KR101192293B1 - Noise cancelling on-ear headphone - Google Patents

Abstract

The present invention relates to an on-ear headphone that removes noise introduced from the outside. The present invention comprises a microphone, attenuation circuit, a speaker, a headphone housing and the ear pad is wrapped around the outer shell member, a plurality of micro-space in which air is penetrated in the buffer member of the ear pad, The outer shell provides an on-ear headphone for noise removal in which a plurality of sound holes are formed. According to the present invention, first, due to the cushioning member filling the inner space of the ear pad as a whole, the seating feeling and the close contact with the ear are improved, and there is an effect of passively minimizing the noise flowing into the ear canal from the outside. Second, even if the pressure is applied to the ear pads by an external force such as the user's hand, even though the air inside the headphone is compressed, a plurality of microcavities exist in the cushioning member, and a plurality of microcavities penetrate the air, thereby compressing the cushioning member less. do. In addition, due to the cushioning member filling the inner space of the ear pad as a whole, there is an effect of substantially expanding the inner acoustic space, thereby reducing the occurrence of howling.

Description

Noise-canceling on-ear headphones {NOISE CANCELLING ON-EAR HEADPHONE}

The present invention relates to an on-ear headphone that removes noise introduced from the outside.

In general, a lot of headphones are used to listen to music without being disturbed by ambient noise alone. However, when the headphones are worn in noisy places such as airplanes, trains, and construction sites, in addition to the original sounds such as the music from the headphone speakers, the external sound, ie, external noise, is duplicated to interfere with the original sound. do.

Therefore, sealed headphones are used to passively block external noise from outside the original sound generated by the headphone speaker, and among them, supra-aural headphone that covers the ear to block external noise. ) And In-ear headphone inserted into the ear, and the Supra-Oral headphone has an around-ear headphone that covers the entire ear and blocks external noise and an on-ear headphone -Ear headphones (On-ear headphone) is the case.

On the other hand, the ear pad that is in contact with the ear when wearing headphones is configured to surround the cover with a cushioning member is wrapped in a jacket, such as synthetic resin, leather, cloth, and the sound hole through which the sound output from the speaker passes.

In this case, in general, the buffer member is formed in a ring shape so that the sound output from the speaker flows into the ear hole. As the buffer member is formed in the ring shape, the buffer member serves as a path through which the sound output from the speaker may flow into the ear hole. That is, in the process of the sound output from the speaker enters the ear hole, the attenuation of the sound does not occur, the user can hear the sound of high quality.

For example, Japanese Patent Laid-Open No. 2006-333483 (name of the invention: a headphone having a noise reduction function) discloses a structure of an ear pad provided with a ring sponge.

However, there is a problem that not only the sound output from the speaker due to the ring-shaped buffer member as described above, but also external noise flows into the ear hole.

That is, outside noise enters the headphone through a space such as a headphone housing or a gap where the headphone housing and the ear pad are combined, and the noise that enters the headphone is accompanied by the sound output from the speaker through the passage formed by the buffer member. It will flow into.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object thereof is to provide a noise removing headphone provided with an ear pad that blocks noise introduced into the ear hole from the outside.

In order to achieve the above object, the present invention provides a microphone for sensing external noise;

An attenuation circuit for analyzing an external noise signal detected from the microphone to generate an attenuation signal having a phase opposite to the analyzed noise; A speaker for outputting the attenuation sound according to the attenuation signal generated by the attenuation circuit; A headphone housing accommodating the speaker; And an ear pad which covers the open front surface of the headphone housing as a part that is in contact with the ear when worn, and the cushioning member is wrapped in an outer shell. Includes, the shock absorbing member of the ear pad, there is a plurality of micro-space in which air is penetrated, and fills the inner space of the ear pad, the sound output from the speaker passes through the front surface of the ear pad It provides an on-ear headphone for removing noise (On-ear Headphone), characterized in that a plurality of sound holes are formed.

Here, the shock absorbing member of the ear pad, at least one surface provides a noise-reducing on-ear headphones, characterized in that formed in the concave.

In addition, the cushioning member of the ear pad provides an on-ear headphone for noise removal, characterized in that open toward the speaker.

As described above, according to the present invention, a plurality of microcavities in which air penetrates the buffer member filling the inner space of the headphone ear pad, and a plurality of sound through holes are formed in the front surface of the ear pad, thereby as follows. It works.

First, due to the cushioning member that fills the inner space of the ear pad as a whole, the seating comfort and close contact with the ear is improved, and the noise flowing into the ear hole from the outside can be minimized passively.

