KR101229766B1 - Selective Recovery Method of Gold from Scrapped Printed Circuit Boards(PCBs) - Google Patents
Selective Recovery Method of Gold from Scrapped Printed Circuit Boards(PCBs) Download PDFInfo
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- KR101229766B1 KR101229766B1 KR20100117044A KR20100117044A KR101229766B1 KR 101229766 B1 KR101229766 B1 KR 101229766B1 KR 20100117044 A KR20100117044 A KR 20100117044A KR 20100117044 A KR20100117044 A KR 20100117044A KR 101229766 B1 KR101229766 B1 KR 101229766B1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
- C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B1/00—Preliminary treatment of ores or scrap
- C22B1/005—Preliminary treatment of scrap
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/007—Wet processes by acid leaching
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/20—Electrolytic production, recovery or refining of metals by electrolysis of solutions of noble metals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
본 발명은 인쇄회로기판 스크랩 또는 폐인쇄회로기판으로부터 금을 선택적으로 회수하는 방법에 관한 것으로 전기분해에 의해 염소가스를 생성하여 침출조(30)에 공급하는 염소가스 전해생성 및 공급단계(S200)와; 전해생성 염소가스가 공급되는 상기 침출조(30)에 인쇄회로기판 스크랩을 투입하여 전해생성 염소에 의해 구리를 침출시키는 구리 침출단계(S300)와; 상기 구리 침출단계(S300)에서 생성된 구리 침출액을 회수하고 난 용액에 농도가 낮은 염산용액을 다시 주입하고 전해생성 염소를 공급하여 금을 침출시키는 금 침출단계(S400) 및; 상기 금 침출단계(S400)에 의해 생성된 금 침출액을 이온교환 컬럼에 공급하여 금을 이온교환수지에 흡착시킨 후 이온교환수지에 흡착된 금을 용리하는 금 흡착 및 회수단계(S400)를 포함하는 것을 그 특징으로 한다.
상기와 같이 본 발명은 염산용액을 사용하여 인쇄회로기판 스크랩으로부터 금을 침출시키기 때문에 시안 또는 왕수를 사용하여 금을 침출시키는 것보다 친환경적이며 또한 고순도의 금을 고수율로 회수할 수 있다.The present invention relates to a method for selectively recovering gold from a printed circuit board scrap or a closed printed circuit board chlorine gas electrolysis generation and supply step of generating chlorine gas by electrolysis and supplying to the leaching tank (30) (S200) Wow; A copper leaching step (S300) for leaching copper by electrolytic-generated chlorine by introducing a printed circuit board scrap into the leaching tank 30 to which the electrolytic-generated chlorine gas is supplied; A gold leaching step (S400) for re-injecting the hydrochloric acid solution having a low concentration to the solution from which the copper leaching solution generated in the copper leaching step (S300) is recovered and supplying electrolytic generated chlorine to gold; The gold leachate produced by the gold leaching step (S400) is supplied to the ion exchange column to adsorb the gold to the ion exchange resin, and the gold adsorption and recovery step of eluting the gold adsorbed on the ion exchange resin (S400) It is characterized by that.
As described above, the present invention uses the hydrochloric acid solution to leach gold from the printed circuit board scrap, and thus, it is more environmentally friendly than the leach of gold using cyan or aqua regia, and high purity gold can be recovered in high yield.
Description
본 발명은 인쇄회로기판(PCB, Printed Circuit Board) 스크랩에 함유되어 있는 금(Au)을 선택적으로 회수하는 방법에 관한 것으로, 보다 상세하게는 개인용 컴퓨터 및 휴대폰 등의 전자제품을 구동시키는 데에 사용되는 인쇄회로기판을 제조하는 과정에서 발생되는 인쇄회로기판 스크랩 또는 사용 후 폐기되는 전자제품에 포함된 폐인쇄회로기판으로부터 금을 회수하는 방법에 관한 것이다.
The present invention relates to a method for selectively recovering gold (Au) contained in a printed circuit board (PCB) scrap, and more particularly used to drive electronic products such as personal computers and mobile phones The present invention relates to a method for recovering gold from a printed circuit board scrap generated in a process of manufacturing a printed circuit board or a waste printed circuit board contained in electronic products discarded after use.
