KR101144437B1 - Touch input device - Google Patents

Abstract

A touch input device is disclosed. The touch input device includes first and second electrodes spaced apart from each other around the first resistive film, the first electrodes are disposed in the corner regions, and the second electrodes are disposed between the corner regions. It further includes a connection electrode connected to the first resistance film and the lead electrode. Through the lead electrode, a voltage is applied to the connection electrode, and a voltage slope is formed on the first resistive film. In addition, the touched position may be sensed by contacting the second resistive film opposite to the first resistive film to sense the voltage at the point of contact.

Touch, 4-wire, 5-wire, resistive, middle

Description

Touch input device {TOUCH INPUT DEVICE}

An embodiment relates to a touch input device.

BACKGROUND With the development and popularization of graphical user interface (GUI) systems, the use of touchscreens with simple inputs has become commonplace.

The touch screen may adopt a resistive film method, a capacitive method, an optical sensor method, an ultrasonic method, an electromagnetic method, a vector force method, or the like.

The resistive film method is a method in which a transparent conductive film between two substrates is in contact with each other and is easily implemented and excellent in touch screen methods. However, mechanical and environmental reliability is inferior.

The optical sensor method is a method of determining a position when the optical path between the optical output device and the optical input device is blocked, and has a disadvantage of being affected by external light and a large circuit size because the circuit part is installed at the outer part.

Similar to the optical sensor method, the ultrasonic method or the surface acoustic wave method has a disadvantage in that it is vulnerable to noise or noise in the factory by determining the position when the acoustic path between the acoustic wave generating element and the acoustic wave recognition element is blocked.

The electromagnetic method is a method using the magnetism and the electromotive force generation principle of the Faraday law, and calculates the coordinates by determining the amount of current flowing through the unit coil for each position. Since a signal of alternating current must be applied to the coil, a special dedicated pen is needed.

The capacitive method is a method that detects the minute current flowing in response to the change in capacitance coupled between the sensor electrode and the finger and determines the position. However, the capacitive method is weak in noise signals, but it is strong in environmental reliability and changes the protective layer on the upper touch screen. Therefore, there is an advantage that the mechanical reliability can be changed freely. Capacitive methods can be divided into analog and digital methods.

Embodiments provide a touch input device with low power consumption and improved durability and reliability.

In one embodiment, a touch input device includes a first substrate; A first resistive film disposed on the first substrate; Lead wiring for supplying an electrical signal to the first resistive film; A connection electrode connected to the lead wiring and connected to the first resistive film; And first electrodes and second electrodes disposed in an outer region of the first resistive layer and connected to the first resistive layer, wherein the outer region includes corner regions corresponding to each corner of the first resistive layer. And intermediate regions between the corner regions, wherein the first electrodes are spaced apart from each other in the corner regions, the second electrodes are disposed spaced apart from each other in the intermediate regions, and the connection electrode is disposed in the It is arranged between the second electrodes.

In one embodiment, a touch input device includes a substrate; A resistive film disposed on the substrate and having a rectangular planar shape; A plurality of dummy electrodes disposed around the resistive film, spaced apart from each other, and connected to the resistive film; Four connection electrodes disposed on central portions of the sides and connected to the resistance film; And a driving unit configured to apply a first voltage and a reference voltage through the connection electrodes.

The touch input device according to the embodiment may include a plurality of connection electrodes and a plurality of lead wires respectively connected to the connection electrodes. Voltage is applied between two connection electrodes facing each other, and a linear voltage distribution is formed on the first resistive film. In this case, the voltage at the touched point may be sensed through the second resistive layer contacting the first resistive layer.

Accordingly, in the touch input device according to the embodiment, a voltage is applied between two connection electrodes facing each other, and a high resistance can be formed between the two connection electrodes, thereby reducing power consumption.

In addition, the transparent conductive film which is touched with the outside does not include an electrode for sensing, and performs only a function of sensing a voltage.

Accordingly, even if the transparent conductive film is damaged by an external touch or the like, the reliability of the touch input device according to the embodiment is not affected.

Accordingly, the touch input device according to the embodiment has improved durability and reliability.

In the description of the embodiments, each panel, member, wiring, film, substrate, or electrode is formed on or under the "on" of each panel, member, wiring, film, substrate, or electrode. In the case of what is described as being intended, "on" and "under" include both "directly" or "indirectly" formed. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the purpose of description, it does not mean that the size is actually applied.

