KR101138910B1 - Mechanical press machine for semiconductor package equipped with easily changeable elastic members - Google Patents

Abstract

PURPOSE: A mechanical press machine which includes a replaceable elastic member is provided to introduce a guide pin to a mounting part of a mounting plate, thereby improving stability of the elastic member. CONSTITUTION: A mold module(10) is comprised of an upper mold member(11) and a lower mold member(13). An upper storage member(21) receives the upper mold member. A lower storage member(23) receives the lower mold member. Upper and lower stoppers(31,33) are respectively mounted on contact surfaces of the upper and lower storage members. An elastic unit(40) comprises an elastic member(43) and a mounting plate which includes a mounting part(41a).

Description

MECHANICAL PRESS MACHINE FOR SEMICONDUCTOR PACKAGE EQUIPPED WITH EASILY CHANGEABLE ELASTIC MEMBERS

The present invention relates to a mechanical press apparatus for a semiconductor package having an elastic member that is easy to replace.

More specifically, when forming or trimming a lead frame of a semiconductor package, it is possible to increase the processing precision and processing speed, and to prevent the load from being directly connected to the load of the device when an error occurs in the stopper stop function due to the dead point error. By introducing the elastic member to the holder plate for fixing to the upper plate of the press to ensure the ease of replacement of the elastic member, when replacing the mold module according to the semiconductor package type and processing work type, the elastic member is also replaced by the optimal one The present invention relates to a mechanical press apparatus for a semiconductor package that ensures durability, increases energy efficiency, and secures completeness of mold modularization.

A mechanical press apparatus for forming or trimming a semiconductor package includes Patent Registration No. 10-0259178 (registered date March 18, 2000) [Structure of fixing an upper mold to a mechanical press apparatus of a semiconductor processing apparatus].

The registered patent secures the upper mold to the mechanical press device of the semiconductor processing device to elastically fix the upper mold to the pressure plate of the press device so that the upper mold is accurately located at the bottom dead center, so that the occurrence of defects during the molding of the semi-finished product is suppressed. About structure to say,

The upper mold is elastically fixed to the press plate of the press apparatus so that the upper mold is accurately positioned at the bottom dead center, and the upper mold is fixed to the mechanical press apparatus of the semiconductor processing apparatus for more accurate bottom dead center control of the upper mold. It is proposed to provide.

However, since the patent introduces an elastic member to the upper plate of the press apparatus, in particular, the pressurized upper plate, the size and load of the upper plate are generally not easy to disassemble and assemble by manpower.

In general, an elastic member having a smaller elastic force than the force of the maximum press (for example, 5 ton / cm 2) (for a plurality of elastic members, the total sum of all elastic member elastic forces is 4.5 ton / cm 2),

It is common to manufacture and use to cope with both the press load change that varies depending on the type of semiconductor package and the type of processing operation.

Due to this, the maximum load is applied to the press apparatus at all times, which causes a lot of equipment, particularly shortening the life of the motor, and unnecessarily excessive energy consumption, thereby causing an increase in production cost.

Accordingly, the present invention is to prevent the load is directly connected to the load of the device when an error occurs in the stop function of the stopper due to the dead point error while increasing the processing precision and processing speed in forming or trimming the lead frame of the semiconductor package In the introduction of the elastic member for the press to take advantage of the mechanical press device, but to compensate for the disadvantages,

In addition, it is introduced to the holder plate for fixing to the upper plate to secure the ease of replacement of the elastic member, and to ensure the durability of the press device by replacing the elastic member with the optimum one when replacing the mold module according to the semiconductor package type and processing type. It is an object of the present invention to provide a mechanical press device for a semiconductor package, which can increase energy efficiency while increasing the life of a motor and ensure complete mold modularization.

