KR101217507B1 - Manufacturing Method Composites having a Pattern - Google Patents

Abstract

The present invention relates to a method for producing a composite material in which the irregularities are formed on the surface of the conductive substrate and the nanoparticles and the metal material are selectively attached to a part of the conductive substrate by the simultaneous implementation of the electrophoresis method and the electroplating method so that the pattern is provided. .

In the method of manufacturing a composite material having a pattern according to the present invention, a material preparation step (S100) of preparing a conductive substrate 120, a metal material, and nanoparticles 160 and irregularities having a pattern on one side of the conductive substrate ( Unevenness forming step (S200) to form a non-conductive layer 170 made of 172 to expose a portion of the conductive substrate through the non-conductive layer, and the functionalization step to have a positive charge on the surface of the nanoparticles ( S300), the positively charged nanoparticles, the conductive substrate and the metal material are charged into the composite treatment tank containing the electrolytic solution and simultaneously subjected to the electrophoresis method and the electroplating method to the nanoparticles on the outer surface of the conductive substrate exposed between the nonconductive layers. By attaching the particles and the metal material at the same time is characterized in that the pattern forming step (S400) to have a pattern of the metal layer 140 is inserted into the nanoparticles inserted form. According to the present invention configured as described above, there is an advantage that the manufacturing process is simplified and the production of a composite material having various characteristics is possible.

Electrophoresis, electroplating, composites, patterns, irregularities,

Description

Manufacturing Method Composites Having a Pattern

1 is a longitudinal sectional view schematically showing an internal configuration of a composite material employing an embodiment of the present invention.

Figure 2 is a longitudinal sectional view schematically showing the internal configuration of a composite material employing another embodiment of the present invention.

3 is a longitudinal sectional view schematically showing an internal configuration of a composite material in which another embodiment of the present invention is employed;

4 is a longitudinal sectional view schematically showing an internal configuration of a composite material in which another embodiment of the present invention is employed;

5 is a flow chart showing a method for producing a composite material with a pattern according to the present invention.

6 is a schematic view showing a manufacturing method according to an embodiment of the present invention.

7 is a schematic view showing a manufacturing method according to another embodiment of the present invention.

8 is a schematic view showing a manufacturing method according to another embodiment of the present invention.

9 is a conceptual diagram showing an embodiment of the principle of the unevenness forming step which is one step in the method of manufacturing a composite material with a pattern according to the present invention.

10 is a conceptual diagram of another embodiment showing the principle of the unevenness forming step which is one step in the method of manufacturing a composite material with a pattern according to the present invention.

Explanation of symbols on the main parts of the drawings

100. Composite material 120. Conductive substrate

130. Metallic materials 140. Metallic layers

150. Pore 160. Nanoparticles

170. Non-conductive layer 172. Unevenness

180. Complex treatment tank 190. Photosensitive material

192.Mask S100. Material preparation stage

S200. Irregularities forming step S300. Functionalization stage

S400. Pattern forming step S420. Electrophoresis Process

S440. Electroplating Process S460. Washing process

S480. Drying process S500. Reduction step

S600. Pattern Separation Step

The present invention provides a composite material having a pattern formed by forming irregularities on the surface of the conductive substrate and selectively attaching nanoparticles and metal materials to a portion of the conductive substrate by simultaneous electrophoresis and electroplating to form a pattern. It is about a method.

Nanoparticles, including carbon nanotubes, have excellent electrical conductivity and strength, so that even if a small amount is added to the metal, a composite material having a much improved characteristic than the structure / functional properties of the original metal base can be obtained.

In particular, recently, composite materials have been developed to have carbon nanotubes added to various materials to have improved physical properties required.

In addition, copper (Cu), which is one of the representative metal substrate materials, is widely used as a signal transmission material in existing electric and electronic parts due to its high electrical conductivity, but the poor mechanical properties of the material itself are an obstacle to miniaturization of devices and components. There is a problem at work.

