KR101135631B1 - Manufacturing method of light-weight grounding plate - Google Patents

Manufacturing method of light-weight grounding plate Download PDF

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KR101135631B1
KR101135631B1 KR1020110131802A KR20110131802A KR101135631B1 KR 101135631 B1 KR101135631 B1 KR 101135631B1 KR 1020110131802 A KR1020110131802 A KR 1020110131802A KR 20110131802 A KR20110131802 A KR 20110131802A KR 101135631 B1 KR101135631 B1 KR 101135631B1
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South Korea
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conductive
ground plate
weight
lightweight
iron
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KR1020110131802A
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Korean (ko)
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안상욱
박동철
양완희
박재범
허정
이정우
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주식회사 인트켐
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B18/00Use of agglomerated or waste materials or refuse as fillers for mortars, concrete or artificial stone; Treatment of agglomerated or waste materials or refuse, specially adapted to enhance their filling properties in mortars, concrete or artificial stone
    • C04B18/02Agglomerated materials, e.g. artificial aggregates
    • C04B18/027Lightweight materials
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B20/00Use of materials as fillers for mortars, concrete or artificial stone according to more than one of groups C04B14/00 - C04B18/00 and characterised by shape or grain distribution; Treatment of materials according to more than one of the groups C04B14/00 - C04B18/00 specially adapted to enhance their filling properties in mortars, concrete or artificial stone; Expanding or defibrillating materials
    • C04B20/02Treatment
    • C04B20/023Chemical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/66Connections with the terrestrial mass, e.g. earth plate, earth pin

Abstract

PURPOSE: A method for manufacturing a light weighted conductive ground rod is provided to effectively prevent the corrosion of an iron subsidiary material. CONSTITUTION: A conductive concrete is mixed to a conductive coating light weighted aggregate. An iron subsidiary material is coated with the conductive concrete and is solidified. The iron subsidiary material is formed into a board shape. The iron subsidiary material is sprayed with a conductive silane coupling rust preventive. A light weighted aggregate for manufacturing the conductive coating light weighted aggregate is an artificial light weighted aggregate manufactured by one or more of bottom ash, sewage sludge, cold rolled mill sludge, silicon dioxide flour, and clay.

Description

경량 도전성 접지판의 제작방법{Manufacturing Method of Light-Weight Grounding Plate}Manufacturing Method of Light-Weight Grounding Plate

본 발명은 경량 도전성 접지판의 제작방법에 관한 것으로, 더욱 상세하게는 종래 도전성 접지판보다 우수한 강도특성과 접지특성은 물론 철부자재의 부식방지특성까지 확보하고 더불어 경량성도 확보할 수 있는 접지판의 제작방법에 관한 것이다.
The present invention relates to a method for manufacturing a lightweight conductive ground plate, and more particularly, to the strength and grounding characteristics of the conventional conductive ground plate, as well as to secure the corrosion resistance of the iron and other materials, and also of the ground plate that can secure the lightweight It is about a manufacturing method.

전기 및 전자기기에는 고장전류와 낙뢰로 인해 고전압의 전류가 유입되어 기기가 파손되는 것을 방지하기 위해 접지시스템이 필요하다. 접지시스템은 지하에 접지부재를 매설한 후 전자기기에 연결하여 방전하는 형태를 가지는데, 통상 접지부재는 도전성 콘크리트와 철부자재를 이용하여 판(plate) 또는 봉(rod) 형태로 접지부재 간 연결이 용이하도록 제작된다.Electrical and electronic devices require a grounding system to prevent damage to the equipment due to high voltage currents caused by fault currents and lightning strikes. The grounding system has a form in which a grounding member is buried underground and connected to an electronic device to discharge it. In general, the grounding member is connected between the grounding members in the form of a plate or rod using conductive concrete and ferrous materials. This is made to facilitate.

접지부재는 시멘트, 무기충전제, 반응조정제, 도전성 탄소섬유 등이 혼합된 도전성 콘크리트를 사용하여 철부자재가 내장된 형태로 성형하여 제작한다. 도 1은 판 형태로 제작된 접지판의 예로서, 내부에 접지연결봉이 관통 배치되고 접지연결봉 양단부에 접속나사가 마련되도록 제작된 예인데, 접속나사에는 어댑터가 접속되어 다른 접지판 내지 접지봉이 연결될 수 있다.The grounding member is manufactured by forming a form in which iron parts are embedded using conductive concrete mixed with cement, an inorganic filler, a reaction regulator, and conductive carbon fibers. 1 is an example of a ground plate manufactured in the form of a plate, the ground connecting rod is disposed inside and the connection screw is provided on both ends of the ground connecting rod, the adapter is connected to the connection screw is connected to the other ground plate to the ground rod Can be.

그런데 종래 도전성 콘크리트로 제작된 도전성 접지판은 방전효과는 우수하나, 무겁다는 단점이 지적되어 왔다. 접지판이 무거우면 접지판을 여러 개 연결하는 경우 작업이 용이하지 않아 공사기간이 지연되기 쉽고, 또한 인건비 증가에 따라 공사비용이 늘어나 경제성이 떨어진다. 위와 같은 문제를 개선하기 위해 경량골재의 사용을 고려할 수 있다. 하지만 경량골재는 흡수성이 커서 콘크리트 배합과정에서 물의 혼합량을 증가시키므로 최종 콘크리트 경화체의 강도특성이 저하되기 쉬우며, 그 결과 종래에는 접지판 제조에 경량골재를 사용하지 못해왔다.By the way, the conductive ground plate made of a conventional conductive concrete has been pointed out that the discharge effect is excellent, but heavy. If the ground plate is heavy, it is not easy to connect several ground plates, so the construction period is easy to be delayed. In order to improve the above problems, the use of lightweight aggregate can be considered. However, the light weight aggregate has a high absorbency, which increases the amount of water mixed in the concrete mixing process, so that the strength characteristics of the final concrete hardened body are easily degraded. As a result, the light aggregate has not been conventionally used for manufacturing a ground plane.

또한 종래 접지판은 내장된 철부자재가 시간이 지나면서 부식하여 팽창크랙이 쉽게 발생하였으며, 철부자재의 부식은 도전성 콘크리트의 탈락과 전기저항의 증가 문제로 이어진다. 이에 따라 종래에는 철부자재의 부식방지를 위해 접지판 성형 전에 철부자재에 방청제를 직접 도포하여 철부자재에 방청특성을 부여하거나 또는 접지판 성형 후에 접지판 표면에 방청제를 도포하여 콘크리트 표면의 미세기공에 발수특성을 부여하여 수분입자가 콘크리트 내부에 침투하지 못하도록 하고자 하였다. 하지만 방청제로 인해 철부자재와 도전성 콘크리트 간의 부착력 저하로 접지판의 물리성능 감소하거나, 도전성이 낮은 방청제를 철부자재에 도포함으로써 도전성 콘크리트와 철부자재간의 전기저항이 증가하는 문제가 나타나며, 접지판 표면에 방청제를 도포하는 방식은 도포된 접지판의 콘크리트 표면에 균열, 파손이 일어날 경우 노출된 철부자재가 부식하는 문제가 발생하기 때문에 적용하지 못해 왔다.
In addition, the conventional ground plate has a built-in iron sub-materials to corrode over time to cause expansion cracks easily, corrosion of the iron sub-materials leads to problems of dropping of conductive concrete and increase of electrical resistance. Accordingly, in order to prevent corrosion of the iron subsidiary materials, the anti-corrosive agent is directly applied to the iron subsidiary materials before forming the grounding plate to give anti-corrosive properties to the iron subsidiary materials, or after application of the anti-corrosive agent to the surface of the grounding plate after forming the grounding plate, The water-repellent properties were intended to prevent moisture particles from penetrating the concrete. However, due to the deterioration of adhesion between the iron subsidiary material and the conductive concrete due to the rust preventive agent, the physical performance of the ground plate is reduced or the electrical resistance between the conductive concrete and the iron subsidiary material increases by applying a low conductivity anticorrosive agent to the iron sub material. The method of applying the rust preventive agent has not been applied because of the problem of corrosion of the exposed iron parts when the crack or breakage occurs on the concrete surface of the applied ground plate.

