KR101179324B1 - Multi nozzle piple assembly and soldering apparatus having the same - Google Patents

Abstract

The nozzle discharge nozzle assembly of the present invention comprises: a first nozzle pipe for discharging solder for connecting a lead of an electronic component to an electric circuit of a circuit board; And one or more second nozzle pipes installed in parallel with the first nozzle pipe and having a nozzle head partially overlapping the first nozzle pipe.

Description

Nozzle assembly for solder discharge and soldering printing apparatus having same {Multi nozzle piple assembly and soldering apparatus having the same}

The present invention relates to a nozzle assembly for solder discharge and a soldering printing apparatus having the same, and more particularly, for solder discharge capable of stably soldering a lead of an electronic component regardless of the size of an electronic component installation hole formed in a circuit board. A nozzle assembly and a soldering printing apparatus having the same.

The circuit board is installed in various electronic components to enable the operation of the electronic components. The circuit board is printed with various types of electric circuits for constructing logic circuits, and various electronic components are installed.

The circuit board is provided with a plurality of holes in a predetermined circuit portion to enable the installation of various electronic components. Holes in the circuit board serve as a path through which the leads of the electronic components can be inserted. Leads of electronic components installed in the holes of the circuit board are connected to the electric circuit of the circuit board by solder (solder).

On the other hand, the hole of the circuit board may be large or small depending on the type and size of the electronic component to be installed. However, nozzle pipes for soldering (soldering) electronic components generally have discharge holes of the same size, and thus are not suitable for soldering large holes having a diameter larger than that of ordinary holes.

For example, a large hole has a diameter larger than a discharge hole of a normal nozzle pipe, so in order to solder the lead of an electronic component installed in the large hole, the solder is ejected several times along the arc of the large hole or the nozzle pipe is horizontally disposed. The solder had to be discharged while moving in the direction.

However, this method not only makes the soldering work very slow, but also causes the problem that soldering of leads is not performed correctly. Therefore, there is a strong demand for the development of a new type of nozzle assembly capable of quickly and accurately soldering an electronic component installed in a large hole larger than the discharge hole of the nozzle pipe and a soldering printing apparatus having such a nozzle assembly.

The present invention is to solve the above problems, to provide a solder discharge nozzle assembly and a soldering printing apparatus having the same that can smoothly solder the electronic components of the circuit board irrespective of the size of the hole formed in the circuit board. The purpose is.

In addition, the present invention provides a solder discharge nozzle assembly and a soldering printing apparatus having the same to prevent the waste of the solder through the one time solder discharge, and effectively prevent damage to the circuit board due to over discharge of the solder. There is a purpose.

According to a first embodiment of the present invention for achieving the above object, a first nozzle pipe for discharging the solder for connecting the lead of the electronic component to the electrical circuit of the circuit board; And one or more second nozzle pipes installed in parallel with the first nozzle pipe and having a nozzle head partially overlapping the first nozzle pipe.

According to a first embodiment of the present invention, a first nozzle pipe for discharging solder for connecting a lead of an electronic component to an electric circuit of a circuit board, and installed in parallel with the first nozzle pipe, A soldering printing apparatus is provided that includes a nozzle assembly including one or more second nozzle pipes having a nozzle head partially overlapping with the nozzle head.

According to a second embodiment of the present invention for achieving the above object, a first nozzle pipe for discharging the solder for connecting the lead of the electronic component to the electrical circuit of the circuit board; And one or more second nozzle pipes installed to form an acute angle with the first nozzle pipe and having a nozzle head partially overlapping the first nozzle pipe.

In the above-described embodiment of the present invention, the first nozzle pipe has a first nozzle head having a first discharge hole formed therein, and the second nozzle pipe has a second discharge hole formed therein and partially with the first nozzle head. The second nozzle head may be overlapped.

In the above-described embodiment of the present invention, the distance between the center of the first discharge hole and the center of the second discharge hole may be smaller than the sum of the radius of the first nozzle head and the radius of the second nozzle head.

In the above-described embodiment of the present invention, the diameters of the nozzle pipes may all be the same.

In the above-described embodiment of the present invention, the distance between the centers may be 1.6 to 2.0 mm.

The present invention can stably solder the lead of the electronic component regardless of the size of the hole for mounting the electronic component formed in the circuit board. Therefore, according to the present invention, the defective rate of the circuit board due to the poor soldering and the poor soldering of the electronic component can be significantly lowered.

In addition, the present invention can solder the lead of the electronic component installed in a relatively large hole by one discharge, it is possible to perform the electronic component installation work of the circuit board quickly and accurately.

