KR101202174B1 - Light-emitting device having phosphor sheet and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a light emitting device and a manufacturing method thereof, the light emitting device comprising: a substrate; A light emitting diode chip attached to one surface of the substrate; A bonding pad formed on the light emitting diode chip; Bonding wires connecting the bonding pads to the substrate; An adhesive member applied to a predetermined region of an upper portion of the light emitting diode chip; And a phosphor sheet having edges removed to correspond to the position at which the bonding pad is formed, the phosphor sheet being attached to the upper portion of the light emitting diode chip by the adhesive member.

Light Emitting Diode Chip, Phosphor, Through Hole, Color Reproducibility, Light Efficiency

Description

LIGHT-EMITTING DEVICE HAVING PHOSPHOR SHEET AND METHOD OF MANUFACTURING THE SAME

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device having a phosphor sheet and a method of manufacturing the same, and more particularly, to a light emitting device and a method of manufacturing the same, which allow a white light output by attaching a phosphor sheet on top of a light emitting diode chip.

A light emitting diode (LED) refers to a device that makes a small number of carriers (electrons or holes) injected by using a pn junction structure of a semiconductor and emits a predetermined light by recombination thereof, and red using GaAsP or the like. Green light emitting diodes using light emitting diodes, GaP and the like, and blue light emitting diodes using InGaN / AlGaN double hetero structure.

The light emitting device may implement white light by combining a light emitting diode chip and a phosphor. For example, a phosphor emitting yellow-green or yellow as part of the light as an excitation source on top of a light emitting diode chip emitting blue light can be disposed to obtain white color by blue emission of the light emitting diode chip and yellow green or yellow emission of the phosphor. have. That is, white light can be realized by a combination of a blue light emitting diode chip made of a semiconductor component emitting a wavelength of 430 to 480 nm and a phosphor capable of generating yellow light using blue light as an excitation source.

That is, the conventional white light emitting device induces white with a combination of blue of the blue and the yellow of the phosphor by the light having a sufficiently high energy emitted from the high brightness blue LED excites the yellow YAG-based phosphor to emit light in the yellow region Method was used.

1 is a structural diagram of a white light emitting device 10 to which a conventional blue LED 13 and a powder type yellow light emitting YAG series phosphor 11 are applied. However, in the conventional light emitting device 10 as shown in FIG. 1, the combination of the blue light emitted from the LED chip 13 and the yellow light emitted from the phosphor 11 is applied to the method of applying the phosphor 11 and the operating conditions of the LED chip 13. Since it is very sensitive to the conventional YAG-based white light emitting device 10 has a lot of difficulties to reproduce the same white. In particular, as shown in FIG. 1, the luminescence brightness is irregular due to the mixing ratio of the epoxy resin or silicone resin used at the time of applying the phosphor 11, the thermal instability of the resin, and the irregular deposition of the phosphor during curing. It has a problem of high color and poor color reproducibility.

Accordingly, an object of the present invention is to provide a light emitting device having a low defect rate and excellent thermal durability and color reproducibility, and a method of manufacturing the same, as compared with a light emitting device using a conventional powder phosphor.

In addition, the technical problem to be achieved by the present invention is to provide a light emitting device and a method of manufacturing the same that can reduce the amount of phosphor used in manufacturing the light emitting device, resulting in cost reduction and contribute to the improvement of productivity.

Another object of the present invention is to provide a light emitting device capable of reducing the loss of light emitted from a light emitting diode chip and increasing light emission efficiency and a method of manufacturing the same.

A light emitting device according to an aspect of the present invention, a substrate; A light emitting diode chip attached to one surface of the substrate; A bonding pad formed on the light emitting diode chip; Bonding wires connecting the bonding pads to the substrate; An adhesive member applied to a predetermined region of an upper portion of the light emitting diode chip; And a phosphor sheet attached to an upper portion of the light emitting diode chip by the adhesive member with edges removed to correspond to a position where the bonding pad is formed.

Preferably, the phosphor sheet may be formed using a mixture of phosphor and resin to form a predetermined opening in a phosphor sheet disc manufactured in a sheet shape, and cut the phosphor sheet disc having the opening formed in accordance with the size of the LED chip. It is characterized by being manufactured.

