KR101176935B1

KR101176935B1 - POT System used in Semiconductor Chip packaging Process, and device for gauging discharge amount of potting resin employed in the same

Info

Publication number: KR101176935B1
Application number: KR20100127017A
Authority: KR
Inventors: 임규태
Original assignee: 주식회사 루셈
Priority date: 2010-12-13
Filing date: 2010-12-13
Publication date: 2012-08-30
Also published as: KR20120065738A

Abstract

Disclosed are a potting system used in a semiconductor chip packaging process and a cured resin discharge amount inspecting device employed therein. Curing resin discharge amount inspection device is composed of a guide rail and a weight scale. The guide rail extends along the arrangement direction of the potting heads, and the weight scale is installed to be movable along the guide rail. Since the discharge amount of the cured resin discharged from the potting head in the potting system can be quickly measured, the time required for the discharge amount inspection can be reduced and the productivity can be improved.

Description

Potting system used in semiconductor chip packaging process, and curing resin discharge amount inspection apparatus employed therein {POT System used in Semiconductor Chip packaging Process, and device for gauging discharge amount of potting resin employed in the same}

The present invention relates to a potting system used in a semiconductor chip packaging process, and an inspection apparatus for inspecting the amount of hard resin discharge of the potting head employed in the potting system.

Semiconductor chips fabricated on wafers are mass-produced as individual chip products through separate packaging processes. The packaging process is carried out through Dicing- ILB-POT-Marking process, and the manufactured chip is inspected through FT (Final Test) process and VI (Visual Inspection) process.

Dicing (SAW) is a process of dividing a number of chips patterned on a wafer into individual chips to form a single product. In the ILB process, the bumps of the completed chip and the inner lead on the film are bonded by thermo-compression using high temperature heat and pressure to form an electrical path to the outside. It is a process. POT process is based on epoxy resin in liquid state to protect the circuit part of chip including ILB process from external physical, chemical, mechanical and electrostatic environment to ensure product reliability. It is a process of applying and sealing a sealing material with a dispenser. Marking process is a process of stamping the serial number of each product by printing the coded information of the product on the surface of the product.

1 is a view schematically showing a conventional potting system for performing a potting (POT) process in the first process for such a packaging. The potting system 10 includes a plurality of potting heads 11, and a tape 15 in which semiconductor chips to be potted are sequentially arranged along the longitudinal direction is disposed below the potting heads 11. The potting head 11 is conveyed downward by a transfer head (not shown) for potting so that the lower end of the potting head 11 is placed on a chip disposed on the tape 15, in which state the potting head 11 The cured resin is discharged from the lower end of the film and applied onto the chip. When the application of the cured resin is completed, the potting head 11 is conveyed upward by the conveying head, and then the tape 15 is conveyed along the longitudinal direction so that the chips to be potted next are placed under the potting head 11. do. Porting is performed by repeating this process.

The potting head 11 operating through such a process should always discharge a precisely set amount of cured resin. If the amount of hardened resin exceeds or falls short of a predetermined amount, the potting defect will occur. However, the discharge amount of the potting head 11 is changed by the error gradually occurs as the potting operation is continuously performed. Therefore, it is necessary to periodically check whether the potting head 11 is actually discharging the correct amount of cured resin.

By the way, the conventional method has a disadvantage in that the discharge amount inspection of the cured resin has to be made by manual operation, which consumes a lot of time and reduces productivity. 2 is a diagram for explaining this. As shown in FIG. 2, a plurality of potting systems 10 are disposed and used in a semiconductor chip packaging process, and the electronic balance 20 for inspecting the amount of cured resin discharge for each potting system 10 includes a potting system 10. Are placed adjacent to them.

The operator operates to discharge the cured resin with respect to one potting head 11, in which the cured resin discharged from the potting head 11 is contained in a separate container (not shown). Take the container to the position of the electronic balance 20, measure the weight using the electronic balance 20, and if the discharge amount inspected by the measured weight matches the set discharge amount, the potting head 11 is set to an appropriate amount. It is determined to discharge the. If it is determined that it is not a proper amount, in consideration of this, the set value of the potting head 11 is readjusted, and the discharge amount according to the adjusted value is measured once again.

This process is performed for all the porting heads 11 in one porting system 10, and when the inspection for one porting system 10 is completed, the same operation is repeated for the other porting system 10. The copper line of the worker following the repetition of this process is shown as an arrow in FIG. 2. As described above, since the worker works while repeating the processes of discharging, moving, measuring, moving, resetting, and the like, there is a problem that a large amount of time is required for the discharge amount inspection.

The present invention has been made to solve the above problems, an object of the present invention is to reduce the amount of time due to the discharge amount inspection to improve the productivity by enabling to quickly measure the discharge amount of the cured resin discharged from the potting head in the potting system To make it possible.

Curing resin discharge amount inspection apparatus according to the present invention for achieving the above object, a guide rail disposed adjacent to a plurality of potting heads in the potting system, extending along the placement direction of the potting heads; And a weight scale installed to be movable along the guide rail, the weight scale measuring the weight of the cured resin discharged from each of the potting heads.

