 제공된다.
According to another feature of the invention, the resin is an epoxy resin, the heat dissipating powder coating, characterized in that the epoxy resin is contained 35 to 65 parts by weight, the heat dissipating powder 30 to 60 parts by weight based on 100 parts by weight of powder coating Is provided.

이상과 같은 구성을 가지는 본 발명은 첨가된 방열성 분말에 의해 방열성이 우수하다. 따라서 본 발명에 의한 분체도료에 의해서는 방열성이 우수한 피막을 얻을 수 있다. The present invention having the above configuration is excellent in heat dissipation by the added heat dissipating powder. Therefore, the powder coating by this invention can obtain the film excellent in heat dissipation.

더욱이 본 발명에서는 방열성 분말로 천매암과, 풀러렌, 알루미나를 사용하는데, 천매암에서 발생되는 원적외선의 복사에너지에 의해 열이 복사형태로 외부로 효과적으로 방열되기 때문에, 천매암을 사용함으로 인해 천매암과 동일한 수준의 열전도성을 가지는 다른 소재를 사용하는 것에 비해 상대적으로 더 우수한 방열효과를 얻을 수 있다. 또한, 풀러렌은 열전도성이 우수하여 방열효과가 우수한데, 이와 더불어 경도도 우수하기 때문에 풀러렌에 의해 도막의 내구성과 경도가 우수하여 스크랫치가 잘 발생되지 않는 등 우수한 품질의 도막을 얻을 수 있다. Furthermore, in the present invention, a heat dissipating powder uses a chalcopyrite, fullerene, and alumina, and heat is effectively radiated to the outside in the form of radiation by far-infrared radiation generated from the chalcopyrite. It is possible to obtain a relatively better heat dissipation effect than using other materials having conductivity. In addition, fullerene has excellent thermal conductivity and excellent heat dissipation effect. In addition, since fullerene also has excellent hardness, the fullerene is excellent in durability and hardness of the coating film, so that scratches are hardly generated.

뿐만 아니라 본 발명에서 사용되는 방열성 분말이 분체도료의 체질안료로서의 역할도 하기 때문에 별도의 체질안료를 혼합하지 않아도 되는 장점이 있다.
In addition, since the heat dissipating powder used in the present invention also plays a role as a extender pigment of the powder coating, there is an advantage that does not need to mix a separate extender pigment.

도 1은 본 발명에 따른 분체도료의 방열성 실험사진1 is a heat dissipation test photograph of powder coating according to the present invention

이하에서 도면을 참조하여 본 발명의 바람직한 실시예를 설명한다.Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

본 발명은 수지와, 방열성 분말, 및 기타 첨가제로 이루어진 분체도료이다. 상기 수지는 바인더로서, 사용되는 수지의 종류가 제한되지는 않으나, 내구성 및 내약품성, 내열성이 우수하고, 피도장물에 대한 접착성도 우수한 에폭시수지의 사용이 바람직하다. 더욱이, 에폭시수지는 전기절연성이 우수하기 때문에 전기절연성이 요구되는 피막을 형성하고자 하는 경우에는 에폭시수지의 사용이 더욱 바람직하다. The present invention is a powder coating composed of a resin, a heat dissipating powder, and other additives. Although the resin is a binder, the type of resin used is not limited, but it is preferable to use an epoxy resin that is excellent in durability, chemical resistance and heat resistance, and also excellent in adhesion to a coating object. Moreover, since epoxy resin is excellent in electrical insulation, when it is desired to form a film requiring electrical insulation, the use of epoxy resin is more preferable.

그리고 상기 방열성 분말은 높은 열전도성을 가지는 소재의 분말로서, 본 발명에서는 천매암분말, 플러렌분말, 알루미나분말이 사용된다. The heat dissipating powder is a powder of a material having high thermal conductivity. In the present invention, a natural rock powder, a fullerene powder, and an alumina powder are used.

천매암(phyllite)은 열전도성이 우수할 뿐만 아니라 내부에 나노크기의 미세한 공간들을 많이 형성하고 있어 물리적 흡착력과 화학적 양이온 치환작용 등이 탁월하다. 또한, 천매암에서는 원적외선이 복사되는데, 이러한 원적외선의 복사에너지에 편승하여 해당 제품의 열이 신속하게 방열되기 때문에 천매암은 동일한 수준의 열전도성을 가지는 소재에 비해 한층 더 우수한 방열성을 갖는다. 또한, 천매암의 이온 치환작용에 의해 도막에 탈취기능도 부여된다. Phyllite is not only excellent in thermal conductivity, but also forms a large number of nano-sized spaces inside, and is excellent in physical adsorption and chemical cation substitution. In addition, the far-infrared radiation is radiated in the feldspar, and since the heat of the product is quickly dissipated by the radiation energy of the far-infrared, the feldspar has better heat dissipation than the material having the same level of thermal conductivity. In addition, the deodorizing function is also imparted to the coating film by the ion substitution effect of the dam rock.

