KR101241095B1 - Over slimming prevention system of glass slimming equipment - Google Patents

Abstract

PURPOSE: An over etching prevention system of glass etching equipment is provided to etch glass to a standardized thickness of according to the temperature and concentration of etchant. CONSTITUTION: A temperature sensor(110) measures the temperature of etchant. A touch screen(120) inputs an etching process command and a user authentication command. A main panel(130) collects input information and output information input about the etching process of a glass. A temperature controller(140) transmits a temperature value to the main panel. [Reference numerals] (120) Touch screen; (132) Communications card; (141) First temperature controller; (142) Second temperature controller; (143) Third temperature controller; (150) Alarm unit; (60) Etchant storage tank

Description

Over Slimming Prevention System of Glass Slimming Equipment

The present invention relates to a system for preventing over-etching of glass etching equipment, and more specifically, targets a glass substrate by inputting an etching rate and a process time standardized according to the current thickness and target thickness of the glass substrate, the concentration and temperature of the etchant. The present invention relates to an over-etching system of glass etching equipment capable of preventing over-etching by etching according to thickness.

Recently, with the development of various portable electronic devices such as mobile communication terminals and notebook computers, there is an increasing demand for a flat panel display device that can be applied thereto.

Such flat panel display devices include liquid crystal display devices, plasma display panels, field emission display devices, and light emitting diode display devices. Although being studied, liquid crystal display devices are in the spotlight due to mass production technology, ease of driving means, and high quality.

Since the liquid crystal display device is widely used in portable electronic devices, it is necessary to reduce the size and weight of the electronic device to improve the portability of the electronic device. In accordance with the trend of weight reduction and thinning of the liquid crystal display device, studies are being actively conducted to reduce the weight and thickness of the liquid crystal display device.

In general, a method using a thin substrate and a method of thinly etching a substrate thickness after bonding a color filter array substrate and a thin film transistor array substrate are used as methods for reducing the weight and thickness of the liquid crystal display device.

However, in the case of using a thin substrate from the beginning of the process instead of a thick substrate, the strength of the substrate itself due to the thin thickness is weak, so that the substrate is broken during the process, so that the yield is very low. There is a problem that there is a limit.

In addition, in the case of using the etching process, since the color filter array substrate and the thin film transistor array substrate are reduced to the same thickness, the strength of the substrate itself is weakened, and thus the yield is very low because the substrate is damaged during the process after the etching process. have.

There are many factors that determine the weight of the liquid crystal display device, but among them, the substrate made of glass is the heaviest structure among other components of the liquid crystal display device. Therefore, in order to reduce the weight of the liquid crystal display device, it is most efficient to reduce the weight of the glass substrate.

Typically, the glass substrate is etched by an etchant such as HF. In other words, the glass substrate is placed in a container filled with an etchant and the surface of the glass substrate is etched by the etchant. In this method, however, the substrate is not uniformly etched due to the imperfection of the substrate itself, and furthermore, impurities generated in the etching process adhere to the substrate, resulting in a rough surface of the substrate. Moreover, the use of excessive etchant increases the cost and the problem of environmental pollution.

In order to solve this problem, an etching solution may be applied to the substrate while the substrate is loaded on the conveyor to move the substrate, but in this case, the etching liquid remains on a part of the substrate surface loaded on the conveyor. The substrate is excessively etched, which causes a problem that the substrate is etched unevenly as a whole.

As a prior art document, the Patent Publication No. 10-2008-0053055 (published June 12, 2008) discloses a technical content of a substrate etching apparatus and a liquid crystal display device manufacturing line using the same.

The substrate etching apparatus includes a cassette for accommodating and transporting a substrate from which a previous process has been completed, a first robot for taking out the substrate stored in the cassette, and a second substrate in which the substrate is transferred from the first robot to place the substrate. An etched cassette for fixing the substrate loaded by the second robot with a robot, a support for supporting the substrate, and a holder for fixing the substrate, and at least one etched cassette is fixed and rotated at a set angle to ground the substrate. And a cassette fixing unit arranged perpendicularly to the substrate, and an etching apparatus for etching the substrate arranged vertically by the cassette fixing unit.

