KR101236890B1 - Substrate of electric double layer capacitor (EDLC), Manufacturing method for substrate of EDLC, EDLC, Manufacturing method for EDLC, Assembly of Substrate of EDLC - Google Patents

Substrate of electric double layer capacitor (EDLC), Manufacturing method for substrate of EDLC, EDLC, Manufacturing method for EDLC, Assembly of Substrate of EDLC Download PDF

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Publication number
KR101236890B1
KR101236890B1 KR1020110045069A KR20110045069A KR101236890B1 KR 101236890 B1 KR101236890 B1 KR 101236890B1 KR 1020110045069 A KR1020110045069 A KR 1020110045069A KR 20110045069 A KR20110045069 A KR 20110045069A KR 101236890 B1 KR101236890 B1 KR 101236890B1
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South Korea
Prior art keywords
current collecting
collecting pattern
metal
printed circuit
circuit board
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KR1020110045069A
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Korean (ko)
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KR20120126924A (en
Inventor
차승진
박재훈
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박재훈
차승진
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Priority to KR1020110045069A priority Critical patent/KR101236890B1/en
Priority to PCT/KR2011/008979 priority patent/WO2012157825A1/en
Publication of KR20120126924A publication Critical patent/KR20120126924A/en
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Publication of KR101236890B1 publication Critical patent/KR101236890B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/66—Current collectors
    • H01G11/70—Current collectors characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/74—Terminals, e.g. extensions of current collectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/78—Cases; Housings; Encapsulations; Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

The present invention relates to an electric double layer capacitor. More particularly, the present invention relates to an electric double layer capacitor in which a unit cell is disposed in a metal housing integrally coupled to a printed circuit board. According to the present invention, it includes an insulating layer and a first metal layer and a second metal layer bonded to upper and lower surfaces of the insulating layer, wherein the first metal layer has a first current collecting pattern and a second current collecting electrically separated from the first current collecting pattern. A pattern is formed, and the second metal layer is connected to the second current collecting pattern through a first terminal connected to the first current collecting pattern through a first via hole formed in the insulating layer and a second via hole formed in the insulating layer. A printed circuit board having a second terminal, a hollow cylinder, electrically connected to the first current collecting pattern, electrically separated from the second current collecting pattern, and an inner peripheral surface or an extension surface of the inner peripheral surface of the second current collecting pattern; A bottom plate for an electric double layer capacitor is provided that surrounds a pattern and includes a metal housing having one end integrally coupled with the printed circuit board.

Description

Substrate of electric double layer capacitor (EDLC), Manufacturing method for substrate of EDLC, EDLC, Manufacturing method for EDLC, Assembly of Substrate of EDLC}

The present invention relates to an electric double layer capacitor. More particularly, the present invention relates to an electric double layer capacitor in which a unit cell is disposed in a metal housing integrally coupled to a printed circuit board.

Electric double layer capacitors are referred to as supercapacitors because their specific capacitance (F / g) is increased by 100 to 1000 times or more compared with conventional electrolytic capacitors or multilayer ceramic capacitors. Electric double layer capacitors have higher power density, longer cycle life, higher discharge rate, and many other advantages over secondary cells.

1 illustrates a structure of a conventional coin-type electric double layer capacitor (EDLC), in which an activated carbon powder is mixed with a fluorine-based binder to prepare an electrode 5 on a sheet, and the electrode sheet is punched into a disc shape. The conductive adhesive 3 is used to adhere to the can 2 and the case 9 to complete the electrodes and the terminals. Thereafter, the separator 4 is inserted between both electrodes, the electrolyte is impregnated, the gasket 7 is inserted, and the end of the can and the housing are bent to be sealed to prepare a coin-type cell.

The conventional coin-type electric double layer capacitor as described above has the following problems.

First, since the gasket is inserted and manufactured by bending the ends of the can and the housing, it is impossible to integrate and simplify the process and to miniaturize the capacitor.

Second, in the reflow process, volume expansion and internal pressure increase due to vaporization of the electrolyte are generated, which causes resistance to increase and leakage of the electrolyte.