인쇄회로기판은 전기·전자제품의 구동을 위한 핵심 구성품으로서 거의 모든 전기·전자제품에 탑재되어 있으며, 전기·전자제품의 생산량이 급격히 증가함에 따라 필연적으로 인쇄회로기판의 제조량도 증가하고 있다. Printed circuit boards are core components for driving electrical and electronic products, and they are mounted in almost all electrical and electronic products. As the production volume of electrical and electronic products increases rapidly, the production volume of printed circuit boards is inevitably increasing.
전기·전자제품의 구동에 필요한 인쇄회로기판은 매우 엄격한 정밀도가 요구되며 이에 따라 제조과정 중 불량품으로 폐기되는 인쇄회로기판 스크랩의 양도 급격히 증가하고 있다. 또한 기술개발과 기술의 첨단화가 급속히 진행됨에 따라 제품의 교체주기가 짧아져 사용 후 버려지는 폐전기·전자제품의 발생량이 증가되면서 폐인쇄회로기판의 양도 크게 증가하고 있다.
Printed circuit boards required for the operation of electrical and electronic products require very strict precision, and accordingly, the amount of scraps of printed circuit boards disposed of as defective products during the manufacturing process is rapidly increasing. In addition, as the development of technology and the advancement of technology are rapidly progressing, the replacement cycle of products is shortened, and the amount of waste electric and electronic products discarded after use increases, and the amount of printed circuit boards is also greatly increased.
이러한 인쇄회로기판 스크랩과 폐인쇄회로기판(이하에서는 이들을 “인쇄회로기판 스크랩”이라 통칭한다.)에는 금, 은, 팔라듐 등과 같은 귀금속뿐만 아니라 구리, 니켈, 주석 등과 같은 유용금속들이 상당량 함유되어 있기 때문에 최근 들어 도시광산 자원으로 불리우는 이들 자원을 회수하여 재활용하기 위한 기술개발이 활발히 진행되고 있다. 특히 휴대폰에 탑재되어 있는 인쇄회로기판의 경우 1톤에 약 350g의 금이 포함되어 있으며, 이러한 금의 함량은 현재 광물자원의 경제성에 따른 채굴조건인 2∼3g/ton-광석 함량의 약 150배 정도로서 상당히 부가가치가 높기 때문에 최근 이들 인쇄회로기판 스크랩을 단순히 폐기 처리하지 않고 회수하여 재활용하는 방안이 강구되고 있다.
These printed circuit board scraps and closed printed circuit boards (hereinafter referred to as “printed circuit board scraps”) contain significant amounts of valuable metals such as copper, nickel, and tin, as well as precious metals such as gold, silver, and palladium. Recently, technology development for recovering and recycling these resources, called urban mining resources, has been actively progressed. In particular, a printed circuit board mounted on a mobile phone contains about 350 g of gold in one ton, and the content of this gold is about 150 times that of 2-3 g / ton-ore, which is a mining condition according to the economic efficiency of mineral resources. As the added value is quite high as a degree, recently, a plan for recovering and recycling these scraps of printed circuit boards without simply discarding them has been devised.
인쇄회로기판 스크랩으로부터 금을 회수하는 방법은 건식제련법과 습식제련법으로 대별되는데, 건식제련법은 한 번에 대량의 인쇄회로기판 스크랩을 처리할 수 있다는 이점은 있으나 금을 회수까지의 시간이 오래 걸리고, 인쇄회로기판 스크랩을 용융시키는 용융로가 구비되어야 하기 때문에 설비투자비가 매우 높으며, 또한 처리공정 중에 필연적으로 슬래그가 생성되며 이 슬래그를 제거하는 과정에서 슬래그와 함께 금도 유출됨으로써 일부의 금이 손실되는 단점이 있다.The method of recovering gold from printed circuit board scrap is roughly divided into dry smelting and wet smelting. Dry smelting has the advantage of processing a large amount of printed circuit board scrap at a time, but it takes a long time to recover gold. The equipment investment cost is very high because a melting furnace for melting printed circuit board scrap is required, and slag is inevitably generated during the treatment process, and some gold is lost due to the flow of gold along with the slag in the process of removing the slag. There is this.
