KR101153578B1 - LED and method of fabricating the same LED and method of fabricating the same - Google Patents

Abstract

The light emitting diode of the present invention includes a light emitting diode chip disposed on the base structure; A molding part encapsulating the light emitting diode chip; And a fly's eye lens disposed on a surface of a molding part on an optical path emitted from the light emitting diode chip.

Description

Light emitting diodes and method of manufacturing the same {LED and method of fabricating the same}

The present invention relates to a light emitting diode, and more particularly, to a light emitting diode having excellent light extraction efficiency and to which the extracted light can be uniformly irradiated, and a method of manufacturing the same.

Light emitting diodes are continuously being researched from light emitting diode chips to packages to improve light emitting efficiency.

The light emitting diode package uses a material having good heat dissipation efficiency systematically to construct a thermally stable structure even when a high current is applied, or to improve the light extraction efficiency by an optimal design considering the optical structure and characteristics of the package.

On the other hand, efforts to improve the luminous efficiency of the light emitting diode are continuously progressed from the chip to the package.

In the package stage, it is possible to construct a thermally stable structure even when a relatively high current is applied using a material having good heat dissipation efficiency using a heat sink, or to increase the light extraction efficiency by an optimal design considering the optical structure and characteristics of the package. Efforts are underway.

On the other hand, although much of the effort for imagining the light extraction efficiency has obtained some effect at the laboratory level, there is a problem that the extracted light is not uniformly irradiated, and it is difficult to apply it in the actual manufacturing process. There are cases.

Therefore, there is a need for a proposal of a light emitting device that can be applied to a structure or cost cost competitiveness in an actual manufacturing process.

An object of the present invention for solving the above problems is to provide a light emitting diode excellent in light extraction efficiency, the light can be uniformly irradiated and a manufacturing method thereof.

In order to solve the technical problem of the present invention as described above, the light emitting diode of the present invention includes a light emitting diode chip disposed on the base structure; A molding part encapsulating the light emitting diode chip; And a fly's eye lens disposed on a surface of a molding part on an optical path emitted from the light emitting diode chip.

The molding part surface on the optical path emitted from the light emitting diode chip may be a spherical surface or an aspherical surface.

The fly's eye lens may comprise a plurality of convex lens cells.

The molding part surface on which the fly's eye lens is disposed may have multiple curvatures.

The center of curvature of the curved surface of the molding part in which the fly's eye lens is disposed is located in the direction of the light emitting diode chip, and the center of curvature of the periphery of the fly portion is located in the opposite direction of the light emitting diode chip. In this case, the fly's eye lens disposed at the center may include a plurality of concave lens cells, and the fly's eye lens disposed at the periphery may include a plurality of convex lens cells.

The center of curvature of the surface of the molding part in which the fly's eye lens is disposed may have a center of curvature in the direction of the LED chip. In this case, the fly's eye lenses disposed in the central portion and the peripheral portion may include a plurality of convex lens cells.

In addition, the method of manufacturing a light emitting diode of the present invention comprises the steps of placing a light emitting diode chip on the base structure; Preparing a cylindrical mold cup having a lower portion sealed into a spherical surface or an aspherical surface, and injecting a molding material into the mold cup; Curing the molding material injected into the mold cup; And removing the mold cup, wherein the inner surface of the lower portion of the mold cup may include a plurality of irregularities formed of curved surfaces.

The curved surface of the lower portion of the mold cup may have multiple curvatures.

In the lower part of the mold cup, the center of curvature of the center of curvature is directed toward the inside of the cup, and the center of curvature of the periphery of the center of the cup faces toward the outside of the cup. In this case, the unevenness of the central portion may be a protrusion having a center of curvature toward the outside of the mold cup, and the uneven portion of the periphery may be a recess having a center of curvature toward the inside of the mold cup.

In the lower portion of the mold cup, the center of curvature and the periphery of the center of curvature preferably all face the inside of the cup. At this time, the concave-convex portion of the central portion and the peripheral portion may be a groove having a curved center toward the inside of the mold cup.

According to the present invention as described above, the present invention is provided with a fly's eye lens on the surface of the molding portion is excellent in light extraction efficiency, it is possible to provide a light emitting diode that can be uniformly irradiated extracted light.

In addition, the present invention can be formed at the same time by integrally forming the fly's eye lens formed on the surface of the molding portion with the molding portion, it is possible to provide a method of manufacturing a light emitting diode with improved workability and productivity.