본 발명은 종래 접지판의 무거운 중량 문제와 접지판에 내장된 철부자재의 부식 문제를 개선하고자 개발된 것으로서, 다음과 같은 기술적 과제를 갖는다.The present invention was developed to improve the problem of heavy weight of the conventional ground plate and the corrosion of the iron sub-material embedded in the ground plate, has the following technical problems.

첫째, 기존 접지판보다 강도특성 내지 접지특성은 우수하면서도 중량은 줄일 수 있는 새로운 도전성 접지판의 제조방법을 제공하고자 한다.First, it is to provide a new method of manufacturing a conductive ground plate that can be reduced in weight and superior in strength characteristics or ground characteristics than the existing ground plate.

둘째, 접지판에 내장된 접지연결봉 등 철부자재의 부식을 효과적으로 억제할 수 있는 접지판의 제작방법을 제공하고자 한다.Second, to provide a manufacturing method of the ground plate that can effectively suppress the corrosion of the iron sub-materials, such as the ground connecting rod embedded in the ground plate.

셋째, 산업부산물을 이용한 인공경량골재를 바람직하게 사용하여 접지판의 제조비용을 절감하고 산업부산물의 재활용에 따른 친환경성을 추구하고자 한다.
Third, the artificial lightweight aggregate using industrial by-products is preferably used to reduce the manufacturing cost of the ground plate and pursue eco-friendliness by recycling industrial by-products.

상기한 기술적 과제를 해결하기 위해 본 발명은, 경량골재를 도전성 하이드로졸 용액으로 도포 또는 침지하여 제조한 도전성 코팅경량골재로 도전성 콘크리트를 배합하고, 도전성 실란결합 방청제가 도포된 철부자재를 상기 도전성 콘크리트로 피복 고형시켜 판형으로 성형 제작하는 것을 특징으로 하는 경량 도전성 접지판의 제작방법을 제공한다.In order to solve the above technical problem, the present invention, the conductive concrete is mixed with a light weight aggregate prepared by applying or immersing a lightweight aggregate in a conductive hydrosol solution, and the iron submaterial coated with a conductive silane-bonding rust preventive agent is applied to the conductive concrete. The present invention provides a method for manufacturing a lightweight conductive ground plate, characterized in that the coating is solidified to form a plate.

여기서 도전성 코팅경량골재는, 바텀애시, 하수오니 슬러지, 냉연열연 슬러지, 석분, 점토 등에 의해 제조된 인공경량골재를, (CH2CHOH)n 분자구조에 중합도가 500~2,000이면서 고형분이 15~25%인 CNT 분산 도전성 하이드로졸 용액으로 도포 또는 침지하여, 도포두께 5㎛ 이상, 표면저항 1,000Ω/sq 이하로 제조한 것을 이용하는 것이 바람직하다. 또한 도전성 콘크리트는, 보통 포틀랜드 시멘트 19~74중량%, 무기충전제 5~9중량%, 세골재 5~12중량%, 도전성 코팅경량골재 11~45중량%, 도전성 탄소섬유 0.1~4.0중량%, 반응조정제 4.4~9.5중량%, 분산제와 유동화제 중 하나 이상의 첨가제 0.5~1.5중량%를 포함하여 조성되는 분체;와, 상기 분체에 대하여 30~45중량%의 물;로 배합하는 것이 바람직하다. The conductive coating lightweight aggregate is an artificial lightweight aggregate manufactured by bottom ash, sewage sludge sludge, cold rolled hot sludge, stone powder, clay, etc., and has a degree of polymerization of 500 to 2,000 in the molecular structure of (CH 2 CHOH) n and a solid content of 15 to 25. It is preferable to apply | coat or immerse with CNT dispersion conductive hydrosol solution which is%, and what was manufactured with the coating thickness of 5 micrometers or more and surface resistance of 1,000 Pa / sq or less. In addition, the conductive concrete is usually 19 to 74% by weight of Portland cement, 5 to 9% by weight of inorganic filler, 5 to 12% by weight of fine aggregate, 11 to 45% by weight of conductive coating lightweight aggregate, 0.1 to 4.0% by weight of conductive carbon fiber, reaction modifier It is preferable to mix | blend 4.4-9.5 weight%, the powder which consists of 0.5-1.5 weight% of additives of at least one of a dispersing agent and a fluidizing agent; and 30-45 weight% of water with respect to the said powder.

더불어 철부자재에 도포하기 위한 도전성 실란결합 방청제는, 헥사메틸디실라젠(Hexamethyldisilazane), N-2아미노에틸3-아미노프로필트리메톡시실란(N-2(aminoethyl)3-amonipropyltrimethoxysilane), 3-아미노프로필트리에톡시실란(3-aminopropyltriethoxysilane) 중에서 선택된 하나 이상의 실란을 물에 중량비로 5~30% 혼합 가수분해 후 고형분 0.5~5%, 입자 크기 20~60㎚의 구리콜로이드가 분산 함유되어 있는 아세트산 용액을 투입하여 pH가 6.5~7.5가 되도록 제조한 것을 이용하는 것이 바람직하다. 한편 도전성 실란결합 방청제는 도포두께 10㎛ 이상, 표면저항 2,000Ω/sq 이하를 가지도록 철부자재에 도포하는 것이 바람직하다.
In addition, the conductive silane-bonding rust inhibitor for applying to iron subsidiary materials is hexamethyldisilazane, N-2aminoethyl3-aminopropyltrimethoxysilane (N-2 (aminoethyl) 3-amonipropyltrimethoxysilane), 3-amino One or more silanes selected from 3-aminopropyltriethoxysilane were mixed with 5-30% hydrolysis in water by weight, followed by acetic acid solution containing 0.5-5% solids and 20-60 nm copper colloid dispersed. It is preferable to use the one prepared so that the pH is 6.5 ~ 7.5. On the other hand, it is preferable to apply | coat an electroconductive silane anticorrosive agent to an iron submaterial so that it may have a coating thickness of 10 micrometers or more and surface resistance of 2,000 kPa / sq or less.

본 발명에 따르면 다음과 같은 효과를 기대할 수 있다.According to the present invention, the following effects can be expected.

첫째, 접지판 제작에서 도전성 콘크리트를 배합할 때 도전성 코팅경량골재를 이용한 결과, 요구하는 소정의 강도특성과 접지특성을 모두 만족시킬 수 있는 경량성의 접지판을 유리하게 제작할 수 있다. 이로써 접지판의 경량화가 가능해져 관련 공사에서 작업성 향상과 공기단축에 기한 공사비용 절감을 이끌 수 있다.First, as a result of using the conductive coating lightweight aggregate when compounding the conductive concrete in the manufacture of the ground plate, it is possible to advantageously produce a lightweight ground plate that can satisfy both the desired strength characteristics and the grounding characteristics. This makes it possible to reduce the weight of the ground plate, leading to improved workability and reduced construction costs due to air shortages in related works.