Until now, high strength of copper or copper alloy material has been dependent on solid solution and precipitation hardening by addition of alloying elements and work hardening by plastic working. However, addition of alloying elements inevitably leads to a decrease in electrical conductivity.

In addition, the metal base and the carbon nanotubes are difficult to attach because of their low affinity. To overcome this problem, a method of depositing carbon nanotubes by forming irregularities using etching on the surface of a metal base is used.

However, this method also has a problem in that the bonding force is lowered since the carbon nanotubes are not integrated with the metal base.

In addition, the productivity is reduced as the process, such as etching is added, it is not preferable because it increases the manufacturing cost.

On the other hand, many studies have been conducted to prepare composite materials requiring high strength and high conductivity by adding carbon nanotubes to a molten metal base.

However, molten metal to which carbon nanotubes are added has a high interfacial energy, that is, it is difficult to uniformly disperse the agglomerated carbon nanotubes due to poor contact properties. There is a problem of uneven distribution within.

In addition, a large number of processes are required to manufacture the composite material, which lowers the productivity and rapidly increases the manufacturing cost, thereby lowering the price competitiveness.

In addition, such a composite material is manufactured in the form of a composite material, and a pattern is required to be applied to a specific technique, but there is a difficulty in forming such a pattern.

An object of the present invention is to solve the above problems, the conductive substrate is attached to a non-conductive material having irregularities on one side of the conductive substrate, the conductive substrate after forming the nanoparticles and metal layers the same or opposite to the pattern on the outer surface of the conductive substrate at the same time It is to provide a composite material and a method of manufacturing the same to provide a pattern by selectively separating the.

Composite material provided with a pattern according to an embodiment of the present invention comprises a nanoparticles and a metal layer mixed deposition by simultaneous electrophoresis process and electroplating process, the pattern is formed on one side of the metal layer It features.

The composite material provided with the pattern according to another embodiment of the present invention is configured to include a conductive substrate, nanoparticles and metal layers mixed and deposited on one side of the conductive substrate by simultaneous electrophoresis and electroplating. One side of the conductive substrate is characterized in that the pattern is formed.

The pattern penetrates through the metal layer.

The metal layer includes at least one of conductive metals such as copper (Cu), gold (Au), silver (Ag), platinum (Pt), nickel (Ni), iron (Fe), aluminum (Al), and magnesium (Mg). It is configured to, characterized in that a plurality of pores are formed between the nanoparticles and the metal layer.

The method of manufacturing a composite material having a pattern according to the present invention includes a material preparation step of preparing a conductive substrate, a metal material, and nanoparticles, an unevenness forming step of forming irregularities on one side of the conductive substrate, and the surface of the nanoparticles A functionalization step of carrying a positive charge and a positively charged nanoparticle, a conductive substrate, and a metal material are charged into a composite treatment tank containing an electrolyte to form a metal layer having a pattern on one side of the outer surface of the conductive substrate. Characterized in that the pattern forming step.

After the unevenness forming step, a separation step for selectively separating the conductive substrate and the metal layer is characterized in that it is carried out.

The material preparation step is characterized in that the process of forming a release layer on the outer surface of the conductive substrate.

In the material preparation step, the conductive substrate is characterized by having a thermal expansion coefficient different from the metal layer and nanoparticles.

The unevenness forming step is a process of selectively forming unevenness on one side of the photosensitive material by applying light after applying the photosensitive material to one side of the conductive substrate, wherein the photosensitive material is formed of a non-conductive material. It is characterized by.

The unevenness forming step may be a process of printing a non-conductive layer having unevenness on one side of the conductive substrate.

The pattern forming step may include an electrophoretic process of attaching the nanoparticles to the outer surface of the conductive substrate by electrophoresis and an electroplating process of attaching the metal material to the outer surface of the conductive substrate by electroplating.

In the pattern forming step, a plurality of pores are formed on one side of the metal layer.