1 is a perspective view illustrating a light emitting diode according to a first embodiment of the present invention, and FIGS. 2 to 4 are cross-sectional views illustrating a method of manufacturing a light emitting diode according to a first embodiment of the present invention.
Figure 5a is a photograph taken the RGB distribution of a typical light emitting diode.
5B is a photograph photographing RGB distribution of a light emitting diode according to a first exemplary embodiment of the present invention.
6A is a graph of color temperature distribution of a typical light emitting diode.
6b is a color temperature distribution graph of the light emitting diode according to the first embodiment of the present invention;
7 is a perspective view for explaining a light emitting diode according to a second embodiment of the present invention;
8 is a cross-sectional view of a light emitting diode according to a second embodiment of the present invention.
9 is a color temperature distribution graph of a light emitting diode according to a second embodiment of the present invention.
10 is a perspective view for explaining a light emitting diode according to a third embodiment of the present invention;
11 is a sectional view of a light emitting diode according to a third embodiment of the present invention;
12 is a color temperature distribution graph of a light emitting diode according to a third embodiment of the present invention.
13 is a perspective view for explaining a light emitting diode according to a fourth embodiment of the present invention;
14 is a cross-sectional view of a light emitting diode according to a fourth embodiment of the present invention.

The features and acts of the present invention will become apparent from the embodiments described below with reference to the accompanying drawings.

The detailed description set forth below in connection with the appended drawings is made with the intention of describing preferred embodiments of the invention, and does not represent the only forms in which the invention may be practiced. It should be noted that the same and equivalent functions included in the spirit or scope of the present invention may be achieved by other embodiments. In addition, certain features disclosed in the drawings are enlarged for ease of description, and the drawings and their components are not necessarily drawn to scale. However, those skilled in the art will readily understand these details. In addition, the same reference numerals are used for the same components in the drawings, and redundant description of the same components is omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a light emitting diode according to a first embodiment of the present invention, and FIGS. 2 to 4 are cross-sectional views illustrating a method of manufacturing the light emitting diode according to the first embodiment of the present invention.

1 to 4, the light emitting diode according to the first embodiment includes a base structure 110, a light emitting diode chip 120 mounted on the base structure 110, and the light emitting diode chip 120. It includes a molding unit 130 for encapsulating, and a fly-eye lens 140 disposed on the surface of the molding portion.

The base structure 110 may be any one of a lead frame and a premold frame. The base structure 110 may include a reflective cup 111. The reflective cup 111 is disposed in an area in which the light emitting diode chip 120 is mounted on the base structure 110 to reflect light emitted from the light emitting diode chip 120 so as to reflect light of the light emitting diode of the present invention. Improve the extraction efficiency.

In addition, the base structure 110 may further include a bonding pad 113 disposed in the reflective cup 111. The bonding pad 113 may contain at least one selected from the group consisting of Au, Ag, Cr, Ni, Cu, Zn, Ti, Pd, and equivalents thereof having excellent electrical conductivity.

The LED chip 120 emits energy emitted in the form of light due to recombination of electrons and holes when power is applied. The LED chip 120 generally includes an n-type semiconductor layer for supplying electrons and a p-type semiconductor layer for supplying holes, and the supplied electrons and holes are interfaces between the n-type semiconductor layer and the p-type semiconductor layer. Recombine at and emit light. In addition, the LED chip 120 may further include an active layer between the n-type semiconductor layer and the p-type semiconductor layer. The active layer may have a quantum dot structure or a multi quantum well structure, and electrons and holes supplied from the n-type and p-type semiconductor layers are combined in the quantum dot or quantum wells to emit light. do. In addition, the LED chip 120 is mounted on the base structure 110 through the bonding pads 113 and electrically connected to one side of the base structure 110. In addition, the LED chip 120 is electrically connected to the other side of the base structure 110 through a connection terminal, for example, a bonding wire 125.

The molding part 130 encapsulates the LED chip 120 by isolating the region where the LED chip 120 of the base structure 110 is mounted from an external environment. The molding part 130 has a high light transmittance to effectively transmit the light emitted from the light emitting diode chip 120, and a material having a low moisture permeability to prevent damage of the light emitting diode chip 120 due to moisture penetration. Can be. Preferably, the molding part 130 may be any one selected from the group consisting of silicone resin, epoxy resin, acrylic resin, and urethane resin.