둘째, 접지판 제작에서 도전성 실란결합 방청제를 철부자재에 도포하기 때문에, 철부자재의 부식방지에 효과적이고 또한 철부자재와 도전성 콘크리트간의 부착력을 유지하면서 철부자재와 도전성 콘크리트 접촉면에서 우수한 전도성을 가지는 접지판으로 제작할 수 있으며, 그 결과 전기적 특성이 효과적으로 유지되는 접지판을 제공할 수 있다. 특히 종래에 방청제 적용시 문제가 되는 철부자재와 도전성 콘크리트 간의 부착력 저하와 낮은 전기적 특성으로 인한 접지판의 전기적 특성 저하 문제를 해결할 수 있다.Second, since the conductive silane coupling rust preventive is applied to the iron sub-materials in the manufacture of the ground plate, it is effective in preventing corrosion of the iron sub-materials and maintains the adhesion between the iron sub-materials and the conductive concrete while maintaining the adhesion between the iron sub-materials and the conductive concrete. It can be manufactured as a result, it can provide a ground plate that effectively maintains the electrical properties. In particular, it is possible to solve the problem of deterioration of the electrical properties of the ground plate due to the deterioration of the adhesion between the iron subsidiary material and the conductive concrete and low electrical properties, which is a problem when applying the rust preventive agent.

셋째, 산업부산물로 제조된 인공경량골재를 유리하게 이용할 수 있기 때문에 산업부산물의 고부가가치화를 통해 경제성 향상은 물론 친환경성을 도모할 수 있다.
Third, since the artificial light weight aggregate made of industrial by-products can be advantageously used, it is possible to improve economics and environment-friendly through high value-added industrial by-products.

도 1은 종래 접지판에 대한 사진이다.
도 2는 본 발명에서 바람직하게 이용하는 도전성 코팅경량골재의 모식도이다.
도 3은 본 발명에 따른 접지판의 제작과정에서 철부자재에 도전성 실란결합 방청제가 도포된 상태의 모식도이다.
도 4는 본 발명에서 바람직하게 제안하는 접지판에 대한 평단면도이다.
1 is a photograph of a conventional ground plate.
Figure 2 is a schematic diagram of the conductive coating lightweight aggregate preferably used in the present invention.
Figure 3 is a schematic diagram of a state in which a conductive silane coupling rust inhibitor is applied to the iron subsidiary material in the manufacturing process of the ground plate according to the present invention.
Figure 4 is a plan cross-sectional view of the ground plate preferably proposed in the present invention.

본 발명은 접지판 제작을 위한 도전성 콘크리트 배합에서 골재로 도전성 코팅경량골재를 이용한다는데 특징이 있다. 여기서 도전성 코팅경량골재는 경량골재를 도전성 하이드로졸 용액으로 도포 또는 침지하여 제조함으로써 도 2에서와 같이 경량골재 표면에 코팅막이 형성된 것인데, 바람직하게는 바텀애시, 하수오니 슬러지, 냉연열연 슬러지, 석분, 점토 등으로 제조한 인공경량골재를 (CH2CHOH)n 분자구조에 중합도가 500~2,000이면서 고형분이 15~25%인 CNT 분산 도전성 하이드로졸 용액으로 도포 또는 침지하여 도포두께 5㎛ 이상, 표면저항 1,000Ω/sq 이하로 제조한 것이다. 이와 같은 도전성 코팅경량골재는 코팅막에 의해 수분흡수성이 제어되는 한편 도전성이 부여되기 때문에 접지판 제작에서 유리하게 이용할 수 있으며, 특히 접지판 제작을 위한 도전성 콘크리트의 배합에서 도전성을 위해 사용되는 탄소섬유의 혼합량을 줄일 수 있다.The present invention is characterized by the use of conductive coating lightweight aggregate as aggregate in the conductive concrete formulation for manufacturing the ground plate. Here, the conductive coating lightweight aggregate is formed by coating or immersing the lightweight aggregate in a conductive hydrosol solution to form a coating film on the surface of the lightweight aggregate, as shown in FIG. 2, preferably bottom ash, sewage sludge, cold rolled hot sludge, stone powder, Artificial lightweight aggregates made of clay are coated or immersed in a (CH 2 CHOH) n molecular structure with a CNT dispersed conductive hydrosol solution having a polymerization degree of 500 to 2,000 and a solid content of 15 to 25%. It is manufactured at 1,000 mW / sq or less. Such conductive coating lightweight aggregate can be advantageously used in the manufacture of the ground plate because the water absorption is controlled by the coating film and the conductivity is provided, and in particular, the carbon fiber used for the conductive in the mixing of the conductive concrete for the ground plate production The mixing amount can be reduced.

더불어 본 발명은 도 3에서와 같이 접지판에 내장되는 철부자재(접지연결봉, 접속나사 등)를 도전성 실란결합 방청제로 도포한다는데 특징이 있다. 부착력이 우수하고 도전성을 가지는 도전성 실란결합 방청제로 도포함으로써 철부자재의 부식방지 뿐만 아니라 철부자재와 도전성 콘크리트간의 우수한 전기적 특성과 부착력이 유지되도록 한 것이다.In addition, the present invention is characterized in that the iron subsidiary materials (ground connecting rod, connecting screw, etc.) embedded in the ground plate is coated with a conductive silane coupling rust inhibitor. It is applied to the conductive silane-bonded rust preventive agent with excellent adhesion and conductivity to maintain the excellent electrical properties and adhesion between the iron subsidiary materials and the conductive concrete as well as preventing corrosion of the iron subsidiary materials.

이와 같이 본 발명은 경량골재를 도전성 하이드로졸 용액으로 도포 또는 침지하여 제조한 도전성 코팅경량골재로 도전성 콘크리트를 배합하고 도전성 실란결합 방청제가 도포된 철부자재를 상기 도전성 콘크리트로 피복 고형시켜 판형의 접지판으로 성형 제작한 결과, 종래 접지판보다 우수한 강도특성과 접지특성은 물론 철부자재의 부식방지특성까지 확보할 수 있고 더불어 경량성도 확보할 수 있게 되었다.As described above, the present invention mixes conductive concrete with a conductive coated lightweight aggregate prepared by applying or dipping a lightweight aggregate with a conductive hydrosol solution, and solidifies the iron subsidiary material coated with the conductive silane coupling rust inhibitor with the conductive concrete to form a plate-like ground plate. As a result of the molding production, it is possible to secure the strength and grounding properties of the conventional ground plate as well as to prevent corrosion of the iron subsidiary materials, and also to secure the light weight.