In the conventional substrate etching apparatus, when the thickness of the substrate is thicker than the target thickness after completion of the first etching process of the substrate, the substrate etching apparatus may perform the second etching process to match the target thickness, but the substrate thickness after completion of the primary etching process is larger than the target thickness. Thin overetching may occur.

Such overetching may be caused by factors such as time input error, thickness measurement error, sudden temperature rise during the etching process, and the concentration of the etchant, and when overetching occurs, the thickness of the substrate cannot be increased to the target thickness again. Inevitably suffer irreversible damage.

Therefore, simply applying an interlock program to the substrate etching apparatus to prevent over-etching has a limitation in preventing over-etching problems occurring during the etching process of the substrate. There is an urgent need for research.

The present invention targets a glass substrate by inputting a standardized etching rate and process time according to the current thickness and target thickness of the glass substrate, the concentration and temperature of the etching solution, and interlocking a PLC and a monitorable touch screen to control all etching processes. Glass etching that can be etched according to the thickness and the etching process is released by stopping the etching process in case of each error about the temperature and concentration of the etching solution, etching process time, thickness measurement and touch screen operation. Provide an over-etching system for the equipment.

Among the embodiments, the over-etching prevention system of the glass etching equipment includes an etching cassette for receiving and transporting the glass substrate, the etching liquid storage tank for supplying the etching liquid through the injection pump on the glass substrate of the etching cassette and the import / In the over-etching system of the glass etching equipment including a moving mechanism for carrying out, installed in the inside of the etchant storage tank to measure the temperature of the etchant at the start, progress and completion of the etching process to transmit the respective temperature value A temperature sensor; A touch screen for inputting a command required for an etching process including a current thickness and a target etching thickness of the glass substrate, an etching rate and a processing time according to the target etching thickness, and a concentration of the etching solution and a user authentication; A main panel connected to the touch screen and the temperature sensor to collect all input information and output information input and output in the etching process of the glass substrate to maintain an optimal etching process state; And a temperature controller positioned between the main panel and the temperature sensor and transmitting the respective temperature values measured by the temperature sensor to the main panel.

In an embodiment, the temperature sensor may include a first temperature sensor, a second temperature sensor, and a third temperature sensor installed at a bottom, a center, and an upper surface of the etchant storage tank, respectively. The first temperature sensor may be installed at the same position as the injection pump.

The temperature controller may include a first temperature controller installed between the first temperature sensor and the main panel, a second temperature controller installed between the second temperature sensor and the main panel, and between the third temperature sensor and the main panel. It may include a third temperature controller installed in.

In one embodiment, the main panel PLC (Programable) for automatically controlling a series of operations for the etching process of the glass substrate, the user authentication, the temperature difference interlock function, and stores the data generated during the etching process for each glass substrate Logic Controller); And a communication card for converting the temperature value transmitted from the temperature controller and a command required for an etching process and user authentication so that the PLC can recognize and attaching the PLC to the PLC.

The main panel collects each temperature value transmitted from the temperature controller and compares the etching process start temperature with the previous etching process completion temperature to perform a temperature difference interlock function to perform the temperature difference interlocking function. The process can be stopped.

In another exemplary embodiment, the main panel may further include an alarm unit configured to generate an upper limit alarm when the temperature of the etchant is greater than or equal to a set value, and generate a lower limit alarm when the temperature of the etchant is less than or equal to a preset value. .

The main panel may apply a manual manipulation prohibition interlock to prohibit the touch screen from being operated while the etching process of the glass substrate is in progress.

