KR101242180B1 - Multi-functional electric module housing - Google Patents

Abstract

PURPOSE: A multifunctional electronic module housing is provided to prevent the corrosion of an electronic module by minimizing dew condensation and moisture inside by having a protection filter for discharging moisture inside the housing. CONSTITUTION: An electronic module is mounted on an internal fixing frame of an inner cover. An outer cover(200) is combined with the inner cover. A gasket(500) is combined with the upper and lower parts of the outer cover. An upper cover(300) and a lower cover(400) are combined with the gasket. A protection filter for controlling the pressure and moisture of inside is combined with an upper surface of the upper and lower covers.

Description

Multifunctional Electronic Module Housing {MULTI-FUNCTIONAL ELECTRIC MODULE HOUSING}

The present invention includes an inner cover to which the electronic module is mounted on an inner fixing frame, an outer cover coupled to the inner cover, a gasket coupled to upper and lower portions of the outer cover, an upper cover and a lower cover coupled to the gasket, and the inner cover and The outer cover relates to a multifunctional electronic module housing, wherein the upper cover is coupled to the upper cover and the lower cover to the lower portion, respectively.

In general, in order to arrange the electronic module to operate independently in various external environments to transmit and receive information or to perform a given function, the electronic module is mounted on the housing to be safely packaged.

For example, an electronic module that plays a role in recognizing and transmitting information in real time, such as a Ubiquitous Sensor Network (USN) sensor, is a situation where a housing is necessary because it is exposed to the atmosphere or placed in various environments such as ground or water. to be.

However, electronic module developers focus on module development, and do not conduct special research and investment on the housing. Therefore, the plastic module or steel containers are custom-made according to the size of the electronic module and used at that time as the housing.

Accordingly, the electronic module housing has a function of simple packaging or only a vent hole for waterproofing and dissipating heat, and various problems are generated when the electronic module housing is applied to the actual site.

For example, when the housing is directly impacted and there is insufficient configuration to cushion the shock, the shock is transmitted to the electronic module mounted therein, resulting in damage to the semiconductor chip or damage to the circuit pattern or connecting parts, and the strength of the impact. Stronger results in the module itself breaking.

In addition, it can not prevent the most condensation of the failure of the electronic module, that is, if the housing is not sealed, condensation will occur someday, if the condensation occurs, the module will not operate normally. In addition, the circuit pattern contacts may be corroded or electrical short may cause a fatal failure.

In addition, the components employed in the electronic module may generate a lot of heat. If the housing does not properly release the generated heat, the semiconductor chip itself may be damaged or the operation characteristics of the circuit elements included in the module may be deteriorated. The result is brought.

In addition, if the pressure inside the housing is not released, the electronic module may not operate normally or the module itself may be damaged.

Therefore, when the electronic module is placed in various environments (air, ground, water, four seasons, and night and day temperature difference is severe), it can be protected from impact, and moisture, heat, There is an urgent need to develop a universal housing that can remove pressure to protect the electronic module.

On the other hand, looking at the prior art in the technical field similar to the present invention, first, the Republic of Korea Patent Publication No. 10-2006-0014562 discloses a cover for protecting the gas sensor, including a cap and a handle on the cover to handle the outside It relates to operation by using, and it does not describe about adjusting the situation inside the case containing a sensor.

In addition, the Republic of Korea Patent Publication No. 10-2009-0027813 discloses a sensor node, including a housing, a sensor mounting portion and a cover formed on the upper surface of the housing.

This is mainly a configuration for easy replacement and assembly of the sensor, it is not described about the buffer against external impact, the situation inside the housing, it can be said that the case can be applied only to a specific type of sensor.

An object of the present invention is to provide a housing for protecting an electronic module disposed in a variety of external environments, can be protected from external shock, and to remove the moisture, heat, pressure inside the housing to increase the performance and efficiency of the electronic module In order to provide a multi-functional electronic module housing.

The present invention includes an inner cover to which the electronic module is mounted on an inner fixing frame, an outer cover coupled to the inner cover, a gasket coupled to upper and lower portions of the outer cover, an upper cover and a lower cover coupled to the gasket, and the inner cover and The outer cover is to solve the above technical problem by providing a multi-functional electronic module housing, characterized in that coupled to the top cover at the top, and the bottom cover at the bottom, respectively.

In addition, the inner cover and the outer cover is coupled, by providing a multi-functional electronic module housing characterized in that the coupling to form a shock absorbing space, to solve the above technical problem.

