KR101113048B1 - Led housing with ring type heat pin - Google Patents

Led housing with ring type heat pin Download PDF

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Publication number
KR101113048B1
KR101113048B1 KR1020100055312A KR20100055312A KR101113048B1 KR 101113048 B1 KR101113048 B1 KR 101113048B1 KR 1020100055312 A KR1020100055312 A KR 1020100055312A KR 20100055312 A KR20100055312 A KR 20100055312A KR 101113048 B1 KR101113048 B1 KR 101113048B1
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South Korea
Prior art keywords
led
housing
annular heat
fins
annular
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KR1020100055312A
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Korean (ko)
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KR20110135534A (en
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서동명
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서동명
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/026—Fastening of transformers or ballasts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

본 발명은 엘이디(LED)(41) 조명등을 구성하는 하우징(housing)(10)에 관한 것으로, 엘이디(41) 및 안정기(42) 등 관련 구동회로가 설치되는 중공(中空)의 콘형(corn形) 금속제 하우징(10)을 구성하되, 콘형 하우징(10)의 장직경 및 단직경이 각각 백열전구의 유리구(21) 직경 및 나선캡(22) 직경과 일치하도록 하고, 하우징(10)의 외주면에는 다수의 환형방열핀(環形放熱pin)(11)을 등간격으로 설치하여, 협소한 공간에서도 최대한의 방열면적(放熱面積)을 확보할 수 있도록 한 것이다.
본 발명을 통하여, 일반 백열전구의 소켓 및 등기구 등에 대한 호환성을 최대한 확보함과 동시에 엘이디(41) 조명등을 소형화하고, 냉각효과를 제고하는 효과를 얻을 수 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing (10) constituting an LED (LED) lamp, and has a hollow cone shape in which associated drive circuits such as the LED 41 and the ballast 42 are installed. A metal housing 10 is constructed, and the long and short diameters of the cone-shaped housing 10 are respectively matched to the diameter of the glass sphere 21 and the spiral cap 22 of the incandescent lamp, and the outer peripheral surface of the housing 10 A plurality of annular radiating fins (11) are installed at equal intervals to ensure maximum heat dissipation area even in a narrow space.
Through the present invention, it is possible to secure the maximum compatibility with the socket and the luminaire of the general incandescent lamp, and at the same time to miniaturize the LED (41) lamps, it is possible to obtain the effect of improving the cooling effect.

Description

환형방열핀이 형성된 엘이디 하우징{LED HOUSING WITH RING TYPE HEAT PIN}LED housing with annular heat sink fin {LED HOUSING WITH RING TYPE HEAT PIN}

본 발명은 엘이디(LED)(41) 조명등을 구성하는 하우징(housing)(10)에 관한 것으로, 엘이디(41) 및 안정기(42) 등 관련 구동회로가 설치되는 중공(中空)의 콘형(corn形) 금속제 하우징(10)을 구성하되, 콘형 하우징(10)의 장직경 및 단직경이 각각 백열전구의 유리구(21) 직경 및 나선캡(22) 직경과 일치하도록 하고, 하우징(10)의 외주면에는 다수의 환형방열핀(環形放熱pin)(11)을 등간격으로 설치하여, 협소한 공간에서도 최대한의 방열면적(放熱面積)을 확보할 수 있도록 한 것이다.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing (10) constituting an LED (LED) lamp, and has a hollow cone shape in which associated drive circuits such as the LED 41 and the ballast 42 are installed. A metal housing 10 is constructed, and the long and short diameters of the cone-shaped housing 10 are respectively matched to the diameter of the glass sphere 21 and the spiral cap 22 of the incandescent lamp, and the outer peripheral surface of the housing 10 A plurality of annular radiating fins (11) are installed at equal intervals to ensure maximum heat dissipation area even in a narrow space.

엘이디(LED, Light Emitting Diode)(41)는 상대적으로 수명이 길고 전력소모가 적은 특성으로 인하여 각종 조명 뿐 아니라, 디스플레이(display)용 광원 등으로 널리 사용되고 있다.LED (Light Emitting Diode) 41 is widely used as a light source for a display (display) as well as various lighting due to its relatively long life and low power consumption.

