KR101260793B1 - Ｋ1Ａ1 Tank Thermal Imaging Periscope - Google Patents

Abstract

Reliability of tank operation by real-time visibility of obstacles in front of tanks by real-time visibility of the vehicle using the thermal periscope and judging obstacles in the image, by generating warning sounds of the display and alarm to the operator. A K1A1 tank thermal periscope is proposed that provides the accuracy and accuracy of the thermal periscope and protects the thermal periscope from shells when performing tank missions.

The proposed K1A1 tank thermal periscope has a thermal imaging camera unit for detecting the front image during the day and night, a housing unit protecting the thermal imaging camera unit, a display unit displaying the thermal imaging unit image and obstacle detection information, and a thermal And a control unit for supplying power to the image camera unit and the display unit, and a control unit for controlling the thermal imaging camera unit and the power unit.

Laceration, periscope, tram, K1A1

Description

Ｋ1A1 Tank Thermal Imaging Periscope}

The present invention relates to a K1A1 tank thermal periscope, and more particularly, to a technology for sensing and expressing an image of a vehicle to a driver of a vehicle in front of the vehicle.

In the K1A1 tank periscope, the periscope required perception of the obstacles and manual countermeasures during the day and night tram operation of the tank driver.

In order to supplement the problem of the manual countermeasure, there is a technology in which a camera is mounted on the front of the tank to check the image of the front, but only the manual information of the driver is required during the electronic driving by expressing only the image information. There was a problem that the visibility in front of the tank was not secured during operation.

In addition, there was a problem with the waterproof and bulletproof function of the periscope.

The present invention was made to solve the above problems,

An object of the present invention is to secure the front view using the thermal periscope during daytime and nighttime operation of the tank, and to determine the obstacles in the image to express the presence of obstacles in front of the tank by generating the alarm sound of the display unit and the alarm to the driver in real time. This provides the reliability and accuracy of the tram operation.

Another object of the present invention is to protect the thermal periscope from the shell during the tank mission by adding the waterproof and bulletproof function of the thermal periscope.

K1A1 tank thermal periscope according to one aspect of the present invention for achieving the above object,

A thermal imaging camera unit for detecting a front image during the day and at night, a housing unit protecting the thermal imaging camera unit, a display unit displaying images and obstacle detection information of the thermal imaging camera unit, a thermal imaging unit and the display unit It includes a power supply unit for supplying power to the thermal imaging camera unit and a control unit for controlling the power supply unit.

The thermal imaging camera unit generates an image signal of the image received from the non-cooling bolometer detector and noise reduction, and a non-cooling bolometer detector that converts the front image into an output image size of 320 × 240. It includes a thermal imaging board unit for detecting the obstacle.

The thermal imaging board unit includes a preprocessing board module for preprocessing an image received from an uncooled bolometer detector, and a postprocessing board module for transmitting obstacle detection and obstacle detection information of the preprocessed image to the display unit.

The preprocessing board module includes a digital signal processor (DSP) for generating an image signal of an uncooled bolometer detector, a network control unit (NCU) for removing non-uniformity, a filter unit for removing noise, It includes a field programmable gate array (FPGA) chip that transmits the image received from the uncooled bolometer detector to the post-processing board module.

The post-processing board module smoothes and binarizes the pre-processed image data, and transmits the obstacle processing unit to classify the boundary line between the objects of the pre-processed image and the boundary line division information between the objects of the image pre-processed by the obstacle processing unit to the display unit. It includes a communication unit.

The housing portion includes an inner housing module that has a ballistic protection function to protect the thermal imaging camera portion from rifle grenade and grenade fragments and an outer housing module that is external to the inner housing module.

The inner housing module is a metal material, characterized in that the aluminum 6061 material.

The outer housing module is a metal material, characterized in that the titanium grade 3 material.

The controller may control the brightness of the thermal imager and the operation of the power supply.

The display unit and the control unit are located close to each other, characterized in that sharing power inside.

It further comprises an alarm for generating an alarm when detecting an obstacle in the obstacle processing unit.