The main panel calculates an etching rate and a process time by using the current thickness of the glass substrate input through the touch screen, and applies a comparative interlock of the etching rate by thickness to apply the comparison interlock of the etching rate. You can stop it.

The main panel proceeds to the secondary etching process when the thickness of the glass substrate is greater than the target thickness when the etching process of the glass substrate is completed, and after calculating the etching rate using the thickness of the glass substrate after completion of the primary etching process Additional processing time can be calculated based on the target thickness.

The main panel may compare the difference between the calculated additional process time and the additional process time input by the user through the touch screen, and stop the etching process when a time difference more than a set value occurs.

The over-etching prevention system of the glass etching apparatus of the present invention can be monitored with a PLC that controls the etching process and inputs the normalized etching rate and the process time according to the current thickness and the target thickness of the glass substrate, the concentration of the etchant and the temperature change. By interlocking the touch screen, the glass substrate is etched according to the target thickness, and when each error occurs for the temperature and concentration of the etchant, the etching process time, the thickness measurement, and the touch screen operation, the etching process is released to stop the etching process. It provides an effect that can prevent in advance.

1 is a diagram illustrating a general automated glass etching equipment.
2 is a block diagram illustrating an over-etching system of glass etching equipment according to an embodiment of the present invention.

Description of the present invention is only an embodiment for structural or functional description, the scope of the present invention should not be construed as limited by the embodiments described in the text. That is, the embodiments are to be construed as being variously embodied and having various forms, so that the scope of the present invention should be understood to include equivalents capable of realizing technical ideas. Also, the purpose or effect of the present invention should not be construed as limiting the scope of the present invention, since it does not mean that a specific embodiment should include all or only such effect.

On the other hand, the meaning of the terms described in the present invention will be understood as follows.

The terms "first "," second ", and the like are intended to distinguish one element from another, and the scope of the right should not be limited by these terms. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" to another element, it may be directly connected to the other element, but there may be other elements in between. On the other hand, when an element is referred to as being "directly connected" to another element, it should be understood that there are no other elements in between. On the other hand, other expressions describing the relationship between the components, such as "between" and "immediately between" or "neighboring to" and "directly neighboring to", should be interpreted as well.

It should be understood that the singular " include "or" have "are to be construed as including a stated feature, number, step, operation, component, It is to be understood that the combination is intended to specify that it does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Generally, the terms defined in the dictionary used are to be interpreted as being consistent with the meanings in the context of the related art, and should not be interpreted as having ideal or excessively formal meanings unless clearly defined in the present invention.

1 is a diagram illustrating a general automated glass etching equipment.

Referring to FIG. 1, a general automated glass etching apparatus includes a cassette 20 in which a glass substrate 1 is accommodated, a first robot 30 extracting a glass substrate 1 in a cassette 20, and The glass substrate 1 of the second robot 35 and the etching cassette 44 which receives the glass substrate 1 extracted by the first robot 30 and conveys the glass substrate 1 to the etching cassette 44. An etchant storage tank for supplying an etchant through the injection pump on the bed.

The cassette 20 has been transported in the previous process, and the glass substrate 1 processed in the previous process has been received and transported. In addition, the first robot 30 includes a rotation shaft 32 and a robot arm 33, and the glass substrate 1 placed on the robot arm 33 in the cassette 20 is rotated by the rotation of the rotation shaft 32. 2 is seated on the substrate mounting portion 36 of the robot (35).

The second robot 35 has an extension shaft 37 which moves up and down to move the glass substrate 1 seated on the substrate placing portion 36 formed at the end thereof.

The glass substrate 1 loaded from the second robot 35 is fixed to the etching cassette 44, and the etching cassette 44 is fixed to the cassette fixing part 40. At this time, the plurality of etching cassettes 44 are fixed to the cassette fixing part 40 at set intervals, and the etching cassette 44 is rotated 90 degrees about the rotation shaft 46 formed at the end of the cassette fixing part 40. do. That is, the glass substrate 1 fixed to the etching cassette 44 horizontally with the ground by the first and second robots 30 and 35 is disposed perpendicular to the ground by the rotation of the cassette fixing part 40. .

