KR101159633B1 - Led illumination device equipped with heat sink using heat pipe - Google Patents

Abstract

PURPOSE: An LED device including a heat sink using a heat pipe is provided to maximize heat dissipation by connecting an LED and a heat radiation unit though the heat pipe. CONSTITUTION: A light source(10) comprises an LED mounted on a PCB. A reflector(30) surrounds the light source. A heat radiation unit(40) has a plurality of heat radiation wings. A heat sink is connected to the PCB and includes a heat pipe(50) in contact with the heat radiation unit. A plurality of heat pipes overlap. A heat radiation plate is inserted between panel type heat pipes.

Description

LED lighting device with heat dissipation means using heat pipes {LED ILLUMINATION DEVICE EQUIPPED WITH HEAT SINK USING HEAT PIPE}

The present invention relates to a LED lighting device having a heat dissipation means using a heat pipe,

More specifically, the heat dissipation means is mainly composed of a heat pipe including acetone and methanol having a low vaporization point as a working medium and a plurality of heat dissipation wings, and the heat pipe is configured to connect the LED and the heat sink. Greatly improve heat dissipation efficiency,

Furthermore, by using the heat pipes in a panel-type superimposed arrangement, heat dissipation characteristics, assemblability and productivity are increased, and heat dissipation plates are separately inserted between the plurality of panel-type heat pipes to eliminate thermal accumulation in the overlapped heat pipes. The present invention relates to an LED lighting device having greatly improved heat dissipation characteristics.

LED is the next generation lighting that has been attracting attention recently because of its small size, light weight, low heat generation, reflection configuration, high-speed response characteristics, pulse operation capability, and light output control characteristics by electric current. It is being researched as a headlamp for automobiles and is replacing existing incandescent lamps and mercury lamps.

In high-luminance lighting devices, such as floodlights using LEDs, it is essential to ensure heat dissipation in order to ensure and maintain the brightness and semi-permanent life characteristics of the LEDs.

Conventional LED lighting devices include Patent Publication No. 10-2011-0115809 (published October 24, 2011) [LED floodlight],

The patent discloses an LED floodlight that can quickly and easily release heat generated from the LED, protects the heat radiating member while providing excellent ventilation, and is easy to install and set.

There is also a Patent Publication No. 10-2011-0120475 (published November 04, 2011) [LED Floodlight],

The published patent is to improve the overall efficiency by using the LED lamp instead of the existing HQI lamp,

HQI lamp, which is widely used as a conventional floodlight, suffers from many problems such as high power consumption, high carbon emission, and high heat generation, resulting in very short lamp life and exposure to fire. Compared to the fact that there are no alternatives because of the specificity of using

The patent discloses a significant improvement in the overall efficiency by using an LED lamp, by quickly depositing carbon nanotubes on the heat sink to dissipate heat generated from the LED, and to concentrate the lens light by using a ceramic lens At the same time, the irradiation angle can be adjusted in the desired direction, which improves illuminance and suggests a light emitter capable of generating negative ions.

In addition, there is a Patent Publication No. 10-2011-0093590 (published August 18, 2011) [LED lighting device],

The patent discloses an LED module including an LED substrate provided with a plurality of LED elements; A main reflection plate having a lateral shape of an horn of an upper and lower ends thereof, the reflecting surface reflecting light of the LED elements formed on an inner surface thereof, and the LED module being installed in an upper opening thereof; An LED lighting device including an auxiliary reflector having a horn shape having a reflecting surface formed on an outer surface thereof and having a vertex pointed directly below the LED module inside the main reflector toward the LED module is provided.

Furthermore, there is a Patent Publication No. 10-2011-0119234 (published November 02, 2011) [LED floodlight module and floodlight using the same],

The disclosed patent relates to an LED floodlight module and an LED floodlight using the same, so that the LED lamp can be easily attached and detached and heat emitted from the LED lamp is effectively released.