In addition, the present invention can accurately and stably perform the installation work of the electronic component in one discharge, it is possible to significantly reduce the waste of solder. Therefore, according to the present invention can reduce the production cost of the circuit board.

1 is a perspective view showing a nozzle assembly according to a first embodiment of the present invention,
2 is a side view showing an example of use of the nozzle assembly shown in FIG.
3 is a perspective view showing a nozzle assembly according to a second embodiment of the present invention,
4 is a plan view illustrating an example of use of the nozzle assembly illustrated in FIG. 3;
5 is a perspective view showing a nozzle assembly according to a third embodiment of the present invention,
FIG. 6 is a side view illustrating an example of use of the nozzle assembly shown in FIG. 5.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, terms that refer to the components of the present invention are named in consideration of the function of each component, it should not be understood as a meaning limiting the technical components of the present invention.

1 is a perspective view showing a nozzle assembly according to a first embodiment of the present invention, Figure 2 is a side view showing an example of the use of the nozzle assembly shown in Figure 1, Figure 3 is a nozzle according to a second embodiment of the present invention 4 is a plan view showing an example of use of the nozzle assembly shown in FIG. 3, FIG. 5 is a perspective view showing a nozzle assembly according to a third embodiment of the present invention, and FIG. 6 is shown in FIG. Side view showing an example of the use of the nozzle assembly.

(Embodiment 1)

The nozzle assembly 100 according to the first embodiment includes a first nozzle pipe 110 and a second nozzle pipe 120 as shown in FIG. 1.

The first nozzle pipe 110 is a tubular member having a circular or polygonal cross section and is directly or indirectly connected to a solder source for supplying solder. The first nozzle pipe 110 has a first nozzle head 118. The first nozzle head 118 has a first discharge hole 112 for discharging the solder supplied from the outside, and has a size of radius R1 from the center point 114 of the first discharge hole 112. The first nozzle head 118 has a straight shape extending along the first center axis 116. However, other portions of the first nozzle pipe 110 may be curved or any shape.

Like the first nozzle pipe 110, the second nozzle pipe 120 is a tubular member having a circular or polygonal cross section and is directly or indirectly connected to a solder source for supplying solder. The second nozzle pipe 120 has a second nozzle head 128. The second nozzle head 128 has a second discharge hole 122 for discharging the solder supplied from the outside, and has a size R2 from the center point 124 of the second discharge hole 122 (for reference). In this embodiment, the radius R2 and the radius R1 have the same value, but may be different if necessary). The second nozzle head 128 has a straight shape extending long along the second center axis 126. However, other portions of the second nozzle pipe 120 may be curved or any shape.

Each of the first nozzle pipe 110 and the second nozzle pipe 120 formed as described above are arranged side by side such that two central axes 116 and 126 are parallel to each other. The distance L1 between the center points 114 and 124 of the first nozzle pipe 110 and the second nozzle pipe 120 is the radius R1 of the first nozzle pipe 110 and the radius R2 of the second nozzle pipe 120. Less than sum That is, the first nozzle head 118 and the second nozzle head 128 have regions overlapping each other.

When the distance between the center points 114 and 124 of the first nozzle head 118 and the second nozzle head 128 is smaller than the sum of the radii of the nozzle heads 118 and 128 as in this embodiment, the discharge holes Good separation results can be obtained since the separation distance between the solder lumps discharged through (112, 122) is eliminated. This will be described again with reference to FIG.

Next, an example of using the nozzle assembly 100 configured as described above will be described with reference to FIG. 2. For convenience, the size of the hole 210 formed in the circuit board 200 will be described by dividing an example of the case where the size of the hole 210 is smaller than the discharge holes 112 and 122 of the nozzle pipes 110 and 120.

1) When the size D of the hole 210 formed in the circuit board 200 is smaller than the diameter of the relatively small discharge holes 112 and 122 among the nozzle pipes 110 and 120: In this case, the first nozzle Since the entire hole 210 can be soldered through the pipe 110 or the second nozzle pipe 120, the discharge hole of the first nozzle pipe 110 or the second nozzle pipe 120 may be aligned with the center of the hole. The position of the nozzle assembly 100 is set to match, and the solder is discharged through the nozzle pipe coinciding with the corresponding hole to install the electronic component on the circuit board 200.