엘이디(41)는 직류전원을 사용하는 다이오드의 일종으로서 정류 및 평활회로, 안정기(42) 등의 부속 구동회로를 필요로 하며, 통상 이들 부속 구동회로 및 엘이디(41) 등을 조합하여 전구 형태로 구성함으로써 소켓 및 등기구 등 기설 조명설비와 호환이 가능하도록 제조된다.The LED 41 is a kind of diode that uses a DC power source and requires accessory driving circuits such as rectification and smoothing circuits and a ballast 42. In general, the LED 41 combines these accessory driving circuits and the LEDs 41 to form a light bulb. It is manufactured to be compatible with existing lighting equipment such as sockets and luminaires.

이러한 상용 엘이디(41) 조명등이 도 1의 우측에 예시되어 있으며, 동 도면을 통하여 알 수 있는 바와 같이, 엘이디(41) 조명등에는 외주면을 이형(異形)처리하여 표면적을 확장한 하우징(10)과 엘이디(41)를 보호하는 투광덮개(31) 등이 구성되고, 전원 단자로서는 도 1 좌측 일반 백열전구의 나선캡(22)과 동일한 규격의 나선캡(22)이 적용되어, 기설 조명설비에 장착이 가능하도록 구성된다.
Such a commercial LED 41 lamp is illustrated on the right side of FIG. 1, and as can be seen from the drawing, the LED 41 lamp has a housing 10 having an outer circumferential surface to be extended to expand its surface area; A floodlight cover 31 or the like for protecting the LED 41 is configured, and as a power supply terminal, a spiral cap 22 of the same standard as the spiral cap 22 of the left incandescent lamp of FIG. It is configured to be possible.

도 1에서와 같이, 종래의 엘이디(41) 조명등용 하우징(10)에는 표면적 확대를 통하여 방열 및 냉각 효과가 부여되었으나, 충분한 냉각효과 발현을 위하여 소형화에 한계가 있을 수 밖에 없었으며, 그에 따라 종래 하우징(10)이 적용된 엘이디(41) 조명등을 일반 백열전구용 등기구 또는 매입등용 등기구에 결합시 등기구 내부 공간을 지나치게 잠식하여 냉각효과가 저하될 뿐 아니라, 등기구 외부로 돌출되어 조도 및 미관이 저해되는 심각한 문제점이 있었다.
As shown in FIG. 1, the heat dissipation and cooling effect is given to the conventional LED 41 lighting housing 10 by expanding the surface area, but there is a limit to miniaturization in order to express a sufficient cooling effect. When the LED (41) lamp applied with the housing (10) is combined with a general incandescent lamp or an embedded lamp, the interior space of the lamp is excessively encroached, and the cooling effect is lowered. There was a problem.

본 발명은 전술한 문제점을 감안하여 창안한 것으로, 하부에 나선캡(22)이 결합되고, 내부에 중공(中空)의 원통형 수납부(12)가 형성되어 엘이디(41) 및 구동회로가 설치되는 상광하협(上廣下狹)의 원뿔대형의 엘이디(41) 조명등용 하우징(10)에 있어서, 원통형 수납부(12)의 외주면에는 다수의 환형방열핀(11)이 형성되되, 환형방열핀(11)들의 중심은 원통형 수납부(12)의 중심선상에 위치하고, 상기 다수의 환형방열핀(11)은 원통형 수납부(12)의 중심선과 평행한 방향으로 등간격(等間隔)으로 배치되되, 환형방열핀(11)의 외경은 하방으로 등차(等差) 축소됨을 특징으로 하는 환형방열핀이 형성된 엘이디 하우징이다.The present invention has been made in view of the above-described problems, the spiral cap 22 is coupled to the bottom, the hollow cylindrical receiving portion 12 is formed inside the LED 41 and the drive circuit is installed In the housing 10 for the cone-shaped LED 41 lighting lamp of the upper light lower narrow, a plurality of annular heat-dissipating fins 11 are formed on the outer circumferential surface of the cylindrical housing 12, and the annular heat-dissipating fins 11 are formed. These centers are located on the center line of the cylindrical housing 12, the plurality of annular heat radiation fins 11 are arranged at equal intervals in a direction parallel to the center line of the cylindrical housing 12, the annular heat radiation fins ( The outer diameter of 11) is an LED housing formed with an annular heat-dissipating fin, characterized in that it is reduced by equality downward.