The pattern forming step may be a process of applying a voltage for a predetermined time in a state in which a negative electrode is connected to the conductive substrate and a positive electrode is connected to the metal material.

In the pattern forming step, the metal material is ionized with metal ions and is attached to a conductive substrate connected to a negative (−) electrode.

In the pattern forming step, the metal material is characterized in that the ionized metal ions of the metal salt added to the electrolyte is attached to the outer surface of the conductive substrate.

In the pattern forming step, the metal material is ionized metal ions of the metal salt introduced into the electrolyte solution and the metal ion ionized plate-like metal material connected to the positive (+) is characterized in that attached to the outer surface of the conductive substrate at the same time.

According to the present invention configured as described above, there is an advantage that the manufacturing process is simplified and the production of a composite material having a variety of characteristics is possible.

Hereinafter, the configuration of the composite material according to the present invention.

1 and 2 show longitudinal cross-sectional views of one embodiment and another embodiment schematically illustrating the internal configuration of a composite material having a pattern according to the present invention.

As shown in the figure, the composite material 100 according to the present invention includes a conductive substrate 120 forming a basic skeleton, and a metal layer 140 and nanoparticles 160 simultaneously deposited on the upper surface of the conductive substrate 120. It is composed.

The conductive substrate 120 is a conductive metal such as copper (Cu), gold (Au), silver (Ag), platinum (Pt), nickel (Ni), iron (Fe), aluminum (Al), magnesium (Mg), and the like. It is formed as, the pre-treatment is not performed for the attachment and bonding of the nanoparticles 160 and the metal layer 140, it is possible to selectively perform the surface cleaning using alcohol or acetone.

The metal layer 140 is formed from a metal material 130 having high conductivity. For example, the metal layer 140 has conductivity such as copper (Cu), gold (Au), silver (Ag), platinum (Pt), nickel (Ni), iron (Fe), aluminum (Al), magnesium (Mg), and the like. It comprises at least one of the high metals.

In addition, the thickness of the metal layer 140 may be variously implemented within a thickness range of 10 nm to 500 μm depending on the required physical properties of the composite material 100, that is, a structural role or a functional role.

The nanoparticles 160 are provided in the metal layer 140 and are configured to improve strength, rigidity, wear resistance, and electrical / thermal characteristics of the nanoparticles 160.

In addition, the nanoparticles 160 and the metal layer 140 may be attached in a tangled state from the outer surface of the plate-shaped conductive substrate 120 to the outside, thereby improving the strength, rigidity, wear resistance, and conductivity of the composite material 100. .

The nanoparticles 160 may include any one or more of carbon nanoparticles (carbon nanotubes, carbon nanofibers, carbon black, etc.), ceramic nanoparticles, and metal nanoparticles.

In addition, pores 150 may be selectively formed in the metal layer 140 deposited in a mixed state with the nanoparticles 160.

That is, in the composite material 100, the nanoparticles 160 and the metal layer 140 are simultaneously attached to the outer surface of the conductive substrate 120 by simultaneous electrophoresis and electroplating, and the conductive substrate as shown in FIG. The nanoparticles 160 may be inserted into the metal layer 140 while the metal layer 140 is deposited on the outer surface thereof. As shown in FIG. 2, the nanoparticles 160 may be formed on the outer surface of the conductive substrate 120. ) And the metal material 130 may be deposited at the same time, so that a part of the nanoparticles 160 may be inserted into the granular metal layer 140 having the pores 150.

The metal layer 140 and the nanoparticles 160 are simultaneously attached to a conductive substrate 120 used to form a basic shape of the composite material 100 and then separated from the conductive substrate 120 to form the composite material 100. Done.

That is, the metal layer 140 and the nanoparticles 160 are simultaneously deposited on the outer surface of the conductive substrate 120 by simultaneously performing electrophoretic deposition and electroplating.

In more detail, the nanoparticles 160 are attached to the outer surface of the conductive substrate 120 through electrophoresis, the metal layer 140 is attached to the outer surface of the conductive substrate 120 through electroplating, and The electroplating method is carried out simultaneously.