The conventional electric double layer capacitor cannot directly combine the can 2 and the case 9 because the can 2 and the case 9 must be sealed while electrically separating them. Therefore, a rubber gasket 7 is disposed between the can 2 and the case 9, and then the end portions of the can 2 and the case 9 are banded and sealed.

The reflow process of attaching the electric double layer capacitor to the substrate is carried out at a high temperature of 260 ° C. or higher for melting the soldering paste. At this time, the electrolyte of the electric double layer capacitor vaporizes, and the pressure inside the electric double layer capacitor increases. In addition, deformation due to a difference in thermal expansion coefficients between the gasket 7 made of rubber, the can 2 of the metal material, and the case 9 and the thermal deformation of the gasket 7 itself made of rubber occur. These various causes cause an increase in resistance and leakage of electrolyte.

Third, in the conventional electric double layer capacitor, the can 2 faces the upper surface in the drawing and the case 9 faces the lower surface in the drawing, so that the can 2 and the case 9 extend in the same direction to be mounted on the printed circuit board. There was a problem with combining terminals.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and can be integrated, simplified, and miniaturized in a process, and can be sealed without arranging a gasket, thereby preventing leakage of electrolyte solution. An object of the present invention is to provide a lower plate for an electric double layer capacitor and a lower plate assembly for an electric double layer capacitor.

In addition, an object of the present invention is to provide a method for manufacturing the electric double layer capacitor, the lower plate for the electric double layer capacitor.

According to the present invention, it includes an insulating layer and a first metal layer and a second metal layer bonded to upper and lower surfaces of the insulating layer, wherein the first metal layer has a first current collecting pattern and a second current collecting electrically separated from the first current collecting pattern. A pattern is formed, and the second metal layer is connected to the second current collecting pattern through a first terminal connected to the first current collecting pattern through a first via hole formed in the insulating layer and a second via hole formed in the insulating layer. A printed circuit board having a second terminal, a hollow cylinder, electrically connected to the first current collecting pattern, electrically separated from the second current collecting pattern, and an inner peripheral surface or an extension surface of the inner peripheral surface of the second current collecting pattern; A bottom plate for an electric double layer capacitor is provided that surrounds a pattern and includes a metal housing having one end integrally coupled with the printed circuit board.

In addition, an insulating layer and a first metal layer and a second metal layer coupled to the upper and lower surfaces of the insulating layer, wherein the first current collecting pattern and the second current collecting pattern electrically separated from the first current collecting pattern is formed on the first metal layer. The second metal layer has a first terminal connected to the first current collecting pattern through a first via hole formed in the insulating layer and a second terminal connected to the second current collecting pattern through a second via hole formed in the insulating layer. Is a printed circuit board, a hollow cylinder, electrically connected to the first current collecting pattern, and electrically separated from the second current collecting pattern, and an inner circumferential surface or an extension surface of the inner circumferential surface surrounds the second current collecting pattern. A metal housing having one end integrally coupled with the printed circuit board, a metal cap sealing the free end of the metal housing, a separator disposed inside the hollow of the metal housing, and the separator And a first electrode and a second electrode electrically separated from each other, and an electrolyte solution contained in the metal housing hollow, wherein the first electrode is electrically connected to the metal cap. An electrode is provided with an electric double layer capacitor electrically connected to the second current collecting pattern.

In addition, a) a step of manufacturing a printed circuit board original plate in which the first metal layer, the insulating layer, and the second metal layer are combined in sequence, and (b) the first current collecting pattern and the first on the first metal layer of the printed circuit board Forming a second current collecting pattern electrically separated from the current collecting pattern; forming a first terminal and a second terminal in the second metal layer; and collecting the first current through the first via hole and the second via hole penetrating the insulating layer. A printed circuit board manufacturing step of electrically connecting a pattern and a second current collecting pattern to the first terminal and the second terminal, respectively, and (c) an inner circumferential surface of the metal housing, which is a hollow cylinder, or an extension surface of the inner circumferential surface thereof, may be used. A method of manufacturing a lower plate for an electric double layer capacitor is provided, comprising: arranging the metal housing on the printed circuit board to surround a pattern, and then coupling the metal housing to the printed circuit board through thermocompression bonding.