In addition, the present invention guides the expansion and contraction of the elastic member, with the connection of the upper receiving member and the upper plate by introducing a guide pin to the settled portion of the mounting plate on which the elastic member is mounted,

It is an object of the present invention to provide a mechanical press apparatus for a semiconductor package that provides an assembly structure of a receiving member for convenience of replacement of a mold module to ensure completeness of mold modularization.

The mechanical press apparatus for a semiconductor package according to the present invention to achieve the above object is

In the mechanical press apparatus comprising an upper plate and a lower plate, for processing the lead frame of the semiconductor package,

A mold module composed of an upper mold member and a lower mold member;

An upper accommodating member accommodating the upper mold member;

A lower receiving member accommodating the lower mold member and mounted to the lower plate;

Upper and lower stoppers mounted on the contact surfaces of the upper and lower receiving members, respectively;

Elastic means including a mounting plate mounted on an upper portion of the upper accommodating member and having a settled portion, and an elastic member provided on the settled portion of the mounting plate; And

A holder plate spaced apart from the mounting plate and supported by the elastic member and having a holder coupled to the upper plate;

It is made, including.

In the mechanical press apparatus for a semiconductor package according to the present invention

It further comprises a guide pin which is arranged in the settled portion of the mounting plate to connect the mounting plate and the holder plate and guide the elastic member,

Each of the upper and lower receiving members includes a main body, both side skirts coupled to the main body, and a front and rear detachable plates coupled to the main body to detachably receive the mold module.

Some or all of the detachable plates of the upper and lower receiving members have an inwardly bent portion, and the bent portion is preferably in close contact with the upper and lower mold members.

The mechanical press device for a semiconductor package having an easily replaceable elastic member according to the present invention is introduced to the holder plate side for fixing to the upper plate to secure the ease of replacement of the elastic member to the semiconductor package type and the processing operation type. When the mold module is replaced accordingly, the elastic member is also replaced with the optimal one, thereby providing a mechanical press device for the semiconductor package that guarantees durability of the press device, increases energy efficiency, and secures the completeness of the mold modularization. In forming a frame or trimming, if an error occurs in the stopper stop function due to dead point error while increasing the processing precision and processing speed, an elastic member is introduced into the press to prevent the load from being directly connected to the load of the device. Taking advantage of the mechanical press There even as kinks can talk perfectly.

In addition, the mechanical press apparatus for a semiconductor package having an easily replaceable elastic member according to the present invention introduces a guide pin to a settled portion of a mounting plate on which an elastic member is placed, thereby connecting the upper accommodating member to the upper plate, thereby providing elasticity. In addition to guiding the stable stretching of the member, it is possible to provide an assembly structure of the receiving member for the convenience of replacement of the mold module.

1 is a front view of a mechanical press apparatus for a semiconductor package according to the present invention.
Figure 2 is a side view of the mechanical press apparatus for a semiconductor package according to the present invention.
3 is an overall front view of a mechanical press apparatus for a semiconductor package according to the present invention.
4 and 5 are enlarged views of main parts of FIG.
6 is an operational state diagram when the elastic means in the present invention functions.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

The present invention may be modified in various ways and may have various forms, and thus embodiments (or embodiments) will be described in detail in the text. However, this is not intended to limit the present invention to the specific form disclosed, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In each of the drawings, the same reference numerals, in particular, the tens and ones digits, or the same digits, tens, ones, and alphabets refer to members having the same or similar functions, and unless otherwise specified, each member in the figures The member referred to by the reference numeral may be regarded as a member conforming to these criteria.

In addition, in the drawings, the components are exaggerated in size (or thickness), in size (or thickness), in size (or thickness), or in a simplified form or simplified in view of convenience of understanding. It should not be.

The terminology used herein is for the purpose of describing particular embodiments (suns, aspects, and embodiments) (or embodiments) only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms “comprises” or “consists” are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.
In describing the mechanical press apparatus A for a semiconductor package having an easily replaceable elastic member according to the present invention, for the sake of convenience, a non-strict approximate direction reference is specified with reference to FIGS. 1 and 2.
In the state as shown in FIG. 1, which is a front view, the direction is also specified according to this criterion in the detailed description of the invention and the claims related to other drawings including FIG.