1 is an exploded perspective view illustrating a touch panel according to an embodiment. 2 is a plan view illustrating a rear surface of an upper substrate. 3 is a plan view illustrating an upper surface of a lower substrate. 4 is a circuit diagram illustrating a touch panel according to an embodiment. 5 and 6 illustrate a process of sensing a touch signal by the touch panel according to the embodiment.

Referring to FIG. 1, the touch panel according to the embodiment includes an upper substrate 100, a lower substrate 200, a spacer 300, an adhesive member 400, a support substrate 500, a connection substrate 600, and a driving unit ( 700).

1 and 2, the upper substrate 100 faces the lower substrate 200. The upper substrate 100 is disposed on the lower substrate 200.

The upper substrate 100 may include an upper transparent substrate 110, a transparent conductive layer 120, an upper connection electrode 130, an upper lead wiring 140, and an upper pad electrode 150.

The upper transparent substrate 110 is transparent and has a plate shape. The upper transparent substrate 110 is flexible and easily deformed by external touch. Examples of the material used as the upper transparent substrate 110 may include polyethylene terephthalate (PET).

The transparent conductive film 120 is disposed on the rear surface of the upper transparent substrate 110. The transparent conductive film 120 covers most of the rear surface of the upper transparent substrate 110. The transparent conductive film 120 is transparent and a conductor.

Examples of the material used as the transparent conductive film 120 include indium tin oxide (ITO) and indium zinc oxide (IZO).

The upper connection electrode 130 directly contacts the transparent conductive film 120. The transparent conductive film 120 is connected to the upper connection electrode 130. The upper lead wiring 140 is connected to the upper connection electrode 130. In addition, the upper lead wiring 140 is connected to the upper pad electrode 150. The upper connection electrode 130, the upper lead wiring 140, and the upper pad electrode 150 are integrally formed.

The upper pad electrode 150 is connected to the connection substrate 600.

Accordingly, the transparent conductive film 120 is connected to the driving unit 700 through the upper connection electrode 130, the upper lead wiring 140, the upper pad electrode 150, and the connection substrate 600. Connected.

1 and 3, the lower substrate 200 faces the upper substrate 100. The lower substrate 200 faces the upper substrate 100 and is spaced apart from each other. The lower substrate 200 is disposed below the upper substrate 100.

The lower substrate 200 may include a lower transparent substrate 210, a resistive film 220, dummy electrodes 231 and 232, lower connection electrodes 241, 242, 243 and 244, and lower lead wires 250. And lower pad electrodes 260.

The lower transparent substrate 210 is transparent and has a plate shape. The lower transparent substrate 210 is an insulator. The lower transparent substrate 210 may be flexible or rigid. The lower transparent substrate 210 is a film substrate or a glass substrate.

The resistance film 220 is disposed on the lower transparent substrate 210. The resistive film 220 faces the transparent conductive film 120. The resistance layer 220 is spaced apart from the transparent conductive layer 120 and faces the transparent conductive layer 120. The resistive film 220 is disposed on most of the front surface of the lower transparent substrate 210.

The resistance film 220 has a rectangular shape when viewed in a plan view. The resistive film 220 has four corners and four sides.

Accordingly, the outer region of the resistive film 220 is divided into four corner regions E corresponding to the corners and intermediate regions C corresponding to the four sides, respectively. That is, the intermediate regions C are formed between the corner regions E, respectively.

The resistive film 220 is transparent and is a conductor. The resistive film 220 has a high resistance. Examples of the material used as the resistive film 220 may include indium tin oxide or indium zinc oxide.

The dummy electrodes 231 and 232 are spaced apart from each other around the resistive film 220. The dummy electrodes 231 and 232 are disposed in the outer region. In addition, the dummy electrodes may be divided into first dummy electrodes 231 disposed in the corner regions E and second dummy electrodes 232 disposed in the intermediate region.

The dummy electrodes 231 and 232 are connected to the resistive film 220. In more detail, the dummy electrodes are directly contacted with the resistance film 220.

The lower connection electrodes 241, 242, 243, and 244 are disposed in the middle regions C, respectively. The lower connection electrodes 241, 242, 243, and 244 are disposed between the second dummy electrodes 232. In more detail, the lower connection electrodes 241, 242, 243, and 244 are disposed at the centers of the sides, respectively. That is, the lower connection electrodes 241, 242, 243, and 244 are disposed between two corner regions E, and the lower connection electrodes 241, 242, 243 and 244 and two corner regions are disposed. Each distance with (E) is substantially equal to each other.