이에 반해 습식제련법은 침출제로서 시안 또는 왕수를 사용하는데, 이러한 침출제는 회수과정에서 NO 가스와 시안 화합물이 생성되므로 인체와 환경에 유해하며 폐수가 발생되는 등의 문제가 있을 뿐만 아니라 과도한 시약(reagent)이 소모되는 단점이 있다. On the other hand, the wet smelting method uses cyan or aqua regia as leaching agents. Since these leaching agents generate NO gas and cyanide compounds in the recovery process, they are harmful to the human body and the environment, and waste water is generated. reagent) is consumed.
따라서 환경규제가 점점 엄격해지는 추세를 고려하여 친환경적이며 금을 더욱 쉽고 효율적으로 회수할 수 있는 방법의 개발이 요구된다.
Therefore, in consideration of the increasingly stringent environmental regulations, it is necessary to develop an environment-friendly method to recover gold more easily and efficiently.
본 발명은 상기와 같은 요구에 부응하기 위해 안출된 것으로, 본 발명은 인쇄회로기판 스크랩으로부터 고수율로 고순도의 금을 선택적으로 회수할 수 있는 방법을 제공하는 데에 그 목적이 있다.
The present invention has been made to meet the above requirements, and an object of the present invention is to provide a method for selectively recovering high-purity gold in high yield from printed circuit board scrap.
상기와 같은 본 발명의 목적은 인쇄회로기판 스크랩으로부터 금을 선택적으로 회수하는 방법을, 전기분해에 의해 염소가스를 생성하여 침출조에 공급하는 염소가스 생성 및 공급단계와; 전해생성염소가 공급되는 상기 침출조에 인쇄회로기판 스크랩을 투입하여 염소에 의해 구리를 침출시키는 구리 침출단계와; 상기 구리 침출단계에서 생성된 구리 침출액을 회수하고 난 용액에 염산용액을 다시 주입하고 전해생성염소를 공급하여 금을 침출시키는 금 침출단계 및; 상기 금 침출단계에 의해 생성된 금 침출액을 이온교환 컬럼에 공급하여 금을 이온교환수지에 흡착시킨 후 이온교환수지에 흡착된 금을 용리하는 금 흡착 및 회수단계를 포함하여 구성하는 것에 의해 달성된다.
An object of the present invention as described above is a method for selectively recovering gold from the printed circuit board scrap, chlorine gas generation and supply step of generating chlorine gas by electrolysis to supply to the leaching tank; A copper leaching step of leaching copper by chlorine by inserting a printed circuit board scrap into the leaching tank to which electrolytic chlorine is supplied; A gold leaching step of re-injecting hydrochloric acid solution into the solution from which the copper leaching solution generated in the copper leaching step is recovered and supplying electrolytic chlorine to leach gold; And a gold adsorption and recovery step of eluting the gold adsorbed on the ion exchange resin by supplying the gold leachate produced by the gold leaching step to the ion exchange column to adsorb the gold to the ion exchange resin. .
본 발명은 염산용액을 사용하여 인쇄회로기판 스크랩으로부터 금을 침출시키기 때문에 침출 과정에서 NO 가스, 시안 화합물 등이 생성되지 않아 시안 또는 왕수를 사용하여 금을 침출시키는 방법에 비해 더 친환경적이다.In the present invention, since the leaching gold from the printed circuit board scrap using hydrochloric acid solution, NO gas, cyan compound, etc. are not generated in the leaching process, which is more eco-friendly than the method of leaching gold using cyan or aqua regia.
또한 본 발명은 다른 습식제련법을 이용하여 인쇄회로기판 스크랩으로부터 금을 회수하는 방법에 비해 고순도의 금을 고수율로 회수할 수 있다.In addition, the present invention can recover the gold of high purity in a high yield compared to the method of recovering gold from the printed circuit board scrap using another wet smelting method.
이에 더하여 본 발명은 적은 양의 시약으로도 쉽게 금을 회수할 수 있어 효율적이며 경제적이다.
In addition, the present invention is efficient and economical since gold can be easily recovered even with a small amount of reagents.
도 1은 본 발명에 따른 인쇄회로기판 스크랩으로부터 금을 회수하는 방법을 도시한 순서도이고,
도 2는 본 발명의 사용되는 전해생성조와 침출조를 나타낸 도면이다.1 is a flowchart illustrating a method of recovering gold from a printed circuit board scrap according to the present invention.