Preferably, the phosphor sheet disc is produced from the mixture using one of a press molding method, an extrusion molding method, or a doctor blade method.

Preferably, the predetermined opening is a portion through which the punching machine passes by irradiating a surface of the phosphor sheet disc with a laser to remove a portion of the phosphor sheet disc, or by pressing the phosphor sheet disc from above using a punching machine. It is characterized by being formed by removing.

Preferably, the phosphor sheet has a thickness of 15 μm to 500 μm.

Preferably, the resin is a silicone resin, epoxy resin, glass, glass ceramic, polyester resin, acrylic resin, urethane resin, nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin, It is characterized by comprising at least one of polyethylene resin, Teflon resin, polystyrene resin, polypropylene resin, polyolefin resin.

Preferably, the reflectivity of the resin is characterized in that 1.4 to 1.8.

Preferably, the hardness of the resin is characterized in that the Shore A (Shore A) hardness of 50 or more or Shore D (Shore D) hardness of 30 or more.

Preferably, the light emitting diode chip is a blue light emitting diode chip, the phosphor is characterized in that the phosphor having a yellow light emitting property.

According to another aspect of the present invention, there is provided a method of manufacturing a light emitting device, the method including: manufacturing a phosphor sheet having corners removed to correspond to a position at which a bonding pad of a light emitting diode chip is formed; Attaching the light emitting diode chip to one surface of a substrate; Connecting the bonding pad formed on the light emitting diode chip to the substrate using a bonding wire; Applying an adhesive member to a predetermined region of an upper portion of the light emitting diode chip; And attaching the phosphor sheet to the upper portion of the light emitting diode chip by the adhesive member.

Preferably, the preparing of the phosphor sheet may include preparing a sheet-shaped phosphor sheet disc using a mixture of phosphor and resin; Forming a predetermined opening in the phosphor sheet disc; And cutting the phosphor sheet disc having the openings formed in accordance with the size of the light emitting diode chip to simultaneously manufacture a plurality of the phosphor sheets.

Preferably, the step of preparing the phosphor sheet disc, characterized in that for producing the phosphor sheet disc from the mixture using any one of a press molding method, an extrusion molding method or a doctor blade method.

Preferably, the forming of the predetermined opening may include removing a portion of the phosphor sheet original by irradiating a laser onto a surface of the phosphor sheet original, or pressing the phosphor sheet original from above using a punching machine to press the punching machine. The opening is formed by removing a portion through which the passage passes.

Preferably, the phosphor sheet has a thickness of 15 μm to 500 μm.

Preferably, the resin is a silicone resin, epoxy resin, glass, glass ceramic, polyester resin, acrylic resin, urethane resin, nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin , At least one of polyethylene resin, teflon resin, polystyrene resin, polypropylene resin, and polyolefin resin.

Preferably, the reflectivity of the resin is characterized in that 1.4 to 1.8.

Preferably, the hardness of the resin is characterized in that the Shore A (Shore A) hardness of 50 or more or Shore D (Shore D) hardness of 30 or more.

Preferably, the light emitting diode chip is a blue light emitting diode chip, the phosphor is characterized in that the phosphor having a yellow light emitting property.

The light emitting device and the method of manufacturing the same according to the present invention can emit light of uniform color, reduce the defective rate, can provide excellent thermal durability and color reproducibility, compared to the light emitting device using the conventional powder phosphor, The homogeneity of the phosphors in the phosphor sheet can be increased, thereby solving the chromatic aberration problem.

In addition, the light emitting device and the method of manufacturing the same according to the present invention can reduce the amount of phosphor used to reduce the manufacturing cost and improve the productivity by using a phosphor sheet, compared to the conventional light emitting device using a powder phosphor.

In addition, conventionally, light emitted from a light emitting diode chip is canceled by each other by light emitted from the phosphor particles while being passed through the molding part or emitted from the phosphor. The luminous efficiency can be increased by reducing the loss of emitted light.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments introduced below are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

Hereinafter, the structure of the light emitting device according to the present invention will be described with reference to FIGS. 2 and 3.