Meanwhile, the metal layer 140 and the nanoparticles 160 are deposited to have a pattern. That is, when the metal layer 140 and the nanoparticles 160 are deposited on the conductive substrate 120, only a portion of the metal layer 140 and the nanoparticles 160 are formed to form a pattern, and the pattern is formed to have a shape penetrating through the metal layer 140. .

To this end, before the metal layer 140 and the nanoparticles 160 are deposited on the conductive substrate 120, a non-conductive layer 170 is provided on the upper surface of the conductive substrate 120, and the metal layer is provided on the non-conductive layer 170. The convex and convex 172 is formed to correspond to or opposite the pattern so that the pattern can be formed on the 140.

When the metal layer 140 and the nanoparticles 160 are deposited on the conductive substrate 120, the metal layer 140 and the nanoparticles 160 are deposited only in the perforated holes of the non-conductive layer 170, so that the non-conductive layer 170 and the metal layer 140 and The nanoparticles 160 form one layer.

The non-conductive layer 170 may be formed on the outer surface of the conductive substrate 120 by printing with a non-conductive material by a printing method so that the unevenness 172 is provided.

On the other hand, the composite material 100 is configured to be used to remove various configurations depending on the use conditions.

Hereinafter, a configuration of another embodiment of the composite material will be described with reference to FIGS. 3 and 4.

3 and 4 show longitudinal cross-sectional views schematically showing the internal construction of a composite material in which another embodiment of the present invention is employed.

As shown in these figures, the non-conductive layer 170 in the composite material 100 is selectively removed as shown in FIG. 3 to have a state in which the conductive substrate 120, the metal layer 140, and the nanoparticles 160 are bonded to each other. Alternatively, as shown in FIG. 4, the non-conductive layer 170, the metal layer 140, and the nanoparticles 160 may be attached to each other, and only the conductive substrate 120 may be separated and used.

In this case, a release layer (not shown) may be provided on an upper surface of the conductive substrate 120 so that the conductive substrate 120 and the metal layer 140 may be easily separated.

The release layer may be variously modified within the range in which the conductive substrate 120 and the metal layer 140 may be separated. That is, the release layer is formed on the outer surface of the conductive substrate 120 by a separate coating process to form a release coating layer, or attaching a release film layer so that the conductive substrate 120 and the metal layer 140 can be easily separated. It is also possible.

In addition, the release layer has a thin thickness so that the conductive substrate 120 and the metal layer 140 do not necessarily have conductivity if they are within a range in which an electrostatic attraction can be sufficiently operated.

In addition, the conductive substrate 120 may be formed of a material having a thermal expansion coefficient different from that of the metal material 130 and the nanoparticles 160 without having a release layer to be separated from the metal layer 140 and the nanoparticles 160. It may be.

Hereinafter, a method of manufacturing the composite material 100 will be described in detail with reference to FIGS. 5 to 9.

Figure 5 is a flow chart showing a manufacturing method of a composite material with a pattern according to the present invention, Figure 6 is a schematic diagram showing a manufacturing method according to an embodiment of the present invention, Figure 7 according to another embodiment of the present invention Figure 9 is a schematic diagram showing a manufacturing method, Figure 9 is a conceptual diagram showing an embodiment of the principle of the pattern forming step as a step in the method of manufacturing a composite material with a pattern according to the present invention.

As shown in these figures, the method of manufacturing the composite material 100, the material preparation step (S100) for preparing the conductive substrate 120, the metal material 130 and the nanoparticles 160 and the conductive substrate ( 120) the unevenness forming step (S200) of forming the unevenness 172 on one side, and the functionalization step (S300) to have a positive charge on the surface of the nanoparticles 160, and has a positive (+) charge The nanoparticles 160, the conductive substrate 120, and the metal material 130 are charged into the composite treatment tank 180 containing the electrolyte to form the metal layer 140 having a pattern on one side of the outer surface of the conductive substrate 120. The pattern forming step (S400) is made.