In addition, the gasket is to solve the above technical problem by providing a multifunctional electronic module housing, characterized in that the upper cover and the upper cover, and the lower cover and the lower cover and the outer cover and the lower cover, respectively.

In addition, by providing a multi-functional electronic module housing, characterized in that the filter is coupled to the upper surface of the upper cover or the lower cover to discharge the moisture inside, to solve the above technical problem.

In addition, by providing a multi-functional electronic module housing characterized in that the valve for discharging the air inside the upper surface of the upper cover or the lower cover, to solve the above technical problem.

In addition, the lower cover to solve the above technical problem by providing a multi-functional electronic module housing, characterized in that the cooler for discharging the heat inside.

In addition, by providing a multi-functional electronic module housing, characterized in that the upper cover is further formed with an antenna connection portion and a connector connection portion, to solve the above technical problem.

According to the present invention, the inner cover, the outer cover, the upper cover, the lower cover, and the gasket are closely coupled to each other, thereby having a remarkable effect of mitigating external impact and sealing the inside of the housing.

The present invention has a remarkable effect that the inner cover and the outer cover are coupled, but combined to form a vacuum shock absorbing space to mitigate the external impact.

The present invention has a remarkable effect of preventing corrosion of the electronic module by minimizing condensation and humidity therein by forming a protective filter for discharging moisture inside the housing.

The present invention has a remarkable effect of preventing the failure of the electronic module due to thermal pressure by adjusting the pressure inside the pressure by forming a pressure valve for discharging the air inside the housing.

The present invention has a significant effect of preventing the electronic module from malfunctioning due to heat by employing a cooler to effectively discharge the heat inside.

The present invention has a remarkable effect of improving the reception rate of the electronic module and smoothly transmitting power or data by forming an antenna connection part and a connector connection part.

1 is a schematic perspective view of an appearance of a multifunctional electronic module housing according to an embodiment of the present invention.
Figure 2 is a schematic perspective view of the appearance of the inner cover and outer cover of the multi-functional electronic module housing according to an embodiment of the present invention.
3 is a schematic cross-sectional view of an inner cover of a multifunctional electronic module housing according to an embodiment of the present invention.
4 is a view showing an example in which the electronic module is mounted on the inner cover in the multi-function electronic module housing according to an embodiment of the present invention.
5 is a schematic cross-sectional view of an outer cover of the multifunctional electronic module housing according to an embodiment of the present invention.
6 is a view schematically showing that the shock absorbing space is formed by the combination of the inner cover and the outer cover in the multi-function electronic module housing according to an embodiment of the present invention.
7 is a perspective view schematically showing the components coupled to the top cover and the top cover of the multi-functional electronic module housing according to an embodiment of the present invention.
8 is a schematic cross-sectional view of the top cover of the multifunctional electronic module housing according to an embodiment of the present invention.
9 is a schematic view of a cross section of a protective filter of a multifunctional electronic module housing according to an embodiment of the present invention.
10 is a perspective view schematically illustrating components coupled to a bottom cover and a bottom cover of a multifunctional electronic module housing according to an embodiment of the present invention.
FIG. 11 is a cross-sectional view schematically illustrating an example in which a lower cover and a cooler of a multifunctional electronic module housing are coupled according to an embodiment of the present invention.
12 is a view showing an example of discharging heat from the cooler mounted on the inner cover of the multi-functional electronic module housing according to an embodiment of the present invention.
FIG. 13 is a view schematically illustrating an example in which a pressure valve is coupled to a multifunctional electronic module housing according to an embodiment of the present invention.
14 is a schematic perspective view of a pressure valve of a multifunctional electronic module housing according to an embodiment of the present invention.
FIG. 15 is a view schematically illustrating an overall assembly view of a multifunctional electronic module housing according to an embodiment of the present invention. FIG.
16 is a schematic cross-sectional view of a gasket of a multifunctional electronic module housing according to an embodiment of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may properly define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and are not intended to represent all of the technical ideas of the present invention. Therefore, various equivalents It should be understood that water and variations may be present.

Before describing the present invention with reference to the accompanying drawings, it should be noted that the present invention is not described or specifically described with respect to a known configuration that can be easily added by a person skilled in the art, Let the sound be revealed.

In addition, the housing according to the present invention may have an external shape such as a cylindrical shape or a square shape, and the shape of the protective filter, the connector and the pressure valve may also have an external shape such as a cylindrical shape or a square shape.