In addition, (a) manufacturing a printed circuit board original substrate in which the first metal layer, the insulating layer, and the second metal layer are combined in sequence, (b) the first current collecting pattern and the first to the first metal layer of the original printed circuit board Forming a second current collecting pattern electrically separated from the first current collecting pattern, forming a first terminal and a second terminal in the second metal layer, and through the first via hole and the second via hole penetrating the insulating layer; A printed circuit board manufacturing step of electrically connecting a current collecting pattern and a second current collecting pattern to the first terminal and the second terminal, respectively; Arranging the metal housing on the printed circuit board to surround the current collecting pattern, and then coupling one end of the metal housing to the printed circuit board by thermocompression bonding; and (d) attaching a second electrode to the second current collecting pattern. Electrically connected, and the second electric field Stacking the separator and the first electrode in order on the pole, and filling the electrolyte into the metal housing so that the electrolyte penetrates the first electrode and the second electrode, and (e) the metal cap of the metal housing. A method for manufacturing an electric double layer capacitor is provided, which includes sealing a free end and electrically connecting the first electrode and the metal cap.

In addition, a lower plate assembly for an electric double layer capacitor having a plurality of lower plates for the electric double layer capacitor is provided.

The electric double layer capacitor of the present invention can be sealed without arranging a gasket, thereby preventing leakage of the electrolyte solution.

In addition, the manufacturing method of the electric double layer capacitor of the present invention can be integrated, simplified and miniaturized the process. In addition, since the lower plate assembly for the electric double layer capacitor is used to manufacture and cut a plurality of electric double layer capacitors at once, the productivity is excellent.

In addition, since the first terminal and the second terminal are formed on the lower plate of the present invention, the electric double layer capacitor can be easily mounted through surface mount technology (SMT) even without forming a terminal.

1 is a cross-sectional view of a conventional electric double layer capacitor.
2 is a plan view of one embodiment of an electric double layer capacitor according to the present invention.
3 is a bottom view of the electric double layer capacitor shown in FIG. 2.
4 is a cross-sectional view taken along the AA direction of the electric double layer capacitor shown in FIG. 2.
FIG. 5 is a cross-sectional view taken along the BB direction of the electric double layer capacitor shown in FIG. 2.
FIG. 6 is a plan view of the lower plate of the electric double layer capacitor shown in FIG. 2.
FIG. 7 is a plan view of an assembly in which a plurality of lower plates of the electric double layer capacitor illustrated in FIG.
8 is a flowchart illustrating an embodiment of a method of manufacturing an electric double layer capacitor according to the present invention.
FIG. 9 is a view for explaining a step of manufacturing an original plate of a printed circuit board by thermally compressing a copper thin plate on a ceramic substrate in one embodiment of a method of manufacturing an electric double layer capacitor according to the present invention.
10 is a view for explaining a step of forming a through hole in a printed circuit board of one embodiment of a method of manufacturing an electric double layer capacitor according to the present invention.
11 and 12 are views for explaining a step of thermocompression bonding a metal housing and a printed circuit board in one embodiment of a method of manufacturing an electric double layer capacitor according to the present invention.
13 to 15 are views for explaining the step of forming a unit cell of the electric double layer capacitor in the metal housing of one embodiment of the manufacturing method of the electric double layer capacitor according to the present invention.
16 is a view for explaining a step of separating each of the electric double layer capacitor in one embodiment of the manufacturing method of the electric double layer capacitor according to the present invention.

Hereinafter, an embodiment of an electric double layer capacitor according to the present invention will be described in detail with reference to the accompanying drawings.

The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. And in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

2 is a plan view of one embodiment of an electric double layer capacitor according to the present invention, FIG. 3 is a bottom view of the electric double layer capacitor shown in FIG. 2, FIG. 4 is a cross-sectional view in the AA direction of the electric double layer capacitor shown in FIG. FIG. 5 is a sectional view taken along the BB direction of the electric double layer capacitor shown in FIG. 2, and FIG. 6 is a plan view of the lower plate of the electric double layer capacitor shown in FIG. 2.