한편 본 발명은 바람직한 접지판의 형태로 도 4와 같은 접지판(10)을 제안한다. 도 4는 접지판의 평단면도인데, 콘크리트 본체(11) 내부에 접지연결봉(12)이 양단부에 제1접속나사(13)가 장착된 채 수평으로 관통 매설되고 동시에 금속망(15)이 접지연결봉(12)에 접촉 배치되면서 수평으로 매설되고 아울러 가운데에 제2접속나사(14)가 수직으로 관통 매설된 형태이다. 제1,2접속나사(13, 14)에는 어댑터 등을 이용하여 전기기기가 연결 장치될 수 있음은 물론 다른 접지판 내지 접지봉이 직렬, 병렬로 연결 장치될 수 있다. 금속망(15)은 접지판의 강도 보강과 더불어 접지 효과를 향상시키는 역할을 하며, 익스펜디드 메탈, 금속타공판 등이면 적당하다. 도 4에서는 접지연결봉(12) 아래에 금속타공판 형태의 금속망(15)이 접합된 채 도전성 콘크리트에 매설된 것을 확인할 수 있다.
Meanwhile, the present invention proposes a ground plate 10 as shown in FIG. 4 in the form of a preferred ground plate. 4 is a cross-sectional plan view of the ground plate, in which the ground connecting rod 12 is embedded in the concrete body 11 and horizontally buried with both ends of the first connecting screw 13 mounted thereon, and at the same time, the metal mesh 15 is connected to the ground connecting rod. It is a form in which it is horizontally buried while contact arrangement (12) is carried out, and the 2nd connection screw 14 is penetrated vertically in the center. The first and second connection screws 13 and 14 may be connected to an electric device by using an adapter or the like, and other ground plates or ground rods may be connected in series and in parallel. The metal mesh 15 serves to enhance the grounding effect and reinforce the strength of the ground plate, and is suitable as long as an expanded metal, a metal perforated plate, or the like. In FIG. 4, it can be seen that the metal mesh 15 in the form of a metal perforated plate is embedded in the conductive concrete under the ground connecting rod 12.

아울러 본 발명은 접지판의 제작을 위한 바람직한 도전성 콘크리트의 배합을 제안한다. 보통 포틀랜드 시멘트 19~74중량%, 무기충전제 5~9중량%, 세골재 5~12중량%, 도전성 코팅경량골재 11~45중량%, 도전성 탄소섬유 0.1~4.0중량%, 반응조정제 4.4~9.5중량%, 분산제와 유동화제 중 하나 이상의 첨가제 0.5~1.5중량%를 포함하여 조성되는 분체;와, 상기 분체에 대하여 30~45중량%의 물;을 포함하여 배합하는 것이다. 분체는 프리믹스로 미리 혼합하여 준비할 수 있다.In addition, the present invention proposes a compounding of the preferred conductive concrete for the manufacture of the ground plate. Common Portland Cement 19 ~ 74%, Inorganic Filler 5 ~ 9%, Fine Aggregate 5 ~ 12%, Conductive Coating Lightweight Aggregate 11 ~ 45%, Conductive Carbon Fiber 0.1 ~ 4.0%, Reaction Regulator 4.4 ~ 9.5% Powder comprising 0.5 to 1.5% by weight of an additive of at least one of a dispersant and a fluidizing agent; and 30 to 45% by weight of water with respect to the powder. The powder can be prepared by mixing in advance with the premix.

보통 포틀랜드 시멘트는 결합재가 되는 것인데, 분체에서 19~74중량%로 사용한다. 19중량% 미만이면 경화체의 충분한 강도 발현이 어려우며, 74중량% 초과하면 지나친 점성으로 인해 유동성 확보에 어려움이 있고 균열발생 문제가 우려된다.Portland cement is usually a binder, which is used at 19 to 74% by weight in powder. If it is less than 19% by weight, it is difficult to develop sufficient strength of the cured product, and if it exceeds 74% by weight, it is difficult to secure fluidity due to excessive viscosity and there is a concern of cracking problem.

무기충전제는 시멘트 내 공극에 대한 충전효과를 발휘하여 시멘트의 강도와 수밀성 개선을 위해 사용하며, 이러한 사용목적을 효과적으로 실현하기 위해 분체에서 5~9중량% 사용하는 것이 적당하다. 무기충전제로는 탄산칼슘이 바람직하다.Inorganic fillers are used to improve the strength and watertightness of cements by exerting a filling effect on the voids in cement, and it is appropriate to use 5 to 9% by weight in powder to realize this purpose effectively. As an inorganic filler, calcium carbonate is preferable.

세골재는 강도 증진 목적으로 사용하는데, 규사가 적당하다. 세골재는 각각 분체에서 5~12중량% 사용하며, 5중량% 미만이면 강도 증진 효과가 미미하고 12중량% 초과하면 과도한 사용으로 경화체의 중량 증대가 우려된다.Fine aggregate is used for strength improvement, and silica sand is suitable. Fine aggregates are used 5 to 12% by weight in the powder, respectively, less than 5% by weight of the strength enhancement effect is insignificant, if more than 12% by weight excessive use of the cured body is feared to increase the weight.

도전성 코팅경량골재는 도전성과 경량성 확보를 종래 무기충전제와 세골재의 사용량을 치환하여 사용하는 것이 된다. 도전성 코팅경량골재는 도전성 하이드로졸 용액으로 도포 또는 침지하여 제조함으로써 경량골재의 수분흡수성을 제어하는 한편 도전성을 부여한 것이 된다. 즉 도전성 콘크리트 배합과정에서 경량골재가 배합수를 흡수하는 것을 표면의 도전성 하이드로졸 용액 코팅막으로 차단하여 배합수의 사용량을 최소화할 수 있게 한 것이다. 또한 도전성 코팅경량골재는 도전성 콘크리트의 경화단계에서 도전성 하이드로졸 용액 피막이 점차 용해되어 폴리머구조를 형성하면서 경화되기 때문에, 접지판 경화체의 물리성능 향상에도 기여한다. 나아가 도전성 하이드로졸 용액에는 전도성 재료(CNT 등)가 분산되어 있기 때문에, 도전성 하이드로졸 용액의 용해에 따라 전도성 재료가 도전성 콘크리트 내에 존재하게 되면서 우수한 전기적 특성을 나타낼 것이다. 이와 같은 도전성 코팅경량골재는 분체에서 11~45중량%로 사용하는데, 11중량% 미만이면 경량화 기여도가 크지 않고 45중량% 초과하면 접지판으로 요구하는 물리성능을 만족시키기 어렵다.Conductive coating lightweight aggregate will be used to replace the amount of conventional inorganic filler and fine aggregate to ensure conductivity and lightness. The conductive coating lightweight aggregate is prepared by coating or dipping with a conductive hydrosol solution to control the water absorbency of the lightweight aggregate and impart conductivity. That is, the lightweight aggregate in the conductive concrete mixing process to prevent the absorption of the mixing water by the conductive hydrosol solution coating film on the surface to minimize the amount of the mixing water used. In addition, since the conductive coating lightweight aggregate is cured while the conductive hydrosol solution film is gradually dissolved in the curing step of the conductive concrete to form a polymer structure, it also contributes to improving the physical performance of the cured ground plate. Furthermore, since the conductive material (CNT, etc.) is dispersed in the conductive hydrosol solution, the conductive material will be present in the conductive concrete as the conductive hydrosol solution is dissolved, thereby exhibiting excellent electrical properties. Such a conductive coating lightweight aggregate is used in the powder 11 ~ 45% by weight, less than 11% by weight is not a large contribution to the weight reduction, 45% by weight is difficult to meet the physical performance required by the ground plate.

한편 도전성 코팅경량골재 제조에는 아래 [표 1]과 같은 특성의 경량골재를 사용하면 적당하며, 특히 바텀애쉬, 하수오니슬러지, 냉연열연 슬러지, 석분, 점토 중 하나 이상의 재료를 혼합하여 소정공정을 통해 제조한 인공경량골재를 사용하는 것이 바람직하다.
On the other hand, it is suitable to use lightweight aggregate having the characteristics as shown in the following [Table 1] for the production of conductive coating lightweight aggregate, and in particular, one or more materials of bottom ash, sewage sludge, cold rolled hot sludge, stone powder, and clay are mixed through a predetermined process. It is preferable to use the manufactured artificial lightweight aggregate.