In the material preparation step (S100), various solvents having a relative dielectric constant of 5 or more, such as water or ethanol, methanol, acetone, propanol, DMF (dimethylformamide), and DMA (dimethylacetamide) may be selectively applied.

In the material preparation step S100, a conductive metal plate may be applied to the conductive substrate 120, and a release layer may be formed on an outer surface thereof. In addition, the conductive substrate 120 may be applied to a polymer and a polymer mixture within a range of a material having conductivity, wherein the conductive substrate 120 may be melted and removed in the pattern separation step S600.

In addition, the conductive substrate 120 may be selectively applied to a carbon sheet or a carbon fabric.

When the material preparation step (S100) is completed, the unevenness forming step (S200) is carried out. The irregularities forming step (S200) is a previous step required to form the above-described pattern, it can be formed in various embodiments.

That is, as shown in FIG. 6, the photosensitive material 190 having the non-conductive property is placed on the upper surface of the conductive substrate 120 in the unevenness forming step S200, and the mask 192 is formed with a hole formed on the upper side of the photosensitive material 190. ) And then irradiate light downward to selectively remove the photosensitive material 190 to form the unevenness 172.

In addition, the unevenness 172 may be formed to have various shapes on the conductive substrate 120.

That is, as shown in FIG. 6, the upper surface of the conductive substrate 120 may be selectively etched through the gaps between the unevenness 172 to have a recessed shape. As illustrated in FIG. 7, the conductive substrate 120 and the photosensitive material may be recessed. After forming the non-conductive layer 170 on the entire upper surface of the 190, the conductive substrate 120 and the photosensitive material 190 may be separated to form an uneven protrusion 172 protruding upward.

Meanwhile, the unevenness forming step S200 may form the unevenness 172 through a printing technique as shown in FIG. 8.

That is, the non-conductive layer 170 is formed on the top surface of the conductive substrate 120 by using a printing technique, but the non-conductive layer 170 has a concave-convex shape.

Therefore, the central portion of the upper surface of the conductive substrate 120 where the non-conductive layer 170 is not formed by the printing technique is exposed to the outside, and the metal layer 140 in the pattern forming step S400 to be described below. And the nanoparticles 160 may be deposited.

In various embodiments as described above, when the unevenness forming step S200 is completed, the functionalizing step S300 is performed. The functionalization step (S300) is a process of allowing the surface of the nanoparticles 160 to have a positive charge, which is possible by introducing functional groups such as imine groups and amine groups.

In the functionalization step (S300), an imine group is introduced to the surface of the nanoparticles 160 using PEI (polyethylenimine) or THF (Tetrahydrofuran) solution, or the surface of the nanoparticles 160 is oxidized and then treated with TETA (triethylenetetramine) to amine. A method of introducing an amine group to the surface of the nanoparticles 160 may be selectively performed by introducing a group / imine group or by plasma treatment in a nitrogen or ammonia gas atmosphere.

That is, when the nanoparticles 160 are sufficiently washed and filtered in an electrolyte and dried in a vacuum oven, the surface of the nanoparticles 160 has a positive charge by introducing an imine group.

Then, the nanoparticles (the carbon nanotube is used in the embodiment of the present invention) subjected to the functionalization step (S300) are selectively washed and filtered sufficiently in an electrolyte solution and then dried for 10 hours in a vacuum oven at 70 ℃, again It is immersed in electrolyte and can be dispersed under bath-type and beam-type ultrasonic waves.

In addition, the functionalization step (S300) is capable of introducing a positive charge by introducing a functional group such as an amine group, an imine group on the surface of the nanoparticles 160 through a plasma treatment.