In the present invention, the lower plate of the electric double layer capacitor means a printed circuit board to which the metal housing 20 is integrally coupled, and the lower plate assembly of the electric double layer capacitor means a printed circuit board to which a plurality of lower plates of the electric double layer capacitor are coupled. . That is, the state which cut | disconnected the lower plate assembly of an electric double layer capacitor is the lower plate of an electric double layer capacitor.

2 to 6, the electric double layer capacitor according to the present invention includes a printed circuit board 10, a metal housing 20, a unit cell 30, and a metal cap 40.

In the present invention, the printed circuit board (printed circuit board) is a printed circuit board-type lead frame (lead frame), a low-temperature simultaneous firing ceramic (integrated by coupling an insulating layer to a lead frame as well as a general printed circuit board) It includes all substrates in which a metal layer is bonded to an insulating layer, such as a low temperture co-fired ceramic (LTCC) substrate and a high temperture co-fired ceramic (HTCC) substrate.

In the present embodiment, the printed circuit board 10 is formed by attaching the first and second copper thin plates 12 and 13, which are the metal layers 12 and 13, to the top and bottom surfaces of the ceramic substrate 11, which is an insulating layer. The first and second copper thin plates 12 and 13 form an electrically conductive layer through which current can flow.

The first copper thin plate 12 attached to the upper surface of the ceramic substrate 11 is formed with a first current collecting pattern 121 and a second current collecting pattern 122 electrically separated from the first current collecting pattern 121. The first current collecting pattern 121 has a circular ring shape surrounding the second current collecting pattern 122, and the second current collecting pattern 122 has a circular shape surrounded by the first current collecting pattern 121.

The second copper thin plate 13 attached to the lower surface of the ceramic substrate 11 is formed with a first terminal 131 and a second terminal 132 electrically separated from the first terminal 131. The first terminal 131 is coupled to the first current collecting pattern 121 through the via hole 15 of the ceramic substrate 11. Copper is filled in the via hole 15 to electrically connect the first terminal 131 and the first current collecting pattern 121. The second terminal 132 is connected to the second current collecting pattern 122 through the via hole 15 of the ceramic substrate 11.

The metal housing 20 is a hollow cylinder, and the lower end thereof is integrally coupled to the first current collecting pattern 121 and the ceramic substrate 11 through thermal bonding. An inner circumferential surface of the metal housing 20 surrounds the second current collecting pattern 122. A coupling pin 21 inserted into the through hole 14 formed in the printed circuit board 10 extends at the lower end of the metal housing 20. The coupling pin 21 serves as a reference when the metal housing 20 and the printed circuit board 10 are bonded by thermocompression, thereby increasing the precision of the coupling. The metal housing 20 and the first current collecting pattern 121 are integrally coupled by the plating layer 22 and are electrically connected to each other.

The unit cell 30 includes a first electrode 31 and a second electrode 33 disposed above and below the separator 32 with the separator 32 interposed therebetween. The separator 32 prevents the first electrode 31 and the second electrode 33 from shorting. The first electrode 31 and the second electrode 33 serve to form an electric double layer capable of storing electricity between the infiltrated electrolyte 35.

The separator 32 used in the electric double layer capacitor of the present invention and the electrode active material, the conductive agent, the binder, and the solvent used in the electrodes 31 and 32 are not limited in kind or content as long as they are used in a conventional electric double layer capacitor. Do not.

For example, the separator 32 may include at least one of polyvinyl alcohol (PVA), polyvinylidene fluoride (PVDF), polypropylene (PP), teflon resin, silicone resin, modified silicone, and styrene butyl rubber (SBR). It may be composed of a polymer, and may be formed of a coating film. The first electrode 31 and the second electrode 33 may be formed by mixing activated carbon, carbon black, a binder, and a solvent to form a sheet, and then punching them in a circle.

In this embodiment, one unit cell 30 is described as being disposed inside the metal housing 20, but a plurality of unit cells 30 may be stacked in series. The second electrode 33 of the unit cell 30 is coupled to the second current collecting pattern 122 through a conductive adhesive (not shown). The unit cell 30 is immersed in the electrolyte 35 contained in the metal housing 20. The electrolyte 35 is not limited in kind as long as it is used in a general electric double layer capacitor. For example, an aqueous solution of NaOH, H 2 SO 4 , KOH, or the like may be used as the electrolyte 35.