2) When the size D of the hole 210 formed in the circuit board 200 is larger than the diameter of the relatively large discharge holes 112 and 122 among the nozzle pipes 110 and 120: in this case, the first nozzle Since none of the pipe 110 and the second nozzle pipe 120 can be soldered to the entire hole 210, the intermediate point between the first nozzle pipe 110 and the second nozzle pipe 120 (ie, The position of the nozzle assembly 100 is set such that the center of the hole 210 substantially coincides with the point bisecting L1 shown in FIG. 1. Thereafter, the solder is discharged simultaneously or sequentially through the first nozzle pipe 110 and the second nozzle pipe 120. Then, as shown in FIG. 2, since the solders S1 and S2 are positioned at the edges of the holes 210, the electronic components may be stably installed on the circuit board 200.

Therefore, the nozzle assembly 100 and the soldering printing apparatus including the nozzle assembly 100 according to the present exemplary embodiment may obtain excellent soldering results regardless of the size of the holes 210 formed in the circuit board 200, and unnecessary solders. Can greatly reduce waste.

In particular, the nozzle assembly 100 according to the present embodiment is useful for accurately and reliably soldering a hole 210 of a relatively large size (eg, 2 mm or more in diameter).

(Second Embodiment)

Next, a second embodiment of the present invention will be described with reference to FIGS. 3 and 4.

The second embodiment of the present invention differs from the first embodiment in the number of nozzle pipes. For reference, in the second embodiment, the same components as those of the first embodiment have the same reference numerals, and detailed descriptions of these components are omitted.

The nozzle assembly 100 according to the second embodiment includes three nozzle pipes 110, 120, and 130 as shown in FIG. 3. The first nozzle pipe 110 and the second nozzle pipe 120 are arranged in the same form as in the first embodiment. The third nozzle pipe 130 is disposed above the interface between the first nozzle pipe 110 and the second nozzle pipe 120, and the third center axis 136 is the first center axis 116 and the second center axis. It is installed parallel to 126. Therefore, the first nozzle pipe 110, the second nozzle pipe 120 and the third nozzle pipe 130 are all parallel to each other.

The third nozzle pipe 130 has a third nozzle head 138. The third nozzle head 138 has a third discharge hole 132 and has a radius R3 from the third center point 134 of the third discharge hole 132. The third center point 134 of the third discharge hole 132 has a distance between the first center point 114 and L2, and has a distance between the second center point 124 and L3. Wherein L2 and L3 have similar conditions as L1. That is, L2 is smaller than the sum of the radius R1 of the first nozzle pipe 110 and the radius R3 of the third nozzle pipe 130, and L3 is the radius R2 of the second nozzle pipe 120 and the third nozzle pipe 130. Is smaller than the sum of the radius R3. Thus, the three nozzle pipes 110, 120, 130 have a virtual area shared with each other.

Next, an example of using the nozzle assembly 100 configured as above will be described with reference to FIG. 4.

Unlike the first embodiment, the nozzle assembly 100 according to the present embodiment does not need to change the position of the nozzle assembly 100 according to the size of the hole 210 formed in the circuit board 200. That is, when the nozzle assembly 100 according to the present embodiment coincides with the center of the triangle formed by the three center points 114, 124, and 134 in the center of the hole 210 during soldering, all of the holes of the shape may be soldered. Can be.

Soldering printing apparatus including the nozzle assembly 100 as described above discharges the solder from each nozzle pipe (110, 120, 130), forming a solder on the edge of the hole 210 except the center of the hole 210 Let's do it. Therefore, the soldering portion formed on the circuit board is stable.

Therefore, the present embodiment is very useful for soldering a circuit board 200 in which holes of relatively small size and holes of relatively large size are irregularly formed.

(Third Embodiment)

Next, a third embodiment of the present invention will be described with reference to FIGS. 5 and 6.

The third embodiment of the present invention differs from the above-described embodiments in the arrangement of the nozzle pipes. For reference, in the third embodiment, the same components as those of the above-described embodiments use the same reference numerals, and detailed descriptions of these components will be omitted.

The nozzle assembly 100 according to the third embodiment has a structure in which two or more nozzle pipes 110 and 120 having central axes 116 and 126 that are not parallel to each other are disposed unlike the above-described embodiments. That is, the first nozzle pipe 110 and the second nozzle pipe 120, or the first nozzle head 118 and the second nozzle head 128, as shown in FIG. The bicenter axis 126 forms a predetermined angle θ. The magnitude of the angle θ formed by the two central axes 116 and 126 is preferably an acute angle smaller than 90 degrees, preferably 2 to 30 degrees, more preferably 5 to 10 degrees. However, the above-described range of angles is merely an example and may be changed by those skilled in the art according to the use of the nozzle assembly 100.