[표 1] 경량골재의 특성[Table 1] Characteristics of lightweight aggregate

Figure 112011097998648-pat00001
Figure 112011097998648-pat00001

또한 도전성 코팅경량골재 제조를 위한 도전성 하이드로졸 용액으로는, (CH2CHOH)n 분자구조에 중합도가 500~2,000이면서 고형분이 15~25%인 CNT 분산 도전성 하이드로졸 용액을 이용하는 것이 바람직하다. 이와 같은 도전성 하이드로졸 용액은 중합도가 500~2,000인 (CH2CHOH)n 분자구조의 폴리머 분말을 물에 혼합하여 35~40℃로 가열한 후 고형분이 1.5~5%인 CNT용액, 기타 첨가제(분산제, 유동화제 등)를 첨가 교반하여 제조하면 된다. 여기서 폴리머 분말의 중합도가 500 미만이면 폴리머 구조 간의 결합력이 약해 물에 의해 쉽게 용해되기 때문에 도전성 콘크리트의 물 배합과정에서 코팅경량골재의 코팅막이 벗겨지기 쉬워 경량골재의 수분흡수 우려가 있으며, 2,000을 초과하면 용해 특성이 지나치게 낮아져 경화체의 물리성능 향상에 기여를 하지 못한다. 또한 CNT용액은 직경-길이 비가 103~104이면서 전기전도도가 5,700±200S/㎝인 CNT가 분산된 용액이면 적당하다.In addition, it is preferable to use a CNT dispersed conductive hydrosol solution having a degree of polymerization of 500 to 2,000 and a solid content of 15 to 25% in the (CH 2 CHOH) n molecular structure as the conductive hydrosol solution for the production of conductive coating lightweight aggregate. This conductive hydrosol solution is a mixture of (CH 2 CHOH) n molecular structure polymer powder having a degree of polymerization of 500 ~ 2,000 in water and heated to 35 ~ 40 ℃ CNT solution having a solid content of 1.5 ~ 5%, other additives ( What is necessary is just to add and disperse a dispersing agent, a fluidizing agent, etc.). If the degree of polymerization of the polymer powder is less than 500, the bonding strength between the polymer structures is weak and easily dissolved by water, so that the coating film of the light weight aggregate is likely to peel off during the water mixing process of the conductive concrete. If so, the dissolution characteristics are too low, which does not contribute to the improvement of the physical performance of the cured product. In addition, CNT solution is suitable if the diameter-length ratio of 10 3 ~ 10 4 and the dispersion of CNT with an electrical conductivity of 5,700 ± 200 S / ㎝.

도전성 코팅경량골재는 앞서 살펴본 경량골재(특히 인공경량골재)을 도전성 하이드로졸 용액을 도포하거나 침지한 후 건조하는 방식으로 제조하면 되며, 도전성 코팅경량골재는 도포두께(코팅막 두께)가 5㎛ 이상이고 표면저항이 1000Ω/sq 이하를 가지도록 제조하는 것이 도전성 코팅경량골재로서 기대효과 발현을 위해 바람직하다.The conductive coating lightweight aggregate may be manufactured by coating or dipping the lightweight aggregate (especially artificial lightweight aggregate) as described above by applying or dipping the conductive hydrosol solution, and the conductive coating lightweight aggregate has a coating thickness (coating film thickness) of 5 μm or more. It is preferable to produce the surface resistance of 1000 Pa / sq or less to express the expected effect as the conductive coating lightweight aggregate.

도전성 콘크리트에서 도전성 탄소섬유는 강도 증진과 함께 전기 전도성 향상을 위해 사용하며, 분체에서 0.1~4.0중량%가 바람직하다. 도전성 탄소섬유가 0.1중량% 미만이면 도전성 콘크리트의 전기적 특성저하로 인해 전기저항율이 높게 나오며, 4.0중량% 초과하면 도전성 콘크리트 혼합시 탄소섬유가 서로 엉기는 현상으로 인해 도전성이 불규칙해지기 쉽다. 도전성 탄소섬유는 PAN계로서 1~15mm 길이를 가지는 것이 바람직한데, 1mm 미만이면 전기저항이 증가하고, 15mm 초과하면 탄소섬유 간의 엉김으로 인해 분산특성이 저하되어 전기저항이 증가하거나 부분적으로 오히려 더 전기저항이 낮아져 전류가 역으로 흘러들어오는 문제가 발생하기 쉽다. In the conductive concrete, the conductive carbon fiber is used to improve the electrical conductivity as well as to enhance the strength, preferably 0.1 to 4.0% by weight in the powder. If the conductive carbon fiber is less than 0.1% by weight, the electrical resistivity is high due to the deterioration of the electrical properties of the conductive concrete. When the conductive carbon fiber is more than 4.0% by weight, the conductivity tends to be irregular due to the entanglement of the carbon fibers. It is preferable that the conductive carbon fiber has a length of 1 to 15 mm as the PAN system, but if it is less than 1 mm, the electrical resistance increases, and if it exceeds 15 mm, the dispersion property is lowered due to the entanglement between the carbon fibers, thereby increasing the electrical resistance or partly more electrical. The lower the resistance, the more likely the current flows in reverse.

반응조정제는 시멘트의 수화반응을 자극하여 경화특성 개선하기 위해 사용하는데, Calcium sulfo aluminate(CSA)가 바람직하다. 반응조정제는 분체에서 4.4~9.5중량% 사용하며, 4.4중량% 미만이면 첨가 효과가 미미하고 9.5중량% 초과하면 과다한 사용으로 물리성능 저하가 우려된다.Reaction modifiers are used to stimulate the hydration of cement to improve the curing properties. Calcium sulfo aluminate (CSA) is preferred. Reaction modifiers are used in the powder 4.4 ~ 9.5% by weight, if less than 4.4% by weight of the addition effect is insignificant, if exceeding 9.5% by weight excessive use is feared to decrease the physical performance.

첨가제는 구성성분 간의 혼합분산성과 유동성 향상을 위해 분산제나 유동화제 중 하나 이상 사용하는데, 여기서 분산제는 음이온계 계면활성제를 채택하고, 유동화제는 멜라민계를 채택하면 적당하다. 첨가제는 분체에서 0.5~1.5중량% 사용하며, 0.5중량% 미만이면 충분한 분산성 내지 유동성 발휘에 효과를 나타내지 못하고 1.5중량% 초과하면 비경제적일 뿐만 아니라 재료분리를 초래할 수 있다.The additive is used at least one of a dispersing agent or a fluidizing agent to improve the mixing dispersibility and fluidity between the components, wherein the dispersing agent is an anionic surfactant, the fluidizing agent is suitable to adopt a melamine type. The additive is used in the powder 0.5 to 1.5% by weight, less than 0.5% by weight does not have an effect on the sufficient dispersibility or fluidity exertion, and more than 1.5% by weight may be uneconomical and cause material separation.