The metal cap 40 seals the free end of the upper portion of the metal housing 20 to prevent leakage of the electrolyte 35. The metal cap 40 is coupled to the first electrode 31 of the unit cell 30 through a conductive adhesive (not shown).

As a result, the first electrode 31 of the unit cell 30 is connected to the first terminal 131 through the metal cap 40, the metal housing 20, the first current collecting pattern 121, and the via hole 15. The second electrode 33 is connected to the second terminal 132 through the second current collecting pattern 122 and the via hole 15. The first current collecting pattern 121 and the second current collecting pattern 122 are insulated from the ceramic substrate 11 as an insulating layer.

FIG. 7 is a plan view of an assembly in which a plurality of lower plates of the electric double layer capacitor illustrated in FIG. The electric double layer capacitor 100 shown in FIG. 2 combines the metal housings 20 to each lower plate of the assembly 200 to which the lower plates of the electric double layer capacitor shown in FIG. 5 are coupled, and then the unit cell 30 is disposed. Then, after sealing with the metal cap 40, it is cut along a predetermined dicing path or cut at once using a punching machine.

Hereinafter, an embodiment of a method of manufacturing an electric double layer capacitor according to the present invention will be described in detail with reference to the accompanying drawings. 8 is a flowchart illustrating an embodiment of a method of manufacturing an electric double layer capacitor according to the present invention.

Referring to FIG. 8, in the method of manufacturing an electric double layer capacitor according to the present invention, a step of manufacturing a printed circuit board disc (S10) and forming a pattern, via hole, and through hole in the printed circuit board disc to manufacture a printed circuit board Step S20, coupling the metal housing to the printed circuit board (S30), disposing a unit cell in the metal housing, filling the electrolyte (S40), sealing the metal housing with a metal cap (S50), Separating each electric double layer capacitor (S60). In the figure, a step of manufacturing one electric double layer capacitor is shown for convenience, but each step is performed in the form of an assembly.

The original printed circuit board is manufactured by the following method (S10).

The ceramic substrate 11 is manufactured. The ceramic material may include one or a plurality of materials selected from aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), silicon nitride (Si 3 N 4 ), beryllium oxide (BeO), barium oxide (BaO), and sapphire. Preferably, but not limited to.

Next, as shown in FIG. 9, the original copper plate of the printed circuit board is manufactured by thermocompression bonding the copper thin plates 12 and 13 on the ceramic substrate 11. The original board of the printed circuit board is composed of a ceramic substrate 11 and copper thin plates 12 and 13 bonded directly to the surface of the ceramic substrate 11.

In this step, the step of heating the prepared substrate 11 to the eutectic point of oxygen and copper, and the step of forming a copper layer by diffusing interfacial oxygen on the heated substrate 11 and fusing with the copper thin plates 12, 13 By advancing to, the ceramic substrate 11 and the copper thin plates 12 and 13 are thermally compressed to form an original plate of a printed circuit board.

Next, via holes 15 and through holes 14 for electrically connecting the patterns 121, 122, 131, and 132 and the upper and lower patterns 121, 122, 131, and 132 are formed on the original board of the printed circuit board. (S20). The pattern is formed by a general pattern forming process such as a photolithography process or an etching process. The first copper collecting plate 121 and the second current collecting pattern 122 are formed on the first copper thin plate 12, and the first terminal 131 and the second terminal 132 are formed on the second copper thin plate 13. do. As shown in FIG. 10, the via hole 15 and the through hole 14 are processed using a microdrill or a laser. The first current collecting pattern 121 and the first terminal 131, the second current collecting pattern 122, and the second terminal 132 are joined by copper filled in the via hole 15.

Next, after manufacturing the metal housing 20, the metal housing 20 is coupled to the printed circuit board 10 by thermocompression (S30).

The metal housing 20 may be manufactured by various methods, and the manufacturing method is not particularly limited. Hereinafter, a method of manufacturing the metal housing 20 by die casting will be described as an example.