According to the present invention, during the daytime and night driving of the K1A1 tank, it is possible to confirm the visibility of the operator and the obstacle determination information of the thermal periscope.

In addition, the waterproof and bulletproof features of the thermal periscope can be added to protect the thermal periscope from shells during tank missions.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

Infrared sensors can be divided into photon and thermal according to the principle of operation, which is mainly a semiconductor material, which has good characteristics but has the disadvantage of operating at liquid nitrogen temperature (-193 ℃). Thermal materials have slightly lower performance than semiconductors, but have the advantage of operating at room temperature. Therefore, quantum materials that require cooling are mainly studied for military purposes, and non-cooled thermal materials are mainly used for civil water. Thermal infrared sensors are generally divided into three types: bolometer, thermocouple, and pyroelectric type. Pyroelectric sensors have good detection power but limited production, while bolometers and thermocouples have lower detection power than pyroelectric type, but are manufactured in monolithic on silicon wafers with detector circuits, which are widely developed for civilian use because of their high productivity. Among them, the bolometer-type infrared sensor measures the change in electrical resistance due to the temperature rise caused by absorbing infrared rays emitted from an object and converting it into thermal energy.

1 is a schematic configuration block diagram of a K1A1 tank thermal periscope according to an embodiment of the present invention, Figure 2 is a schematic configuration block diagram of the thermal imaging camera unit of the K1A1 tank thermal periscope shown in Figure 1, Figure 3 1 is a schematic block diagram illustrating the thermal imaging board of the K1A1 electric vehicle periscope shown in FIG. 1, FIG. 4 is a schematic block diagram illustrating the pre-processing board module of the K1A1 electric vehicle periscope shown in FIG. 1, and FIG. A schematic block diagram of the post-processing board module of the K1A1 tank thermal periscope shown in FIG.

1 to 5, the K1A1 tram thermal imaging telescope according to an embodiment of the present invention includes a control unit 100, a power supply unit 200, a thermal imaging camera unit 300, and a display unit 400.

The thermal imaging camera unit 300 detects an image of an object (hereinafter, referred to as an “obstacle”) existing in front of the tank while the tram is running at the stock price and at night. The image camera unit 300 includes a bolometer detector 310 and a thermal image board unit 320.

The bolometer detector 310 converts the image acquired from the thermal imaging camera unit 300 into a predetermined size. For example, a focal plane array bolometer detector that converts to a size of 320 × 240 may be used. The non-cooling method is an infrared sensor method that detects a change in electrical characteristics according to temperature change of a material due to absorbed light energy. A bolometer is a resistance thermometer used for measuring radiation. The detector uses a metal or a semiconductor having a property of increasing temperature and changing electrical resistance when subjected to radiation. In addition to gold and semiconductors, superconductors and dielectrics may be used as the detector, and the surface may be blackened or formed in a thin film form in order to increase absorption.

In addition, in order to increase sensitivity and improve responsiveness, the bolometer structure can be miniaturized or embedded in a vacuum container. As described above, the uncooled bolometer detector 310 is a device that uses a change in dielectric constant or a resistance according to temperature change.

The thermal image board unit 320 generates an image signal from the image received from the bolometer detector 310, removes noise before undergoing an image processing process, and detects an obstacle. In addition, the uncooled bolometer detector 310 is driven to generate an image signal of an image detected by the bolometer detector 310. The uncooled method is an infrared sensor method that detects a change in electrical properties due to the temperature change of the material due to absorbed light energy.The borosimetry is a resistance thermometer used to measure radiation.The temperature increases when the radiation is received and the electrical resistance changes. A metal or a semiconductor is used as a detector.

In addition to gold and semiconductors, superconductors and dielectrics may be used as the detector, and a black surface or a thin film may be formed in order to increase absorption. Also, in order to increase sensitivity and improve responsiveness, the bolometer structure can be miniaturized or embedded in a vacuum container. Therefore, the uncooled bolometer detector 310 is a device using a change in dielectric constant or a change in resistance according to temperature change.

The thermal image board unit 320 further includes a post-processing board module 323 for transmitting obstacle detection information of the image preprocessed by the pre-processing board module 321 to the display unit 400.