More specifically, the patent discloses a LED light emitting module, the base portion for absorbing and emitting heat generated from the LED; A plurality of through holes penetrating the base portion; And a heat pipe installed in the plurality of through holes to conduct heat absorbed from the base to the outside. Therefore, it is possible to effectively dissipate the heat generated by the driving of the LED can prevent the degradation of the performance of the LED, can extend the life, and has the advantage that can only replace the malfunctioning LED.

However, all of the four conventional patents have problems such as insufficient assembly ability and productivity, insufficient heat dissipation performance, or reduced purchasing power due to a cost increase of a lighting device due to a complicated structure, especially a heat dissipation structure.

In particular, high-brightness floodlights in which sports fields, outdoor performances, golf courses, port facilities, greenhouses, etc. are used in agriculture, are not required to be purchased and used in accordance with national legislation, and buyers must be competitive in terms of age and price. You choose LED floodlights, not lights.

Floodlights based on existing technologies do not meet these requirements.

Accordingly, the present invention provides a heat dissipation means consisting of a heat pipe and a plurality of heat dissipation blades containing a heat vapor containing acetone, methanol and the like as a working medium mainly having a low evaporation point in presenting the LED lighting device having a heat dissipation means using a heat pipe. In addition, the heat pipe is configured in the form of connecting the LED and the heat radiator to provide an LED lighting device that can significantly increase the heat dissipation efficiency.

In addition, the present invention by using the heat pipes of the panel-type superimposed arrangement to increase the heat dissipation characteristics, assembling and productivity, and to the heat accumulation phenomenon in the overlapped heat pipes by inserting a heat sink separately between the plurality of panel-type heat pipes. It is an object of the present invention to provide a LED lighting device, which is particularly suitable for high brightness flood lamps by greatly improving heat dissipation characteristics.

Furthermore, the present invention is to solve the problem that the temperature rises in the inner region of the reflection shade provided with a light source when the window covering the reflection shade for the function of preventing the inflow of foreign matters, to ensure the long life characteristics of the LED and maintain the luminance quality for a long time An object of the present invention is to provide an LED lighting device in which a heat circulation path is formed between an inner space and a space between an enclosure and an inner reflection plate constituting a reflection shade.

In addition, the present invention is a heat dissipation between the heat dissipation wing is made smoothly, but the air communication is not smooth in the direction across the heat dissipation blade is not good heat dissipation when arranging the lighting device in the horizontal direction In order to solve the problem, since the heated air is vertically raised and the cooling air is disposed vertically, the object of the present invention is to provide an LED lighting device in which a plurality of air communication incisions are introduced into the heat dissipation blade to significantly improve the heat dissipation characteristics. It is done.

LED lighting device having a heat dissipation means using a heat pipe according to the present invention to achieve the above object

A light source consisting of LEDs mounted on the PCB;

A reflection shade surrounding the light source;

Heat dissipation means including a heat dissipation member having a plurality of heat dissipation wings; And

A heat pipe connected to the PCB of the LED and in contact with the heat sink;

It is made, including.

In the LED lighting device having a heat dissipation means using a heat pipe according to the present invention

The heat pipe is a panel type with a built-in working medium, a plurality of overlapping arrangement,

A heat sink is inserted between the panel type heat pipes, and the heat sink is in contact with the heat sink.

The reflection shade is composed of an enclosure and an inner reflector having a space between each other,

It is preferable that a heat circulation path is formed between the inner space of the inner reflection plate and the space.