또한, 상기 환형방열핀(11)의 두께(t)와 인접 환형방열핀(11)간 이격 거리는 동일하고, 상단 환형방열핀(11)의 외경은 58mm 내지 61mm이며, 원통형 수납부(12)의 외경은 38mm 내지 40mm이고, 원통형 수납부(12)의 높이는 48mm 내지 52mm이며, 환형방열핀(11)의 두께는 2mm 내지 5mm임을 특징으로 하는 환형방열핀이 형성된 엘이디 하우징이다.
In addition, the distance between the thickness (t) of the annular heat-radiating fin 11 and the adjacent annular heat-radiating fin 11 is the same, the outer diameter of the upper annular heat-radiating fin 11 is 58mm to 61mm, the outer diameter of the cylindrical housing 12 is 38mm To 40mm, the height of the cylindrical housing portion 12 is 48mm to 52mm, the thickness of the annular heat-dissipating fin 11 is an LED housing formed with an annular heat-dissipating fin, characterized in that 2mm to 5mm.

본 발명을 통하여, 일반 백열전구의 소켓 및 등기구 등에 대한 호환성을 최대한 확보함과 동시에 엘이디(41) 조명등을 소형화하고, 냉각효과를 제고하는 효과를 얻을 수 있다.
Through the present invention, it is possible to secure the maximum compatibility with the socket and the luminaire of the general incandescent lamp, and at the same time to miniaturize the LED (41) lamps, it is possible to obtain the effect of improving the cooling effect.

도 1은 백열전구와 종래의 하우징이 적용된 엘이디 조명등 비교 사시도
도 2는 백열전구와 본 발명이 적용된 엘이디 조명등 비교 사시도
도 3은 본 발명이 적용된 엘이디 조명등 분해사시도
도 4는 본 발명의 부분절단 사시도
도 5는 본 발명의 방열면적 산출 모식도
도 6은 수직방열핀이 적용된 엘이디 하우징의 방열면적 산출 모식도
도 7은 환형방열핀과 수직방열핀의 방열면적차 그래프1 is a perspective view comparing the LED lamp with the incandescent bulb and the conventional housing
Figure 2 is a perspective view comparing the incandescent lamp and the LED lamp to which the present invention is applied
Figure 3 is an exploded perspective view of the LED lamp to which the present invention is applied
4 is a partially cutaway perspective view of the present invention
5 is a schematic view of the heat radiation area calculation of the present invention
6 is a schematic view of the heat dissipation area calculation of the LED housing to which the vertical heat dissipation fins are applied
7 is a heat radiation area difference graph of the annular heat sink fin and the vertical heat sink fin

본 발명의 상세한 구성을 첨부된 도면을 통하여 설명하면 다음과 같다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A detailed configuration of the present invention will be described with reference to the accompanying drawings.

우선 도 2는 본 발명이 적용된 엘이디(41) 조명등과 일반 백열전구를 비교한 사시도로서, 좌측의 일반 백열전구와 우측의 본 발명 적용 엘이디(41) 조명등은 그 크기 및 형상이 거의 일치하는 것을 알 수 있으며, 이로써 기설 조명설비와의 호환성을 극대화함과 동시에 등기구 내부 공간 잠식을 최소화함으로써 냉각효과 또한 향상시킬 수 있다.First, FIG. 2 is a perspective view comparing the LED 41 lamp to which the present invention is applied and a general incandescent lamp, and the size and shape of the general incandescent lamp on the left side and the LED 41 lamp to which the present invention is applied on the right side are almost identical. As a result, the cooling effect can be improved by maximizing compatibility with existing lighting equipment and minimizing the encroachment of the interior space of the luminaire.

도 3은 본 발명이 적용된 엘이디(41) 조명등의 분해사시도로서, 동 도면을 통하여 알 수 있는 바와 같이, 본 발명 하우징(10)의 하부에는 나선캡(22)이 결합되고, 내부에는 엘이디(41) 및 안정기(42) 등이 설치되며, 상부에는 엘이디(41)를 보호하는 투광덮개(31)가 결합되어 엘이디(41) 조명등을 구성하게 된다.FIG. 3 is an exploded perspective view of the LED 41 lamp to which the present invention is applied. As can be seen from the same figure, the spiral cap 22 is coupled to the lower portion of the housing 10 of the present invention, and the LED 41 is disposed therein. And ballasts 42 are installed, and the floodlight cover 31 protecting the LED 41 is coupled to the LED 41 to form an LED lamp.