In addition, when the molding unit 130 defines a region where the light emitting diode chip 120 is positioned as a lower portion, the molding unit 130 may have a cylindrical shape having an upper surface of a spherical surface or an aspherical surface. In more detail, the molding part 130 has a lower portion, that is, an area encapsulating the light emitting diode chip 120 is in the form of a cylinder, and is emitted from the upper portion of the cylinder, that is, the light emitting diode chip 120. The region on the optical path may be a curved surface having a center of curvature in the direction of the light emitting diode chip 120 to collect light. For example, the surface of the molding part 130 on the optical path emitted from the LED chip 120 may be a curved surface such as a convex lens.

The fly's eye lens 140 is disposed on a surface of the molding unit 130 on the optical path emitted from the light emitting diode chip 120 and includes a plurality of convex lens cells. That is, the fly's eye lens 140 has a curved surface whose center of curvature faces the inside of the molding part 130. The fly's eye lens 140 allows the light collected by the molding unit 130 to be uniformly irradiated to the outside, so that the color distribution of the light irradiated to the outside is uniform.

The fly's eye lens 140 may be formed at the same time as the molding part 130 and integrated with the molding part 130, or may be formed separately from the molding part 130.

In addition, the fly's eye lens 140 may be formed of a material having the same refractive index as that of the molding part 130. In addition, the fly's eye lens 140 may be formed of a material having the same light transmittance as the molding part 130.

The light emitting diode according to the first embodiment of the present invention as described above operates as follows.

First, power is supplied to the LED chip 120 through the base structure 110.

When power is supplied to the LED chip 120, the LED chip 120 emits light by recombination of electrons and holes in an active layer. In addition, if the LED chip 120 has a structure in which the active layer is omitted, the LED chip 120 emits light by recombination of electrons and holes at an interface between the n-type semiconductor layer and the p-type semiconductor layer.

Some of the light emitted from the light emitting diode chip 120 is emitted to the outside through the molding part 130, and the other is reflected to the reflective cup 111 of the base structure 110 and emitted to the outside.

In this case, the light emitted from the light emitting diode chip 120 is collected by the curved surface of the molding part 130 on the emitted path.

On the other hand, the light collected by the curved surface of the molding unit 130 is uniformly irradiated to the outside by the fly's eye lens 140 to have a uniform color distribution.

Hereinafter, a method of manufacturing a light emitting diode according to a first embodiment of the present invention will be described with reference to FIGS. 2 to 4.

Referring to FIG. 2, first, a base structure 110 is prepared. The base structure 110 may be any one selected from the group consisting of a lead frame and a pre-molded frame.

The base structure 110 may include a reflective cup 111. The reflective cup 111 is formed in a region in which the light emitting diode chip 120 is mounted on the base structure 110 to reflect light emitted from the light emitting diode chip 120 so as to reflect light of the light emitting diode of the present invention. Improve the extraction efficiency.

After preparing the base structure 110, the light emitting diode chip 120 is disposed on the base structure 110. In more detail, the light emitting diode chip 120 is mounted through the bonding pad 113 in the reflection cup 111 disposed on one side of the base structure 110. In addition, the LED chip 120 is electrically connected to the other side of the base structure 110 using a connection terminal, for example, a bonding wire 115. Therefore, the LED chip 120 is electrically connected to the base structure 110 through the bonding pad 113 and the bonding wire 115.

Referring to FIG. 3, after arranging the light emitting diode chip 120 on the base structure 110, a mold cup M? C for preparing the molding part 130 is prepared. In this case, the mold cup M? C may be formed using a mold cup M? C having an internal shape corresponding to the shape of the molding part 130 to be formed. For example, when the mold cup M? C is defined as an open portion, the mold cup M? C may have a cylindrical shape in which the lower part is closed with a spherical or aspherical surface with a center of curvature toward the mold cup M? C.

In addition, the curved inner surface of the lower portion of the mold cup (M? C) may be provided with a plurality of irregularities. In this case, the concave-convex may be a concave groove having a center of curvature toward the inside of the mold cup. In addition, it is obvious that the curvature of the groove is larger than the curvature of the curved surface of the lower portion of the mold cup M? C. If the mold cup M? C is made of a transparent material, the unevenness may be shaped like a concave lens.

After preparing the mold cup M-C as described above, the molding cup M-C is formed of any one molding material selected from the group consisting of a silicone-based resin, an epoxy-based resin, an acrylic-based resin, and a urethane-based resin. Inject.

Then, the base structure 110 on which the light emitting diode chip 120 is mounted is inserted with the light emitting diode chip 120 facing the inside of the mold cup M? C.