상기와 같은 재료들로 분체를 구성하면 충분하나, 경우에 따라 강섬유(steel fiber)를 도전성 탄소섬유와 마찬가지로 강도 증진과 전기 전도성 향상 목적으로 더 혼입할 수 있다. 강섬유는 분체의 0.3~3.4중량% 사용하는 것이 사용목적과 경제성 및 작업성을 고려할 때 적당하다. 강섬유는 END HOOK TYPE 또는 BUNDLE TYPE으로서 길이가 30~50㎜인 것을 사용하는 것이 바람직하며, 길이가 30mm 미만이면 전기저항이 높아 접지저항 효과가 떨어지고, 50mm 초과하면 강섬유 간에 엉김현상으로 분산성이 낮아져 부분적으로 전기저항이 높게 나타나는 문제가 발생할 우려가 크다.It is sufficient to form the powder with the above materials, but in some cases, steel fibers (steel fiber), like the conductive carbon fibers, may be further mixed for strength and electrical conductivity enhancement purposes. Steel fiber 0.3 ~ 3.4% by weight of powder is suitable considering the purpose of use, economics and workability. Steel fiber is preferably END HOOK TYPE or BUNDLE TYPE with a length of 30 ~ 50㎜. If the length is less than 30mm, the electrical resistance is high and the ground resistance effect is reduced. If the thickness exceeds 50mm, the dispersibility is reduced due to entanglement between steel fibers. There is a high possibility that the problem of high electrical resistance is partially caused.

앞서 살펴본 바와 같은 재료들로 분체를 구성한 후에, 이러한 분체에 대하여 30~45중량%의 물을 배합하면 접지판 제작을 위한 도전성 콘크리트가 된다. 이때 배합수가 분체의 30중량% 미만이면 유동성이 부족하여 작업성 확보가 곤란하고, 분체의 45중량% 초과하면 콘크리트의 강도부족이 우려된다.
After the powder is composed of the materials as described above, 30 to 45% by weight of water is added to the powder to form a conductive concrete for manufacturing a ground plate. At this time, when the blended water is less than 30% by weight of the powder, it is difficult to secure workability due to lack of fluidity, and when it exceeds 45% by weight of the powder, the lack of strength of the concrete may be feared.

더불어 본 발명은 접지판 제작에서 철부자재를 도전성 콘크리트로 피복 성형하기 전에, 철부자재에 도전성 실란결합 방청제를 도포할 것을 제안한다. 이는 철부자재의 부식을 방지하기 위함이다. 특특히 도전성 실란결합 방청제는, 헥사메틸디실라젠(Hexamethyldisilazane), N-2아미노에틸3-아미노프로필트리메톡시실란(N-2(aminoethyl)3-amonipropyltrimethoxysilane), 3-아미노프로필트리에톡시실란(3-aminopropyltriethoxysilane) 중에서 선택된 하나 이상의 실란을 물에 중량비로 5~30% 혼합 가수분해 후 고형분 0.5~5%, 입자 크기 20~60㎚의 구리콜로이드가 분산 함유되어 있는 아세트산 용액을 투입하여 pH가 6.5~7.5가 되도록 제조하는 것이 바람직한데, 이는 부착력과 방청효과 확보를 고려한 결과이다. 이와 같이 제조한 도전성 실란결합 방청제는 철부자재에 도포두께 10㎛ 이상, 표면저항 2,000Ω/sq 이하를 가지도록 도포하면 적당한데, 그래야 철부자재의 방청특성을 확보하고 철부자재와 도전성 콘크리트간의 우수한 전기특성을 유지하는데 유리하다.
In addition, the present invention proposes to apply a conductive silane-bonded rust preventive agent to the iron submaterials before coating and forming the iron submaterials with conductive concrete in manufacturing the ground plate. This is to prevent corrosion of the iron subsidiary materials. In particular, the conductive silane bond rust preventive agent is hexamethyldisilazane, N-2aminoethyl3-aminopropyltrimethoxysilane (N-2 (aminoethyl) 3-amonipropyltrimethoxysilane), 3-aminopropyltriethoxysilane One or more silanes selected from (3-aminopropyltriethoxysilane) were mixed with 5-30% hydrolysis in water by weight, and then an acetic acid solution containing 0.5-5% solids and a copper colloid having a particle size of 20-60 nm was added thereto. It is desirable to manufacture 6.5 to 7.5, which is the result of considering the adhesion and the antirust effect. The conductive silane-bonded rust preventive prepared in this way is suitable to be applied to the iron submaterial to have a coating thickness of 10 μm or more and a surface resistance of 2,000 μs / sq or less. It is advantageous to maintain the properties.

이하에서는 실시예에 의거하여 본 발명에 따른 도전성 접지판의 물리적인 특성을 살펴본다. 다만, 하기의 실시예는 본 발명을 예시하기 위한 것일 뿐이며, 본 발명의 범위가 이로써 한정되는 것은 아니다.
Hereinafter, look at the physical characteristics of the conductive ground plate according to the present invention based on the embodiment. However, the following examples are only for illustrating the present invention, and the scope of the present invention is not limited thereto.

[[ 실시예Example ]물성 시험Property test

1. 도전성 1. Conductive 코팅경량골재Coating Lightweight Aggregate 제조 Produce

아래 [표 2]와 같은 특성의 인공경량골재와 도전성 하이드로졸 용액을 이용하여 도전성 코팅경량골재를 제조하였다. 인공경량골재를 도전성 하이드로졸 용액으로 도포 코팅하여 건조함으로써, 도포두께 20㎛, 표면저항 920Ω/sq를 갖는 도전성 코팅경량골재로 제조하였다.Using the artificial lightweight aggregate and the conductive hydrosol solution of the characteristics shown in Table 2 below to prepare a conductive coating lightweight aggregate. The artificial lightweight aggregate was coated and dried with a conductive hydrosol solution to prepare a conductive coated lightweight aggregate having a coating thickness of 20 μm and a surface resistance of 920 μs / sq.

[표 2] 도전성 코팅경량골재 제조를 위한 재료 [Table 2] Materials for the manufacture of conductive coating lightweight aggregate

Figure 112011097998648-pat00002
Figure 112011097998648-pat00002

2. 시편 제작2. Specimen Fabrication

아래 [표 3]에 따른 분체와 분체의 35중량% 물로 도전성 콘크리트를 배합하고, RS 규격에 따라 도전성 콘크리트 공시체와 도전성 접지판을 제작하였다. 다만 접지판의 경우 비교예1,2는 RC 규격에 따라 제작한 반면, 실시예1은 철부자재에 도전성 실란결합 방청제를 도포 분사하여 기건에서 12시간 건조한 다음 RC 규격에 따라 제작하였다. 실시예1에 이용된 도전성 실란결합 방청제는 3-아미노프로필트리에톡시실란(3-aminopropyltriethoxysilane)을 물에 중량비로 25% 혼합 가수분해 후 고형분 0.8%, 입자 크기 40㎚의 구리콜로이드가 분산 함유되어 있는 아세트산 용액을 투입하여 pH가 6.9가 되도록 제조한 것이며, 이러한 도전성 실란결합 방청제를 철부자재에 도포하여 건조한 결과 도포건조두께 20micron, 표면저항 1420Ω/sq을 나타냈다.Conductive concrete was mixed with 35 wt% water of powder and powder according to [Table 3] below, and a conductive concrete specimen and a conductive ground plate were prepared according to RS standard. However, in the case of the ground plate, Comparative Examples 1 and 2 were manufactured according to the RC standard, whereas Example 1 was sprayed by spraying a conductive silane coupling rust preventive agent on the iron subsidiary material and dried for 12 hours in the air. The conductive silane-bonding rust inhibitor used in Example 1 was mixed with 25% hydrolysis of 3-aminopropyltriethoxysilane in water by weight ratio, followed by dispersion of 0.8% solids and 40 nm copper colloid. A pH of 6.9 was prepared by adding an acetic acid solution. The conductive silane-bonded rust inhibitor was applied to an iron subsidiary material and dried to obtain a coating dry thickness of 20 microns and a surface resistance of 1420 Pa / sq.