본 발명의 하우징(10)은 알루미늄 또는 알루미늄합금 등의 열전도성이 우수한 금속으로 제조되며, 도 4에서와 같이, 중공(中空)의 원통형 수납부(12)의 외주면에 다수의 환형방열핀(環形放熱pin)(11)이 형성되되, 이들 다수의 환형방열핀(11)과 원통형 수납부(12)는 모두 동축을 이루고 즉, 환형방열핀(11)들의 중심이 원통형 수납부(12)의 중심선상에 위치하고, 상기 다수의 환형방열핀(11)은 원통형 수납부(12)의 중심선과 평행한 방향으로 등간격(等間隔)으로 배치되되, 환형방열핀(11)의 외경은 하방으로 등차(等差) 축소되어, 전체적으로 상광하협(上廣下狹)의 원뿔대를 형성하게 된다.The housing 10 of the present invention is made of a metal having excellent thermal conductivity, such as aluminum or aluminum alloy, and as shown in Figure 4, a plurality of annular heat radiation fins on the outer peripheral surface of the hollow cylindrical housing 12 pins 11 are formed, and the plurality of annular heat-dissipating fins 11 and the cylindrical accommodating portion 12 are all coaxial, that is, the center of the annular heat-dissipating fins 11 is positioned on the center line of the cylindrical accommodating portion 12. The plurality of annular radiating fins 11 are arranged at equal intervals in a direction parallel to the center line of the cylindrical housing 12, and the outer diameter of the annular radiating fins 11 is reduced uniformly downward. As a whole, it forms a truncated cone of the upper and lower straits.

본 발명의 수평 환형방열핀(11) 구조를 통하여 제한된 공간에서 최대한의 방열면적을 확보함으로써 방열 및 냉각효과를 극대화할 수 있는데, 이러한 수평 환형방열핀(11)의 방열 효과를 도 6에서와 같은 수직방열핀(19)과의 비교를 통하여 확인할 수 있다.The heat dissipation and cooling effects can be maximized by securing a maximum heat dissipation area in a limited space through the horizontal annular heat dissipation fin 11 structure of the present invention. This can be confirmed by comparison with (19).

도 5 및 도 6은 각각 환형방열핀(11) 및 수직방열핀(19)이 적용된 동일한 치수의 하우징(10)을 모식화하여 도시한 것으로, 도 5의 환형방열핀(11)의 경우 환형방열핀(11)의 상부면 및 저면의 면적을 방열면적으로 설정하고, 도 6의 수직방열핀(19)의 경우 직삼각형 형상의 수직방열핀(19) 양 측면의 면적을 방열면적으로 설정하여, 각각의 경우에 대하여 총 방열면적을 산출 및 비교한다.5 and 6 schematically show the housing 10 of the same dimensions to which the annular heat radiation fins 11 and the vertical heat radiation fins 19 are applied, respectively, in the case of the annular heat radiation fins 11 of FIG. 5. Set the area of the top and bottom surfaces of the heat dissipation area, and in the case of the vertical heat dissipation fin 19 of FIG. Calculate and compare the area.

우선 도 5의 환형방열핀(11)은 직경이 하방으로 등차 축소되고 동일한 두께(t)를 가지는 다수의 환형방열핀(11)이 등간격(等間隔)으로 배치되고, 인접 환형방열핀(11)간 이격 거리가 환형방열핀(11)의 두께(t)와 동일한 조건을 가지며, 상단 환형방열핀(11)의 반경, 원통형 수납부(12)의 반경 및 원통형 수납부(12)의 높이를 각각 Rt, Rb 및 h라 하면, 총 방열면적은 다음의 수학식 1과 같이 표시될 수 있다.First, the annular radiating fins 11 of FIG. 5 are equally reduced in diameter downward, and a plurality of annular radiating fins 11 having the same thickness t are arranged at equal intervals, and are spaced apart from adjacent annular radiating fins 11. The distance has the same condition as the thickness t of the annular heat-dissipating fin 11, and the radius of the upper annular heat-dissipating fin 11, the radius of the cylindrical accommodating portion 12 and the height of the cylindrical accommodating portion 12 are R t and R, respectively. For b and h, the total heat dissipation area may be expressed by Equation 1 below.