Figure 2 is a view showing the electrolytic generation tank and leaching tank used in the present invention.
이하에서는 본 발명의 구성과 바람직한 실시예를 첨부된 도면을 참조하여 더욱 상세히 설명한다.
Hereinafter, with reference to the accompanying drawings, the configuration and the preferred embodiment of the present invention will be described in more detail.
본 발명은 인쇄회로기판 스크랩으로부터 고순도의 금을 효과적으로 회수하는 방법을 제공하고자 하는 것으로, 이를 위해 본 발명은 도 1에 도시된 바와 같이 크게 염소가스 전해생성 및 공급단계, 구리 침출단계, 금 침출단계, 금 흡착 및 회수단계를 포함한다.
The present invention is to provide a method for effectively recovering high-purity gold from the printed circuit board scrap, for the present invention is largely as shown in Figure 1 chlorine gas electrolytic generation and supply step, copper leaching step, gold leaching step , Gold adsorption and recovery steps.
(1) 인쇄회로기판 스크랩 절단단계(S100)(1) printed circuit board scrap cutting step (S100)
이 단계는 인쇄회로기판 스크랩을 침출조에 장입할 수 있는 정도의 적당한 크기로 절단하는 단계로서 선택적 과정이며, 이때 절단된 스크랩의 크기는 1, 2, 5mm 정도인 것이 바람직하다.
This step is an optional step of cutting the printed circuit board scrap into a suitable size that can be charged into the leaching tank, it is preferable that the size of the cut scrap is about 1, 2, 5mm.
(2) 염소가스 전해생성 및 공급단계(S200)(2) chlorine gas electrolytic generation and supply step (S200)
이 단계는 상기 인쇄회로기판 스크랩 절단단계(S100)에서 절단된 인쇄회로기판 스크랩의 조각 또는 원형 상태의 인쇄회로기판 스크랩으로부터 구리 또는 금을 용해시키는 데에 사용되는 염소가스를 전해생성하여 공급하는 단계로서 이를 위해 본 발명에는 전해생성조와 침출조가 구비된다.This step is to electrolytically generate and supply chlorine gas used to dissolve copper or gold from pieces of the printed circuit board scrap cut in the printed circuit board scrap cutting step (S100) or printed circuit board scrap in a circular state. To this end, the present invention is provided with an electrolysis generating tank and a leaching tank.
도 2는 본 발명에 사용되는 전해생성조(10)와 침출조(30)를 도시한 도면으로서 이 도면에 도시된 바와 같이 전해생성조(10)는 이온교환막(13)에 의해 음극실(11)과 양극실(12)로 구획되고, 침출조는(30) 그 내부에 교반봉(32)이 설치된다. FIG. 2 is a view showing an
상기와 같은 구조로 이루어진 전해생성조(10)의 음극실(11)과 양극실(12)에 각각 1∼6몰, 1∼5몰 농도의 염산용액을 주입한 후, 전류를 인가하게 되면 전해생성조(10)의 양극실(12)에서 염산용액의 전기분해에 의해 염소가스(16)가 생성되어 튜브(20)를 통해 침출조(30)로 공급되며, 이때 전해생성조(10)에 인가되는 전류의 전류밀도는 100∼1,000A/m2이다. 이때 음극실(11)에서는 수소가스(15)가 생성된다.
After injecting hydrochloric acid solutions of 1 to 6 mol and 1 to 5 mol concentrations into the
(3) 구리 침출단계(S300)(3) copper leaching step (S300)
이 단계는 상기 염소가스 전해생성 및 공급단계(S200)에 의해 공급된 염소가스에 의해 인쇄회로기판 스크랩으로부터 구리를 용해시키는 단계이다.
This step is a step of dissolving copper from the printed circuit board scrap by the chlorine gas supplied by the chlorine gas electrolytic generation and supply step (S200).
상기 염소가스 전해생성 및 공급단계(S200)에 의해 침출조로 공급된 염소가스는 침출조에 존재하는 용액에 의해 녹아 염소이온이 되는데, 이때 상기 인쇄회로기판 스크랩 절단단계(S100)에서 절단된 인쇄회로기판 스크랩의 조각 또는 원형 상태의 인쇄회로기판 스크랩(1)을 침출조(30)에 투입하게 되면 인쇄회로기판 스크랩(1)에 함유된 구리가 용해되어 침출되는데, 이때 침출조(30)의 온도를 25∼75℃, 교반속도를 100∼700rpm, 반응시간 약 10∼180분을 유지하게 되면 더욱 효과적으로 인쇄회로기판 스크랩(1)으로부터 구리를 침출시킬 수 있다.