2 is a cross-sectional view of a semiconductor device having a phosphor sheet according to an embodiment of the present invention. The semiconductor device 20 of FIG. 2 includes the lower substrate 21, the light emitting diode chip 22 mounted on the lower substrate 21, and the pattern electrodes 24 and 25 formed in a predetermined shape on the lower substrate 21. ), A bonding pad 28 formed on the light emitting diode chip 22, a bonding wire 26 connecting the bonding pads 28 and the pattern electrodes 24 and 25, and an adhesive member 25. The phosphor sheet 23 is attached to the upper portion of the light emitting diode chip 22. Here, in order to simplify the drawings, the illustration of the adhesive member 25 and the sealing member 27 is omitted.

Here, the lower substrate 21 may be any substrate that can mount the light emitting diode chip 22 at a high density. For example, but not limited to, the lower substrates include alumina, quartz, calcium zirconate, forsterite, SiC, graphite, fusedsilica, and mullite ( mullite, cordierite, zirconia, beryllia, aluminum nitride, low temperature co-fired ceramic (LTCC), and the like. The ceramic can be used as a multi-layer ceramic package (MLP) through the firing process by forming a metal conductor wiring pattern thereon. When used in these packages, airtightness is excellent.

In addition, the pattern electrodes 24 and 25 are manufactured using a metal material including copper or aluminum having excellent conductivity, and each pattern electrode 24 and 25 corresponding to the positive electrode and the negative electrode of the light emitting diode chip 22. Are formed separately from each other. The pattern electrode 24 of the pattern electrodes 24 and 25 is an anode electrode and the pattern electrode 25 is a cathode electrode.

In addition, the light emitting diode chip 22 is a blue light emitting LED chip, and is made of a semiconductor component emitting a wavelength of 430 to 480 nm. However, according to the embodiment, the LED chip 22 that emits other color light may be used as the LED chip 22, and the scope of the present invention is not limited to the specific LED chip.

In addition, the phosphor sheet 23 is manufactured mainly using a phosphor having a yellow wavelength, which is excited and emitted by blue light emitted from the light emitting diode chip 22. Here, one embodiment of the present invention corresponds to the case of configuring the phosphor sheet 23 for producing white light when the light emitting diode chip 22 outputs blue light, but, in the light emitting diode chip 22 If the color of the output light is not blue, the phosphor of the phosphor sheet 23 should also be changed to produce white light. The configuration of the phosphor sheet 23 will be described in detail below.

Specifically, the anode electrode 24 is formed on one upper surface of the lower substrate 21 to be spaced apart from each other to electrically insulate the cathode electrode 25 formed in the LED chip mounting region. The anode electrode 24 is also formed on the bottom surface of the lower substrate 21, and the anode electrode 24 formed on the bottom surface of the lower substrate 21 has an anode electrode formed on the upper surface of the lower substrate 21. 24 may be extended or may be separated from the anode electrode 24 formed on the upper surface of the lower substrate 21, but may be electrically connected.

The cathode electrode 25 is formed in a direction opposite to the anode electrode 21. Accordingly, the LED chip 22 is mounted on the cathode electrode 25 and is electrically connected to the anode electrode 24 and the cathode electrode 25 through the bonding wire 26. Of course, if necessary, the anode electrode 24 may be used as a cathode and the cathode electrode 25 may be replaced with an anode. In this case, the driving power application method may be reversed.

In addition, the bonding wire 26 connects the bonding pad 28 formed on the light emitting diode chip 22 and the pattern electrodes 24 and 25, whereby the light emitting diode chip 22 is electrically connected to the outside. Connected. The bonding wire 26 is usually a gold wire made of a metal having high electrical conductivity, for example, gold. That is, a high purity gold wire of 99.99% or more is melted with ultrasonic waves and heat, and then bonded to the bonding pad 28 and the pattern electrodes 24 and 25. Here, one side bonded to the bonding pad 28 may have a shape of a gold ball 26a (see FIG. 3).

In addition, the bonding pad 28 is usually formed of an aluminum alloy or a copper alloy material, is formed on the light emitting diode chip 22, and the pattern electrode 24 formed on the lower substrate 210 through the bonding wire 26. 25).