Thereafter, the molding part material injected into the mold cup M-C is cured to simultaneously form the molding part 130 and the fly's eye lens 140 according to the shape of the mold cup M-C. In this case, the shape of the fly's eye lens 140 is determined by the unevenness of the lower portion of the mold cup M? C. For example, when the unevenness is a groove having a curved center of curvature toward the inside of the mold cup M? C, the fly's eye lens 140 may include a plurality of convex lens cells.

Meanwhile, curing of the molding part material may be performed by thermal curing or photocuring. The thermosetting is a method of curing by applying heat from the outside when the molding material has a thermosetting property. In addition, when the molding material has a photocuring property, the photocuring may emit light from the light emitting diode chip 120 by irradiating light from the outside or by applying power to the light emitting diode chip 120. It is a method for curing the molding material. On the other hand, when curing the molding material by using external light it is obvious that the mold cup (M? C) is made of a transparent material.

Meanwhile, in the first exemplary embodiment of the present invention, the molding part 130 and the fly's eye lens 140 are simultaneously formed using a mold cup M? C, but the present invention is not limited thereto. For example, it is also possible to form a fly's eye lens 140 by curing the molding material to form the molding part 130 and then separately processing the surface of the molding part 130.

Referring to FIG. 4, after the molding part 130 and the fly's eye lens 140 are formed, the mold cup M? C is removed. When the mold cup M? C is removed, the light emitting diode according to the first embodiment of the present invention including the molding part 130 and the fly's eye lens 140 simultaneously formed by the curing is completed.

5A is a photograph photographing the RGB distribution of a general light emitting diode, and FIG. 5B is a photograph photographing the RGB distribution of the light emitting diode according to the first embodiment of the present invention. At this time, the color distribution evaluation distance is 50 mm from the light source.

5A and 5B, as shown in FIG. 5A, a general light emitting diode having no fly's eye lens may have a color distribution formed in a band for each RGB. In addition, it can be seen that the light emitting diode according to the first embodiment of the present invention having the fly's eye lens has fewer RGB color bands than the general light emitting diode as shown in FIG. 5B.

That is, it can be seen that the light emitting diode according to the first embodiment of the present invention has a uniform color distribution than the general light emitting diode.

FIG. 6A is a color temperature distribution graph of a general light emitting diode, and FIG. 6B is a color temperature distribution graph of the light emitting diode according to the first embodiment of the present invention. At this time, the color temperature measurement distance is 50 mm from the light source.

6A and 6B, it can be seen that a general light emitting diode having no fly's eye lens has a sharp drop in color temperature in a region spaced a certain distance from the center as shown in FIG. 6A. That is, in the general light emitting diode having no fly's eye lens, light generated from the light emitting diode chip is not uniformly irradiated.

In addition, it can be seen that the light emitting diode according to the first embodiment of the present invention having the fly's eye lens gradually decreases in color temperature from the center as shown in FIG. 6B. That is, the light emitting diode according to the first embodiment of the present invention having the fly's eye lens can be seen that the light emitted from the light emitting diode chip is uniformly shown.

7 is a perspective view illustrating a light emitting diode according to a second embodiment of the present invention, and FIG. 8 is a cross-sectional view of the light emitting diode according to the second embodiment of the present invention.

7 and 8, the light emitting diode according to the second embodiment of the present invention is similar to the light emitting diode according to the first embodiment of the present invention. However, the curved surface on the light emission path of the molding unit 230 has multiple curvatures, and the shape of the fly's eye lens 240 disposed on the curved surface on the light path of the molding unit 230 is different.

In more detail, the light emitting diode according to the second embodiment of the present invention is disposed on the base structure 210, the light emitting diode chip 220 for emitting light through recombination of electrons and holes, and the light emitting diode A molding unit 230 encapsulating the chip 220 and a fly's eye lens 240 formed on a curved surface on the light emission path of the molding unit 230.

In this case, when the molding unit 230 defines a region where the light emitting diode chip 220 is located as a lower portion, the molding unit 230 may have a cylindrical shape in which the upper portion is a spherical or aspherical curved surface having multiple curvatures. In more detail, the molding part 230 has a lower portion, that is, an area encapsulating the light emitting diode chip 220 is in the form of a cylinder, and is emitted from the upper portion of the cylinder, that is, the light emitting diode chip 220. The curved surface of the region on the optical path preferably has multiple curvatures. More preferably, the center 233 of the curved surface on the light emission path of the molding unit 230 may be a curved surface of which the center of curvature faces the opposite direction of the LED chip 220, and the peripheral portion 231 may have a center of curvature. It may be a curved surface facing the light emitting diode chip 220.