To drive the uncooled bolometer detector 310, a field programmable gate array (FPGA) chip 321-5 may be used to stabilize the system and apply user requirements. In addition, the thermal imaging board is implemented using a VHDL (Very High Speed Integrated Circuits Hardware Description Language) used to automate the design of digital circuits.

The control signal of the bolometer detector 310 is generated by using a digital signal processor (DSP) and an advanced reduced instruction set computer machine (ARM). The collision can be prevented. In addition, by using the FPGA 321-5, it is possible to correct errors in the image detected by the thermal imaging camera while the vehicle is in operation.

The preprocessing board module 321 includes a DSP, a network control unit (NCU) 321-1, a filter unit 321-3, and an FPGA chip 321-5. The DSP generates an image signal of the uncooled bolometer detector 310. The NCU 321-1 removes the nonuniformity, the filter unit 321-3 removes the noise, and the FPGA 321-5 receives the image received from the uncooled bolometer detector 210 after processing the board module 323. To send).

The post-processing board module 323 smoothes the preprocessed image data and performs a binarization process. Through this, the boundary between the objects is extracted from the preprocessed image, and the boundary between the objects is recognized and displayed on the display unit 400 to avoid collision of the tank. The boundary line extraction between objects is performed by the obstacle processing unit 323-1 included in the post-processing board module 323. In addition, the post-processing board module 323 includes an obstacle detection algorithm chip (not shown) having a database including human information and object information, and the obstacle detected by the uncooled bolometer detector 310 and the database. Compares people information and things information stored in 60% or more and sends an alarm signal to the alarm.

The housing part (not shown) includes an inner housing module 600 having a bulletproof function to protect the thermal imaging camera part 300 from the grenade and grenade fragments, and an outer housing module (not shown) that is external to the inner housing module 600. It includes. In addition, the housing portion (not shown) may be manufactured to a thickness of 10mm on the front side and 4mm on the side to protect from the impact of the rifle and grenades fragments. The inner housing module 600 is made of a metal material, aluminum 6061 material, the outer housing module (not shown) is a metal material, using a titanium grade 3 material.

In addition, a shock absorber of a rubber or a spring may be mounted inside the thermal imaging camera unit 300 so as to cushion the thermal imaging camera unit 300 from external vibration and shock. On the other hand, for the waterproofing of the thermal imaging camera unit 300, a sealing means, such as rubber sealing, can be completely sealed to the outside using a sealing means, such as rubber sealing, to increase the pressure inside the assembly of the thermal imaging camera. You can also use The rubber sealing may be a silicone rubber to prevent wear due to lubricating oil used in the tank, heat or water generated during operation of the tank, and to prevent shape deformation of the rubber sealing itself.

The controller 100 controls the brightness of the thermal imaging camera unit 300 and whether the power supply unit 200 is operated.

The assembly of the thermal imaging camera unit 300 and the housing unit (not shown) is designed to allow the operator to manually rotate inside the K1A1 tank. Since the keypad is installed inside the K1A1 tank, the K1A1 tank operator can control the thermal imaging camera unit 300, the power supply unit 200, and the display unit 400. Control the brightness of the thermal imaging camera unit 300 and the power supply unit 200 displayed on the display unit 400 through the keypad, and set the on or off of the alarm sound generated when the obstacle display area is set or the obstacle is detected. Can be.

The display unit 400 and the control unit 200 are disposed close to each other so that the two equipments share the transformer inverter. By sharing the power supply, the power supply unit 200 cable, the control unit 200 cable, or the display unit 400 cable is composed of one integrated connector, thereby simplifying inverter requirements and wiring.

The integrated connector is connected to the thermal imaging camera unit 300 and the central axis of rotation located in the lower portion of the housing (not shown) assembly. The central axis of rotation is designed in the direction of the cockpit of the K1A1 tank. An inner material and an outer covering of the integrated connector may prevent electromagnetic interference (EMI).

The obstacle processing unit 323-1 may include an alarm that generates an alarm sound when an obstacle is detected through the thermal imaging camera unit 300, and may be turned on or off using the keypad.