Second, even if the pressure is applied to the ear pads by an external force such as the user's hand, even though the air inside the headphone is compressed, a plurality of microcavities exist in the cushioning member, and a plurality of microcavities penetrate the air, thereby compressing the cushioning member less. do. In addition, due to the cushioning member filling the inner space of the ear pad as a whole, there is an effect of substantially expanding the inner acoustic space, thereby reducing the occurrence of howling.

1 is an exploded perspective view showing an on-ear headphone for noise removal according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of the noise canceling-on-ear headphones of FIG. 1 in combination. FIG.
FIG. 3 is a schematic diagram schematically illustrating an on-ear headphone for noise removal in which the structure of the shock absorbing member is variously illustrated in FIG. 2.
<Description of the code | symbol about the principal part of drawing>
100, 100a, 100b, 100c: headphones
110: headphone housing
120: speaker plate 130: microphone
140: attenuation circuit 150: speaker
160: ear pads
162: jacket
H: many sonic holes
164, 164a, 164b, 164c: buffer member
S: Multiple microspaces

Best Mode for Carrying Out the Invention

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view illustrating a noise canceling on-ear headphone according to an exemplary embodiment of the present invention, and FIG. 2 is a schematic view schematically illustrating a cross section of the noise canceling on-ear headphone of FIG.

1 and 2, the headphone according to the embodiment of the present invention is a headphone housing 110, speaker plate 120, microphone 130, attenuation circuit 140, speaker 150, ear pads And 160.

The headphone housing 110 has an accommodation space in which the front of the head is opened and is coupled to the rear of the speaker plate 120.

The speaker plate 120 serves to mount the speaker 150 in the accommodation space of the headphone housing 110. In addition, a hole is formed in a part of the speaker plate 120, which allows the sound from the speaker 150 to be output to the outside through the hole.

In this case, at least one hole formed in a part of the speaker plate 120 may be variously configured and shaped as necessary.

The microphone 130 is fixedly mounted to the speaker plate 120 to detect sound generated from the outside of the headphones, that is, external noise, and is generally mounted closest to the front side of the speaker 150.

The attenuation circuit 140 is located on the rear side of the speaker 150, and a circuit for generating an attenuation signal capable of canceling the external noise by analyzing the external noise detected through the microphone 130 is formed. That is, the external noise signal detected by the microphone 130 is analyzed to generate an attenuation signal having a phase opposite to the analyzed noise.

The speaker 150 is mounted in the accommodation space of the headphone housing 110 by the speaker plate 120 and is positioned at the rear side of the microphone 130 to output sound according to an input electrical signal. More specifically, it is to output the general sound according to the input electrical signal and the attenuation sound according to the attenuation signal generated by the attenuation circuit 140.

The ear pad 160 is formed in an oval shape and is a part which contacts the ear when worn. And covers the entire open front of the headphone housing 110, the cushioning member is wrapped in the outer shell 162, such as synthetic resin, leather, cloth, and fills the inner space of the ear pad (160). At this time, the buffer member is opened toward the speaker 150. In addition, a plurality of sound holes H are formed in the center of the front surface of the outer shell 162 of the ear pad 160 so that sound output from the speaker 150 can pass.

<First Example>

Here, when wearing the headphones of the present invention formed as described above, the cushioning feel is improved due to the cushioning member that fills the inner space of the ear pad 160 as a whole. That is, the general ring-shaped buffer member has a better seating and close contact with the ear than the headphones provided in the ear pad, there is an advantage that can block the inflow of external noise as much as possible.

And the cushioning member of the ear pad 160 is formed to cover the entire ear, and by filling the entire inner space of the ear pad 160, the ring-shaped buffer member to block the noise more passively than the headphones provided in the ear pad Increases.

That is, the outside noise enters into the headphone, and by blocking the passage of the noise entering the headphone into the ear hole 200, the noise flowing into the ear hole 200 is minimized, thereby removing external noise. It has the advantage of fulfilling its role as a headphone.

<Second action example>

On the other hand, the sound output from the speaker 150 of the headphone is the sound of the high and low frequencies, the sound of the low range is large in energy and penetrates the ear pad 160, that is, the buffer member well, so that the user There is no problem listening to the sound.

However, the high-frequency sound output from the speaker 150 does not penetrate the obstacle (buffer member of the ear pad) disposed in front of the speaker 150 well.

That is, in the headphone provided with the ring-shaped shock absorbing member in the ear pad, the sound output from the speaker enters the ear hole, and there is no obstacle in the passage formed by the ring-shaped shock absorbing member, so there is no problem in listening to the sound in the high frequency range. In the case where the shock absorbing member is provided in front of the speaker 150, there is a problem that the sound of the high frequency band output from the speaker 150 is attenuated by the shock absorbing member.