The chlorine gas supplied to the leaching tank by the chlorine gas electrolytic generation and supplying step (S200) is melted by a solution present in the leaching tank to become chlorine ions. In this case, the printed circuit board cut in the cutting of the printed circuit board scrap (S100). When a piece of scrap or a circular printed
침출조(30)에서의 용해반응이 진행됨에 따라 구리의 침출양이 점점 증가되고 이로 인해 침출조(30)의 산화-환원 전위가 상승되는데, 일정 시간 경과 후 침출조의 산화-환원전위가 200∼400mV에서 1,000mV로 상승되면 전원 공급을 중단시켜 침출공정을 중지시킨 후 침출조(30)로부터 구리 침출액을 회수한다.
As the dissolution reaction in the
(4) 금 침출단계(S400)(4) gold leaching step (S400)
상기 구리 침출단계(S300)에서 생성된 구리 침출액을 회수하고 난 침출조(30)에 0.1∼1몰 농도의 새로운 염산용액을 주입한 다음, 전해생성조(10)에 다시 전류를 인가하게 되면 금의 침출이 시작되며, 일정 시간 경과 후 전해생성조(10)의 전류 공급을 중단시키면 이에 의해 침출조(30)로의 전해생성 염소가스의 공급이 중단되고 그 결과 금의 침출과정이 종료된다.
After recovering the copper leachate produced in the copper leaching step (S300) and injecting a new hydrochloric acid solution of 0.1 to 1 molar concentration into the
(5) 금 흡착 및 회수단계(S500)(5) Gold adsorption and recovery step (S500)
상기 금 침출단계(S400)가 완료되면 침출조로부터 금 침출액을 회수한 다음, 이 침출액을 이온교환 컬럼에 공급하여 침출액 속의 금을 이온교환수지에 흡착시킨다. 이후 이온교환수지에 흡착된 금을 용리하기 위하여 아세톤과 1몰 염산용액을 부피비 9:1로 혼합한 다음 이온교환 컬럼에 재차 공급하여 고순도의 금 용액을 회수한다.
When the gold leaching step (S400) is completed, the gold leaching liquid is recovered from the leaching tank, the leaching liquid is supplied to the ion exchange column to adsorb the gold in the leaching liquid to the ion exchange resin. Then, in order to elute the gold adsorbed on the ion exchange resin, acetone and 1 mole hydrochloric acid solution are mixed in a volume ratio of 9: 1, and then supplied to the ion exchange column again to recover a high purity gold solution.
본 발명자들은 상기와 같은 단계들로 이루어진 본 발명의 유효성을 확인하기 위해 본 발명의 금 회수방법을 휴대폰에 사용된 폐인쇄회로기판에 적용하여 이로부터 금을 실제로 회수하여 보았으며, 그 결과 약 95%의 고수율로 약 99.9%의 고순도의 금을 회수할 수 있었다.
The present inventors applied the gold recovery method of the present invention to a waste printed circuit board used in a mobile phone in order to confirm the effectiveness of the present invention consisting of the above steps, and actually recovered the gold from the result. With high yield of%, it was possible to recover about 99.9% of high purity gold.
10: 전해생성조 11: 음극실
12: 양극실 13: 이온교환막
15: 수소가스 16: 염소가스
20: 튜브 30: 침출조
32: 교반봉 10: electrolytic production tank 11: cathode chamber
12: anode chamber 13: ion exchange membrane
15: hydrogen gas 16: chlorine gas
20: tube 30: leaching tank
32: stirring rod
Claims (5)
전기분해에 의해 염소가스를 생성하여 침출조(30)에 공급하는 염소가스 전해생성 및 공급단계(S200)와;
염소가스가 공급되는 상기 침출조(30)에 인쇄회로기판 스크랩을 투입하여 염소에 의해 구리를 침출시키는 구리 침출단계(S300)와;
상기 구리 침출단계(S300)에서 생성된 구리 침출액을 회수하고 난 용액에 염산용액을 주입한 다음 전해생성 염소가스를 공급하여 금을 침출시키는 금 침출단계(S400) 및;
상기 금 침출단계(S400)에 의해 생성된 금 침출액을 이온교환 컬럼에 공급하여 금을 이온교환수지에 흡착시킨 후 아세톤과 염산용액을 혼합한 용액을 사용하여 이온교환수지에 흡착된 금을 용리하는 금 흡착 및 회수단계(S500)를 포함하는 것을 특징으로 하는 인쇄회로기판 스크랩으로부터 금을 선택적으로 회수하는 방법.