The LED lighting apparatus according to the present invention is a heat radiator composed of a heat pipe and a plurality of heat dissipation wings including acetone, methanol and the like as a working medium mainly having a low evaporation point in presenting an LED lighting apparatus having heat dissipation means using a heat pipe. The heat dissipation means is configured, and the heat pipe is configured to connect the LED and the heat dissipation member to greatly increase the heat dissipation efficiency. Increase heat dissipation by inserting a heat sink separately between the plurality of panel type heat pipes, thereby greatly improving heat dissipation characteristics, and providing a technology particularly suitable for high-brightness floodlights. Foreign matter by forming a heat circulation path between the space between the enclosure and the internal reflector In the case of covering the window with the reflection shade to prevent inflow, the problem of temperature rise in the region inside the reflection shade with the light source is solved, which ensures the long life characteristics of the LED and maintains the luminance quality for a long time. The air flows smoothly between the heat dissipation blades, but the air flow is not smooth in the direction across the heat dissipation wing, so heat dissipation is poor when the lighting devices are arranged in the horizontal direction. In order to solve the problem, since the cooling air is disposed with the vertically descending characteristic, a plurality of air communication cutouts may be introduced into the heat dissipation vane, thereby significantly improving the heat dissipation characteristic.

1 is a perspective view of the LED lighting device having a heat dissipation means using a heat pipe according to the present invention.
Figure 2 is an exploded perspective view of the LED lighting apparatus having a heat dissipation means using a heat pipe according to the present invention.
3 is a cross-sectional view of the LED lighting apparatus according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

The present invention may be modified in various ways and may have various forms, and thus embodiments (or embodiments) will be described in detail in the text. However, this is not intended to limit the present invention to the specific form disclosed, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In each of the drawings, the same reference numerals, in particular, the tens and ones digits, or the same digits, tens, ones, and alphabets refer to members having the same or similar functions, and unless otherwise specified, each member in the figures The member referred to by the reference numeral may be regarded as a member conforming to these criteria.

In addition, in the drawings, the components are exaggerated in size (or thickness), in size (or thickness), in size (or thickness), or in a simplified form or simplified in view of convenience of understanding. It should not be.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms “comprises” or “consists” are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

In describing the LED lighting device A having heat dissipation means using a heat pipe according to the present invention, for the sake of convenience, an approximate direction reference that is not rigid is specified with reference to FIGS. 1A and 2.

In the state as shown in Fig. 1 [A] and Fig. 2, the top, bottom, left, and right sides are divided, and the description relating to other drawings also specifies the direction according to this criterion.

First, as shown in Figures 1 and 2, the LED lighting device (A) having a heat dissipation means using a heat pipe according to the present invention is a light source 10 consisting of an LED, a reflector 30 surrounding the light source, heat dissipation It comprises a heat dissipation means (H) (see Fig. 2) including a sieve 40 and the heat pipe (50).

The light source, in particular the light source composed of LED (L) uses the LED chip 11 mounted on the PCB (11a), basically composed of a columnar, reflector plate 33, in particular two stages (33A, 33B) ( 3 (A)) using the bent reflector 33

Particularly, in the LED lighting device for floodlight, it was recognized as a standard to secure desired illuminance by using a high wattage driving LED and a lens.

In the present invention, a low-watt driving LED and a two-stage reflector alone have the same or better high illuminance lighting, for example, a LED lighting device for a floodlight.

Furthermore, while the LED chip 11 constituting the light source 10 is arranged in a columnar shape, the fixture 20 is used for connection with the heat dissipation means (H).

As can be seen in FIG. 2, two powders 20A having a plurality of PCB contact surfaces 20a to fit a flat, strip-type LED PCB 11a (in the middle of the right and second one-dot chain lines in FIG. 2). It is composed of a combination of approximately planar shapes having a semi-circular shape as shown in the plan view.

The powder 20A type fixing body 20 is for accommodating a heat pipe in the center receiving portion 21 to increase the heat dissipation effect. Therefore, in the present specification, the term 'heat pipe' connected to the PCB of the LED and in contact with the heat sink is meant to include a case of direct contact with the PCB of the LED as well as an indirect contact (with a fixture interposed therebetween).