It is also noted that the screw coupling illustrated in the housing according to the present invention can be replaced by fitting coupling or pin coupling according to design conditions.

In addition, the material of the components of the housing according to the present invention is formed of steel, stainless steel, compressed paper and / or synthetic resin, etc., but is not limited to that illustrated.

1 is a schematic perspective view of an appearance of a multifunctional electronic module housing according to an embodiment of the present invention.

The multifunctional electronic module housing is configured to couple the inner cover 100, the outer cover 200, the top cover 300, the bottom cover 400, and the two gaskets 500.

Here, the upper cover 300 is screwed with the inner cover 100 and the outer cover 200, the lower cover 400 is also configured to be screwed with the inner cover 100 and the outer cover 200.

In addition, the two gaskets 500 are screwed on the upper and lower sides of the outer cover 200, and the upper and the outer cover 200 and the top cover 300, respectively, the packing is coupled, the lower outer cover 200 and lower Each packing 400 and the cover 400 to be combined.

That is, the inner cover 100, the outer cover 200, the top cover 300, the bottom cover 400, and the two gaskets 500 are screwed or packed to each other so that the airtightness and tightness are increased.

In other words, the upper cover 300 and the lower cover 400 are coupled to each other by the inner cover 100, the outer cover 200, the two gaskets 500, but the space to which each is coupled in a vacuum state And the sealing property becomes high.

Figure 2 is a schematic perspective view of the appearance of the inner cover and the outer cover of the multi-function electronic module housing according to an embodiment of the present invention, Figure 3 is a schematic view of a cross section of the inner cover, Figure 4 is an electronic module 5 is a view illustrating an example mounted on the inner cover, and FIG. 5 is a schematic view of a cross section of the outer cover, and FIG. 6 is a view schematically showing that the shock absorbing space is formed by the combination of the inner cover and the outer cover.

The inner cover 100 is formed in a wheel-shaped frame structure, the upper and lower lid frame is a screw connector 110, the cover portion 120 is formed on the side of the vertical frame, respectively, the electronic module as a horizontal frame connecting the vertical frame The fixing frame 130 is formed, and the cooler connection screw groove 140 is formed on the lower side portion of the vertical frame.

Preferably, the material of the inner cover 100 may use a compressed paper that is strong in impact absorption, light in weight, and easy to deform, or may use a flexible resin material depending on conditions.

The screw connector 110 of the upper lid frame is formed to screw the outer cover 200 and the top cover 300, the screw connector 110 of the lower lid frame is the outer cover 200 and the lower cover 400 And screws are formed to engage.

The screw connector 110 serves to fix the inner cover 100 in close contact with other components. When the inner cover 100 is formed of compressed paper, the screw connector 110 is naturally drilled during screwing. It may not be formed.

In addition, the screw connector 110 may be deformed according to design conditions, but the outer diameter of the screw connector 110 should be wider than the outer diameter of the screw so as not to cause interference with the screw.

The cover connection part 120 is fit and coupled to the cover connection groove 210 formed in the outer cover 200 to fix the inner cover 100 to the outer cover 200, as well as to form a shock absorbing space therebetween. Do it.

That is, since the shock absorbing space is formed on the surfaces other than the cover connecting portion 120 and the cover connecting groove 210, the shock transmitted to the inner cover 100 is buffered when the outer cover 200 is impacted.

The electronic module fixing frame 130 is coupled to the electronic module serves to fix the electronic module.

Preferably, the electronic module fixing frame 130 and the electronic module may be screwed, if the inner cover 100 is formed of a compressed paper material or a flexible resin material that is easy to deform, perforated according to the size of the electronic module Since the positions can be different, it is easy to mount electronic modules of various sizes.

The cooler connection screw groove 140 is screwed with the cooler screw groove 430 formed in the cooler 410 of the lower cover 400 to fix the cooler 410 to the inner cover 100 and to fix it. do.

The outer cover 200 serves to separate the external environment and the internal environment as much as possible with the inner cover 100. The cover connecting groove 210, the outer packing groove 220, the external screw groove ( 230 and a gasket connecting screw groove 240 are formed.

The cover connecting groove 210 is customly coupled to the cover connecting portion 120 formed in the inner cover 100 to fix the inner cover 100 as well as to form a shock absorbing space.

Here, the shock absorbing space serves to form a vacuum structure between the inner cover 100 and the outer cover 200.