First, a steel mold is precisely machined to precisely match the shape of the metal housing. Next, metals, such as aluminum and copper, are put into a crucible and heated and melted. Next, molten metal is injected into the mold. Finally, the mold is cooled to solidify the molten metal and then separated from the mold to complete the metal housing 20.

Next, the metal housing 20 and the printed circuit board 10 are bonded by thermal compression.

In the step of thermocompression, as shown in FIG. 11, the coupling pin 21 of the metal housing 20 is inserted into the through hole 14 of the printed circuit board 10, and thus the bottom of the bottom of the metal housing 20. The surface is in close contact with the ceramic substrate 11 of the printed circuit board 10, the bottom side is in close contact with the first current collecting pattern 121 and as shown in Figure 12, is connected to the cylinder 50 After arranging the metal housing 20 and the printed circuit board 10 on the base plate 70 of the thermocompression bonding apparatus having the pressurization head 60 which can move up and down, the pressure head of the thermocompression bonding apparatus at a predetermined temperature ( 60, and the ceramic substrate 11 of the metal housing 20 and the printed circuit board 10 by pressing the metal housing 20 and the printed circuit board 10 by using the heated pressure head 60. Bonding the first current collecting pattern 121 to each other;

Next, the printed circuit board 10 and the first current collecting pattern 121 are integrated through plating.

The plating method may be a general method such as electrolytic plating, electroless plating and vacuum deposition, sputtering, vacuum plating such as ion implantation method, and the like, and is not particularly limited. An electroplating method will be described as an example. In electrolytic plating, a metal is plated using an object to be plated as a cathode, whereby a film having a low production cost and having good adhesion can be obtained. After inserting the metal housing 20 and the printed circuit board 10 bonded by thermal compression as the plating object to the aqueous solution of the electrolyte, the negative electrode is connected to the plating object, and the positive electrode is connected to another metal, and then dissolved in an aqueous electrolyte solution when a direct current flows. As the metal ions precipitated on the surface of the plating object, a metal film is coated. Through this, the first current collecting pattern 121 of the metal housing 20 and the printed circuit board 10 may be integrated.

Next, the unit cell 30 is disposed in the metal housing 20 and then filled with the electrolyte 35 (S40).

As shown in FIG. 13, the conductive adhesive 34 is coated on the second current collecting pattern 122 using a dispenser. As shown in FIG. 14, the second electrode 33 is bonded onto the adhesive 34. The separator 32 and the first electrode 31 are sequentially stacked on the second electrode 33 to form a unit cell 30. In order to increase the capacity, the unit cells 30 are repeatedly stacked in series. Next, as shown in FIG. 15, the electrolyte 35 is filled into the metal housing 20. The electrolyte 35 penetrates the first electrode 31 and the second electrode 33.

Next, the metal housing 20 is sealed with a metal cap 40 (S50).

After applying the conductive adhesive 44 to the inner surface of the metal cap 40 or the first electrode 31, the metal cap 40 is bonded to the metal housing 20 to seal the metal housing 20, and One electrode 31 and the inner surface of the metal cap 40 are combined. If necessary, the metal cap 40 and the metal housing 20 are integrated by laser seam welding or plating.

Finally, as shown in FIG. 16, each electric double layer capacitor is separated (S60).

Separation methods include cutting along a predetermined dicing path and cutting at once using a punching machine.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention.

100: electric double layer capacitor
200: Bottom plate assembly for electric double layer capacitor
10: printed circuit board 11: ceramic substrate
12, 13: copper sheet 121: first current collector pattern
122: second current collecting pattern 131: first terminal
132: second terminal 14: through hole
15: via hole 20: metal housing
21: coupling pin 30: unit cell
31: first electrode 32: separator
33: second electrode 34: conductive adhesive
35: electrolyte 40: metal cap

Claims (13)