Figure 112010037596746-pat00001
Figure 112010037596746-pat00001

또한 도 6의 수직방열핀(19)은 동일한 형상 및 크기의 직삼각형 수직방열핀(19)이 방사상(放射狀)으로 형성된 것으로, 동일한 두께(t)를 가지는 다수의 수직방열핀(19)이 도시된 바와 같이 등간격으로 배열되며, 수직방열핀(19) 상단 내접원의 반경, 원통형 수납부(12)의 반경 및 원통형 수납부(12)의 높이를 각각 Rt, Rb 및 h라 하면, 총 방열면적은 다음의 수학식 2와 같이 표시될 수 있다.In addition, the vertical radiating fin 19 of FIG. 6 is a vertical triangular vertical radiating fin 19 of the same shape and size is formed radially, as shown in the plurality of vertical radiating fins 19 having the same thickness (t). Arranged at equal intervals, if the radius of the inscribed circle on the top of the vertical radiating fin 19, the radius of the cylindrical housing 12 and the height of the cylindrical housing 12 are R t , R b and h, respectively, the total heat dissipation area is It may be represented as in Equation 2.

Figure 112010037596746-pat00002
Figure 112010037596746-pat00002

일반적인 규격 백열전구의 유리구(21) 직경이 58mm 내지 61mm이고, 나선캡(22) 직경이 38mm 내지 40mm이며, 나선캡(22) 접합부와 유리구(21) 중심간 거리가 58mm 내지 61mm임을 감안하면, 상단 환형방열핀(11)의 외경은 58mm 내지 61mm이며, 원통형 수납부(12)의 외경은 38mm 내지 40mm이고, 원통형 수납부(12)의 높이는 48mm 내지 52mm로 설정할 수 있으며, 이에, 상기 치수 범위의 평균치인 59.6mm, 39mm 및 50mm를 각각 상단 환형방열핀(11)의 외경, 원통형 수납부(12)의 외경 및 원통형 수납부(12)의 높이로 설정하여, 방열핀의 두께(t)별 총 방열면적을 산출하면 다음의 표 1과 같다.
Considering that the diameter of the glass bulb 21 of the general standard incandescent lamp is 58 mm to 61 mm, the diameter of the spiral cap 22 is 38 mm to 40 mm, and the distance between the spiral cap 22 junction and the center of the glass ball 21 is 58 mm to 61 mm. The outer diameter of the upper annular heat-radiating fin 11 is 58mm to 61mm, the outer diameter of the cylindrical housing 12 is 38mm to 40mm, the height of the cylindrical housing 12 can be set to 48mm to 52mm, thereby, the above dimension range 59.6 mm, 39 mm, and 50 mm, which are the average values, are set to the outer diameter of the upper annular heat radiating fin 11, the outer diameter of the cylindrical housing 12, and the height of the cylindrical housing 12, respectively, for the total heat dissipation according to the thickness (t) of the heat radiation fins. The area is calculated as shown in Table 1 below.

방열핀 두께별 방열면적Heat dissipation area by heat sink fin thickness t
(mm)t
(mm) 환형방열핀(11)Annular Heat Resistant Fins (11) 수직방열핀(19)Vertical Heat Resistant Fins (19) 면적차
ΣAi-n?A(㎟)Area difference
ΣAi-n? A (mm2) nn ΣAi(㎟)ΣAi (mm2) nn n?A(㎟)n? A (mm2) 0.30.3 8383 124,509124,509 258258 132,225132,225 -7,716-7,716 0.40.4 6363 93,78993,789 193193 98,91398,913 -5,124-5,124 0.50.5 5050 75,34575,345 155155 79,43879,438 -4,093-4,093 0.60.6 4242 63,05963,059 129129 66,11366,113 -3,054-3,054 0.70.7 3636 54,27954,279 110110 56,37556,375 -2,096-2,096 0.80.8 3131 47,67447,674 9797 49,71349,713 -2,039-2,039 0.90.9 2828 42,57342,573 8686 44,07544,075 -1,502-1,502 1One 2525 38,46838,468 7777 39,46339,463 -995-995 22 1313 20,05820,058 3939 19,98819,988 7070 33 88 13,82313,823 2626 13,32513,325 498498 44 66 10,75810,758 1919 9,7389,738 1,0201,020 55 55 8,9838,983 1515 7,6887,688 1,2951,295 66 44 7,6987,698 1313 6,6636,663 1,0351,035 77 44 6,9716,971 1111 5,6385,638 1,3331,333 88 33 6,1726,172 1010 5,1255,125 1,0471,047