The external dimensions of the assembly of the thermal imaging camera unit 300 and the housing unit according to the present invention are suitable for a stacked narrow camera having a size of 70 mm × 75 mm × 110 mm in consideration of the case where the cover is rotated by 90 °. The thermal imaging camera unit 300 having a pixel size of 25 μm, the housing unit (not shown) mounted on the side of the thermal imaging camera unit 300, and the side cabling space are included in the assembly 70 mm, the width of the external standard of the assembly, and the thermal imaging camera. The maximum allowable width of the part 300 should not exceed 45 mm. The side cabling space is 4mm, and the space except the maximum allowable width of the side cabling space and the thermal imaging camera unit 300 is a housing outer wall to protect the sides and the front surface of the assembly from grenades and rifles. The upper portion of the assembly is a space of the thermal imaging camera unit 300. In addition, the lower part of the assembly is an integrated connector space, and serves as a rotation axis when the assembly is rotated. The rotating shaft should have a diameter close to the upper width to maintain the robustness against foam shock and driving vibration.

The thermal imaging camera assembly 600 according to the present invention is composed of an assembly of various components housing the thermal imaging camera unit 610. The thermal imaging camera assembly 600 may include a rectangular parallelepiped inner housing assembly 620 having an open surface for housing the thermal imaging camera unit 610 and the thermal imaging camera unit 610 from the outside, and the inner housing assembly 620. It includes a back cover 640 covering the open one side.

The front surface of the inner housing assembly 620 is bolted to the thermal imaging camera window 630 with the thermal imaging camera window cover 631, the rubber sealing 632 is attached along the outer peripheral surface of the thermal imaging camera window 630 is sealed Used as a means.

The front surface of the thermal imaging camera window cover 631 is equipped with a front protective cover 670 made of titanium. The rear cover 640 may be a 10mm thick aluminum 6061 material, the front bulletproof cover 670 may be a titanium grade 3 material of 2mm thickness.

The camera window 630 of the thermal imaging camera assembly 600 according to the present invention has a diameter of 35.6 mm and a thickness of 2 mm, and the sealing rubber ring 632 may be manufactured to a thickness of 2 mm, and the coupling of the camera window 630 may be performed. The sealing rubber ring 632 is coupled by making a groove having a depth of 1.5 mm along the outer circumferential surface of the camera window 630 of the inner housing assembly 620 to facilitate and increase the sealing property.

Meanwhile, since the thermal imaging camera unit 620 is mounted to the sliding rail mount 660 and fastened to the inner housing body 620, the inner housing assembly 620 includes a sliding rail mount 660 space. The space of the sliding rail mount 660 is to arrange a round rail groove on the side of the inner housing assembly 620, and to form a protrusion on the front of the inner housing assembly 620, and to couple the buffer rubber ring 661 to the protrusion. do.

The space where the thermal imaging camera unit 610 is fastened and the integrated connector 690 and the cable 651 are fastened

Fixed to the sliding rail mount 660 and then coupled to the sliding rail mount module 660 space. The sliding rail mount 660 buffers vibration in the front and rear directions while moving along the sliding rail groove in a state in which the thermal imaging camera unit 610 is coupled.

The sliding rail mount 660 according to the present invention is coupled to the thermal imaging camera unit 610 and is equipped with a buffer rubber ring 661 that absorbs shock during assembly or assembly with the inner housing assembly 620. The sliding rail mount 660 has a 3 mm space in the front of the inner housing assembly 620 and in front of the lens of the thermal imaging camera unit 300 so as not to interfere with the shutter operation of the thermal imaging camera unit 610.

Four flat head bolts penetrated under the sliding rail mount 660 and the thermal imaging camera unit 610 are coupled, and three small adapters are disposed on the side of the thermal imaging camera unit 610 and one medium adapter is arranged on the rear side. It is. Through the small adapter and the medium adapter, the control signal transmission, power supply, or video transmission of the thermal imaging camera unit 610 may be performed. The outer side, top protective cover configuration includes a 2 mm thick side, top protective cover module 680, and an aluminum inner housing 681 made of titanium Grade 3 material.