An insulating layer and a first metal layer and a second metal layer coupled to upper and lower surfaces of the insulating layer, wherein the first metal layer is formed with a first current collecting pattern and a second current collecting pattern electrically separated from the first current collecting pattern, The second metal layer includes a first terminal connected to the first current collecting pattern through a first via hole formed in the insulating layer and a second terminal connected to the second current collecting pattern through a second via hole formed in the insulating layer. Printed circuit boards,
A hollow cylinder, electrically connected to the first current collecting pattern, electrically separated from the second current collecting pattern, and an inner circumferential surface or an extension surface of the inner circumferential surface surrounds the second current collecting pattern, and one end of the printed circuit board A metal housing integrally coupled with the
The lower plate for the electric double layer capacitor electrically connected to the metal housing and the first current collecting pattern of the printed circuit board by a plating layer. The method of claim 1,
And the metal housing and the printed circuit board are integrally coupled by thermocompression bonding. delete An insulating layer, a first metal layer and a second metal layer coupled to upper and lower surfaces of the insulating layer, and through holes formed in the insulating layer, wherein the first metal layer is electrically separated from the first current collecting pattern and the first current collecting pattern. A second current collecting pattern is formed, and the second current collecting pattern is formed in the second metal layer through a first terminal connected to the first current collecting pattern through a first via hole formed in the insulating layer and a second via hole formed in the insulating layer. A printed circuit board having a second terminal connected thereto;
A hollow cylinder, electrically connected to the first current collecting pattern, electrically separated from the second current collecting pattern, and an inner circumferential surface or an extension surface of the inner circumferential surface surrounds the second current collecting pattern, and one end of the printed circuit board A lower plate for an electric double layer capacitor which is integrally coupled with and comprises a metal housing having a coupling pin inserted into the through hole. An insulating layer and a first metal layer and a second metal layer coupled to upper and lower surfaces of the insulating layer, wherein the first metal layer is formed with a first current collecting pattern and a second current collecting pattern electrically separated from the first current collecting pattern, The second metal layer includes a first terminal connected to the first current collecting pattern through a first via hole formed in the insulating layer and a second terminal connected to the second current collecting pattern through a second via hole formed in the insulating layer. Printed circuit boards,
A hollow cylinder, electrically connected to the first current collecting pattern, electrically separated from the second current collecting pattern, and an inner circumferential surface or an extension surface of the inner circumferential surface surrounds the second current collecting pattern, and one end of the printed circuit board A metal housing integrally coupled with the
A metal cap for sealing a free end of the metal housing;
A separator disposed inside the hollow of the metal housing;
A first electrode and a second electrode disposed with the separator interposed therebetween, and electrically separated from each other;
An electrolyte contained in the metal housing hollow;
The first electrode is electrically connected to the metal cap, and the second electrode is electrically connected to the second current collecting pattern.
An electric double layer capacitor electrically connected to the metal housing and the first current collecting pattern of the printed circuit board by a plating layer. The method of claim 5,
And the metal housing and the printed circuit board are integrally coupled by thermocompression bonding. delete An insulating layer, a first metal layer and a second metal layer coupled to upper and lower surfaces of the insulating layer, and through holes formed in the insulating layer, wherein the first metal layer is electrically separated from the first current collecting pattern and the first current collecting pattern. A second current collecting pattern is formed, and the second current collecting pattern is formed in the second metal layer through a first terminal connected to the first current collecting pattern through a first via hole formed in the insulating layer and a second via hole formed in the insulating layer. A printed circuit board having a second terminal connected thereto;
A hollow cylinder, electrically connected to the first current collecting pattern, electrically separated from the second current collecting pattern, an inner circumferential surface or an extension surface of the inner circumferential surface surrounds the second current collecting pattern, and one end of the printed circuit board A metal housing integrally coupled with the metal housing and having a coupling pin inserted into the through hole;
A metal cap for sealing a free end of the metal housing;
A separator disposed inside the hollow of the metal housing;
A first electrode and a second electrode disposed with the separator interposed therebetween, and electrically separated from each other;
An electrolyte contained in the metal housing hollow;
The first electrode is electrically connected to the metal cap, and the second electrode is electrically connected to the second current collecting pattern. (a) manufacturing a printed circuit board negative electrode in which the first metal layer, the insulating layer, and the second metal layer are combined in order;
(b) forming a first current collecting pattern and a second current collecting pattern electrically separated from the first current collecting pattern on the first metal layer of the original printed circuit board; and forming a first terminal and a second terminal on the second metal layer. A printed circuit board manufacturing step of electrically connecting the first current collecting pattern and the second current collecting pattern to the first terminal and the second terminal, respectively, through the first via hole and the second via hole penetrating the insulating layer;
(c) arranging the metal housing on the printed circuit board such that the inner circumferential surface of the metal housing, which is a hollow cylinder, or an extension surface of the inner circumferential surface, surrounds the second current collecting pattern, and then joins the metal housing to the printed circuit board. Wow,
and (d) electrically connecting the metal housing and the first current collecting pattern through a plating process. 10. The method of claim 9,
The step (c) is a step of coupling the one end of the metal housing to the printed circuit board through the thermo-compression step. (a) manufacturing a printed circuit board negative electrode in which the first metal layer, the insulating layer, and the second metal layer are combined in order;
(b) forming a first current collecting pattern and a second current collecting pattern electrically separated from the first current collecting pattern on the first metal layer of the original printed circuit board; and forming a first terminal and a second terminal on the second metal layer. A printed circuit board manufacturing step of electrically connecting the first current collecting pattern and the second current collecting pattern to the first terminal and the second terminal, respectively, through the first via hole and the second via hole penetrating the insulating layer;
(c) arranging the metal housing on the printed circuit board so that the inner circumferential surface of the metal housing, which is a hollow cylinder, or an extension surface of the inner circumferential surface, surrounds the second current collecting pattern, and then couples one end of the metal housing to the printed circuit board. To do that,
(d) electrically connecting the metal housing and the first current collecting pattern through a plating process;
(e) electrically connecting a second electrode to the second current collecting pattern, stacking a separator and a first electrode in order on the second electrode, and allowing the electrolyte to penetrate the first electrode and the second electrode; Filling the electrolyte into the metal housing;
(f) sealing the free end of the metal housing with a metal cap and electrically connecting the first electrode and the metal cap. The method of claim 11,
The step (c) is a step of coupling one end of the metal housing to the printed circuit board through the thermocompression bonding. A bottom plate assembly for an electric double layer capacitor, wherein a plurality of bottom plates for the electric double layer capacitor of any one of claims 1, 2 and 4 are combined.
KR1020110045069A 2011-05-13 2011-05-13 Substrate of electric double layer capacitor (EDLC), Manufacturing method for substrate of EDLC, EDLC, Manufacturing method for EDLC, Assembly of Substrate of EDLC KR101236890B1 (en)