In other words, the shock absorbing space is formed as well as the shock-proofing function as a whole of the housing, thereby further preventing the shock.

The outer packing groove 220 is combined with the packing gasket inner packing groove 520 formed in the gasket 500, the inner rubber packing 720 is sandwiched between the two, thereby maintaining the function of waterproof and dustproof Play a role.

Here, the rubber packing used for the outer packing groove 220 is not limited to the rubber packing, but may be replaced by means for maintaining the state inside the housing, for example, adhesive means.

The outer thread groove 230 of the upper end is composed of a screw thread therein, and is screwed with the upper screw groove 340 is configured in the upper cover 300, so that the upper cover 300 is tightly fixed.

In addition, the outer thread groove 230 of the lower end is screwed with the lower screw groove 440 is configured in the lower cover 400, serves to secure the lower cover 400 tightly.

The gasket connection screw groove 240 is screwed with the gasket screw groove 530 is configured in the gasket 500 serves to tightly fix the gasket (500).

Depending on the design conditions, the outer cover 200 may be made of stainless steel, synthetic resin or steel, and the outer cover 200 is injected into the mold half and half to be coupled to each other in the manufacturing process for coupling to the inner cover 100. can do.

Alternatively, the inner cover 100 and the outer cover 200 may be made of a mold while being coupled, of course.

Alternatively, the inner cover 100 may also be made in half and half to be coupled to each other in the outer cover 200.

7 is a view illustrating the components coupled to the top cover and the top cover of the multi-functional electronic module housing according to an embodiment of the present invention, Figure 8 is a schematic cross-sectional view of the top cover respectively.

The upper cover 300 is a related configuration is formed so that the power connector, the antenna, the protective filter 600 is coupled, the screw is coupled to the inner cover 100 and the outer cover 200, the gasket 500 and the packing By engaging, it serves to maintain the waterproof and dustproof state inside the housing.

Referring to the cross section of the top cover 300, the antenna connector 310, the connector connector 320, the upper filter connector 330, the upper screw groove 340 and the upper packing groove 350 is formed.

The antenna connector 310 is manufactured integrally with the top cover 300 or additionally attached to the antenna cover 310, and the outside of the antenna connector 310 is coupled to the antenna connector 310.

This is connected to the electronic module fixedly mounted on the inner cover 100 serves to improve the data reception rate of the module.

Depending on the design conditions, the antenna connector 310 may be changed in the outer diameter and length in accordance with the specifications of the antenna, of course.

The connector connector 320 serves to couple the connector 700 for connecting a power source or other cable to the electronic module.

Here, the connector connection part 320 is not only configured in the upper cover 300 according to the design conditions, it can be formed in the lower cover 400, etc. Of course, the position, quantity, size can be changed as necessary.

The upper filter connecting portion 330 is formed to mount the protective filter 600 for adjusting the moisture and pressure inside the housing.

Here, the upper filter connecting portion 330 is composed of a threaded hole to facilitate the mounting of the protective filter 600, the upper filter connecting portion remaining after mounting the protective filter 600 according to the user's needs ( 330, if present, by using a rubber stopper 710 to keep the waterproof and dustproof state inside.

Depending on the design conditions, the connector connecting portion 320 and the upper filter connecting portion 330 can be formed exactly as the number of the initial need, and of course, the rubber stopper 710 may not be used.

The upper screw groove 340 is composed of a screw thread therein, by being screwed with the screw connector 110 formed in the outer screw groove 230 and the inner cover 100 formed in the outer cover 200, The top cover 300 is to be fixed in close contact.

The upper packing groove 350 is combined with the gasket outer packing groove 510 formed in the gasket 500 and the outer rubber packing 730 is inserted between the two, thereby maintaining a waterproof and dustproof state inside the housing. Play a role of

Here, the rubber packing used for the outer packing groove 220 is not limited to the rubber packing may be replaced with a means for maintaining the waterproof and dustproof state inside the housing, for example, an adhesive means.

9 is a schematic view of a cross section of a protective filter of a multifunctional electronic module housing according to an embodiment of the present invention.

The protective filter 600 controls the moisture and pressure inside the housing and suppresses condensation. The protective filter 600 includes a composition of various materials therein and closes the top hole with a membrane filter to exert a reverse osmosis effect. It plays a role.

Preferably, the upper portion of the protective filter 600, the wrench hole 610, the lower portion of the filter screw portion 660 is formed, the membrane filter 650, acetate filter 640, charcoal filter 630 and high density therein The acetate filter 620 is included.