In this way, the glass substrate 1 disposed perpendicular to the ground is conveyed toward the spray plate formed with the etching liquid storage tank and the plurality of nozzles through the conveyor 50 to perform etching.

2 is a block diagram illustrating an over-etching system of glass etching equipment according to an embodiment of the present invention.

Referring to FIG. 2, the over-etching prevention system 100 of glass etching equipment includes a temperature sensor 110, a touch screen 120, a main panel 130, a temperature controller 140, and an alarm unit 150. .

The temperature sensor 110 is installed inside the etching liquid storage tank 60, and measures the temperature of the etching liquid at the beginning of the etching process, during the etching process, and when the etching process is completed, and transmits a temperature value.

The temperature sensor 110 includes a first temperature sensor 111, a second temperature sensor 112, and a third temperature sensor 113 installed at the bottom, center, and top of the etching liquid storage tank, respectively, and the injection pump. The first temperature sensor 111 present at the same position as is a reference.

The touch screen 120 inputs a command required for an etching process including a current thickness and a target etching thickness of the glass substrate 1, an etching rate and a process time according to the target etching thickness, and a concentration of an etching solution, and a command required for user authentication.

The touch screen 120 provides a screen for standardizing and selecting a process time according to the target time thickness, and outputs a corresponding process time screen when selecting the target time thickness. The process time screen allows the user to select one of the partial PM (post-mask) post process and the continuous process, and the user inputs only the process time after the partial PM automatically in the case of the partial PM post-process. Only enter the time after the continuous process.

The main panel 130 is connected to the touch screen 120 and the temperature sensor 110 to display all input information and output information such as the temperature value and concentration of the etching liquid input and output in the etching process of the glass substrate 1, and the etching process time. Collect and control to maintain the optimum etching process state. The touch screen 120 and the main panel 130 communicate with each other using RS-232C.

The main panel 130 includes a PLC 131 and a communication card 132.

PLC 131 is an industrial control device that uses programmable memory to control special functions such as logic functions, sequencing, timing, counting, and calculation, and controls various kinds of machines or processors. Contains wealth.

The PLC 131 automatically controls a series of operations for an etching process, a user authentication, and a temperature difference interlock function of the glass substrate 1, and stores data generated during an etching process for each glass substrate.

The communication card 132 converts the commands necessary for the etching process and user authentication so that the PLC 131 can recognize them, and attaches them to the PLC 131 for use.

In addition, the main panel 130 may prohibit the touch screen 120 from being manipulated during the etching process because the main panel 130 may be overetched when the etching process time is changed or the etching liquid is added during the etching process of the glass substrate 1. Prohibit manual operation Apply the interlock function. The main panel 130 initializes the process time to 0 seconds so that the previous process time does not remain when the etching process is completed.

The main panel 130 calculates an etching rate and a process time by using the current thickness of the glass substrate 1 input through the touch screen 120, and applies a comparison interlock of the etching rate by the thickness. In case of thickness difference, the etching process is stopped.

After completion of the primary etching process, the main panel 130 performs the secondary etching process when the thickness of the glass substrate 1 is greater than or equal to the target thickness, and calculates an etching rate by measuring the thickness of the glass substrate after completion of the primary etching process. The additional process time is then calculated based on the target thickness. In this case, the main panel 130 may be over-etched due to an error in the additional process time. In case of time difference, the etching process is stopped.

The temperature controller 140 is positioned between the main panel 130 and the temperature sensor 110, and compares an etching process start temperature with a previous etching process completion temperature according to the control of the main panel 130 to interlock a temperature difference. The first and second mobile devices, which perform the function and automatically stop the etching process when the temperature difference between the etching process start temperature and the previous etching process completion temperature is equal to or greater than the set value, thereby inducing the carrying out of the etching cassette 44. 2, the etching cassette 44 is released by the robot (30, 35).