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KR1020110045069A KR101236890B1 (en) 2011-05-13 2011-05-13 Substrate of electric double layer capacitor (EDLC), Manufacturing method for substrate of EDLC, EDLC, Manufacturing method for EDLC, Assembly of Substrate of EDLC
PCT/KR2011/008979 WO2012157825A1 (en) 2011-05-13 2011-11-23 Lower plate for electric double-layer capacitor (edlc), manufacturing method for lower plate for edlc, electric double-layer capacitor, manufacturing method for edlc, and lower plate assembly for edlc

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JP2004363377A (en) 2003-06-05 2004-12-24 Seiko Instruments Inc Electrochemical cell and manufacturing method thereof
JP2006185858A (en) 2004-12-28 2006-07-13 Seiko Instruments Inc Electrochemical cell and its manufacturing method
JP2007201383A (en) 2006-01-30 2007-08-09 Sanyo Electric Co Ltd Power accumulation device
KR20080065860A (en) * 2007-01-10 2008-07-15 (주) 스마트씽커즈 Electric double layer capacitor

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JP2004363377A (en) 2003-06-05 2004-12-24 Seiko Instruments Inc Electrochemical cell and manufacturing method thereof
JP2006185858A (en) 2004-12-28 2006-07-13 Seiko Instruments Inc Electrochemical cell and its manufacturing method
JP2007201383A (en) 2006-01-30 2007-08-09 Sanyo Electric Co Ltd Power accumulation device
KR20080065860A (en) * 2007-01-10 2008-07-15 (주) 스마트씽커즈 Electric double layer capacitor

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