Mechanical press device (A) for a semiconductor package having an easily replaceable elastic member according to the present invention can be seen from the front view of Figure 1 and the side view of Figure 2 and the overall front view and the main portion enlarged view of FIGS. As can be seen, the mold module 10, the receiving member 20 for detachably accommodating the mold module, the stopper 30 for limiting the limit value (dead center) of the upper and lower mold members, the press receiving device 21 The holder plate 50 is fixed to the upper plate (A1) of the elastic and is provided spaced apart from the holder plate is connected to the upper receiving member and the holder plate and includes an elastic plate (43) containing a mounting plate (41) And means 40.

The lower plate A2 is arranged below the lower receiving member 20 of the receiving member 20, and the driving means A3 is arranged below the lower plate A2, and the upper and lower plates and the driving means A3. ), The racks are connected to the guide pillars, and in particular, four guide pillars are arranged at four corners of the longitudinal plate and the four racks.

In addition, the driving means (A4) can be implemented as a cam in particular in accordance with the mechanical press device (A), the force of the cam is to move the lower plate (A2) directly, or connected by a chain or the like to the upper plate (A1) Can move,

The force of the upper and lower plates A1 and A2 is moved along the guide pillar A3 to the receiving member 20 and the mold module 10 to process the lead frame of the semiconductor package provided in the mold module. ) And trimming.

The member movable as needed may be both upper and lower plates.

The mold module 10 includes upper and lower mold members 11 and 13 including upper and lower molds M1 and M2 and upper and lower mold plates 11A and 13A on which each bracket is mounted. .

It is replaced according to the type and processing of semiconductor package, so that the modularity of mold can be achieved through complete detachability and can contribute to productivity and processing quality.

As can be seen in FIG. 1, the stepped portion 11a of the upper mold plate 11A slides on the guide jaw 21b of the skirt 21B provided on both sides of the main body 21A of the upper accommodating member 21. Fitted,

As can be seen in Figure 2, the stepped portion (13a) of the lower mold plate (13A) is a mold module accommodated inside the removable plate 23C provided on the front and rear surfaces of the main body (23A) of the lower receiving member (23). Sliding is mounted on the inward bent portion (23c) formed by bending toward the (10), cross-fixed in a diagonal direction to each other, the ease of replacement of the mold module 10 together with the removable plates 21C, 23C and firmness of the fixed state It is supposed to secure.

The accommodating member 20 includes an upper accommodating member 21 accommodating the upper mold member 11 and a lower accommodating member 23 accommodating the lower mold member 13 and mounted on the lower plate. Is done.

In addition, the upper and lower receiving members 21 and 23 are respectively main body 21A and 23A, both side skirts 21B and 23B coupled to the main body, and front and rear detachable plates coupled to the main body ( It comprises 21C) (23) C, and accommodates the mold module 10 detachably.

In addition, some or all of the detachable plates 21C and 23C of the upper and lower receiving members 21 and 23 are provided with inward bending portions 21c and 23c (see Fig. 2),

The inwardly bent portions 21c and 23c formed by bending toward the mold module 10 accommodated therein are in close contact with the upper and lower mold members, in particular the mold plates 11A and 13A.

In particular, as described above, the stepped portions 11a and 13a of each of both side surfaces and the front and rear surfaces of the upper and lower mold plates 11A and 13A are respectively referred to as guide jaws 21b (see FIG. 1) of the skirt 21B. Slidingly coupled to the inward bent portion 23c (see Fig. 2) of the detachable plate 23C, respectively, are cross mounted,

Each of the front and rear and both side portions of the upper and lower mold plates 11A and 13A is closely contacted by the inward bent portion 21c (see FIG. 2) and the skirt 23B (see FIG. 1) of the detachable plate 21C, respectively. Is fixed

Both the ease of replacement and the stability of the mounting state after completion of replacement can be ensured.