3 is a top view of the LED chip 22 mounted on the substrate 21 before attaching the phosphor sheet 23 to the upper portion of the LED chip 22. Referring to FIG. 3, two bonding pads 28 are formed on the light emitting diode chip 22, and bonding wires 26 are connected to the bonding pads 28, respectively.

Hereinafter, the phosphor sheet 23 according to an embodiment of the present invention will be described with reference to FIG. 4.

4 is a plan view of the phosphor sheet 23. Referring to FIG. 4, it can be seen that the edge of the phosphor sheet 23 is partially removed to correspond to the position of the bonding pad 28 illustrated in FIG. 3. That is, in the phosphor sheet 23, two edges of four corners are partially removed to correspond to the position and shape of the bonding pad 28, and a region where blue light is substantially emitted from the LED chip 22 as a whole. It is the same as that of the in-active region 22a (refer FIG. 3). Hereinafter, the site | part of the fluorescent substance sheet 23 from which the some area | region 29 was removed is called "edge cutting part." Thus, when the phosphor sheet 23 is attached to the upper portion of the light emitting diode chip 22, the interference of the bonding pad 28 and the bonding wire 26 formed on the upper portion of the light emitting diode chip 22 is damaged. It is possible to attach the phosphor sheet 23 without.

Specifically, referring to FIG. 4, two corners of the upper portion of the phosphor sheet 23 are partially removed by the region 29 indicated by the dotted line, so that the length L ₁ of the upper side of the phosphor sheet 23 is lower than that of the lower side. The phosphor sheet 23 is manufactured so as to be shorter than the length L ₂ and generally have a U-shape. However, the present invention is not limited thereto, and when only one bonding pad is formed on the LED chip 22, only a part corresponding to the formation position of the bonding pad may be partially removed from the phosphor sheet. Therefore, the present invention is not limited to the shape of the specific phosphor sheet.

Meanwhile, the phosphor sheet 23 according to the present invention may be manufactured using a slurry in which phosphor and resin are mixed. Here, it is preferable that resin mixed with fluorescent substance has high hardness and good reliability. For example, the resin is preferably a material having a Shore A hardness of about 50 or more or a Shore D hardness of about 30 or more.

In addition, the resin is not limited, but for example, silicone resin, epoxy resin, glass, glass ceramic, polyester resin, acrylic resin, urethane resin, nylon resin, polyamide resin, polyimide Thermosetting resins having transparency such as resins, vinyl chloride resins, polycarbonate resins, polyethylene resins, teflon resins, polystyrene resins, polypropylene resins, and polyolefin resins can be used.

In addition, the slurry is prepared by mixing the liquid epoxy resin and the phosphor, and may further include an additive such as a solvent as necessary. In addition, the slurry is not limited to the above liquid resin but may further include a solid resin.

Further, depending on the embodiment, the reflectance of the resin mixed with the phosphor is not limited, but may be, for example, about 1.4 to about 1.8.

In addition, the thickness of the phosphor sheet 23 (refer to d1 of FIG. 7) may vary from about 15 μm to about 500 μm, and preferably, about 30 μm to about 150 μm, depending on the embodiment. . That is, if the phosphor sheet 23 is too thin, less than about 30 μm, it is difficult for the light emitting device 20 to emit white light because it is difficult to uniformly distribute the phosphor inside the phosphor sheet 23. If the thickness 23 is too thick exceeding about 150 mu m, the light intensity cd may fall because light may be emitted to the side portions other than the front portion of the phosphor sheet 23.

