KR101262843B1 - Chemical application nozzle and chemical application device using thereof - Google Patents

Abstract

The present invention relates to a chemical liquid applying nozzle and a chemical liquid applying device using the same, the chemical liquid applying nozzle for applying the chemical liquid to the substrate through the lowermost slit, the lower end of the substrate so that the chemical liquid discharged from the slit is not dispersed on the substrate surface A first lip close to the front side of the chemical liquid application direction and a lower end spaced apart from the substrate surface and disposed at a rear side of the chemical liquid application direction so that the chemical liquid discharged from the slit is dispersed on the substrate surface. It provides a chemical liquid applying nozzle and a chemical liquid applying apparatus using the same and the second lip coupled to the first lip. According to the present invention, there is an effect that the chemical liquid can be uniformly applied according to the required set value by preventing the chemical liquid from being dispersed in advance in the site where the application by the chemical liquid on the substrate is to be advanced.

Chemical liquid, application, nozzle, first lip, second lip

Description

Chemical application nozzle and chemical application device using the same

1 is a state diagram of a conventional chemical liquid applying device.

2 is a state diagram of one embodiment of a chemical liquid application nozzle according to the present invention.

Figure 3 is an embodiment separation state of the chemical liquid application nozzle according to the present invention.

Figure 4 is a view of various other embodiments of the chemical liquid application nozzle according to the present invention.

5 is a view showing an embodiment of a chemical liquid applying apparatus using a chemical liquid applying nozzle according to the present invention.

Figure 6 is another embodiment of a chemical liquid applying apparatus using a chemical liquid applying nozzle according to the present invention.

Description of the Related Art [0002]

100: chemical liquid application nozzle 101: supply passage

102: manifold 103: transfer path

110: first lip 120: second lip

130: slit 131: small chamber

141, 142: extension part 200: control material

210: notch groove 220: adjustment hole

230: adjusting screw 300: supply unit

400: loading unit 500: driving equipment

600: transfer unit

The present invention relates to a chemical liquid applying nozzle and a chemical liquid applying device using the same, and more particularly, to a chemical liquid applying nozzle for applying the chemical liquid to the substrate surface and a chemical liquid applying apparatus using the same.

In general, a photoresist is coated by applying a photoresist to a thin film of a substrate to realize a predetermined circuit pattern, the photoresist is exposed in correspondence with a circuit pattern, and a series of developing and removing exposed or unexposed areas are developed. The process is called photolithography or photolithography.

In order to proceed with such a photo process, a chemical liquid applying apparatus for applying a photoresist to a substrate by a spinless coating method (or a slit coating method) or a developer to a substrate has been proposed.

For example, in the conventional chemical liquid applying apparatus, a chemical liquid applying nozzle having a slit for discharging the chemical liquid in a direction crossing the substrate while supporting the substrate on a surface plate is perpendicular to the direction in which the slit is formed. It may be exemplified to apply a photosensitive liquid to the surface of the substrate through the slit while traveling on.

As another example, the conventional chemical liquid applying apparatus may be exemplified by the continuous transfer of the substrate in one direction by the transfer substrate and applying the chemical liquid to the upper surface of the substrate to be transferred in one direction by installing the chemical liquid applying nozzle above the substrate transfer path. .

Such a conventional chemical liquid applying apparatus is most ideal to uniformly apply the chemical liquid to the entire surface of the substrate, it will be described in detail with reference to the accompanying conventional chemical liquid applying apparatus as follows.

1 is a state diagram of a conventional chemical liquid applying device.

Referring to FIG. 1, a conventional chemical liquid applying apparatus includes a chemical liquid applying nozzle 20 in which a transfer part 10 for horizontally transferring the substrate S in one direction and a slit 22 for applying the chemical liquid to the substrate S are formed. do.

The chemical liquid application nozzle 20 passes the chemical liquid supplied therein along the transfer passage 21 formed in the structure bent several times therein and then is applied to the surface of the substrate S through the lowermost slit 22. do.

Therefore, the chemical liquid application nozzle 20 stabilizes the pressure and flow rate of the chemical liquid and transfers the chemical liquid because the transport path of the chemical liquid is further extended by the transfer passage 21 formed by bending several times.

On the other hand, the chemical liquid applying nozzle 20 of the conventional chemical liquid applying apparatus has a coating property to be dispersed in the front and rear of the chemical liquid application direction relative to the slit 22 when the liquid chemical is applied to the substrate through the slit 22 Have.

Therefore, since the chemical liquid application nozzle of the conventional chemical liquid application device generates a result of dispersing the chemical liquid in front of the chemical liquid application direction, that is, the site where the application of the chemical liquid on the substrate is to proceed in advance, it is preferable to apply the chemical liquid uniformly according to the required setting value. There was a disadvantage that it was not easy.