It is preferable to include a; moving means for moving the weight scale along the guide rail. The moving means, the ball screw disposed along the guide rail; And a moving member fixed to the weight scale and moved along the guide rail by the rotation of the ball screw. The moving means may further include a motor for rotating the ball screw.

On the other hand, according to this invention, the potting system provided with the cured resin discharge amount inspection apparatus which has such a structure is provided.

According to the present invention, since the discharge amount of the cured resin discharged from the potting head in the potting system can be measured quickly, the time according to the discharge amount inspection can be reduced and productivity can be improved.

1 is a view schematically showing a conventional potting system for performing a potting (POT) process in the first process for such packaging.
Figure 2 is a view showing the copper wire of the worker for inspecting the discharge amount of the cured resin in the conventional potting system.
3 schematically shows a potting system according to the invention.
4 is an enlarged perspective view of the potting system of FIG. 3;

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

3 is a view schematically showing a potting system according to the present invention, and FIG. 4 is an enlarged perspective view of the potting system of FIG. 3.

The potting system 30 according to the present invention includes a plurality of potting heads 31 arranged along the potting line, and a tape 35 on which chips are disposed is placed under the potting head 31. Since the potting process of the potting head 31 and the feeding method of the tape 35 are the same as described above, a detailed description thereof will be omitted.

On the side of the position where the tape 35 is placed, the cured resin discharge amount inspection device 40 according to the present invention is provided along the tape 35. Curing resin discharge amount inspection apparatus 40 according to the present invention comprises a pair of guide rails 41, electronic balance 43, the base 44, the moving member 47, and the ball screw 49 .

The guide rails 41 are formed in a pair and extend along the tape 35 in the longitudinal direction of the tape 35, that is, in the arrangement direction of the potting head 31, and are disposed to be adjacent to the potting head 31. .

The electronic balance 43 is a weigh scale for measuring the discharge amount by measuring the weight of the cured resin discharged from the potting head 31. A pedestal 44 is placed on the guide rail 41 and the pedestal 44 is placed on the pedestal 44. By placing the electronic balance 43 to be fixed, the electronic balance 43 is movable along the guide rail 41.

The moving member 47 and the ball screw 49 constitute moving means for driving the electronic balance 43 to move along the guide rail 41. That is, the ball screw 49 is disposed in the lower direction between the guide rails 41 along the longitudinal direction of the guide rails 41, and the movable member 47 is fixed to the pedestal 44 to fix the electronic scale 43. The moving member 47 is provided with a ball screw 49. Accordingly, as the ball screw 49 rotates, the moving member 47 moves along the guide rail 41, and as a result, the electronic balance 43 is movable along the arrangement direction of the discharge head 31. The moving means of the present invention may comprise a motor (not shown) for rotating the ball screw 49. The motor is preferably composed of a stepping motor capable of adjusting the amount of rotation so that the movement position of the electronic balance 43 can be adjusted.

According to the present invention as described above, the operator can operate the motor to position the electronic balance 43 in the lower portion of the discharge head 31 to be inspected. Then, the curing resin is discharged from the discharge head 31 so that the discharge head 31 discharges the set amount of the curing resin. The discharged cured resin is discharged to the container 43a placed on the front scale 43, and thus the amount discharged through the electronic balance 43 can be confirmed. When the discharge amount is confirmed to be the proper amount, the electronic balance 43 is moved to inspect the next discharge head 31, and if it is determined that the discharge amount is not the proper amount, after adjusting the set value for the corresponding discharge head 31, the discharge amount is checked again. Is carried out.

By repeating this operation, for example, from the leftmost discharge head 31 to the rightmost discharge head 31, the discharge amount inspection for all the discharge heads 31 in one potting system 30 is completed.

In order to facilitate the operation, the moving distance of the moving member 47 moved by the motor can be set in advance. That is, since the discharge head 31 is arranged at the same interval, by providing a separate control means so that the moving distance of the moving member 47 is a predetermined distance, the operator can conveniently move the electronic balance ( 43) can be moved.

According to the present invention as described above, it is not necessary to perform cumbersome work such as carrying and moving the hardened resin discharged for the discharge amount inspection on the discharge head 31. Therefore, the time required for the discharge amount inspection is reduced to reduce the work stop time for the inspection of the porting system, thereby improving productivity.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

Claims

In the curing resin discharge amount inspection apparatus provided in the potting system for performing the potting process during the semiconductor chip packaging process,
A guide rail extending along an arrangement direction of the potting heads in the potting system; And
A weight scale installed to move along the guide rail and measuring a weight of the cured resin discharged from each of the potting heads;
Curing resin discharge amount inspection device comprising a.

The method of claim 1,
Curing resin discharge amount inspection device further comprises; moving means for moving the weight scale along the guide rail.

The method of claim 2,
Wherein,
A ball screw disposed along the guide rail; And
A moving member fixed to the weight scale and moved along the guide rail by rotation of the ball screw;
Curing resin discharge amount inspection device comprising a.

The method of claim 3, wherein
The moving means further comprises a motor for rotating the ball screw; cured resin discharge amount inspection apparatus further comprises.

The potting system provided with the cured resin discharge amount test | inspection apparatus which has a structure as described in any one of Claims 1-4.