In addition, the shape and size of the fixing body 20 and the structure of the contact surface 20a (various types such as circular type can be changed),

The structure, shape, number of sizes, etc. of the LED chip 11 and the PCB 11a may be variously modified.

The LED chip attached to the contact surface 20a of the fixture 10 by using an adhesive, in particular, a special adhesive commercially available with high thermal conductivity, is attached to the contact surface of the side surface of the columnar fixture 20 so that two steps ( 33A, 33B) is composed of a side LED chip 11A for irradiating light to the bent reflector plate 33,

On the circular lower surface of the fixed body 20, a binding disk 13 is fixed to each fastening portion 23 of the two symmetrical powders 20A through bolts B to bind the two powders.

In the exploded perspective view of FIG. 2, the strip-type PCBs 11a of the light source 10 and the binding disk 13 are illustrated in a cylindrical integrated form for convenience.

If necessary, the binding disk is composed of a front LED chip 11B mounted on a disk type PCB as shown in the left middle, third one-dot chain circle of FIG. 2, and the front LED chip 11B is divided into two powders ( 20A) can also be configured to bind.

Heat pipes, also called heat pipes, were manufactured by General Motors of the United States in 1942 for heat dissipation of spacecraft. The working medium filled in the hollow pipe uses acetone, methanol and the like having a low vaporization point.

In the present invention, in particular, the heat pipe 50 is used, in particular, as shown in FIG. 2, by using a panel-type one 50 in an overlapping arrangement (four overlapping arrangements in a perspective view in the upper right corner of the first one-dot dashed line in FIG. 2). In order to improve heat dissipation characteristics, assemblability and productivity, and to insert heat sinks separately between the plurality of panel type heat pipes to solve thermal stacking phenomenon in the overlapped heat pipes, the heat dissipation characteristics are greatly increased, so that they have characteristics particularly suitable for high-brightness floodlights. It was.

The overlapped panel type heat pipe 50 is arranged in contact with the receiving portion 21 of the two powders 20A of the fixture 20 to which the LED PCB constituting the light source 10 is arranged.

The upper portion of the heat pipe is arranged in contact with the receiving portion 41 between the powders 40A of the heat dissipation body 40 having the heat dissipation blades, particularly the plurality of heat dissipation blades 40a arranged radially with respect to the upper and lower axes.

On the other hand, the reflection shade 30 surrounding the light source 10, in particular the columnar light source is composed of an inner reflection plate and an outer enclosure.

The inner reflector 33 is composed of a relatively steep inclined first end 33A at the top and a relatively gentle inclined second end 33B at the bottom connected thereto, and each end 33A, 33B is a polygon rather than a smooth surface. It is configured to be arranged to increase the reflection characteristics.

In addition, the enclosure 31 forms a smooth curved surface inside and outside, it is possible to form the heat radiation fins on the inside or outside, or both to improve the heat dissipation characteristics as needed. In addition, a variety of materials can be selected for heat dissipation and light weight of the material, for example, may be an aluminum material.

Furthermore, as can be seen in FIG. 3B, the enclosure 31 and the internal reflection plate 33 have a space 37a spaced apart from each other, and the interior space of the internal reflection plate 33 on which the light source 10 is arranged. A heat circulation path 37 is formed between the space 37a and the space 37a to help improve heat dissipation.

This solves the problem that the temperature rises in the reflection shade inner region provided with the light source 10, especially when the window 35 is covered by the reflection shade 30 to prevent the inflow of foreign matters, thereby ensuring the long life characteristics of the LED. And to maintain luminance quality for a long time.

In FIG. 2, the window 35 is fixed to the rim of the enclosure 31 using fastening means such as a band 35A and a clip 35a.

The heat circulation passage 37 is a passage connecting the separation space 37a and the internal space 937b and the upper and lower slots 33a and 33b of the reflecting plate. In the drawings different from the above, a plurality of upper slots 33a can be confirmed.