After the functionalization step (S300), a pattern forming step (S400) is performed. The pattern forming step (S400), the functionalized nanoparticles 160, copper (Cu), gold (Au), silver (Ag), platinum (Pt), nickel (Ni), iron (Fe), aluminum (Al) ) Simultaneously attaches a metal material 130 including at least one of highly conductive metals such as magnesium and magnesium to the outside of the conductive substrate 120 to integrate the metal layer 140 and the nanoparticles 160. It is a process.

In this case, the metal layer 140 may be variously deposited within a thickness range of 10 nm to 500 μm depending on the required physical properties of the composite material 100, that is, a structural role or a functional role.

More specifically, the pattern forming step (S400) is an electrophoretic process (S420) of attaching the nanoparticles 160 to the outer surface of the conductive substrate 120 by electrophoresis method, and the metal material 130 by electroplating method The electroplating process (S440) is attached to the outer surface of the substrate 120, the electrophoretic process (S420) and the electroplating process (S440) is carried out at the same time.

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIG. 9 to which the pattern forming step S400 is attached.

9 is a conceptual diagram showing the principle of the pattern forming step (S400) which is one step in the method of manufacturing a composite material according to the present invention.

As shown in the figure, in the embodiment of the present invention, the nanoparticles 160 having positive charges dispersed therein are charged together with an electrolyte in the complex treatment tank 180, and the conductive substrate 120 is negative (−). At the pole, the metal material 130 is connected to the positive electrode, respectively, and then spaced apart from the conductive substrate 120 and the metal material 130 at regular intervals and then fixed.

The metal material 130 is composed of a copper (Cu) plate, the carbon nanotubes are applied to the nanoparticles 160, and the distance between the conductive substrate 120 and the copper (Cu) is 0.8 cm.

In addition, an uneven surface 172 formed of a non-conductive material is formed on an outer surface of the conductive substrate 120.

Thereafter, a voltage is applied to the conductive substrate 120 and the nanoparticles 160 for a predetermined time.

At this time, the positively charged carbon nanotubes are deposited on the surface of the negatively-charged conductive substrate 120 by electrophoresis to form the nanoparticles 160, and the metal material 130 After the positive electrode is connected and ionized with an electrolyte (Cu → Cu ²⁺ + 2e ⁻ ), the ionized Cu ²⁺ is formed on the outer surface of the conductive substrate 120 and the nanoparticle 160 to which the negative electrode is connected. It is attached to form the metal layer 140.

In more detail, the metal layer 140 and the nanoparticles 160 are not deposited on the non-conductive layer 170, and the metal layer 140 and the nanoparticles are selectively selected only on a portion of the outer surface of the conductive substrate 120 exposed to the electrolyte. Particles 160 are deposited.

Accordingly, when the pattern forming step S400 is completed, the nanoparticles 160 and the metal layer 140 are simultaneously deposited on the outer surface of the conductive substrate 120 to form the composite material 100, and the composite material 100 A pattern can be formed therein.

More specifically, the outer surface of the conductive substrate 120, the nanoparticles 160 are first attached to the composite material 100 of the shape (see Fig. 2) is formed in which the metal layer 140 surrounds the outer surface of the nanoparticles 160 The metal layer 140 may be deposited on the outer surface of the conductive substrate 120 and the nanoparticles 160 may be inserted into the metal layer 140 during the process of depositing the metal layer 140 (see FIG. 1). By having it, the composite material 100 in which the pores 150 are formed may be manufactured.

After the pattern forming step S400, a washing process S460 is performed in which the conductive substrate 120 to which the patterned composite material 100 is attached is removed from the composite treatment tank 180 and washed with an electrolyte solution.

The completed composite material 100 is charged into a vacuum oven and dried at 70 ° C. for about 10 hours to proceed with a drying process (S480).

In addition, after the drying process (S480), a reduction step (S500) of reducing the dried conductive substrate 120, the nanoparticles, and the metal layer 140 in a heat treatment furnace in a reducing atmosphere may be selectively performed.