The temperature controller 140 may include a first temperature controller 141 connected to the first temperature sensor 111, a second temperature controller 142 and a third temperature sensor 113 connected to the second temperature sensor 112. And a third temperature controller 143 connected.

The alarm unit 150 generates an upper limit alarm when the temperature of the etchant is greater than or equal to the set value under the control of the main panel 130, and generates a lower limit alarm when the temperature of the etchant is less than or equal to the set value. The alarm unit 150 may generate an operation prohibition alarm when the touch screen 120 is operated during the etching process.

Hereinafter, the operation of the over-etching prevention system of the glass etching equipment according to an embodiment of the present invention with reference to Figure 2 in detail.

The touch screen 120 interworks with the CPU of the PLC 131 by using RS-232C communication and outputs a user authentication screen.

In the user authentication procedure, an expert or an operator who is an expert in the etching process of the glass substrate 1 inputs an ID and a password previously input into the memory of the PLC 131 to the touch screen 120, and the main panel 130 uses a touch screen ( When the ID and password inputted through the 120 are matched with data stored in the memory of the PLC 131, the user may input the current thickness and the target etching thickness of the glass substrate 1 on the touch screen 120. do.

User ID and password used for user authentication can use the password and password, and can also use a unique ID and password registered by the user.

The main panel 130 outputs a process time screen that can be selected by standardizing each process time according to the etch target thickness on the touch screen 120. When the user selects the target thickness through the touch screen 120, the main panel 130 causes a process time corresponding to the target thickness selected by the user to be output to the touch screen 120.

Alternatively, the user may calculate an etching rate and a process time according to a target thickness of the glass substrate 1 before the etching process and input the same to the touch screen 120. In this case, the main panel 130 allows the user or a third party to perform process time verification authentication within a predetermined time through the touch screen 120. If the main panel 130 does not properly perform process time verification authentication, the main panel 130 automatically stops the etching process and discharges the etching cassette 44.

Since the etching rate of the glass substrate 1 is greatly affected by the temperature change of the etching solution, the main panel 130 performs a temperature difference interlock function to prevent overetching due to a sudden temperature change.

The first temperature sensor 111, the second temperature sensor 112, and the third temperature sensor 113 installed for each of the low, middle, and high levels in the etching liquid storage tank 60 may include an etching process start temperature, Temperature values for the etching process progress temperature and the etching process completion temperature may be measured.

The first temperature controller 141, the second temperature controller 142, and the third temperature controller 143 are temperatures of the first temperature sensor 111, the second temperature sensor 112, and the third temperature sensor 113. The value is received and transmitted to the PLC 131 through the communication card 132.

The PLC 131 collects respective temperature values received from the first temperature controller 141, the second temperature controller 142, and the third temperature controller 143 to complete the current process temperature and the previous process at the start of the etching process. By comparing the temperature of the etching liquid, when the temperature difference is greater than the set value, the alarm unit 150 warns, and automatically stops the etching process and release the etching cassette 44.

The etching rate depends on the concentration of the etchant. For example, when the etching liquid is supplied to the etching liquid storage tank 60 to increase the concentration, the etching ratio is increased in proportion, and when the concentration of the etching liquid is lowered, the etching ratio is decreased.

When the etching process is completed, the main panel 130 causes the target supply amount of the etching solution described in the process standard to be displayed on the screen of the touch screen 120 when the etching rate is input, and the user inputs the etching solution through the touch screen 120. Allows you to check the real-time etchant supply.

As such, the main panel 130 may maintain the etching solution concentration since the constant supply amount of the etchant is added to the etchant storage tank 60 according to a standard determined according to the etchant ratio, and again when the target supply amount of the etchant is completed. Wait in the initial state.