The lower slot can be formed in various shapes and numbers,

For example, as shown in the lower right, third one-dot circle in FIG. 2 (substantially the third one-dot circle is a longitudinal cross-sectional view of the right portion of the reflector, and substantially the fourth one-dot circle is a bottom observation perspective view), an internal reflector. 33 has a third stage bent portion 33C at the lower end in addition to the two stage bent portions 33A and 33B.

One surface 33F connecting the first, second, and third stage bends 33A, 33B, 33C of the polygonal reflector is separated from each other at the third stage bends 33C. It may be modified to form a lower slot (33b ').

One of the core of the present invention, the heat dissipation means (H) is made of a heat sink 40, the heat pipe 50, and the heat sink 60, which will be described in more detail.

The heat dissipation body 40 is a structure which has several radial heat dissipation wing | blade 40a about an up-and-down axis line,

In particular, in order to ensure the introduction and adhesion of the heat pipe, and to improve the assemblability, the heat dissipating body is composed of powder 40A, and the receiving portion for accommodating the heat pipe, in particular, the panel type heat pipe 50, on the contact surface of each powder 40A. 41 and heat passages 40c on both sides of the housing portion (a circular channel is formed when the two powders are assembled) are formed.

As can be seen in the heat sink powder 40A shown in plan view in the upper left, first dashed-dotted circle of FIG.

A fastening portion 43a (43b) for bolt connection with other components is formed on a contact surface of each of the heat dissipation blades 40a or the heat dissipation wing 40a and the connection body 40B in which they are connected.

In addition, each heat dissipation blade is formed with a spaced apart air communication cut 40b. The air communication cutout 40b is introduced to improve heat dissipation.

In general, due to the structural characteristics of the radiator arranged in a radial direction, air communication is smoothly performed between the heat dissipation wings, but there is a problem that air communication is not smooth in the direction crossing the heat dissipation wing.

In particular, in order to solve the problem of poor heat dissipation when the lighting device is arranged in the horizontal direction (heating air is vertically raised and cooling air is disposed with the vertically falling characteristic),

By introducing a plurality of air communication incisions to the heat dissipation blades can significantly improve the heat dissipation characteristics.

The spacing, dimensions, and shape of the air communication cutout 40b may be variously modified.

Next, as described above, the heat pipe, in particular, the panel type heat pipe, is used to overlap a plurality, the upper part of which is fitted to the receiving portion 41 of the heat sink body 40A, and the lower part of the heat pipe for the light source 10. It is coupled to the receiving portion 21 of the stagnant powder 20A.

The overlapping plate-shaped heat pipes may accumulate in the heat pipe portion sandwiched in the middle without heat dissipation.

In the present invention, in order to solve this problem, the heat sink is interposed between the panel type heat pipes, and the heat sink has a structure in contact with the heat sink 40.

In FIG. 2, the heat sink 60 is arranged at both sides of the annulus 63 of the upper center (based on the upper and lower center axis), the trim part 65 at the lower center, and the long holes and the lower sides of the middle (based on the upper and lower heights). It has a perforation 61 composed of two pairs of circular holes.

The perforation part acts as an air communication path to perform a heat dissipation function (especially in the form of a long hole, the same as the incision next to the lower two pairs of circular holes), and if necessary, the binding function with the heat dissipator powder 40A and the like (especially Bottom two pairs of circular holes).

The ring portion 63 will accommodate the fixing of the power cable or the mounting function of the lighting device (A) itself,

The trimming portion 65 is shown in the cross-sectional view of engagement in the second, dashed circle of the left side of Figure 2,

In introducing the heat dissipation plate 60 between the panel-type heat pipes 50 accommodated between the stationary powder 30A and the receiving portions 21 and 41 of the heat dissipating powder 40A, and closely contacted with each other.