After the reduction step (S500), a pattern separation step (S600) is carried out. The pattern separation step S600 is a process of separating the composite material 100 having the pattern from the non-conductive layer 170 or the conductive substrate 120.

That is, when the release layer is provided on the outer surface of the conductive substrate 120 in the material preparation step (S100), the composite material 100 can be easily separated from the conductive substrate 120 as shown in FIG. 4. It becomes possible.

In another embodiment, the conductive substrate 120 is applied by applying a conductive material having a lower melting point than the metal material 130 and the nanoparticles 160 when preparing the conductive substrate 120 in the material preparation step (S100). By heating and melting and removing, only the composite material 100 in the state shown in FIG. 4 may be left.

In another embodiment, when the non-conductive layer 170 is applied to the photosensitive material 190 in the same state as in FIG. 1, the composite material 100 may be selectively removed by irradiating with light. It may be manufactured to have.

In another embodiment, the conductive substrate 120 is configured to be different from the thermal expansion coefficients of the nanoparticles 160, the metal material 130, and the non-conductive layer 170 to heat the conductive substrate 120 and the composite material. It may be possible to have 100 separated.

According to the above process, the production of the composite material with a pattern according to the present invention is completed.

On the other hand, in the method of manufacturing a composite material provided with a pattern according to the present invention, other embodiments can be applied in the construction of the metal material 130.

That is, FIG. 10 is a conceptual view illustrating a manufacturing method of another embodiment of the composite material manufacturing method according to the present invention. In another embodiment, the metal material 130 is not a single material but a plurality of types of composite metals.

That is, the metal material 130 may be applied to a single-phase alloy or a composite metal containing two or more metals, by applying a plating solution to the electrolyte solution and ionized metal material 130 and plate-like metal material ( 130 may be made of different materials.

At this time, the outer surface of the conductive substrate 120, the nanoparticles 160 and the alloy or composite metal phase containing two or more metals can be deposited at the same time.

The scope of the present invention is not limited to the above-described embodiments, and many other modifications based on the present invention will be possible to those skilled in the art within the scope of the present invention.

That is, in the pattern forming step (S400) of the embodiment of the present invention, but the metal layer is formed so that the ionized metal ions are attached to the outer surface of the conductive substrate to form a metal layer, but if necessary, a metal salt is added to the electrolyte, The metal salt may be ionized and attached to the outer surface of the conductive substrate.

In addition, the metal ion introduced into the electrolyte solution may be configured such that the ionized metal ion and the metal ion ionized by the plate-shaped metal material connected to the positive electrode are simultaneously attached to the outer surface of the conductive substrate.

As described above, in the present invention, a non-conductive material having irregularities on one side of the conductive substrate is formed, and the nanoparticles and metal layers that are the same or opposite to the pattern are simultaneously formed on the outer surface of the conductive substrate, and then the patterns are selectively separated. It is possible to manufacture the provided composite material.

Therefore, the nanoparticles and the metal material are tightly coupled in a mixed state on the outside of the conductive substrate, and can be easily produced through a simple separation process, thereby improving the price competitiveness.

Further, in the present invention, by selectively forming pores in the metal layer, it is possible to selectively change and improve the mechanical / electrical / thermal characteristics, which is applicable to various applications.

Claims (17)