Depending on the design conditions, it may be configured by adding a membrane filter at the bottom, the order of the acetate filter 640, charcoal filter 630, high-density acetate filter 620 may be changed of course.

The wrench hole 610 is a hexagon wrench when the protective filter 600 is mounted and dismantled on the upper filter connection part 330 formed on the upper cover 300 or the lower filter connection part 460 formed on the lower cover 400. It is formed to facilitate the work using the back.

Depending on the design conditions, it may be replaced by a means capable of performing the same function in addition to the wrench hole 610, may not be formed at all.

The high density acetate filter 620 is formed to be positioned below the protective filter 600, and mainly serves to absorb moisture in the housing.

Here, acetate is a material that is very easy to absorb moisture, and also has the function of filtering the harmful substances by the internal activated carbon particles.

The charcoal filter 630 is formed to be positioned on the high density acetate filter 620, and is disposed to absorb moisture in the housing and perform a function of blocking electromagnetic waves.

Acetate filter 640 is formed so as to be located on the charcoal filter 630, the high-density acetate filter 620 and the charcoal filter 630 to absorb the moisture even if the absorption is made again, high density according to the design conditions Compared to the acetate filter 620, it may be formed at a lower density or may not be disposed.

The membrane filter 650 is located at the uppermost hole of the protective filter 600 to implement the reverse osmosis effect, that is, by controlling the moisture or pressure therein by discharging the moisture or fine particles absorbed in the housing.

FIG. 10 is a view illustrating components coupled to a bottom cover and a bottom cover of a multifunctional electronic module housing according to an embodiment of the present disclosure, FIG. 11 is an example of a combination of a bottom cover and a cooler, and FIG. 12 is a diagram for dissipating heat from a cooler. It is a figure which showed each example.

First, since the multi-functional electronic module housing according to the embodiment of the present invention has a cylindrical upper and lower symmetrical structure, it can be understood symmetrically in the coupling configuration, and depending on the design conditions, it may be possible to escape some symmetry. Of course.

That is, the mutual coupling relationship between the upper cover 300, the outer cover 200, the inner cover 100 and the gasket 500 is the same or very similar to the relationship between the lower cover 400 and the other components are found in advance Put it.

The lower cover 400 has a related configuration such that the protective filter 600 and the pressure valve 800 are coupled to each other, and the inner cover 100 and the outer cover 200 are screwed to each other, and the gasket 500 is connected thereto. By doing the packing, it serves to keep the inside of the housing waterproof and dustproof.

Referring to the cross section of the lower cover 400, the valve connecting portion 420, the lower screw groove 440 and the lower packing groove 450 and the lower filter connecting portion 460 is formed.

In addition, the cooler 410 is formed through the lower cover 400 and is tightly fixed to the inner cover 100 through the cooler screw groove 430.

The valve connection part 420 is formed to mount the pressure valve 800, which will be described later with reference to the accompanying drawings.

The lower screw groove 440 is composed of a screw thread therein, by being screwed with the screw connector 110 formed in the outer screw groove 230 and the inner cover 100 formed in the outer cover 200, The bottom cover 400 is fixed tightly.

The lower packing groove 450 is combined with the gasket outer packing groove 510 formed in the gasket 500, and the outer rubber packing 730 is inserted therebetween, thereby maintaining a waterproof and dustproof state inside the housing. Play a role of

The lower filter connecting portion 460 is formed to mount the protective filter 600 for adjusting the moisture and pressure inside the housing.

Here, the lower filter connecting portion 460 is formed as necessary, and may not be formed depending on the design conditions, and when the rubber stopper 710 is used, the lower filter connecting portion 460 may be formed as described in the upper cover 300. .

The cooler 410 is formed in a heat pipe type, so that the cooler screw groove 430 is screwed with the cooler connection screw groove 140 formed in the inner cover 100.

When the cooler 410 is tightly fixed to the inner cover 100, as shown in FIG. 12, heat generated from the electronic module is discharged in the direction of the arrow.

Depending on the design conditions, the structure of the cooler 410 is not limited to the heat pipe type may be replaced with another type of cooler that can effectively discharge the heat inside.

FIG. 13 is an example in which a pressure valve is coupled to a multifunctional electronic module housing according to an embodiment of the present invention. FIG. 14 is a view schematically showing pressure valves, respectively.