For example, the lower connection electrodes 241, 242, 243, and 244 may include a first lower connection electrode 241, a second lower connection electrode 242, a third lower connection electrode 243, and a fourth lower connection. Electrode 244. The first to fourth lower connection electrodes 244 correspond to central portions of the four sides.

In addition, the first lower connection electrode 241 and the third lower connection electrode 243 face each other, and the second lower connection electrode 242 and the fourth lower connection electrode 244 face each other.

The lower connection electrodes 241, 242, 243, and 244 are connected to the resistive film 220. In more detail, the lower connection electrodes 241, 242, 243, and 244 are directly contacted with the resistance film 220.

The lower lead wires 250 are connected to the lower connection electrodes 241, 242, 243, and 244 and the lower pad electrodes 260. That is, the lower lead wires 250 connect the lower connection electrodes 241, 242, 243, and 244 and the lower pad electrodes 260.

The lower lead wires 250 extend from the lower connection electrodes 241, 242, 243, and 244, respectively, and are connected to the lower pad electrodes 260, respectively.

The lower pad electrodes 260 are connected to the lower lead wires 250. The lower pad electrodes 260 are electrically connected to the connection substrate 600.

The lower connection electrodes 241, 242, 243, and 244, the lower lead wires 250, and the lower pad electrodes 260 are integrally formed. In addition, the dummy electrodes 231 and 232, the lower connection electrodes 241, 242, 243 and 244, the lower lead wires 250 and the lower pad electrodes 260 are formed of the same material. , Has a low resistance.

Examples of a material used as the dummy electrodes 231 and 232, the lower connection electrodes 241, 242, 243 and 244, the lower lead wires 250 and the lower pad electrodes 260 may include aluminum, Copper, tungsten, molybdenum, silver, and alloys thereof.

The spacer 300 is interposed between the upper substrate 100 and the lower substrate 200. The spacer 300 maintains a cell gap between the upper substrate 100 and the lower substrate 200.

The adhesive member 400 is interposed between the upper substrate 100 and the lower substrate 200. The adhesive member 400 is adhered to the upper substrate 100 and the lower substrate 200. The adhesive member 400 may have a shape in which part thereof is cut.

The support substrate 500 supports the lower substrate 200. The support substrate 500 is transparent and rigid. The support substrate 500 may be a glass substrate.

Alternatively, the support substrate 500 may be integrally formed with the lower transparent substrate 210.

Alternatively, the lower transparent substrate 210 is a glass substrate, and rigid, so that the touch panel according to the embodiment may not require the support substrate 500.

The connection substrate 600 is interposed between the upper substrate 100 and the lower substrate 200. The connection substrate 600 is connected to the upper pad electrode 150 and the lower pad electrodes 260. In addition, the connection substrate 600 is connected to the driving unit 700. The connection substrate 600 may be, for example, a flexible printed circuit board (FPCB).

Accordingly, the resistor layer 220 is formed through the connection substrate 600, the lower pad electrodes 260, the lower lead wires 250, and the lower connection electrodes 241, 242, 243, and 244. It is electrically connected to the driving part 700. In addition, the driving unit 700 is electrically connected to the transparent conductive film 120 through the connection substrate 600, the upper connection electrode 130, the upper lead wiring 140, and the upper pad electrode 150. Is connected.

The driver 700 applies an electrical signal such as a driving voltage to the resistive film 220 and senses the voltage at the touched position P through the transparent conductive film 120. In more detail, the driving part 700 is connected through the connection substrate 600, the lower pad electrodes 260, the lower lead wires 250, and the lower connection electrodes 241, 242, 243, and 244. In addition, a driving voltage is applied to the resistive film 220. In addition, the driving unit 700 receives the voltage at the touched position P through the connection substrate 600, the upper connection electrode 130, the upper lead wiring 140, and the upper pad electrode 150. Detect.

4 to 6, a process of detecting the position P by the touch panel according to the embodiment is as follows.

A first driving voltage V1 is applied to the first lower connection electrode 241, and a reference voltage is applied to the third lower connection electrode 243.

As a result, a voltage having a constant slope in the X-axis direction is formed in the resistance film 220. That is, the voltage of the resistive film 220 is decreased or increased with a constant slope in the X-axis direction.

Referring to FIG. 4, since the dummy electrodes 231 and 232 are spaced apart from each other, a resistor R is formed between the dummy electrodes 231 and 232. In addition, resistors R are also formed in the resistive film 220. By the resistors R, a constant voltage gradient is formed in the resistive film 220. In FIG. 4, both the first driving voltage V1 and the second driving voltage V2 are displayed, but the first driving voltage V1 and the second driving voltage V2 are alternately applied.