The main panel 130 measures the thickness of the glass substrate 1 after completion of the primary etching process, and proceeds to the secondary etching process when the desired thickness, that is, the target thickness is not reached. The main panel 130 measures the thickness of the glass substrate 1 after completion of the first process, calculates an etching rate, and then calculates additional process time based on the target thickness.

At this time, the over-etching may occur due to the error of the additional process time, so that the user may check the additional process time automatically calculated by the PLC 131, and outputs a screen requesting confirmation of the additional process time to the touch screen 120. do.

The main panel 130 automatically stops the secondary etching process when a time difference between the additional process time input by the user through the touch screen 120 and the additional process time calculated by the PLC 131 exceeds a set value. .

In addition, the main panel 130 is applied to the current thickness of the glass substrate 1 input to the touch screen 120 and the main panel 130 by applying a comparison interlock of the visual ratio by the thickness in order to prevent the thickness measurement error The etching process stops automatically when the measured thickness differs by the set value.

When the etching process is completed, the main panel 130 measures the thickness of the glass substrate 1 and changes the etching solution concentration.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

100: over-etching system of glass etching equipment
110: temperature sensor 120: touch screen
130: main panel 131: PLC
132 communication card 140 temperature controller
150: alarm unit

Claims (6)

Overeating of the glass etching equipment including an etching cassette for storing and transporting a glass substrate, an etching liquid storage tank for supplying the etching liquid through the injection pump on the glass substrate of the etching cassette, and a moving mechanism for carrying in / out of the etching cassette. In each prevention system,
A temperature sensor installed inside the etchant storage tank to measure the temperature of the etchant at the start, progress and completion of the etching process and to transmit respective temperature values;
A touch screen for inputting a command required for an etching process including a current thickness and a target etching thickness of the glass substrate, an etching rate and a processing time according to the target etching thickness, and a concentration of the etching solution and a user authentication;
A main panel connected to the touch screen and the temperature sensor to collect all input information and output information input and output in the etching process of the glass substrate to maintain an optimal etching process state; And
Located between the main panel and the temperature sensor, including a temperature controller for transmitting each temperature value measured by the temperature sensor to the main panel,
The temperature sensor
A first temperature sensor, a second temperature sensor, and a third temperature sensor respectively installed on the bottom, center, and top of the etchant storage tank;
The temperature controller
A first temperature controller disposed between the first temperature sensor and the main panel, a second temperature controller disposed between the second temperature sensor and the main panel, and a third temperature controller installed between the third temperature sensor and the main panel. 3. An over-etching system for glass etching equipment comprising a temperature controller.
delete delete The method of claim 1, wherein the main panel
Each temperature value transmitted from the temperature controller is collected and the temperature difference interlock function is performed by comparing the etching process start temperature with the previous etching process completion temperature to stop the etching process when the temperature rises above the set value. ,
When the temperature of the etchant is above the set value temperature alarm (Alarm), if the temperature of the etchant further comprises an alarm to generate a lower limit alarm when the temperature of the etchant further comprises a glass etching equipment prevention system .
The method of claim 1, wherein the main panel
Applying a manual manipulation prohibition interlock to prohibit the touch screen from being operated while an etching process of the glass substrate is in progress,
After completion of the etching process of the glass substrate, when the thickness of the glass substrate is greater than the target thickness, the secondary etching process is performed, and after calculating the etching rate using the thickness of the glass substrate after the completion of the primary etching process based on the target thickness Over-etching system of the glass etching equipment, characterized in that for calculating the additional process time.
The method of claim 1, wherein the main panel
An etching rate and a process time are calculated using the current thickness of the glass substrate input through the touch screen, and the etching process is stopped when a thickness difference of a set value or more occurs by applying a comparative interlock of the etching rate by the thickness.
And comparing the difference between the calculated additional process time and the additional process time input by the user through the touch screen, and stopping the etching process when a time difference of more than a set value occurs.

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