When the center of the heat sink is sandwiched between the heat pipes, both sides contact the heat sink 40

The heat pipe 50 forms the separation part 51 from the upper portion of the fixture 20,

At this time, due to the heat sink in the middle of the heat pipe is also closely contacted by the heat sink powder

The lower part of the separation part is suddenly loaded, thereby preventing the situation in which the heat pipe is bent and the internal working medium is not circulated and shut off.

The lower portion of the separation unit 51 may naturally open due to the trimming portion 65 of the heat sink, and the circulation of the working medium may be performed without clogging.

If necessary, increase or decrease the top and bottom height of the cutout, or lower the height of the heat sink to be lower than the height of the blades 40a of the heat sink, and keep the ring portion 63 of the heat sink exposed to the upper end of the heat sink 40. By introducing various measures to reduce the length of overlapping section of heat sink and heat pipe

Despite the separation part 51 of the heat sink and the heat pipe 50 and the close contact between the fixing body and the heat sink and the heat pipe, the bending (increasing internal space) problem that prevents the flow of the working medium of the heat pipe is prevented from occurring. Can be.

Next, the LED lighting device (A) according to the present invention has a hook portion 70 for fixing the lighting device to the wall or the ceiling, the hook portion is composed of a relay member 71 and the bracket (73).

The bracket 73 has a 'c' like shape, the through hole 73B is formed at the ends of the vertical bent both parts

The through hole 73B is superposedly arranged in the screw hole N of both vertical bent portions 71B of the relay member 71, and the bolt B is fastened to the screw hole to bind the relay member and the bracket.

A hollow 73A and a long hole 73a on both sides of the hollow are formed at an upper horizontal portion of the bracket, and both of them can be used for mounting of lighting devices or preventing sagging of other members such as cables.

The relay member 71 has a slit 71A through which a plurality of panel type heat pipes 50 superimposed in the center pass, and has bent portions 71B on both sides of the circular body.

The length of the heat pipe is a little longer than the height of the fixture 20 and the heat sink 40, the difference corresponds to the thickness of the reflecting plate, the enclosure, the relay member body, etc. in the middle.

When assembling, the lower part of the plurality of panel type heat pipes 50 is arranged in the fixed body (20 powder 20A) accommodating part 21

The binding disk 13 (or the front part LED 11B) is fixed to the fastening part 23 of each powder 20A with the bolt B, and is fixed,

Subsequently, the PCB 11a of the LED chip is attached to the outer surface of the fixture 20, that is, the contact surface 20a.

Next, the upper portion of the panel type heat pipe 50 protruding upward is inserted into the disc-type body center slit 71A of the relay member 71 of the hook portion 70, and both sides of the slit 71A are moved from the upper side to the lower side. When the bolt is inserted into the first binding portion 71a, the bolts are penetrated through the respective fastening portions 23 of the upper surface of the fixed body 20 powder 20A.

The upper and lower surfaces of the stationary powder 20A are firmly bound by the relay member 71 and the binding disk 13, and the heat pipe located in the accommodation portion 21 also comes into close contact with the stationary body.

Next, the protruding upper portions of the plurality of panel type heat pipes 50 are arranged in the accommodating portion 41 of the heat dissipating powder 40A, wherein the heat dissipating plate 60 is interposed between the separating portions 51 between the heat pipes. ,

The upper part of the heat dissipator 40 powder 40A is coupled to the through-hole 45a of the fastening disk 45 by mutual binding, and this bolt B is the central connector of the heat dissipation 40 powder 40A. A first fastening portion 43a adjacent to 40B (upper left, in the first one dashed line circle in Fig. 2) is coupled.

A slit 45A is formed at the center of the fastening disk 45 so that the ring portion 63 of the heat sink 60 passes through and is exposed upward.