In addition, the phosphor mixed with the resin may be used by mixing a plurality of phosphors as necessary as well as one kind of phosphors. As described above with reference to FIG. 1, the conventional wavelength conversion light emitting device is manufactured by embedding the light emitting diode 13 in the blue / near ultraviolet region in the epoxy 12 mixed with the phosphor 11, thereby improving thermal stability. On the other hand, while the light stability is unstable, the phosphor in the phosphor sheet 23 of the present invention is excellent in thermal stability and light stability and can emit high luminance. The type of the phosphor is not particularly limited, all available fluorescent substance for a known wavelength converter used and include, but are not limited to, for example, (Ba, Sr, Ca) 2 SiO 4: Eu 2 +, YAG ((Y, _{Gd) 3 (Al, Ga)} 5 O 12: Ce 3 +) based phosphor, TAG ((Tb, Gd) 3 (Al, Ga) 5 O 12: Ce 3 +) based phosphor, (Ba, Sr, Ca) ^{_{3 SiO 5: Eu 2 +,}} (Ba, Sr, Ca) MgSi 2 O 6: Eu 2+, Mn 2 +, (Ba, Sr, Ca) 3 MgSi 2 O 8: Eu 2 +, Mn 2 + , and ( _{Ba, Sr, Ca) MgSiO 4} : it may be mentioned at least one member selected from the group consisting of Eu ^{2 +,} Mn ^{2 +.}

5 to 6, the phosphor sheet original plate 33 used to manufacture the phosphor sheet 23 according to the present invention will be described.

FIG. 5 is a view showing a phosphor sheet original plate 33 prepared in a sheet shape using a slurry of a phosphor and a resin mixture, and FIG. 6 shows the opening 30 of the phosphor sheet original plate 33 in FIG. It is a figure which shows the arrangement | positioning of the several fluorescent substance sheet 23 surrounding.

Here, the phosphor sheet disc 33 may be manufactured by press molding a slurry, which is a mixture of the above-described phosphor and resin, into a sheet shape in a mold, or may be formed through various manufacturing processes such as an extrusion molding method or a doctor blade method. It may be. That is, the slurry may be fed into the extruder and pushed out of the mold to form the phosphor sheet disc 33, or a blade designed to pour the slurry to the bottom and pass a blade designed to maintain a constant distance from the bottom over the slurry to have a constant thickness of phosphor. The sheet disc 33 can also be formed.

Referring to FIG. 5A, a plurality of openings 30 are formed in the phosphor sheet disc 33 to form two corner cutouts in the phosphor sheet 23 to form a shape as shown in FIG. 4. do.

Specifically, a plurality of openings are formed by irradiating a surface of the phosphor sheet master plate 33 with a laser to form the openings 30, or by pressing a phosphor sheet plate from above using a punching machine to remove a portion through which the punching machine has passed. 30 can be formed. However, the opening 30 may be formed through an additional process in a step after the phosphor sheet original plate 33 is manufactured in a sheet shape, but when the phosphor sheet original plate 33 is manufactured using the above press working method or the like. The opening 30 may be formed at the same time as the sheet fabrication process.

FIG. 5B is a view showing a state in which the phosphor sheet original plate 33 is cut along the dotted line in FIG. 5A. Here, the phosphor sheet original plate 33 may be cut through, for example, a sawing or scribing process. However, the present invention is not limited to a specific cutting process method, and known methods for cutting sheets may be used without limitation.

6 is an enlarged view of an area (area A) indicated by a dotted line in FIG. 5 (b), and has a total of four phosphor sheets 23 having the shape of FIG. 4 with one opening 30 as a center. It can be seen that can be prepared. In addition, the size of one opening 30 is four times the area of the portion (area 29) cut off from the edge of the phosphor sheet 23. Therefore, an opening 30 having a size larger than that of the region 29 is formed in the phosphor sheet disc 33, and the phosphor sheet disc 33 is cut into four pieces centering on the opening 30 to form a phosphor sheet ( By manufacturing 23, the edge cutout can be more easily manufactured than removing the region 29 from the individual phosphor sheet 23. FIG.

Hereinafter, a method of manufacturing the phosphor sheet 23 of the present invention will be described with reference to FIG. 8.

Referring to FIG. 8, first, a phosphor sheet master plate 33 is manufactured in a sheet form using a slurry in which phosphor and resin are mixed (step S810). As described above, the phosphor sheet original plate 33 may be formed through various manufacturing processes such as a press working method, an extrusion molding method, or a doctor blade method.

Next, a plurality of openings 30 are formed in the phosphor sheet master plate 33 using a laser or a punching machine (step S820). The opening 30 is formed in the phosphor sheet disc to form an edge cut in the phosphor sheet 23 as described above.