In addition, the stopper 30, as shown in Figure 1, is provided on each of the contact surface of the upper and lower receiving members (21, 23), in particular on both sides of the contact surface to limit the dead point of the press apparatus.

Next, as shown in Figs. 1 and 2 and Figs. 4 to 6 (in Fig. 3 to Fig. 6, the elastic means 40, in particular the elastic member 43 is shown in perspective view), the present invention One of the core of the elastic means 40 includes a mounting plate 41 mounted on top of the upper receiving member 21 and having a settled portion, the mounting plate is the first and the Second mounting plates 41A and 41B,

Settlement part 41a is provided in 41A of 1st mounting plates.

An elastic member, in particular a coil spring type elastic member 43, is mounted to this settling portion. A plurality of elastic members are provided, and the settled portion has a corresponding number.

In addition, the elastic means is arranged in the mounting portion (41a) of the mounting plate to connect the mounting plate 41 and the holder plate 50, and is inserted into the coil spring type elastic member 43 is inserted into the elastic member It further comprises a guide pin 45 for guiding.

The holder plate 50 is spaced apart from the mounting plate 41, and is supported upward by the elastic member 43, and has a holder, in particular a shank type holder 53, the holder having a number ( It can be slidingly coupled to the holding plate A1a (see FIG. 4) of the upper plate A1 which serves as a member and serves as a female member.

The holder plate 50 has a structure of an insertion hole 51 having a stepped portion on which the head of the guide pin 45 is seated. The lower end of the guide pin 45 has a threaded portion, and the threaded portion is a mounting plate, in particular a second The structure is screwed to the mounting plate (41B),

Through this, the second mounting plate 41B, the first mounting plate 41A, the elastic member 43, and the holder plate 50 may be connected to each other.

On the other hand, the separation plate (G) is formed between the holder plate 50 and the first mounting plate (41A), due to the dead point error inevitably generated in the mechanical press device

When the press operates continuously despite the stopper 31 and 33 contacting each other during the processing (forming and trimming, etc.)

As the elastic member 43 of the elastic means 40 is compressed from FIG. 5 to FIG. 6, the spaced part is changed (narrowed) from 'G' to 'G0' to relieve the pressing force, which causes an excessive force on the device. It can function to prevent the occurrence of.

In particular, when the elastic means is conventionally introduced into the upper plate, it is difficult to disassemble and assemble by simply manpower, and thus requires a separate forklift and other mechanisms. Therefore, the elastic force is slightly smaller than the maximum press force (for example, 5 ton / ㎠). Elastic members (in the case of a plurality of elastic members, total elastic force of all the elastic members, for example, 4.5 ton / ㎠) to cope with both the press load changes that vary depending on the type of semiconductor package and processing operation In the case of manufacturing, since the press device is always subjected to the maximum load, the equipment becomes too much, and the energy consumption is unnecessarily excessive, resulting in an increase in the production cost.

In contrast, in the present invention, the elastic plate is separately introduced between the holder plate 50 and the mounting plate 41 so that the holder plate 50 is naturally replaced in the process of replacing the mold module 10 according to the object to be processed. It is possible to easily replace and use the elastic member 43 corresponding to the press force applied to the machining work by separating from the holding plate (A1a) of the), thereby minimizing the load on the press device and reducing energy waste. The benefits can also be improved.

In the above description, the general known structures related to the specific operation structure of the mechanical press apparatus for semiconductor packages such as the upper plate, the space between the mounting plate and the holder plate, the individual elastic force and the total elastic force of the elastic member, etc. are omitted, but those skilled in the art can easily Can guess, reason, and reproduce.

In addition, in the above description of the present invention, the press apparatus having a specific shape and structure has been described with reference to the accompanying drawings. However, the present invention can be variously modified, changed, and replaced by those skilled in the art. It should be interpreted as falling within the protection scope of the present invention.