In the method for selectively recovering gold from the printed circuit board scrap,
Generating and supplying chlorine gas by electrolysis to supply chlorine gas to the leaching tank 30 (S200);
A copper leaching step (S300) for leaching copper by chlorine by inserting a printed circuit board scrap into the leaching tank 30 to which chlorine gas is supplied;
A gold leaching step (S400) for injecting hydrochloric acid solution into the solution from which the copper leaching solution generated in the copper leaching step (S300) is injected and then leaching gold by supplying an electrolytic generated chlorine gas;
By supplying the gold leachate produced by the gold leaching step (S400) to the ion exchange column to adsorb the gold to the ion exchange resin and eluting the gold adsorbed on the ion exchange resin using a mixture of acetone and hydrochloric acid solution A method for selectively recovering gold from the printed circuit board scrap comprising a gold adsorption and recovery step (S500).
상기 구리 침출단계(S300)에서 인쇄회로기판 스크랩을 침출조(30)에 투입하기 전에 적당한 크기로 절단하는 인쇄회로기판 스크랩 절단단계(S100)가 더 포함되는 것을 특징으로 하는 인쇄회로기판 스크랩으로부터 금을 선택적으로 회수하는 방법.
The method according to claim 1,
In the copper leaching step (S300), the printed circuit board scrap cutting step (S100) for cutting to a suitable size before the input of the printed circuit board scrap into the leaching tank 30, gold from the printed circuit board scrap How to selectively recover.
상기 전기분해는 이온교환막(13)에 의해 음극실(11)과 양극실(12)로 구획되는 전해생성조(10)에서 이루어지되,
상기 전기분해는 음극실(11)과 양극실(12)에 각각 1∼6몰, 1∼5몰 농도의 염산용액이 주입된 상태에서 이루어지는 것을 특징으로 하는 인쇄회로기판 스크랩으로부터 금을 선택적으로 회수하는 방법.
The method according to claim 1,
The electrolysis is performed in the electrolytic production tank 10 partitioned into the cathode chamber 11 and the anode chamber 12 by the ion exchange membrane 13,
The electrolysis is selectively recovered from the printed circuit board scrap, characterized in that the hydrochloric acid solution of 1-6 mol, 1-5 mol concentration is injected into the cathode chamber 11 and the anode chamber 12, respectively. How to.
상기 금 침출단계(S400)는 상기 구리 침출단계(S300)에서 생성된 구리 침출액을 회수하고 난 용액에 0.1∼1몰 농도의 새로운 염산용액이 주입된 상태에서 행해지는 것을 특징으로 하는 인쇄회로기판 스크랩으로부터 금을 선택적으로 회수하는 방법.
The method according to claim 1,
The gold leaching step (S400) is a printed circuit board scrap characterized in that the copper leaching solution produced in the leaching step (S300) is recovered in a state in which a new hydrochloric acid solution of 0.1 to 1 molar concentration is injected Selectively recovering gold from the process.
상기 아세톤과 염산용액을 혼합한 용액은 아세톤과 1몰 염산 용액이 부피비 9:1로 혼합된 용액인 것을 특징으로 하는 인쇄회로기판 스크랩으로부터 금을 선택적으로 회수하는 방법.The method according to claim 1,
The solution of acetone and hydrochloric acid solution is a method for selectively recovering gold from the printed circuit board scrap, characterized in that the solution of acetone and 1 mol hydrochloric acid solution in a volume ratio of 9: 1.
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| CN104264184A (en) * | 2014-09-12 | 2015-01-07 | 上海电力学院 | Method for extracting metallic copper from waste circuit board |
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