In this state, pressure is applied to a specific position P of the upper substrate 100 by fingers or the like from the outside. In this case, the transparent conductive layer 120 and the resistance layer 220 contact each other at the position P where the finger is touched.

The driver 700 senses the voltage Vx of the position P where the finger is touched through the transparent conductive layer 120, and senses the X coordinate of the position P where the finger is touched.

Thereafter, the driver 700 blocks the first driving voltage V1 and the reference voltage applied to the first lower connection electrode 241 and the third lower connection electrode 243, and blocks the second lower connection. The second driving voltage V2 is applied to the electrode 242, and a reference voltage is applied to the fourth lower connection electrode 244.

Thereafter, the driving unit 700 senses the voltage Vy of the position P where the finger is touched through the transparent conductive film 120, and senses the Y coordinate of the position P where the finger is touched. .

Accordingly, the touch panel according to the embodiment may receive a signal such as a touch input from the outside.

In addition, since only the resistance film 220 is disposed between the first lower connection electrode 241 and the third lower connection electrode 243, the first lower connection electrode 241 and the third lower connection electrode 243. The resistance between) is high.

Accordingly, the amount of current flowing between the first lower connection electrode 241 and the third lower connection electrode 243 is reduced. Similarly, the amount of current flowing between the second lower connection electrode 242 and the fourth lower connection electrode 244 is small. Therefore, the touch panel according to the embodiment consumes less power.

In addition, a touch with the outside is made through the upper substrate 100. Therefore, much deformation is applied to the upper substrate 100, and damage may occur to the transparent conductive layer 120. In this case, since the transparent conductive film 120 does not need to have a high resistance, the transparent conductive film 120 may be formed thick. Thus, the transparent conductive film 120 has improved durability.

In addition, electrodes for sensing are not disposed on the upper substrate 100. Therefore, even if the upper substrate 100 is damaged by touch or the like, it does not affect the performance of the touch panel according to the embodiment.

Therefore, the touch panel according to the embodiment may have improved durability and improved reliability.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is an exploded perspective view illustrating a touch panel according to an embodiment.

2 is a plan view illustrating a rear surface of an upper substrate.

3 is a plan view illustrating an upper surface of a lower substrate.

4 is a circuit diagram illustrating a touch panel according to an embodiment.

5 and 6 illustrate a process of sensing a touch signal by the touch panel according to the embodiment.

Claims (7)

A first substrate; A resistive film disposed on the first substrate; Lead wiring for supplying an electrical signal to the resistive film; A connection electrode connected to the lead wiring and connected to the resistance film; And A first electrode and a second electrode disposed in an outer region of the resistive film and connected to the resistive film, The outer region includes corner regions corresponding to each corner of the resistive film and intermediate regions between the corner regions, The first electrodes are spaced apart from each other in the corner regions, The second electrodes are disposed spaced apart from each other in the intermediate regions, The touch electrode is disposed between the second electrode. The method of claim 1, wherein the corner regions include a first corner region and a second corner region sandwiching the connection electrode, And a distance between the connection electrode and the first corner region corresponds to a distance between the connection electrode and the second corner region. The method of claim 1, wherein the corner regions are four, the middle regions are four, The connection electrode includes a first connection electrode, a second connection electrode, a third connection electrode, and a fourth connection electrode disposed in each of the intermediate regions. The method of claim 1, A second substrate opposite the first substrate; A transparent conductive film formed on the second substrate; And a spacer interposed between the first substrate and the second substrate. The method of claim 4, wherein The connection electrode includes a first connection electrode and a second connection electrode facing each other, A touch input device including a driving unit configured to apply a first voltage to the first connection electrode, apply a reference voltage to the second connection electrode, and sense a second voltage at a contact position between the transparent conductive film and the resistance film . Board; A resistive film disposed on the substrate and having a rectangular planar shape; A plurality of dummy electrodes disposed around the resistive film, spaced apart from each other, and connected to the resistive film; Four connection electrodes disposed on central portions of sides of the resistive film and connected to the resistive film; And And a driving unit configured to apply a first voltage and a reference voltage through the connection electrodes. The semiconductor device of claim 6, further comprising a transparent conductive film spaced apart from the resistive film to face the resistive film and having a shape corresponding to the resistive film. The driving unit detects a second voltage through the transparent conductive film.

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