Accordingly, as shown in FIG. 2, the buffer member filling the inside of the ear pad 160 is filled with a buffer member (for example, a sponge) 164 in which a plurality of microcavities S exist. At this time, air has penetrated the plurality of microcavities (S).

That is, the sound of the high frequency band output from the speaker 150 passes through the plurality of microcavities S present in the buffer member 164, so that the user may hear sounds closer to the sound of the high frequency band output from the speaker 150 (less attenuation). High-frequency sound).

FIG. 3 is a schematic diagram illustrating an on-ear headphone for noise removal in which the shock absorbing member has various structures in FIG. 2. Next, the shock absorbing members 164a, 164b, and 164c provided in the ear pad 160 are illustrated. Describe the structure.

Referring to FIG. 3A, the front surface of the shock absorbing member 164a of the ear pad 160 is recessed in the rearward direction. In more detail, when worn, a portion of the front surface of the shock absorbing member 164a is recessed in the direction of the speaker 150 disposed at the rear side with respect to the ear hole 200 (see FIG. 2). That is, in the ear pad 160, as much as the space in which the buffer member 164a is recessed is hollowed out. Here, "front" is defined as the direction close to the ear when worn, "back" is to be defined in the direction away from the ear.

In the process of the sound output from the speaker 150 enters the ear hole 200, as described above, the sound of the high frequency band output from the speaker 150 is absorbed as much as the buffer member 164a is recessed. The path through is shortened (see arrow).

Therefore, the effect of attenuating the sound in the high frequency range is reduced, so that the user can listen to the sound with higher quality than the noise canceling on-ear headphones 100 (see FIG. 2) equipped with a buffer member 164 (see FIG. 2) having a flat cross section. Is possible.

At this time, as shown in Figure 3 (a), as the buffer member 164a is recessed around the concave hole 200 except for the portion in contact with the wheel when worn, the seating feeling can be maintained as it is.

On the other hand, the back of the buffer member 164b of the ear pad 160 is concave in the forward direction as shown in (b) of FIG. 3 or the buffer member 164c of the ear pad 160 as shown in (c) of FIG. ) It is also possible to form a concave pie with the front and back concave in the rear and front directions, respectively.

In addition, since the functions and roles of the shock absorbing members 164b and 164c of the ear pad 160 are formed in the same manner as in FIG. 3A, description thereof will be omitted.

<Third action example>

Meanwhile, pressure is applied to the headphones, that is, the ear pads, by an external force such as a hand, and the air inside the headphones may be compressed.

In this case, in a headphone in which a microphone is disposed inside to remove external noise, if the pressure applied to the ear pad and the closed space in the headphone are small, the pressure change occurs severely inside the headphone. This will occur.

However, as described above, a plurality of microcavities S exist in the shock absorbing members 164, 164a, 164b, and 164c provided in the ear pad 160, and air is penetrated into the plurality of microcavities S. In this case, when the pressure is applied to the ear pads 160, a substantial acoustic space is enlarged and compressed less than the ear pads provided with the ring-shaped shock absorbing member, and thus the resonance effect is reduced to reduce the occurrence of the howling.

In addition, as a plurality of sound holes H are formed in the front center of the outer shell 162 of the ear pad 160, pressure is applied to the ear pad 160 to compress the air inside the headphones 100, 100 a, 100 b, and 100 c. Even if it is, the air can escape to the outside of the headphones (100, 100a, 100b, 100c) through the plurality of sound holes (H). That is, there is an advantage in that the pressure change transmitted to the microphone 130 is reduced, and accordingly the generation of the howling can be reduced.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

Claims (3)

A microphone for detecting external noise;
An attenuation circuit for analyzing an external noise signal detected from the microphone to generate an attenuation signal having a phase opposite to the analyzed noise;
A speaker for outputting the attenuation sound according to the attenuation signal generated by the attenuation circuit;
A headphone housing accommodating the speaker; And
An ear pad which covers the open front surface of the headphone housing as a part which is in contact with the ear when worn, and the cushioning member is wrapped in an outer shell; Including;
The shock absorbing member of the ear pad, there is a plurality of micro-cavities through which air is penetrated, fill the inner space of the ear pad,
In the front surface of the outer pad of the ear pad, a plurality of sound holes through which the sound output from the speaker is formed,
At least one surface of the buffer member of the ear pad is concave, characterized in that the on-ear headphones for noise removal (On-ear Headphone). delete delete

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