In addition, the fly's eye lens 240 is disposed on a curved surface on the light emission path of the molding part 230, and the fly's eye lens 243 of the center portion 233 has a center of curvature similar to that of the center portion 233. It may be a concave lens shape consisting of a curved surface facing the opposite direction of the chip 220. In addition, the fly's eye lens 241 of the peripheral portion 231 may have a convex lens shape having a center of curvature toward the light emitting diode chip 220 similarly to the peripheral portion 231.

The method of manufacturing the light emitting diode according to the second embodiment of the present invention as described above is not described with reference to the drawings, but is similar to the method of manufacturing the light emitting diode according to the first embodiment. However, the shape of the mold cup used to form the molding part 230 and the fly's eye lens 240 is different.

In this case, the mold cup (M? C) used in the first embodiment may have a multi-curvature lower portion. Preferably, the lower portion of the mold cup may have a center of curvature of the central curved surface toward the outside of the mold cup, and a center of curvature of the peripheral curved surface may face the inside of the mold cup.

In addition, the inner surface of the lower portion of the mold cup is provided with a plurality of irregularities. For example, the unevenness of the central portion may be a protrusion having a center of curvature toward the outside of the mold cup, and the uneven portion of the periphery may be a recess having a center of curvature toward the inside of the mold cup. If the mold cup is a transparent material, the unevenness of the center portion may be shaped like a convex lens, and the unevenness portion of the peripheral portion may be shaped like a concave lens.

When the molding material is injected into the mold cup and cured, as shown in FIGS. 7 and 8, it is possible to form the molding part 230 having the fly's eye lens 240 disposed on the emitted light path.

9 is a color temperature distribution graph of the light emitting diode according to the second embodiment of the present invention. At this time, the color temperature measurement distance is 50 mm from the light source.

9, it can be seen that the light emitting diode according to the second embodiment of the present invention gradually decreases the color temperature from the center portion. That is, the light emitting diode according to the second embodiment of the present invention having the fly's eye lens can be seen that the light emitted from the light emitting diode chip is shown more uniformly than the general light emitting diode not having the fly's eye lens.

10 is a perspective view illustrating a light emitting diode according to a third embodiment of the present invention, and FIG. 11 is a cross-sectional view of the light emitting diode according to the third embodiment of the present invention.

10 and 11, the light emitting diode according to the third embodiment of the present invention is similar to the light emitting diode according to the first embodiment of the present invention. However, the structure in which the curved surface on the light emission path of the molding part 330 has multiple curvatures is different.

In more detail, the light emitting diode according to the third embodiment of the present invention is disposed on the base structure 310, the light emitting diode chip 320 for emitting light through recombination of electrons and holes, and the light emitting diode A molding unit 330 encapsulating the chip 320 and a fly's eye lens 340 formed on a curved surface on the light emission path of the molding unit 330.

In this case, when the molding unit 330 defines a region where the light emitting diode chip 320 is positioned as a lower portion, the molding unit 330 may have a cylindrical shape in which the upper portion is a spherical or aspherical curved surface having multiple curvatures. In more detail, the molding part 330 has a lower portion, that is, a region encapsulating the light emitting diode chip 320 is in the form of a cylinder, and the light emitted from the upper portion of the cylinder, that is, the light emitting diode chip 320. The curved surface of the region on the path preferably has multiple curvatures. More preferably, the center of curvature 333 and the peripheral portion 331 of the curved surface on the light emission path of the molding part 330 is located in the direction of the light emitting diode chip 320. In addition, the curvature of the central portion 333 is preferably larger than the curvature of the peripheral portion 331.

In addition, the fly's eye lens 340 is disposed on a curved surface on the light emission path of the molding unit 330, that is, the center and the peripheral portion, and the fly's eye lens 341 is disposed on the central portion 333 and the peripheral portion 331. 343 all have a plurality of convex lens cells.

The manufacturing method of the light emitting diode according to the third embodiment of the present invention as described above is not described with reference to the drawings, but is similar to the manufacturing method of the light emitting diode according to the first embodiment. However, the shape of the mold cup used is different.

In this case, the mold cup (M? C) used in the first embodiment may have a multi-curvature lower portion. Preferably, the lower portion of the mold cup has a center of curvature at the center and the periphery thereof toward the inside of the mold cup. In addition, the curvature of the central portion is larger than the curvature of the peripheral portion.