delete delete delete delete delete delete A material preparation step of preparing a conductive substrate, a metal material and nanoparticles, an unevenness forming step of exposing a portion of the conductive substrate through the nonconductive layer by forming a nonconductive layer made of concave-convex having a pattern on one side of the conductive substrate; A functionalization step in which the surface of the nanoparticles is positively charged, the positively charged nanoparticles, the conductive substrate, and the metal material are charged into a composite treatment tank containing electrolyte, and electrophoresis and electroplating are performed simultaneously. A pattern forming step of simultaneously attaching nanoparticles and a metal material to the outer surface of the conductive substrate exposed between the non-conductive layer to have a pattern of the metal layer in which the nanoparticles are inserted, and a separation step of separating the conductive substrate and the metal layer Done, In the material preparation step, A release layer is formed on the outer surface of the conductive substrate, In the pattern forming step, the release layer is a method of manufacturing a composite material having a pattern, characterized in that the conductive substrate is configured so that the electrostatic attraction to the nanoparticles and the metal material. A material preparation step of preparing a conductive substrate, a metal material and nanoparticles, an unevenness forming step of exposing a portion of the conductive substrate through the nonconductive layer by forming a nonconductive layer made of concave-convex having a pattern on one side of the conductive substrate; A functionalization step in which the surface of the nanoparticles is positively charged, the positively charged nanoparticles, the conductive substrate, and the metal material are charged into a composite treatment tank containing electrolyte, and electrophoresis and electroplating are performed simultaneously. A pattern forming step of simultaneously attaching nanoparticles and a metal material to the outer surface of the conductive substrate exposed between the non-conductive layer to have a pattern of the metal layer in which the nanoparticles are inserted, and a separation step of separating the conductive substrate and the metal layer Done, In the material preparation step, The conductive substrate has a coefficient of thermal expansion different from that of the metal layer and the nanoparticles, The method of manufacturing a composite material with a pattern, characterized in that the metal layer and the conductive substrate is separated by heating in the separation step. A material preparation step of preparing a conductive substrate, a metal material and nanoparticles, an unevenness forming step of exposing a portion of the conductive substrate through the nonconductive layer by forming a nonconductive layer made of concave-convex having a pattern on one side of the conductive substrate; A functionalization step in which the surface of the nanoparticles is positively charged, the positively charged nanoparticles, the conductive substrate, and the metal material are charged into a composite treatment tank containing electrolyte, and electrophoresis and electroplating are performed simultaneously. A pattern forming step of simultaneously attaching nanoparticles and a metal material to the outer surface of the conductive substrate exposed between the non-conductive layer to have a pattern of the metal layer in which the nanoparticles are inserted, and a separation step of separating the conductive substrate and the metal layer Done, In the material preparation step, The conductive substrate has a lower melting point than metal materials and nanoparticles, Method of manufacturing a composite material having a pattern, characterized in that only the conductive substrate is selectively melted in the separation step. The method of claim 8 or 9, wherein the irregularities forming step, And coating a photosensitive material formed of a non-conductive material on one side of the conductive substrate and irradiating light to selectively form irregularities on one side of the photosensitive material. The method of claim 8 or 9, wherein the irregularities forming step, Method of manufacturing a composite material with a pattern characterized in that the process of printing a non-conductive layer having irregularities on one side of the conductive substrate. The method of claim 8 or 9, wherein the pattern forming step, An electrophoretic process of attaching the nanoparticles to the outer surface of the conductive substrate by electrophoresis; The method of manufacturing a composite material with a pattern characterized in that the electroplating process for attaching the metal material to the outer surface of the conductive substrate by the electroplating method. The method of claim 12, wherein in the pattern forming step, Method of manufacturing a composite material having a pattern, characterized in that the pores are formed on one side of the metal layer. The method of claim 12, wherein the pattern forming step, The method of manufacturing a composite material with a pattern, characterized in that the process of applying a voltage for a predetermined time in a state in which the negative electrode is connected to the conductive substrate and the positive electrode is connected to the metal material. The method of claim 12, wherein in the pattern forming step, And the metal material is ionized with metal ions and attached to a conductive substrate connected to a negative (-) electrode. The method of claim 12, wherein in the pattern forming step, The metal material is a method of manufacturing a composite material having a pattern, characterized in that the ionized metal ion of the metal salt added to the electrolyte is attached to the outer surface of the conductive substrate. The method of claim 12, wherein in the pattern forming step, The metal material is a composite material having a pattern, characterized in that the ionized metal ion of the metal salt introduced into the electrolyte and the plate-shaped metal material connected to the positive electrode are simultaneously attached to the outer surface of the conductive substrate. Manufacturing method.

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