[표 3]  [Table 3]

접지판용 도전성 콘크리트의 분체 조성  Powder Composition of Conductive Concrete for Ground Plate

Figure 112011097998648-pat00003
Figure 112011097998648-pat00003

3. 시험결과3. Test result

도전성 콘크리트 공시체와 접지판은 각각 기건에서 7일 양생 후에 한전등록구매규격 RS-5975-0067에 따라 특성을 평가하였다. 특히 공시체와 접지판의 전기저항율 변화를 평가하기 위해 기건 7일 양생된 공시체와 접지판을 28일 동안 항온항습조건(20±1℃, 90%)에 둔 후에 수분 흡수 전후의 특성을 평가하였으며, 접지판의 부식특성을 평가하기 위해 접지판을 소금농도 50±5g/L인 용액에 60일간 침지한 후 접지판을 세로방향으로 절단하여 도전성 콘크리트와 철부자재의 접촉면에 대한 부식정도를 확인하고 접촉면 대비 부식면적을 나타내는 것으로 평가하였다. 그 결과 아래 [표 4] 및 [표 5]와 같이 나타냈다.The conductive concrete specimen and the ground plate were evaluated in accordance with KEPCO registration standard RS-5975-0067 after 7 days of curing in each case. In particular, to evaluate the change in electrical resistivity of the specimen and the ground plate, the specimen and ground plate, which were cured for 7 days, were placed under constant temperature and humidity conditions (20 ± 1 ℃, 90%) for 28 days. In order to evaluate the corrosion characteristics of the ground plate, the ground plate was immersed in a solution with a salt concentration of 50 ± 5g / L for 60 days, and then the ground plate was cut longitudinally to check the degree of corrosion of the contact surface between the conductive concrete and the iron subsidiary materials. It was evaluated to show a relative corrosion area. The results are shown in the following [Table 4] and [Table 5].

[표 4] 도전성 콘크리트 공시체 특성[Table 4] Characteristics of conductive concrete specimen

Figure 112011097998648-pat00004
Figure 112011097998648-pat00004

[표 5] 접지판 특성[Table 5] Ground plate characteristics

Figure 112011097998648-pat00005
Figure 112011097998648-pat00005

위에서 보는 바와 같이 도전성 콘크리트 공시체의 경우, 도전성 코팅경량골재를 세골재와 함께 사용한 실시예1, 세골재만을 사용한 비교예1, 미처리 인공경량골재와 세골재를 사용한 비교예2 모두에서 전기저항율은 한전등록구매규격 RS-5975-0067에서 규정한 0.1Ωm 이하를 만족하는 것으로 확인되었다. 그러나 실시예1의 전기저항율이 비교예1,2에 비해 상당히 낮은 것을 확인할 수 있었는데, 이는 수분흡수로 인해 도전성 코팅경량골재의 코팅막이 용해되면서 도전성을 가지는 CNT가 콘크리트 미세 기공에 분산되기 때문인 것으로 생각된다. 그리고 비교예1에 비해 비교예2의 전기저항율이 더 낮은 것은 미처리된 경량골재가 흡수한 수분이 경화 후에도 잔존하고 있어 이로 인해 전기저항율이 더 낮게 나오는 것으로 생각된다.As shown above, in the case of conductive concrete specimens, the electrical resistivity of both Example 1 using the conductive coated lightweight aggregate with fine aggregate, Comparative Example 1 using only fine aggregate, and Comparative Example 2 using untreated artificial lightweight aggregate and fine aggregate were calculated by KEPCO. It was confirmed that it satisfies 0.1 mm or less specified in RS-5975-0067. However, it was confirmed that the electrical resistivity of Example 1 was considerably lower than that of Comparative Examples 1 and 2, because the CNT having conductivity was dispersed in the concrete micropores as the coating film of the conductive coating lightweight aggregate was dissolved due to water absorption. do. In addition, the electrical resistivity of Comparative Example 2 is lower than that of Comparative Example 1, and the moisture absorbed by the untreated lightweight aggregate remains after curing, which is considered to result in lower electrical resistivity.

도전성 콘크리트 공시체에서 압축강도와 휨강도는 비교예1보다 실시예1에서 더 높게 나왔는데, 이는 접지판 성형 경화단계에서 용해된 도전성 하이드로졸 용액 피막이 도전성 콘크리트의 미세기공에 채워지면서 강도가 증가한 것으로 사료된다. 그리고 비교예2에서는 압축강도와 휨강도가 크게 떨어지는 것으로 나타났으며, 이는 배합과정에서 미처리된 경량골재의 수분흡수성으로 인해 배합수량이 증가하게 되면서 이로 인해 압축강도와 휨강도 특성 저하로 이어진 것으로 사료된다. 단위용적중량의 경우에는 실시예1에서 가장 낮은 것을 확인할 수 있는데, 이로부터 본 발명에 따르면 경량화가 가능해짐을 알 수 있다. The compressive strength and the flexural strength of the conductive concrete specimens were higher in Example 1 than in Comparative Example 1, which is considered to increase in strength as the conductive hydrosol solution film dissolved in the ground plate molding curing step was filled in the micropores of the conductive concrete. In Comparative Example 2, the compressive strength and the flexural strength were found to be greatly decreased, which was increased due to the water absorption of the untreated lightweight aggregate during the compounding process, and thus, the compressive strength and the flexural strength were deteriorated. In the case of unit volume weight, it can be seen that the lowest in Example 1, from which it can be seen that the weight can be reduced according to the present invention.

한편 접지판의 경우에는 전기저항변화율을 측정한 결과 비교예1,2와 실시예1 모두 한전등록구매규격 RS-5975-0067에서 규정한 5%를 초과하지 않는 것으로 확인되었다. 다만 비교예1,2에 비해 실시예1의 전기저항변화율이 낮은데, 이는 도전성 코팅경량골재와 방청특성을 위해 도포한 도전성 실란결합 코팅제가 우수한 도전성을 가지기 때문에 도전성 콘크리트와 철부자재간의 전기적 특성이 유지되는 것으로 보인다.On the other hand, in the case of the ground plate, as a result of measuring the electrical resistance change rate, it was confirmed that both Comparative Examples 1 and 2 and Example 1 did not exceed 5% specified in the KEPCO registration specification RS-5975-0067. However, the electrical resistance change rate of Example 1 is lower than that of Comparative Examples 1 and 2, which maintains the electrical properties between the conductive concrete and the iron subsidiary material because the conductive silane-coated coating coated for the light weight aggregate and the antirust property has excellent conductivity. Seems to be.

또한 접지판 제조에서 방청제 미처리 철부자재를 이용한 비교예1,2와 도전성 실란결합 방청제가 도포된 철부자재를 이용한 실시예1의 부식정도를 비교한 결과, 비교예1,2의 경우에 도전성 콘크리트와 철부자재의 접촉면에서 많은 부식을 확인할 수 있었으나 실시예1에서는 부식이 나타나지 않는 것으로 확인되었다. 이로써 도전성 실란결합 방청제 도포를 통해 철부자재의 부식방지특성을 기대할 수 있다.In addition, as a result of comparing the degree of corrosion of Comparative Example 1 and 2 using the untreated anticorrosive iron subsidiary material in the manufacture of the ground plate and Example 1 using the iron subsidiary material coated with the conductive silane coupling rust preventive agent, in the case of Comparative Examples 1 and 2 Although many corrosion could be confirmed at the contact surface of the iron subsidiary material, it was confirmed that the corrosion did not appear in Example 1. As a result, anticorrosive properties of the iron subsidiary materials can be expected through the application of the conductive silane bond rust inhibitor.