In view of the above problems, an object of the present invention is to provide a chemical liquid applying nozzle and a chemical liquid applying device using the same, which can prevent the chemical liquid from being dispersed in the chemical liquid application direction on the substrate.

Still another object of the present invention is to provide a chemical liquid applying nozzle capable of stabilizing pressure and flow rate before applying the chemical liquid to the substrate at the discharge end of the slit, and a chemical liquid applying device using the same.

The chemical liquid application nozzle of the present invention for achieving the above object, in the chemical liquid application nozzle for applying the chemical liquid to the substrate through the lowermost slit, so that the chemical liquid discharged from the slit has a gap so as not to be dispersed on the surface of the substrate. A first lip having a lower end spaced upward from a substrate surface and installed in front of the chemical liquid application direction; And a second lip having a lower end spaced further upward from the substrate surface than the lower end of the first lip so that the chemical liquid discharged from the slit is dispersed on the substrate surface, and installed at a rear side of the chemical liquid applying direction and coupled to the first lip. To include, wherein the slit is characterized in that it further comprises a small chamber that is curved toward the first lip or the second lip side of the discharge end thereof.

In addition, the chemical liquid applying apparatus of the present invention includes a transfer unit for transferring a substrate, the chemical liquid application nozzle for applying the chemical liquid to the substrate transferred along the transfer unit, and a supply unit for supplying the chemical liquid to the chemical liquid application nozzle.

In addition, the present invention chemical application device, the loading portion is loaded with the substrate, the chemical liquid application nozzle for applying the chemical liquid while traveling in one direction on the surface of the substrate loaded and stopped or transported to the loading portion, and the chemical liquid application nozzle And a supply unit for supplying a chemical liquid to the chemical liquid applying nozzle.

Hereinafter, various embodiments of the chemical liquid applying nozzle according to the present invention will be described in detail with reference to the accompanying drawings.

≪ Example 1 >

Figure 2 is a first embodiment of the chemical liquid application nozzle according to the present invention, Figure 3 is a first embodiment of the chemical liquid application nozzle according to the present invention.

2 and 3, the first embodiment of the chemical liquid application nozzle according to the present invention has a low stage substrate S such that the chemical liquid discharged from the slit 130 is not dispersed on the surface of the substrate S. The first lip 110 spaced upward from the surface and installed in the front of the chemical liquid application direction, and the lower end of the first lip 110 so that the chemical liquid discharged from the slit 130 is dispersed on the surface of the substrate S. A second lip 120 is further spaced apart (h) from the surface of the substrate (S) than the lower end of the substrate and installed in the rear of the chemical liquid application direction and coupled to the first lip (110).

That is, since the lower ends of the first lip 110 and the second lip 120 are formed to be different from each other from the surface of the substrate S, the front and rear sides of the slit 130 of the chemical liquid application nozzle 100 are different. The amount of the chemical liquid dispersed on the surface of the substrate (S) can be adjusted differently.

In particular, in the chemical liquid applying nozzle 100 according to the first embodiment, the chemical liquid applied in the slit 130 is dispersed only at the lower end of the second lip 120, and is not dispersed at the lower end of the first lip 110. .

In addition, the chemical liquid applying nozzle 100 according to the first embodiment includes a supply passage 101 for receiving a chemical liquid to be applied to the substrate S, and a manifold for temporarily storing the chemical liquid communicated with the supply passage 101. The fold 102 and the manifold 102 and the slit 130 preferably further comprises a transfer passage 103 for communicating.

Furthermore, the chemical liquid applying nozzle 100 according to the first embodiment preferably further includes an exhaust passage 104 for stabilizing the pressure in the manifold 102 and exhausting the fume.

In the first embodiment, the chemical liquid application nozzle 100 is transferred from the rear to the front while the substrate S is fixed, and the chemical liquid application nozzle 100 may be considered. In this fixed state, the substrate S may be transferred from the front to the rear and the chemical liquid may be applied onto the substrate S. The chemical liquid applying nozzle 100 may be transferred from the rear to the front, and at the same time, the substrate S may be considered. It is also conceivable to transfer the chemical liquid onto the substrate S while transferring from front to back.

However, the chemical liquid application nozzle 100 is transferred from the front to the rear in the state in which the substrate S is fixed, and the chemical liquid is applied onto the substrate S, or the substrate S is fixed in the state where the chemical liquid application nozzle 100 is fixed. The chemical liquid is applied on the substrate S by transferring from the rear to the front, or the chemical liquid applying nozzle 100 is transferred from the front to the rear while the substrate S is transferred from the rear to the front and the chemical liquid is transferred onto the substrate S. Application is not possible because the chemical liquid pre-coated on the substrate S is in contact with the lower end of the first lip 110.