풀러렌(fullerene)은 탄소원자가 5각형과 6각형으로 이루어진 축구공 모양으로 연결된 초전도성 분자로서, 내구성과 내열성이 우수할 뿐만 아니라 열전도성도 우수하다. 이러한 풀러렌이 사용됨으로 인해 도막의 방열성이 상승될 뿐만 아니라 도막의 경도도 상승되어 스크랫치가 잘 생기지 않는 품질이 우수한 도막을 얻을 수 있다. 알루미나 역시 내마모성이 우수하고, 내열성, 내식성 역시 우수한 소재이다. 이러한 방열성 분말들은 1~30㎛ 정도의 입도로 분말화되어 사용된다. Fullerene is a superconducting molecule in which carbon atoms are connected in the form of a soccer ball consisting of a pentagon and a hexagon, and have excellent durability and heat resistance as well as excellent thermal conductivity. Due to the use of such fullerenes, not only the heat dissipation of the coating film is increased but also the hardness of the coating film is increased, thereby obtaining a coating film having excellent quality of hardly scratching. Alumina also has excellent wear resistance, heat resistance and corrosion resistance. These heat dissipating powders are powdered to a particle size of 1 ~ 30㎛ used.

한편, 이러한 방열성 분말들은 분체도료 100중량부에 대해 30~60중량부로 혼합되고, 에폭시수지는 35~65중량부로 혼합된다. 방열성 분말이 상기 수준 미만으로 혼합되는 경우에는 이들 성분들에 의한 방열효과가 미미하고, 이들 성분들이 상기 수준을 초과하여 혼합되는 경우에는 상대적으로 수지비율이 낮아져서 분체도료의 도장성이 저하되며, 특히 분체도료의 대표적인 도장방식인 정전스프레이 방법으로 도장하기가 곤란해집니다. On the other hand, these heat dissipating powders are mixed in 30 to 60 parts by weight with respect to 100 parts by weight of powder coating, epoxy resin is mixed in 35 to 65 parts by weight. When the heat dissipating powder is mixed below the level, the heat dissipation effect by these components is insignificant, and when these ingredients are mixed above the level, the resin ratio is relatively low, so that the paintability of the powder coating is deteriorated. It is difficult to paint by electrostatic spray method, which is a typical coating method of powder coating.

상기 천매암과 풀러렌, 알루미나의 혼합비도 적절히 조절되는데, 바람직하게는 방열성 분말 100중량부에 각각 천매암 70~95중량부, 풀러렌 5~30중량부, 알루미나 0.1~5중량부로 혼합된다. The mixing ratio of the feldspar, fullerene, and alumina is also appropriately controlled, and preferably, 70 to 95 parts by weight of the feldspar, 5 to 30 parts by weight of fullerene, and 0.1 to 5 parts by weight of alumina, respectively, in 100 parts by weight of heat dissipating powder.

한편, 이들 방열성 분말들은 체질안료로서의 역할도 하므로, 이들 분말들을 사용함으로 인해 별도로 체질안료를 혼합할 필요가 없다. On the other hand, since these heat dissipating powders also serve as extender pigments, it is not necessary to mix the extender pigments separately by using these powders.

이러한 수지와 방열성 분말 외에도 기타 첨가제들이 분체도료 100중량부에 대해 5~10중량부로 첨가되는데, 이들 첨가제들은 경화제, 분산증진제, 핀홀방지제, 왁스, 레벨링제, 색상안료로서, 일반적인 분체도료에 사용되는 것들이다. In addition to these resins and heat dissipating powders, other additives are added in an amount of 5 to 10 parts by weight based on 100 parts by weight of powder coating. These additives are hardeners, dispersion enhancers, pinhole inhibitors, waxes, leveling agents, and color pigments. Things.

이와 같은 구성을 가지는 본 발명은 다음과 같은 방법으로 제조된다.This invention which has such a structure is manufactured by the following method.