The configuration of the front bulletproof cover according to the present name includes a 4mm-thick front bulletproof cover 670 which is a titanium grade 3 material. The configuration of the back cover according to the embodiment of the present invention includes a 10mm thick back cover 640 made of aluminum 6061.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalents thereof are included in the scope of the present invention Should be interpreted.

1 is a schematic block diagram of a K1A1 tank thermal periscope according to an embodiment of the present invention.

2 is a schematic structural block diagram of a thermal imaging camera unit according to an embodiment of the present invention.

3 is a schematic block diagram of a thermal image board unit according to an exemplary embodiment of the present invention.

4 is a schematic structural block diagram of a pretreatment board module according to an embodiment of the present invention.

5 is a schematic structural block diagram of a post-processing board module according to an embodiment of the present invention.

6A is a schematic structural assembly diagram of an inner housing module according to an embodiment of the present invention.

6B is a schematic structural assembly diagram of an inner housing module according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: control unit 200: power supply unit

300: thermal imaging camera unit 310: uncooled bolometer detector

320: thermal image board unit 321: pretreatment board module

321-1: Network control unit 321-3: Filter unit

321-5: Field Programmable Gate Array Chip 323: Post-Processing Board Module

323-1: Obstacle Handling Unit 323-3: Communication Unit

400: display unit 600: internal housing module

610: thermal imaging camera unit 620: inner housing body

630: camera window 631: camera window cover

632: sealed rubber ring 640: rear cover module

650: integrated connector 651: cable

660: sliding rail mount module 661: cushioning rubber ring

670: front protective cover module 680: top protective cover module

681: Aluminum Inner Housing

Claims (11)

A thermal image camera unit for detecting an image in front of the day and night, a housing unit for protecting the thermal image camera unit, a display unit for displaying images and obstacle detection information of the thermal image camera unit, and the thermal image camera unit; In the K1A1 tank thermal periscope including a power supply unit for supplying power to the display unit and a control unit for controlling the thermal imaging camera unit and the power supply unit, The thermal imaging camera unit A focal plane array bolometer detector for converting the front image into an output image size of 320 × 240; And K1A1 tank thermal periscope characterized in that it comprises ;; the image signal generation and noise removal of the image received from the uncooled bolometer detector, the thermal image board unit for detecting the obstacle. delete The thermal imaging board unit of claim 1, wherein the thermal image board unit is used. A preprocessing board module for preprocessing the image received from the uncooled bolometer detector; And And a post-processing board module configured to transmit the obstacle detection of the pre-processed image and the obstacle detection information to a display unit. The method of claim 3, wherein the pretreatment board module A digital signal processor (DSP) for generating an image signal of the uncooled bolometer detector and a network control unit (NCU) for removing unevenness; A filter unit for removing noise; And And a field programmable gate array (FPGA) chip for transmitting the image received from the uncooled bolometer detector to the post-processing board module. The post-processing board module of claim 3, wherein An obstacle processing unit which smoothes and binarizes the preprocessed image data and classifies boundaries between objects of the preprocessed image; And And a communication unit configured to transmit boundary separation information between objects of the preprocessed image to the display unit in the obstacle processing unit. The method of claim 1, wherein the housing portion An inner housing module having a bulletproof function to protect the thermal imaging camera unit from rifle and grenades debris; And K1A1 tank thermal periscope, characterized in that it comprises; an outer housing module in addition to the outside of the inner housing module. The method of claim 6, wherein the inner housing module K1A1 tank thermal periscope, characterized in that the material is aluminum 6061 material. The method of claim 6, wherein the outer housing module K1A1 tank thermal periscope, characterized in that the material is a titanium grade 3 material. The method of claim 1, wherein the control unit K1A1 tank thermal periscope, characterized in that for controlling the brightness of the thermal imaging unit and the operation of the power unit. delete The method of claim 5, K1A1 tank thermal periscope further comprises an alarm for generating an alarm sound when the obstacle is detected in the obstacle processing unit.

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