상기 표 1과 표 1의 두께(t)별 면적차를 도시한 도 7을 통하여 알 수 있는 바와 같이, 환형방열핀(11)의 두께(t)가 2mm에 근접하면 환형방열핀(11) 적용 하우징(10)의 총 방열면적이 수직방열핀(19) 적용 하우징(10)의 총 방열면적을 추월하게 되며, 두께(t) 5mm 이상에서는 방열면적의 증가폭이 둔화되는 것을 확인할 수 있다.As can be seen from FIG. 7 showing the area difference for each thickness t of Table 1 and Table 1, when the thickness t of the annular heat radiation fin 11 approaches 2 mm, the housing to which the annular heat radiation fin 11 is applied ( The total heat dissipation area of 10) exceeds the total heat dissipation area of the housing 10 to which the vertical heat dissipation fins 19 are applied, and it can be seen that the increase in the heat dissipation area is slowed at a thickness t of 5 mm or more.

따라서, 일반적인 규격 백열전구 치수가 적용된 본 발명의 하우징(10)의 경우 환형방열핀(11)의 두께를 2mm 내지 5mm로 형성하는 것이 바람직하다.
Therefore, in the case of the housing 10 of the present invention to which the general standard incandescent bulb dimensions are applied, it is preferable to form the thickness of the annular heat-dissipating fin 11 to 2 mm to 5 mm.

10 : 하우징(housing)
11 : 환형방열핀(環形放熱pin)
12 : 수납부
19 : 수직방열핀
21 : 유리구
22 : 나선캡
31 : 투광덮개
41 : 엘이디(LED)
42 : 안정기10: housing
11: annular radiating fin
12: storage
19: vertical radiating fin
21: glass sphere
22: spiral cap
31: floodlight
41: LED
42: ballast

Claims (2)

삭제delete 하부에 나선캡(22)이 결합되고, 내부에 중공(中空)의 원통형 수납부(12)가 형성되어 엘이디(41) 및 구동회로가 설치되는 상광하협(上廣下狹)의 원뿔대형의 엘이디(41) 조명등용 하우징(10)으로서, 원통형 수납부(12)의 외주면에는 다수의 환형방열핀(11)이 형성되되, 환형방열핀(11)들의 중심은 원통형 수납부(12)의 중심선상에 위치하고, 상기 다수의 환형방열핀(11)은 원통형 수납부(12)의 중심선과 평행한 방향으로 등간격(等間隔)으로 배치되되, 환형방열핀(11)의 외경은 하방으로 등차(等差) 축소됨을 특징으로 하는 환형방열핀이 형성된 엘이디 하우징에 있어서,
환형방열핀(11)의 두께(t)와 인접 환형방열핀(11)간 이격 거리는 동일하고, 상단 환형방열핀(11)의 외경은 58mm 내지 61mm이며, 원통형 수납부(12)의 외경은 38mm 내지 40mm이고, 원통형 수납부(12)의 높이는 48mm 내지 52mm이며;
환형방열핀(11)의 두께는 2mm 내지 5mm임을 특징으로 하는 환형방열핀이 형성된 엘이디 하우징.The spiral cap 22 is coupled to the lower portion, and a hollow cylindrical housing portion 12 is formed therein so that the LED 41 and the cone-shaped cone of the upper and lower cones where the driving circuit is installed are arranged. (41) As a housing 10 for a lighting lamp, a plurality of annular heat-dissipating fins 11 are formed on the outer circumferential surface of the cylindrical accommodating portion 12, and the centers of the annular heat-dissipating fins 11 are located on the center line of the cylindrical accommodating portion 12. The plurality of annular radiating fins 11 are disposed at equal intervals in a direction parallel to the center line of the cylindrical housing 12, but the outer diameter of the annular radiating fins 11 is reduced uniformly downward. In the LED housing formed with an annular heat radiation fin,
The distance t between the thickness t of the annular heat sink fin 11 and the adjacent annular heat sink fins 11 is the same, and the outer diameter of the upper annular heat sink fins 11 is 58 mm to 61 mm, and the outer diameter of the cylindrical housing 12 is 38 mm to 40 mm. , The height of the cylindrical housing 12 is 48mm to 52mm;
The annular heat-dissipating fin (11) has a thickness of 2mm to 5mm LED housing formed with an annular heat-dissipating fin.
KR1020100055312A 2010-06-11 2010-06-11 Led housing with ring type heat pin KR101113048B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080098762A (en) * 2007-05-07 2008-11-12 한학수 The illuminator for using led lamp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080098762A (en) * 2007-05-07 2008-11-12 한학수 The illuminator for using led lamp

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