먼저, 방열성 분말들을 배합 비율에 맞추어 믹싱한다. 이때 방열성 분말은 건조된 것을 사용하며, 믹싱과정에서도 수분이 유입되지 않도록 믹싱한다. 이들 방열성 분말들에 수분이 유입되면 방열성 분말들이 쉽게 뭉치게 되어 균일한 혼합이 곤란해진다. 이어서 수지에 혼합된 방열성 분말들과, 전술한 기타 첨가제들을 첨가하여 믹싱한다. 믹싱된 원료혼합물을 용융압출하여 분쇄한다. 분쇄된 분말을 분급하여 입도가 5㎛ 미만인 것과 140㎛ 초과한 것을 분리 제거함으로써, 분체도료가 완성된다.
First, the heat dissipating powders are mixed to the blending ratio. At this time, the heat dissipating powder is dried and mixed so that moisture does not flow in the mixing process. When moisture is introduced into these heat-dissipating powders, the heat-dissipating powders are easily agglomerated, making it difficult to uniformly mix. Then, the heat dissipating powder mixed with the resin and the other additives described above are added and mixed. The mixed raw material mixture is melt-extruded and pulverized. The powder coating is completed by classifying the pulverized powder and separating and removing those having a particle size of less than 5 µm and more than 140 µm.

실시예 1Example 1

경화제가 포함된 에폭시수지 52중량부, 천매암과 풀러렌, 알루미나가 70:28:2의 중량비로 혼합되어 이루어진 방열성 분말 42중량부, 백색안료를 비롯하여 분산증진제, 핀홀방지제, 왁스, 레벨링제를 6중량부로 혼합하여 방열성 분체도료를 제조하였다. 이와 같이 제조된 분체도료로 알루미늄판에 80㎛ 두께의 도막을 형성하고 그 물성을 테스트하였다. 그 결과는 표 1과 같다.52 parts by weight of epoxy resin with curing agent, 42 parts by weight of heat-dissipating powder consisting of a mixture of feldspar, fullerene and alumina in a weight ratio of 70: 28: 2, 6 parts by weight of white pigment, dispersion enhancer, pinhole inhibitor, wax and leveling agent The heat-dissipating powder paint was prepared by mixing the parts. A powder coating film of 80 μm thickness was formed on the aluminum plate with the powder coating thus prepared, and its physical properties were tested. The results are shown in Table 1.

항 목Item 사 양Specification 결과result 비 고Remarks 건조도막 상태Dry coating state 색상, 기포, Levelling 이상 없을 것No color, no bubble, no leveling 이상 없음clear 연필경도Pencil hardness F 이상F or more HH MISUBISHI UNIMISUBISHI UNI CROSS CUTCROSS CUT 100/100100/100 100/100100/100 ERICHSEN 시험ERICHSEN Exam 4mm에서 균열없을 것No crack at 4mm 양호Good 충격성 시험Impact test 500g의 추를 20cm 높이에서
낙하시 도막이 박리되지 않을 것500 g weight at 20 cm height
The film should not peel off during the fall 이상 없음clear Dupont impactDupont impact 내산성 시험Acid resistance test 48시간 침지 후 도막 부풀음,
변색 등 기타 이상이 없을 것Swelling of the film after 48 hours soaking,
No abnormalities such as discoloration 이상 없음clear 5% H2SO4 5% H 2 SO 4 내염수분무 시험Salt Water Spray Test 240시간 시험후 크로스커트 부위 평균 박리 폭이 3mm이내 일 것 After 240 hours of test, the average peel width of the crosscut area should be within 3mm. 이상 없음clear 5% NaCl
Fog/35℃ 5% NaCl
Fog / 35 ℃ 내알칼리성 시험Alkali resistance test 48시간 침지후 도막 부풀음,
변색 등 기타 이상이 없을 것Swelling of the film after 48 hours soaking,
No abnormalities such as discoloration 이상 없음clear 5% NaOH5% NaOH 내비등수성Boiling water resistance 98±2℃ * 1시간 후 양호할 것98 ± 2 ℃ * Good after 1 hour 이상 없음clear

실시예 2Example 2

실시예1에서 제조된 분체도료를 도 1에 게재된 바와 같이, LED방열체의 히트싱크에 도장하고, 4시간 동안 LED 방열체의 전원을 켠 후 시간에 따라 LED 칩 주변 온도, 히트싱크 동일 부위의 표면온도를 측정하였다. 측정결과는 표 2와 같다. As shown in FIG. 1, the powder coating prepared in Example 1 is coated on the heat sink of the LED radiator, and the LED chip ambient temperature and heat sink are the same site over time after the LED radiator is turned on for 4 hours. The surface temperature of was measured. The measurement results are shown in Table 2.