이상과 같은 결과에 따라 접지판 제조에 코팅경량골재와 도전성을 가지는 실란결합 구리콜로이드 방청제를 적절히 적용하면 단위부피당 중량 감량에 따른 접지판의 경량화가 가능해지고 철부자재의 방청효과와 방청제의 도전성을 가지게 함으로써 접지판의 전기저항변화율 저하 효과를 가져올 수 있으며, 아울러 미처리 경량골재 적용시에 문제가 될 수 있는 수분흡수특성에 의한 물리성능 저하 특성이 개선되어 충분한 물리성능 확보가 가능해질 것이다.
According to the above results, if the coated light aggregate and the silane-bonded copper colloidal rust preventive agent having conductivity are appropriately applied to the ground plate manufacture, it is possible to reduce the weight of the ground plate according to the weight loss per unit volume, and to have the anti-corrosive effect of the iron subsidiary materials and the conductivity of the rust preventive agent. As a result, the electrical resistance change rate of the ground plate may be reduced, and the physical performance deterioration characteristics may be improved due to the water absorption characteristics, which may be a problem when the untreated lightweight aggregate is applied, thereby ensuring sufficient physical performance.

10: 접지판
11: 콘크리트 본체
12: 접지연결봉
13, 14: 접속나사
15: 금속망
10: ground plate
11: concrete body
12: grounding rod
13, 14 connection thread
15: metal mesh

Claims (5)

경량골재를 (CH2CHOH)n 분자구조에 중합도가 500~2,000이면서 고형분이 15~25%인 CNT 분산 도전성 하이드로졸 용액으로 도포 또는 침지하여 도포두께 5㎛ 이상, 표면저항 1,000Ω/sq 이하의 도전성 코팅경량골재로 제조하고,
상기 도전성 코팅경량골재로 도전성 콘크리트를 배합하고,
도전성 실란결합 방청제가 도포된 철부자재를 상기 도전성 콘크리트로 피복 고형시켜 판형으로 성형 제작하는 것을 특징으로 하는 경량 도전성 접지판의 제작방법.
Lightweight aggregates are coated or immersed in a (CH 2 CHOH) n molecular structure with a CNT dispersed conductive hydrosol solution with a polymerization degree of 500 to 2,000 and a solid content of 15 to 25% .The coating thickness is 5 µm or more and surface resistance is 1,000Ω / sq or less. Manufactured by conductive coating lightweight aggregate,
Conductive concrete is blended with the conductive coating lightweight aggregate,
A method for producing a lightweight conductive ground plate, comprising: forming an iron subsidiary material coated with a conductive silane-bonding rust inhibitor with the conductive concrete to form a plate.
제1항에서,
상기 도전성 코팅경량골재의 제조를 위한 경량골재는,
바텀애시, 하수오니 슬러지, 냉연열연 슬러지, 석분, 점토 중 하나 이상에 의해 제조된 인공경량골재인 것을 특징으로 하는 경량 도전성 접지판의 제작방법.
In claim 1,
Lightweight aggregate for the production of the conductive coating lightweight aggregate,
A method of manufacturing a lightweight conductive ground plate, characterized in that the artificial lightweight aggregate manufactured by at least one of bottom ash, sewage sludge, cold rolled hot sludge, stone powder, clay.
제2항에서,
상기 도전성 콘크리트는,
보통 포틀랜드 시멘트 19~74중량%, 무기충전제 5~9중량%, 세골재 5~12중량%, 도전성 코팅경량골재 11~45중량%, 도전성 탄소섬유 0.1~4.0중량%, 반응조정제 4.4~9.5중량%, 분산제와 유동화제 중 하나 이상의 첨가제 0.5~1.5중량%를 포함하여 조성되는 분체;와,
상기 분체에 대하여 30~45중량%의 물;로 배합한 것임을 특징으로 하는 경량 도전성 접지판의 제작방법.
In claim 2,
The conductive concrete,
Common Portland Cement 19 ~ 74%, Inorganic Filler 5 ~ 9%, Fine Aggregate 5 ~ 12%, Conductive Coating Lightweight Aggregate 11 ~ 45%, Conductive Carbon Fiber 0.1 ~ 4.0%, Reaction Regulator 4.4 ~ 9.5% Powder comprising 0.5 to 1.5% by weight of an additive of at least one of a dispersant and a fluidizing agent; and
30 to 45% by weight of water with respect to the powder; manufacturing method of a lightweight conductive ground plate, characterized in that the formulation.
제1항 내지 제3항 중 어느 한 항에서,
상기 도전성 실란결합 방청제는,
헥사메틸디실라젠(Hexamethyldisilazane), N-2아미노에틸3-아미노프로필트리메톡시실란(N-2(aminoethyl)3-amonipropyltrimethoxysilane), 3-아미노프로필트리에톡시실란(3-aminopropyltriethoxysilane) 중에서 선택된 하나 이상의 실란을 물에 중량비로 5~30% 혼합 가수분해 후 고형분 0.5~5%, 입자 크기 20~60㎚의 구리콜로이드가 분산 함유되어 있는 아세트산 용액을 투입하여 pH가 6.5~7.5가 되도록 제조한 것임을 특징으로 하는 경량 도전성 접지판의 제작방법.
4. The method according to any one of claims 1 to 3,
The conductive silane bond rust inhibitor,
Hexamethyldisilazane, N-2 aminoethyl3-aminopropyltrimethoxysilane (N-2 (aminoethyl) 3-amonipropyltrimethoxysilane), 3-aminopropyltriethoxysilane (3-aminopropyltriethoxysilane) The above silane was prepared by mixing 5 ~ 30% hydrolysis in water by weight ratio, and then adding acetic acid solution containing 0.5 ~ 5% solids and 20 ~ 60nm of copper colloid in dispersion to pH 6.5 ~ 7.5. A method of manufacturing a lightweight conductive ground plate, characterized in that.
삭제delete
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103258583A (en) * 2013-05-13 2013-08-21 国家电网公司 Resistance reducing material and application of iron ore in grounding grid upgrading as resistance reducing material

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Publication number Priority date Publication date Assignee Title
KR19980072240A (en) * 1997-03-03 1998-11-05 이재복 Manufacturing method of ground electrode using cement material
KR20100029684A (en) * 2008-09-08 2010-03-17 더큰 Grounding plate and grounding rod made of open-cell type metal foam
KR100975389B1 (en) * 2009-12-31 2010-08-11 (주)폴리뱅크 Coating method of lightweight aggregate
KR20110094903A (en) * 2010-02-18 2011-08-24 문종욱 Coated eps lightweight aggregate and manufacturing process of incombustible concrete panel using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980072240A (en) * 1997-03-03 1998-11-05 이재복 Manufacturing method of ground electrode using cement material
KR20100029684A (en) * 2008-09-08 2010-03-17 더큰 Grounding plate and grounding rod made of open-cell type metal foam
KR100975389B1 (en) * 2009-12-31 2010-08-11 (주)폴리뱅크 Coating method of lightweight aggregate
KR20110094903A (en) * 2010-02-18 2011-08-24 문종욱 Coated eps lightweight aggregate and manufacturing process of incombustible concrete panel using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103258583A (en) * 2013-05-13 2013-08-21 国家电网公司 Resistance reducing material and application of iron ore in grounding grid upgrading as resistance reducing material

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