Next, an example of using the nozzle assembly 100 configured as described above will be described with reference to FIG. 6.

As shown in FIG. 6, the nozzle assembly 100 according to the third embodiment has a center point 114 and 124 of one of the nozzle pipes 110 and 120 at the center of the hole 210 of the circuit board 200. After matching, soldering can be performed. What is different from the above-described embodiments is that the height (h) of the nozzle assembly 100 is adjusted according to the size of the hole 210.

That is, when the size of the hole 210 is relatively small compared to the conventional hole, the solder is discharged while the nozzle assembly 100 is moved upward (in the reference direction of FIG. 6), and conversely, If the size is relatively large compared to the conventional hole, the solder is discharged while the nozzle assembly 100 is moved downward (in the reference direction of FIG. 6).

Soldering printing apparatus including the nozzle assembly 100 as described above the vertical height of the nozzle assembly 100 without changing the working path of the nozzle assembly 100 according to the position of the hole 210 formed in the circuit board 200 Since only additional control is required, there is no need to calibrate or modify the working path of the preset nozzle assembly 100.

In addition, since the nozzle assembly 100 and the soldering printing apparatus including the same according to the present embodiment may change the relative height of the nozzle assembly 100 with respect to the circuit board 200, the holes 210 of all sizes may be soldered. This is very useful when the sizes of the holes 210 formed in the circuit board 200 are very diverse.

For reference, in the above-described embodiment, the nozzle assembly 100 has been described as being composed of two or three nozzle pipes 110, 120, and 130, but three or more nozzles may be used depending on the purpose and use of the nozzle assembly 100. It may consist of nozzle pipes.

Meanwhile, the soldering printing apparatus according to the present embodiment includes any one of the nozzle assemblies 100 described above, and supplies solder to the nozzle assembly 100 from a solder source (not shown) that stores solder, and a solder source. A pump (not shown), a transfer unit (not shown) for transferring the nozzle assembly 100 on the circuit board, a control unit (not shown) for controlling the operation of the pump and the transfer device, and the like. . In the above configuration, the solder source, the pump, the transfer unit, the control unit, etc. are not shown in the present specification, but are devices that can be easily employed by those skilled in the art of the present invention. Detailed description thereof will be omitted.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions And various modifications may be made.

100 nozzle assembly
110 First nozzle pipe 112 First discharge hole
114 First center point 116 First center axis
120 Second nozzle pipe 122 Second discharge hole
124 2nd center point 126 2nd center axis
130 3rd nozzle pipe 132 3rd discharge hole
134 3rd center point 136 3rd center axis
200 Circuit Board 210 Holes

Claims (9)

A first nozzle pipe for discharging solder for connecting a lead of an electronic component to an electric circuit of a circuit board; And
And at least one second nozzle pipe installed in parallel with said first nozzle pipe and having a nozzle head partially overlapping said first nozzle pipe. The method of claim 1,
The first nozzle pipe has a first nozzle head having a first discharge hole,
And the second nozzle pipe has a second nozzle head in which a second discharge hole is formed and partially overlaps with the first nozzle head. The method of claim 2,
And the distance between the center of the first discharge hole and the center of the second discharge hole is less than the sum of the radius of the first nozzle head and the radius of the second nozzle head. At least one agent having a first nozzle pipe for discharging solder for connecting a lead of an electronic component to an electric circuit of a circuit board, and a nozzle head installed in parallel with the first nozzle pipe and partially overlapping the first nozzle pipe Soldering printing apparatus comprising a nozzle assembly comprising a two nozzle pipe. The method of claim 4, wherein
The first nozzle pipe has a first nozzle head having a first discharge hole,
And the second nozzle pipe has a second nozzle head having a second discharge hole formed therein and partially overlapping the first nozzle head. The method of claim 5,
And a distance between the center of the first discharge hole and the center of the second discharge hole is smaller than the sum of the radius of the first nozzle head and the radius of the second nozzle head. A first nozzle pipe for discharging solder for connecting a lead of an electronic component to an electric circuit of a circuit board; And
And at least one second nozzle pipe installed at an acute angle with the first nozzle pipe and having a nozzle head partially overlapping the first nozzle pipe. The method of claim 7, wherein
The first nozzle pipe has a first nozzle head having a first discharge hole,
And the second nozzle pipe has a second nozzle head in which a second discharge hole is formed and partially overlaps with the first nozzle head. 9. The method of claim 8,
And the distance between the center of the first discharge hole and the center of the second discharge hole is less than the sum of the radius of the first nozzle head and the radius of the second nozzle head.

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