경과시간Elapsed time LED 칩 주변 온도LED chip ambient temperature 히트싱크 온도Heatsink temperature 0:300:30 59.1℃59.1 DEG C 54.2℃54.2 ℃ 1:001:00 63.2℃63.2 ℃ 56.3℃56.3 ℃ 2:002:00 64.5℃64.5 DEG C 58.1℃58.1 ℃ 3:003:00 65.1℃65.1 ℃ 58.5℃58.5 ℃ 4:004:00 65.0℃65.0 DEG C 58.4℃58.4 ℃

비교예 1Comparative Example 1

시중에 시판되는 일반 분체도료를 실시예2에서 사용된 동일한 LED방열체에 도장하고, 동일한 조건으로 실험하였다. 그 결과는 <표 3>과 같다. A commercially available commercial powder coating was applied to the same LED radiator used in Example 2 and tested under the same conditions. The results are shown in <Table 3>.

경과시간Elapsed time LED 칩 주변 온도LED chip ambient temperature 히트싱크 온도Heatsink temperature 0:300:30 74.5℃74.5 DEG C 56.7℃56.7 ℃ 1:001:00 74.3℃74.3 ℃ 55.2℃55.2 DEG C 2:002:00 71.8℃71.8 ℃ 56.4℃56.4 ℃ 3:003:00 74.2℃74.2 ℃ 56.7℃56.7 ℃ 4:004:00 71.3℃71.3 ℃ 57.6℃57.6 ℃

실시예 2와 비교예 1를 비교해 보면, 본 발명에 의한 방열성 분체도료가 적용된 실시예 2의 LED 칩 주변온도가 비교예 1에 비해 최고 15.4℃ 낮았다. 또한, 칩주변의 온도와 히트싱크의 온도차가 적을수록 히트싱크의 방열성이 우수하다 볼 수 있는데, 실시예 2가 비교예 1에 비해 칩주변과 히트싱크의 온도차가 상대적으로 더 낮았다. 이러한 사항들을 종합하여 볼 때 본 발명에 의한 분체도료의 방열성이 우수함을 알 수 있다. Comparing Example 2 with Comparative Example 1, the ambient temperature of the LED chip of Example 2 to which the heat dissipative powder coating according to the present invention was applied was at most 15.4 ° C. lower than that of Comparative Example 1. In addition, the smaller the temperature difference between the temperature around the chip and the heat sink, the better the heat dissipation of the heat sink, Example 2 was relatively lower than the temperature difference between the chip and the heat sink compared to Comparative Example 1. In summary, it can be seen that the heat dissipation of the powder coating according to the present invention is excellent.

Claims (2)

수지와, 방열성 분말을 포함하며, 상기 방열성 분말은 천매암분말과, 풀러렌분말과, 알루미나분말을 포함하여 이루어진 것을 특징으로 하는 방열성 분체도료.
A resin and a heat dissipating powder, wherein the heat dissipating powder is a heat dissipating powder coating, characterized in that it comprises a natural rock powder, a fullerene powder, and an alumina powder.
제1항에 있어서, 상기 수지는 에폭시수지이며, 분체도료 100중량부에 대해 에폭시수지가 35~65중량부, 상기 방열성 분말이 30~60중량부 포함된 것을 특징으로 하는 방열성 분체도료.The heat dissipating powder coating according to claim 1, wherein the resin is an epoxy resin and 35 to 65 parts by weight of the epoxy resin and 30 to 60 parts by weight of the heat dissipating powder with respect to 100 parts by weight of the powder coating.
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WO2000001774A1 (en) 1998-07-03 2000-01-13 International Coatings Limited Powder coating compositions
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KR20070041704A (en) * 2007-03-29 2007-04-19 (주)조인존 A phyllite paint and varnish
JP2009538224A (en) 2006-05-25 2009-11-05 ピーピージー インダストリーズ オハイオ インコーポレーテツド Aqueous dispersions of polymer-encapsulated particles, and related coating compositions and coated substrates

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KR100312961B1 (en) * 1992-11-06 2001-11-14 피터 부이 데이비스 Powder coating compositions and their use
WO2000001774A1 (en) 1998-07-03 2000-01-13 International Coatings Limited Powder coating compositions
JP2009538224A (en) 2006-05-25 2009-11-05 ピーピージー インダストリーズ オハイオ インコーポレーテツド Aqueous dispersions of polymer-encapsulated particles, and related coating compositions and coated substrates
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