Therefore, the absolute direction in which the chemical is applied on the surface of the substrate S based on FIG. 2 is applied from the rear to the front.

As described above, when the chemical liquid is applied in the absolute direction, ie, the rear of the chemical liquid is applied to the surface of the substrate S, the chemical liquid is not dispersed in the front of the chemical liquid applying nozzle 100, that is, the lower end of the first lip 110. The chemical liquid is dispersed only at the rear of the chemical liquid applying nozzle 100, that is, at the lower end of the second lip 120.

Therefore, the chemical liquid application nozzle 100 prevents the chemical liquid from being sprayed in the forward direction of the chemical liquid application direction, thereby preventing the chemical liquid from being applied to the site where the chemical liquid is to be applied on the substrate S in advance, and uniformly applying the chemical liquid according to the required setting value. There is an advantage to this.

In the above, it is preferable that the slit 130 further includes a small chamber 131 which is curved toward the first lip 110 or the second lip 120 at its discharge end. The small chamber 131 has the advantage of improving the coating uniformity by stabilizing the pressure and flow rate before the chemical liquid is applied to the substrate S by temporarily storing the chemical liquid supplied through the transfer passage 103.

In the above, it is preferable that the second lip 120 further includes an adjusting base 200 which can adjust the degree of separation between its lower end and the substrate S.

The adjusting base 200 is a cut groove 210 is formed in the second lip 120 is cut, the control hole 220 is formed across the cut groove 210 on the outer surface of the second lip 120 and Adjusting screw 230 for adjusting the separation of the lower end of the second lip 120 and the substrate (S) by expanding or contracting the gap of the notch groove 210 by inserting the adjustment hole 220 by the spiral operation. It includes.

The adjusting base 200 extends or contracts the interval of the notch groove 210 by rotating the adjusting screw 230 in the forward or reverse direction, and finally, the bottom end of the second lip 120 and the substrate S. The interval can be adjusted.

Therefore, the second lip 120 is controlled by the adjusting substrate 200 so that the distance between the lower end and the substrate (S) is controlled, so that the chemical liquid is applied to the substrate (S) to be able to adjust the desired thickness of the beads to be formed. There is an advantage.

<Example 2>

Figure 4 is a second embodiment of the chemical liquid application nozzle 100 in accordance with the present invention. Here, the same reference numerals as in the above-described drawings indicate members having the same function.

Referring to FIG. 4, the second embodiment of the chemical liquid applying nozzle 100 according to the present invention further includes extensions 141 and 142 in the same configuration as that of the first embodiment.

The extension parts 141 and 142 are components extending horizontally from the lower end of the second lip 120, and contact the surface of the chemical liquid applied to the substrate S at the lower end of the second lip 120. ) Has the advantage of determining the shape of the bead finally formed on the surface.

For example, as shown in the extension 141 shown in (a) of FIG. 4, the bottom may be horizontally extended and rounded at the final end, and as shown in the extension 142 shown in (b) of FIG. 4. The bottom may be formed to extend only horizontally.

Hereinafter, various embodiments of a chemical liquid applying apparatus using a chemical liquid applying nozzle according to the present invention will be described in detail with reference to the accompanying drawings.

&Lt; Example 1 >

5 is a view showing an embodiment of a chemical liquid applying apparatus using a chemical liquid applying nozzle according to the present invention. Here, the same reference numerals as in the above-described drawings indicate members having the same function.

Referring to FIG. 5, a chemical liquid applying apparatus using a chemical liquid applying nozzle according to the present invention is configured to apply a chemical liquid to a substrate 600 transferred along a transfer part 600 and a transfer part 600. A chemical liquid application nozzle 100 and a supply unit 300 for supplying a chemical liquid to the chemical liquid application nozzle 100.

The transfer unit 600 may include a plurality of substrate transfer shafts installed along the substrate transfer path, and transfer the substrate S loaded on the upper surface in one direction. In FIG. 5, the substrate S is transported from the front to the rear.

Therefore, the chemical liquid application nozzle 100 applies the chemical liquid supplied from the supply unit 300 to the surface of the substrate (S).

In particular, since the chemical liquid application nozzle 100 disperses the chemical liquid only in the rear of the chemical liquid application direction without dispersing the chemical liquid in the front of the chemical liquid application direction, there is an advantage that the chemical liquid can be uniformly applied according to the required set value.