In addition, the lower part of the mutually coupled radiator 40 powder 40A can be seen in the radiator body 40A shown in plan view in the upper left, first dashed-dotted circle of FIG. 2,

When the bolt is coupled from the top to the bottom to the second binding portion 71b of the center disk type body of the relay member 71,

This bolt is screwed to the first fastening portion 43a of the heat sink powder 40A,

[Assembly of the heat radiator 40, the heat pipe 50, the heat radiating plate 60], ie, the heat radiating means H and the [assembly of the light source 10-fixing body 20] between the relay member 71, And they are joined together.

Next, the enclosure 31 and the reflecting plate 33 are superimposed and arranged

After arranging a separate binding disk 31A at the overlapping portion of the upper disk of the enclosure and the reflecting plate (arranged at the center disk when the reflecting plate 33 is disposed),

When the bolt is screwed into the through hole 31a of the binding disc 31A, the penetrating hole 33c of the reflecting plate 33 and the upper disc portion of the enclosure (here also can form a through hole)

The outermost third binding portion 71c of the central disk type body of the relay member 71 is coupled to the reflection shade 30.

The window is then arranged in the lower portion of the reflector 30 enclosure 31, ie the flange around the opening, and the band 35A is bound using the clip 35a.

In addition, when the bracket 73 constituting the hook portion 70 is coupled to the bent portions 71B at both ends of the relay member 71, the assembly is completed.

In the above description, although the conventionally known technologies related to the type of LED chip, the material of each component, the driving use of the lighting device, and the like are omitted, those skilled in the art can easily infer, infer, and reproduce them.

In addition, in the above description of the present invention, the LED lighting apparatus having a specific shape and structure has been described with reference to the accompanying drawings. However, the present invention can be variously modified, changed, and replaced by those skilled in the art. Should be construed as falling within the protection scope of the present invention.

A: Processing System 10: Light Source
11: LED chip 11A: side part
11B: Front side 13: Binding Disc
20: fixed body 20A: powder
21: accommodating part 23: fastening part
20a: contact surface 30: reflection shade
31: enclosure 33: reflector
35: Windows 35A: Band
37: heat circulation path 37a: separation space
H: heat dissipation means 40: heat dissipation
40A: powder 41: receiving part
43: fastening portion 45: fastening disk
50: heat pipe 51: separation unit
60: heat sink 61: perforation
63: ring 65: trimming
70: hook portion 71: relay member
71A: Slit 73: Bracket

Claims (4)

A light source composed of LEDs mounted on the PCB;
A reflection shade surrounding the light source; And
And a heat dissipation means having a plurality of heat dissipation wings and a heat pipe connected to the PCB of the LED and in contact with the heat dissipation element.
The heat pipe is a panel type with a built-in working medium, a plurality of LED lighting apparatus, characterized in that the arrangement. The method of claim 1,
A heat dissipation plate is sandwiched between the panel type heat pipes, and the heat dissipation plate is in contact with the heat dissipation body. The method of claim 2,
The radiator 40 is composed of two powders 40A, and an accommodating portion 41 is formed between the powders 40A.
The light source 10 has a fixture 20 in which the LED chip 11 is arranged and connected to the heat dissipation means H, which is composed of two powders 20A having a PCB contact surface 20a. It is composed, the receiving portion 21 is provided between the powders,
An upper portion of the plurality of overlapped panel type heat pipes 50 is fitted into the accommodating portion 41 of the heat dissipating powder 40A, and the lower portion accommodating the accommodating portion 21 of the fixture body 20A for the light source 10. ),
The heat dissipation plate 60 has a trimming portion 65 at the lower center thereof, and the heat dissipation plate 60 is sandwiched between the heat pipes 50, and both sides contact the heat dissipation body 40, and the fixture 20 The heat pipe 50 forms the separating part 51 from the upper part, and the lower part of the separating part 51 can be naturally opened due to the trim part 65 of the heat sink, so that the circulation of the working medium is blocked. LED lighting device, characterized in that made without. The method according to any one of claims 1 to 3,
LED lighting apparatus, characterized in that formed in each of the heat dissipation blades of the heat dissipating air communication incision 40b.

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