A: Press device A1, A2: Upper, lower plate
10: mold module 11, 13: upper, lower mold member
11A, 13A: Upper and Lower Mold Plates
20, 21, 23: housing members 21A, 23A: main body
21B, 23B: Skirt 21C, 23C: Detachable plate
30, 31, 33: stopper 40: elastic means
41, 41A, 41B: Mounting plate 43: Elastic member
45: guide pin 50: holder plate
53: holder G: separation

Claims (4)

In the mechanical press apparatus comprising an upper plate (A1) and a lower plate (A2), for processing the lead frame of the semiconductor package,
A mold module 10 composed of an upper mold member 11 and a lower mold member 13;
An upper accommodating member 21 accommodating the upper mold member 11;
A lower accommodating member 23 accommodating the lower mold member 13 and mounted on the lower plate A2;
Upper and lower stoppers 31 and 33 mounted on the contact surfaces of the upper and lower receiving members 21 and 23, respectively;
A mounting plate 41 mounted on the upper accommodating member 21 and having a settling portion 41a, and an elastic member 43 provided at the settling portion 41a of the mounting plate 41; Elastic means 40 made up; And
A holder plate 50 spaced apart from the mounting plate 41 and supported upward by the elastic member 43, and having a holder 53 coupled to the upper plate A1.

The elastic means 40 further includes a guide pin 45 arranged on the settlement portion 41a of the mounting plate 41,
The head of the guide pin 45 is seated on the step of the holder plate 50 insertion hole 51, the screw portion of the lower end of the guide pin 45 is screwed to the mounting plate 41, the mounting plate 41 And the holder plate 50, and the guide pin is inserted into the coil spring type elastic member 43 to guide the elastic member.

The upper and lower receiving members 21 and 23 are respectively coupled to the main body 21A and 23A, both side skirts 21B and 23B coupled to the main body, and the main body 21A and 23A. It comprises a front and rear detachable plate (21C) (23C), to receive the mold module 10 detachably,

Some or all of the detachable plates 21C and 23C of the upper and lower receiving members 21 and 23 are provided with inwardly bent portions 21c and 23c that are bent toward the mold module 10 accommodated therein. Doing

The upper and lower mold members 11 and 13 of the mold module 10 include upper and lower metal fittings M1 and M2 and upper and lower mold plates 11A and 13A on which the respective metal fittings are mounted, respectively. The stepped portions 11a are formed on both side surfaces of the upper mold plate 11A, and the stepped portions 13a are formed on the front and rear surfaces of the lower mold plate 13A.

Both side stepped portions 11a of the upper mold plate 11A are slidably coupled to the guide jaws 21b of the skirt 21B of the upper accommodating member 21.
The front and rear stepped portions 13a of the lower mold plate 13A are slidingly coupled to the inward bent portion 23c of the lower receiving member 23 and the removable plate 23C.
Each of the front and rear and both side portions of the upper and lower mold plates 11A and 13A is tightly fixed by the inward bent portion 21c and the skirt 23B of the detachable plate 21C, respectively. Mechanical presses. The method of claim 1,
The mounting plate 41 includes first and second mounting plates 41A and 41B. The mounting plate 41A is formed on the first mounting plate 41A, and the second mounting plate 41A is provided. 41B has a structure in which the lower threaded portion of the guide pin 45 is screwed,
A gap G is formed between the holder plate 50 and the first mounting plate 41A, so that the stoppers 31 and 33 are removed during the machining process due to the dead point error inevitably generated by the mechanical press apparatus. In spite of being in contact with each other, when a press is continuously operated and a force is applied, the spaced portion is changed from 'G' to 'G0' as the elastic member 43 of the elastic means 40 is compressed, thereby causing A mechanical press device for a semiconductor package, characterized in that to release the pressing force.
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