Alternatively, the forming of the plurality of openings 30 may proceed simultaneously with the step of manufacturing the phosphor sheet original plate 33, that is, when the phosphor sheet original plate 33 is manufactured by pressing. The process of manufacturing the shape and the process of forming the opening 30 may be carried out at the same time.

Next, a plurality of phosphor sheets 23 are manufactured by cutting the region surrounding the opening 30, as a center (step S830).

Specifically, the phosphor sheet original plate 33 having the opening 30 is formed along a cutting line shown by a dotted line in FIG. 5A, for example, by a sawing or scribing process. Can be cut In other words, by cutting the phosphor sheet original plate 33 produced in a large size into a size suitable for the light emitting diode chip 22, a large amount of phosphor sheet 23 can be made at once, so that the homogeneity of the phosphor sheet 23 is increased. Productivity may be improved in the manufacturing process of the phosphor sheet.

Hereinafter, a method of manufacturing the semiconductor device 20 shown in FIG. 2 will be described with reference to FIGS. 9 through 11.

9 is a cross-sectional view illustrating a structure in which a phosphor sheet according to an embodiment of the present invention is attached to an upper portion of a light emitting diode chip, and FIG. 10 is a cross-sectional view of a light emitting device according to an embodiment of the present invention in which an encapsulation member is formed. 11 is a flowchart illustrating a method of manufacturing a light emitting device according to an embodiment of the present invention.

In the following description, it is assumed that the light emitting diode chip 22 outputs blue light, and the phosphor sheet 23 is mainly composed of a phosphor whose yellow wavelength is excited and emitted by the blue light.

Referring to FIG. 11, first, a substrate 21 that can be manufactured by an LTCC process or the like and a phosphor sheet 23 having a predetermined thickness are separately manufactured (step S1110). Here, it is assumed that pattern electrodes 24 and 25 are formed on the manufactured substrate 21. And the thickness of the manufactured fluorescent substance sheet 23 shall be uniform within about 15 micrometers-about 500 micrometers according to an Example.

According to the present invention, after the phosphor sheet 23 is separately manufactured, the quality of the phosphor sheet 23 itself or the color sense by the classifier can be confirmed before the phosphor sheet 23 is formed on the LED chip 22, thereby completing the light emitting device. It can reduce the defective rate of (20) and help improve the yield.

Thereafter, the light emitting diode chip 22 is attached to the substrate 21 and then electrically connected to the anode electrode 24 and the cathode electrode 25 through the wire 26 (step S1120). Although omitted for simplicity of illustration, an insulating material is disposed between the light emitting diode chip 22 and the cathode electrode 25 to insulate the light emitting diode chip 22 and the cathode electrode 25.

Here, in the case where the LED chip 22 having the positive electrode and the negative electrode in the upper plane of the LED chip is mounted on the substrate 21, two wires 26 are formed to form the LED chip 22 and the electrode. 24 and 25 may be connected to each other. However, in the case of mounting the LED chip having the positive electrode and the negative electrode on the upper and lower planes of the LED chip on the electrodes 24 and 25, the wire 26 may be connected. Only one may be formed and connected to the upper electrode of the light emitting diode chip.

Thereafter, as shown in FIG. 9, the adhesive member 25 is applied to the upper portion of the light emitting diode chip 22 (step S1130). Here, as the adhesive member 25, a transparent adhesive such as UV curable resin, thermosetting resin, sealant, or the like may be used. The adhesive member 25 may be applied to an area except for the bonding pad 28 on the upper portion of the LED chip 22.