The valve connecting portion 420 is formed with a screw thread therein, such that the valve connecting portion 420 is screwed with the screw thread formed on the outer body of the pressure valve 800.

The pressure valve 800 is composed of a valve body 810, a valve control unit 820 and a valve cap 830, serves to control the pressure inside the housing by blocking the outside air inlet and discharge the internal air. Configure to

For example, the inner side of the pressure valve 800 may be formed in a rubber tube shape that becomes narrower toward the outside, and when only a cork stopper is covered at the end of the tube, only the internal air may flow out.

Depending on the design conditions, it is not limited to the shape of Figure 14, for example, may be configured as a cylindrical integral, the position can also be formed in the center and / or circumference, the upper cover 400, the lower cover 400.

15 is an overall assembly view of a multi-functional electronic module housing according to an embodiment of the present invention, Figure 16 is a schematic cross-sectional view of the gasket, respectively.

The two gaskets 500 are screwed to the outer cover 200, and configured to seal the outer cover 200 and the top cover 300, the outer cover 200, and the bottom cover 400 in contact with the packing surface. To maintain the waterproof and dustproof state inside the housing.

Referring to the cross section of the gasket 500, the gasket outer packing groove 510, the gasket inner packing groove 520, and the gasket screw groove 530 are formed.

The outer gasket outer packing groove 510 is disposed between the upper packing groove 350 and the lower rubber packing 730 formed in the upper packing groove 350 and the lower cover 400 disposed in the upper cover 300. It is formed to couple to each other.

The gasket inner packing groove 520 is formed to be coupled to each of the upper and lower ends with the inner rubber packing 720 interposed between the outer packing groove 220 formed in the outer cover 200.

The gasket screw groove 530 is screwed with the gasket connecting screw groove 240 is configured in the outer cover 200 to fix the gasket in close contact.

Meanwhile, the above descriptions using only FIGS. 1 to 16 describe only the main matters of the present invention, and the present invention is limited to the configurations and functions of FIGS. 1 to 16 as long as various designs are possible within the technical scope. It is obvious that it is not limited.

100: inner cover
110: screw connector
120: cover connection
130: sensor node fixing frame
140: Cooler connection screw groove
200: outer cover
210: cover connection groove
220: outside packing groove
230: external thread groove
240: Gasket connection screw groove
300: top cover
310: antenna connection
320: connector connection
330: upper filter connection
340: top thread groove
350: top packing groove
400: bottom cover
410: cooler
420: valve connection
430 cooler screw groove
440: lower thread groove
450: Lower packing groove
460: lower filter connection
500: Gasket
510: gasket outer packing groove
520: gasket inner packing groove
530: Gasket Screw Groove
600: protection filter
610: wrench hole
620: high density acetate filter
630: Charcoal Filter
640: Acetate Filter
650: membrane filter
660 filter thread
700: Connector
710: rubber stopper
720: Internal rubber packing
730: Outer rubber packing
800: pressure valve
810: valve body
820: valve control unit
830: valve stopper

Claims (9)

An inner cover on which the electronic module is mounted on the inner fixing frame;
An outer cover coupled to the inner cover;
A gasket coupled to upper and lower portions of the outer cover;
An upper cover coupled to the gasket; And a bottom cover; including;
The inner cover and the outer cover are respectively coupled to the upper cover and the lower cover at the top,
The upper surface of the upper cover or the lower cover, characterized in that the filter for adjusting the pressure and moisture therein is coupled, multifunctional electronic module housing.
The method of claim 1,
The inner cover and the outer cover is coupled,
And to form a shock absorbing space in a vacuum state.
The method of claim 1,
The gasket is a multifunctional electronic module housing, characterized in that the upper and the outer cover and the upper cover, the lower and the outer cover and the lower cover, respectively, the packing or adhesive bonding.
delete The method of claim 1,
The filter is a multifunctional electronic module housing, characterized in that it comprises an acetate filter or charcoal filter or membrane filter.
The method of claim 1,
The upper surface of the upper cover or the lower cover, characterized in that the valve for discharging the air inside is coupled, multifunctional electronic module housing.
The method according to claim 6,
The valve is multifunctional electronic module housing, characterized in that it comprises a tube narrowed toward the outside.
The method of claim 1,
The bottom cover is characterized in that the cooler for discharging the heat inside is coupled, multifunctional electronic module housing.
The method of claim 1,
The upper cover upper surface is characterized in that the antenna connecting portion and the connector connecting portion is further formed, multifunctional electronic module housing.

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