In addition, although the chemical liquid applying nozzle 100 may be fixedly installed in the first embodiment, the chemical liquid applying nozzle 100 may be configured to apply the chemical liquid while traveling in the reverse direction with respect to the substrate transfer direction. As described above, when the chemical liquid applying nozzle 100 is applied in the direction of traveling in the reverse direction with respect to the substrate transfer direction, the chemical liquid can be applied to the substrate S, thereby reducing the time required for the chemical liquid to be applied.

<Example 2>

Figure 6 is another embodiment of a chemical liquid applying apparatus using a chemical liquid applying nozzle according to the present invention. Here, the same reference numerals as in the above-described drawings indicate members having the same function.

Referring to FIG. 6, a second embodiment of a chemical liquid applying apparatus using a chemical liquid applying nozzle according to the present invention is loaded with a substrate 400 on which a substrate S is loaded, and is loaded or stopped on the loading portion 400. The chemical liquid application nozzle 100 which travels in one direction on the surface of the substrate S to be applied and applies the chemical liquid, the driving substrate 500 which runs the chemical liquid application nozzle 100 in one direction, and the chemical liquid supply nozzle 100. It includes a supply unit 300 for supplying a chemical liquid.

The loading unit 400 may include, for example, a surface plate for supporting the bottom surface of the substrate S. The substrate S may be loaded or unloaded by a separate transfer material (not shown). In the second embodiment, the substrate S is loaded and stopped, but it may be configured to transfer the substrate S in one direction.

The traveling substrate 500 may include, for example, a linear motor installed toward the loading unit 400, and drives the chemical liquid applying nozzle 100 in one direction on the substrate S. Therefore, the chemical liquid applying nozzle 100 is supported by the traveling substrate 500 and travels in one direction on the substrate S loaded on the loading part 400 to apply the chemical liquid.

In particular, since the chemical liquid application nozzle 100 disperses the chemical liquid only in the rear of the chemical liquid application direction without dispersing the chemical liquid in the front of the chemical liquid application direction, there is an advantage that the chemical liquid can be uniformly applied according to the required set value.

The present invention has been shown and described with reference to certain preferred embodiments, but the present invention is not limited to the above-described embodiments and has ordinary skill in the art to which the present invention pertains without departing from the concept of the present invention. Various changes and modifications are possible by the user.

As described above, the present invention prevents the chemical solution from being sprayed in the forward direction of the chemical liquid application direction, thereby preventing the chemical liquid from being applied to the site where the chemical liquid is to be applied on the substrate in advance, so that the chemical liquid can be uniformly applied according to the required setting value. It works.

In addition, the present invention, by temporarily storing the chemical liquid in the small chamber of the slit discharge stage, the pressure and flow rate is stabilized before the chemical liquid is applied to the substrate, thereby improving the coating uniformity.

In addition, the present invention, since the degree of separation between the bottom end of the second lip and the substrate is controlled, there is an effect that can be adjusted to the desired thickness of the bead is finally formed by applying the chemical to the substrate.

Claims (7)

In the chemical liquid application nozzle for applying the chemical to the substrate through the bottom slit, A first lip having a lower end spaced upward from the substrate surface so as to have an interval such that the chemical liquid discharged from the slit is not dispersed on the substrate surface and installed in front of the chemical liquid application direction; And A second lip having a lower end spaced further upward from a substrate surface than a lower end of the first lip so that the chemical liquid discharged from the slit is dispersed on the substrate surface and installed at a rear side of the chemical liquid applying direction and coupled to the first lip; Including, And the slit further comprises a small chamber formed at the discharge end thereof to be curved toward the first lip or the second lip. delete The method of claim 1, The second lip further comprises an extension extending horizontally at its lower end. delete The method of claim 1, The second lip further includes an adjusting substrate that can adjust the degree of separation between the lower end and the substrate, The adjuster is, A notch groove notched in the second lip; An adjusting hole formed across the cutout groove at an outer surface of the second lip; And And a control screw inserted into the adjusting hole to adjust the separation distance between the bottom end of the second lip and the substrate by expanding or contracting the gap between the notches. A transfer unit transferring a substrate; A chemical liquid applying nozzle of any one of claims 1, 3, and 5 for applying a chemical liquid to a substrate to be transported along the conveying part; And A chemical applying device comprising a supply for supplying a chemical to the chemical applying nozzle. A loading unit in which a substrate is loaded; A chemical liquid applying nozzle of any one of claims 1, 3, and 5, wherein the chemical liquid is applied to the surface of the substrate that is loaded on the loading unit and stops or is transported in one direction; A driving material for driving the chemical liquid applying nozzle in one direction; And A chemical applying device comprising a supply for supplying a chemical to the chemical applying nozzle.

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