 Thereafter, the phosphor sheet 23 is attached to the upper portion of the light emitting diode chip 22 in the arrow direction of FIG. 9 (step S1140). At this time, since the edge cutout is formed in the phosphor sheet 23 in the region corresponding to the bonding pad 28, the bonding pad 28 and the bonding wire 26 are not damaged by the attaching step. That is, after the light emitting diode chip 22 is configured to be electrically connected to the outside, the phosphor sheet 23 is attached to the top of the light emitting diode chip 22 by using the adhesive member 25. By doing so, there is an advantage that the present invention can be applied using the general chip process as it is. However, attaching the phosphor sheet 23 after connecting the light emitting diode chip 22 using the bonding wire 26 may be difficult to process and may cause a defect. Alternatively, it is also possible to attach the phosphor sheet 23 to the top surface of the light emitting diode chip 22 before the bonding wires 26 are connected. In this case, wire bonding may be performed by depositing a thick bonding pad 28 or forming a bump ball on the bonding pad 28, and the process may be easier than the aforementioned method, and the defect rate may be reduced. can do. In addition, according to the present invention, since the phosphor sheet 23 has an edge cut portion, even if the phosphor sheet 23 is attached first, it does not cause difficulty in the connection work of the bonding wire 26. Alternatively, a method of mounting the light emitting diode chip 22 having the phosphor sheet 23 attached thereto is also possible. Therefore, the manufacturing method of the light emitting device according to the present invention should not be interpreted as being limited to the specific order described in the present specification.

Thereafter, as shown in FIG. 10, a transmissive sealing member 27 is formed on the top of the substrate including the light emitting diode chip 22 having the phosphor sheet 23 attached thereon (step S1150). ). The encapsulation member 27 is formed of an epoxy or silicon material, and may be formed by molding using a mold such as transfer molding. However, the present invention is not limited thereto. In addition to encapsulating the light emitting diode chip 22, the encapsulation member 27 may also serve as a lens for adjusting a directing angle of light emitted from the light emitting diode chip 22. It may be.

In the light emitting device of the present invention as described above, the light emitting diode chip 22 and the phosphor sheet 23 may be variously selected to form a desired color. In order to implement white light emission, a blue light emitting diode chip emitting light having a wavelength of 430 to 480 nm is mounted, and a phosphor sheet manufactured by using a yellow light emitting phosphor is attached to the light emitting diode chip using an adhesive member. At this time, blue light is emitted from the light emitting diode chip, and the blue light is directly incident on the yellow light emitting phosphor sheet, and a part of the incident light is wavelength-converted to yellow light. Accordingly, blue light, which is a part of the primary light emission, and yellow light wavelength-converted by the phosphor sheet are mixed to realize white color. The degree of light conversion can be adjusted by adjusting the concentration and distribution of the phosphor 32 in the phosphor sheet 23 and the thickness of the phosphor sheet 23.

Alternatively, for white light emission, a UV light emitting diode chip emitting a wavelength of 350 nm to 410 nm may be mounted, and a phosphor sheet manufactured by including red, blue and green light emitting phosphors may be formed on the light emitting diode chip. have. Alternatively, individual phosphor sheets prepared by including blue light emitting phosphors, green light emitting phosphors, and red light emitting phosphors may be sequentially formed on the light emitting diode chips.

The light emitting device of the present invention and a method of manufacturing the same are not limited to the above-described embodiments, but may be applied to products having various structures including phosphors.

The present invention can be carried out by modification and modification within the scope without departing from the gist of the present invention, the scope of the present invention is defined by the claims to be described later rather than the detailed description, the meaning and scope of the claims and their All changes or modifications derived from the equivalent concept should be construed as being included in the scope of the present invention.

1 is a cross-sectional view of a conventional light emitting device.

2 is a cross-sectional view of a light emitting device according to an embodiment of the present invention.

3 is a top plan view of the light emitting diode chip of FIG. 2.

4 is a plan view of a phosphor sheet according to an embodiment of the present invention.

FIG. 5 is a plan view of a phosphor sheet disc for producing the phosphor sheet of FIG. 4; FIG.

FIG. 6 is a plan view showing the arrangement of phosphor sheets in the phosphor sheet original of FIG. 5; FIG.

7 is a perspective view of a phosphor sheet according to an embodiment of the present invention.

8 is a flowchart illustrating a method of manufacturing a phosphor sheet according to an embodiment of the present invention.

9 is a cross-sectional view showing a structure to which the phosphor sheet according to an embodiment of the present invention is attached.

10 is a cross-sectional view showing a light emitting device according to an embodiment of the present invention in which an encapsulation member is formed.