In addition, the inner surface of the lower portion of the mold cup may be provided with a plurality of concave-convex, for example, the center and the peripheral portion has a groove made of a curved surface toward the inside of the mold cup in the center of curvature. If the mold cup is made of a transparent material, the irregularities of the central portion and the peripheral portion may be shaped like concave lenses.

When the molding material is injected into the mold cup and cured, as shown in FIGS. 10 and 11, it is possible to form the molding part 330 in which the fly's eye lens 340 is disposed on the emitted light path.

12 is a graph of color temperature distribution of a light emitting diode according to a third exemplary embodiment of the present invention. At this time, the color temperature measurement distance is 50 mm from the light source.

Referring to FIG. 12, it can be seen that the light emitting diode according to the third embodiment of the present invention gradually decreases the color temperature from the zoom core. That is, the light emitting diode according to the third embodiment of the present invention having the fly's eye lens can be seen that the light emitted from the light emitting diode chip is uniformly shown as compared to the general light emitting diode not having the fly's eye lens.

13 is a perspective view illustrating a light emitting diode according to a fourth embodiment of the present invention, and FIG. 14 is a cross-sectional view of the light emitting diode according to the fourth embodiment of the present invention.

13 and 14, the light emitting diode according to the fourth embodiment of the present invention is similar to the light emitting diode according to the first embodiment of the present invention. However, the shape of the base structure 410 and the molding part 430 is different.

In more detail, the light emitting diode according to the fourth embodiment of the present invention is disposed on the base structure 410, the light emitting diode chip 420 for emitting light through recombination of electrons and holes, and the light emitting diode The molding part 430 encapsulating the chip 420 and a fly's eye lens 440 formed on a curved surface of the light emitting path of the molding part 430.

In this case, the base structure 410 may be any one of a sub-mount substrate and a light emitting diode wafer. In addition, the base structure 410 has a recess in an area where the light emitting diode chip 420 is mounted, a reflecting cup 411 is disposed in the recess, and a light emitting diode chip inside the reflecting cup 411. 420 is mounted.

In addition, the LED chip 420 is electrically connected to the metal wire 450 through the bonding wire 425.

In addition, the molding part 430 encapsulates the LED chip 420 on the base structure 410, and the shape of the molding part 430 may be a dome shape.

In addition, a fly's eye lens 440 including a plurality of convex lens cells may be disposed on a curved surface of an optical path emitted from the LED chip 420 among the curved surfaces of the dome.

110, 210, 310, 410; Base structure
120, 220, 320, 420; Light emitting diode chip
130, 230, 330, 430; Molding part
140, 240, 340, 440; Fly eye lens

Claims (14)

A light emitting diode chip disposed on the base structure;
A molding part encapsulating the light emitting diode chip; And
And a fly-eye lens disposed on a surface of a molding part on an optical path emitted from the light emitting diode chip.
The center of curvature of the curved surface of the molding portion on which the fly-eye lens is disposed, the center of curvature is located in the direction of the light emitting diode chip, the center of curvature of the peripheral portion of the light emitting diode is located in the opposite direction of the light emitting diode chip. The method of claim 1,
The surface of the molding part in which the fly's eye lens is disposed is a spherical or aspheric curved surface. The method of claim 2,
The fly's eye lens includes a plurality of convex lens cells. The method of claim 1,
The light emitting diode having the surface of the molding portion in which the fly's eye lens is disposed has multiple curvatures. delete The method of claim 1,
The fly's eye lens disposed in the center includes a plurality of concave lens cells, the fly's eye lens disposed in the peripheral portion includes a plurality of convex lens cells. delete delete Disposing a light emitting diode chip on the base structure;
Preparing a cylindrical mold cup having a lower portion sealed into a spherical surface or an aspherical surface, and injecting a molding material into the mold cup;
Curing the molding material injected into the mold cup; And
Removing the mold cup;
The inner surface of the lower portion of the mold cup includes a plurality of irregularities made of a curved surface, the center of curvature in the lower portion of the mold cup has a center of curvature toward the inside of the cup, the periphery of the curved surface of the light emitting diode manufacturing method. The method of claim 9,
The curved surface of the lower portion of the mold cup has a multi-curvature manufacturing method of the light emitting diode. delete The method of claim 9,
The unevenness of the central portion is a protrusion made of a curved surface of the center of curvature toward the outside of the mold cup,
The irregularities of the peripheral portion is a manufacturing method of a light emitting diode, the center of curvature is a groove made of a curved surface toward the inside of the mold cup.
delete delete

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