11 is a flowchart illustrating a method of manufacturing a light emitting device according to an embodiment of the present invention.

Claims (18)

Board; A light emitting diode chip attached to one surface of the substrate; A bonding pad formed on the light emitting diode chip; Bonding wires connecting the bonding pads to the substrate; An adhesive member applied to a predetermined region of an upper portion of the light emitting diode chip; And A phosphor sheet attached to an upper portion of the light emitting diode chip by the adhesive member with edges removed to correspond to a position where the bonding pad is formed, The phosphor sheet is formed by forming a predetermined opening in a phosphor sheet disc manufactured in a sheet shape using a mixture of phosphor and resin, and cutting the phosphor sheet disc having the opening formed in accordance with the size of the LED chip. Will be The hardness of the resin is Shore A (Shore A) hardness of 50 or Shore D (Shore D) light emitting device, characterized in that more than 30. delete The light emitting device according to claim 1, wherein the phosphor sheet original plate is manufactured from the mixture using one of a press molding method, an extrusion molding method, and a doctor blade method. 2. The punching machine of claim 1, wherein the predetermined opening passes a laser beam on a surface of the phosphor sheet disc to remove a portion of the phosphor sheet disc, or presses the phosphor sheet disc from above using a punching machine. A light emitting device, characterized in that formed by removing the portion. The light emitting device of claim 1, wherein the phosphor sheet has a thickness of 15 µm to 500 µm. The method of claim 1, wherein the resin is a silicone resin, epoxy resin, glass, glass ceramic, polyester resin, acrylic resin, urethane resin, nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate A light emitting device comprising at least one of resin, polyethylene resin, teflon resin, polystyrene resin, polypropylene resin, and polyolefin resin. The light emitting device of claim 1, wherein a reflectance of the resin is 1.4 to 1.8. delete The light emitting device of claim 1, wherein the light emitting diode chip is a blue light emitting diode chip, and the phosphor is a phosphor having yellow light emitting characteristics. Manufacturing a phosphor sheet from which corners are removed to correspond to a position at which a bonding pad of the light emitting diode chip is formed; Attaching the light emitting diode chip to one surface of a substrate; Connecting the bonding pad formed on the light emitting diode chip to the substrate using a bonding wire; Applying an adhesive member to a predetermined region of an upper portion of the light emitting diode chip; And Attaching the phosphor sheet to the upper portion of the light emitting diode chip by the adhesive member; Preparing the phosphor sheet, Preparing a sheet-shaped phosphor sheet disc using a mixture of phosphor and resin; Forming a predetermined opening in the phosphor sheet disc; And Manufacturing the plurality of phosphor sheets at the same time by cutting the phosphor sheet disc having the openings formed in accordance with the size of the light emitting diode chip, The hardness of the resin is a Shore A (Shore A) hardness of 50 or more Shore D (Shore D) hardness of 30 or more manufacturing method characterized in that. delete The method of claim 10, wherein the manufacturing of the phosphor sheet disc, A method of manufacturing a light emitting device, characterized in that the phosphor sheet disc is produced from the mixture by one of a press molding method, an extrusion molding method, or a doctor blade method. The method of claim 10, wherein the forming of the predetermined opening, Forming the opening by irradiating a surface of the phosphor sheet disc with a laser to remove a portion of the phosphor sheet disc, or by pressing a phosphor sheet disc from above using a punching machine to remove a portion through which the punching machine has passed. Light emitting device manufacturing method characterized in that. The method of claim 10, wherein the phosphor sheet has a thickness of 15 μm to 500 μm. The method according to claim 10, wherein the resin, Silicone resin, epoxy resin, glass, glass ceramic, polyester resin, acrylic resin, urethane resin, nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin, polyethylene resin, Teflon resin, A light emitting device manufacturing method comprising at least one of a polystyrene resin, a polypropylene resin, and a polyolefin resin. The method of claim 10, wherein the reflectance of the resin is 1.4 to 1.8. delete The method of claim 10, wherein the light emitting diode chip is a blue light emitting diode chip, and the phosphor is a phosphor having yellow light emitting characteristics.

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