KR101093285B1 - Hot plate for hot embossing nano imprinting lithography apparatus - Google Patents

Hot plate for hot embossing nano imprinting lithography apparatus Download PDF

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Publication number
KR101093285B1
KR101093285B1 KR1020100075151A KR20100075151A KR101093285B1 KR 101093285 B1 KR101093285 B1 KR 101093285B1 KR 1020100075151 A KR1020100075151 A KR 1020100075151A KR 20100075151 A KR20100075151 A KR 20100075151A KR 101093285 B1 KR101093285 B1 KR 101093285B1
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South Korea
Prior art keywords
hot plate
substrate
heating
cooling
tube
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KR1020100075151A
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Korean (ko)
Inventor
김국원
전상범
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순천향대학교 산학협력단
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

PURPOSE: A thermal plate apparatus for a high temperature-embossing nano imprint lithography apparatus is provided to improve the accuracy of an imprint pattern structure by spirally arranging a heating tube and a cooling pipe. CONSTITUTION: Top and bottom thermal plate heats and cools a substrate. A thermal plate main body(10) has an empty internal space. A heating tube(21) is arranged in an internal space of the thermal plate main body and heats the substrate. A cooling tube(31) is arranged in the internal space of the thermal plate main body and cools the substrate. A transport unit(40) transfers one of the heating pipe and the cooling pipe to be closer to the substrate than the other one.

Description

Hot plate for hot embossing nano imprinting lithography apparatus

The present invention relates to a hot embossing nano imprinting lithography apparatus, and more particularly, to increase the rapid heating and rapid cooling efficiency of the hot plate by moving the cooling device and the heating device in the hot plate. A hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus.

Photolithography is the most widely used method for processing ultra-fine shapes of micrometer or nanometer line widths in the manufacturing process of semiconductors or display devices. Photolithography has limitations in that it is difficult to produce a shape in which the thin equipment is larger than 1 or a non-stepped shape such as optical prism. High-temperature embossing is emerging as a new alternative to overcome this limitation.

High temperature embossing is a method in which a substrate, for example, a glass substrate is heated above a glass transition temperature, and then press-molded the substrate with a stamp in which an ultra-fine shape is formed.

The high temperature embossing nanoimprint process, which is attracting attention as the next generation of nanolithography, was published in 1996 by Stephen Chou ("Imprint of Sub-25nm vias and trenches in polymers", Applied Physics Letters, 67 (21), p.3114-). 3116) for the first time.

An example of a general high temperature embossing nanoimprint lithography apparatus is described in FIGS. 1 and 2 of Korean Patent Registration No. 10-0761212 and the corresponding part of the detailed description, and an example of a conventional high temperature embossing nanoimprint lithography apparatus is disclosed in the Korean patent 3 to 5 of the registration number 10-0761212 and the corresponding part of the detailed description.

Such a high temperature embossing nanoimprint lithography apparatus has advantages in that the process is simple and inexpensive, and that the manufacturing of high fine equipment and non-stepped shapes is possible compared to the photocuring nanolithography apparatus.

However, in the conventional high temperature embossed nanoimprint lithography apparatus, a plurality of heating holes and cooling holes penetrate in a hot plate in a straight line, and a heating heater is built in each heating hole, and cooling gas flows through each cooling hole. Since the heating and cooling holes are formed in the shape of the through-holes in the hot plate because of the structure, the positions of the heating and cooling holes are no longer changed and fixed.

For this reason, in the heating step of the high temperature embossing nanoimprint lithography process, it is not only difficult to move the heating hole closer to the stamp than the cooling hole in the upper hot plate or to move the heating hole closer to the substrate than the cooling hole in the lower hot plate. In the cooling step of the high temperature embossing nanoimprint lithography process, it was difficult to move the cooling hole closer to the stamp than the heating hole in the upper hot plate, or to move the cooling hole closer to the substrate than the heating hole in the lower hot plate. As a result, the rapid heating capacity and the rapid cooling capacity of the hot plate were low.

At present, there is a need for a hot plate device for solving such low rapid heating ability and low rapid cooling ability.

Accordingly, it is an object of the present invention to increase the rapid cooling capacity and the rapid heating capacity of a hot plate device for a high temperature embossed nanoimprint lithography apparatus.

Another object of the present invention is to increase the productivity of the high temperature embossed nanoimprint lithography process by shortening the rapid cooling time and the rapid heating time of the hot plate device.

Another object of the present invention is to increase the temperature uniformity of the hot plate device to increase the accuracy of the imprinted pattern structure.

In order to achieve the above object, a hot plate device for a high temperature embossed nanoimprint lithography apparatus according to the present invention is disposed at an upper side and a lower side of a substrate, respectively, and has a high temperature plate having upper and lower hot plates respectively for heating and cooling the substrate. An embossing nanoimprint lithography apparatus, wherein each of the upper and lower hot plates comprises: a hot plate body having an empty inner space; A heating tube disposed in an inner space of the hot plate body to heat the substrate; A cooling tube disposed in an inner space of the hot plate body to cool the substrate; And a moving device for moving any one of the heating tube and the cooling tube closer to the substrate than the other.

Preferably, the moving device moves the heating tube closer to the substrate than the cooling tube in order to increase the rapid heating capability, and moves the cooling tube to the substrate rather than the heating tube in order to increase the rapid cooling capability. It is possible to move closer.

Preferably, the heating tube is any one of a heating tube for distributing a heating medium and a heating tube incorporating a heating coil, and the cooling tube may be a cooling tube for distributing a cooling medium.

Preferably, the heating tube and the cooling tube may be arranged in parallel to each other in a spiral.

Preferably, the moving device may be any one of a gear moving device and a cylindrical moving device.
In addition, a hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus according to the present invention for achieving the above object, the high temperature embossed nano imprint lithography having a hot plate disposed on one side of the substrate to heat and cool one side of the substrate In the apparatus, the hot plate, the hot plate body having an empty inner space; A heating tube disposed in an inner space of the hot plate body to heat the substrate; A cooling tube disposed in an inner space of the hot plate body to cool the substrate; And a moving device for moving any one of the heating tube and the cooling tube closer to the substrate than the other.

According to the present invention, a hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus has high rapid cooling and rapid heating capability since any one of the cooling device and the heating device in the hot plate body can move closer to the substrate than the other. Cooling and heating time can also be shortened, further increasing the productivity of high temperature embossed nanoimprint lithography processes. In addition, since the heating tube and the cooling tube are arranged spirally, the temperature of the imprint working surface is uniform, so that the accuracy of the imprint pattern structure can be maintained.

1 is a cutaway perspective view schematically showing the structure of a hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus according to the present invention.
FIG. 2 is an enlarged perspective view showing the moving device in the hot plate device shown in FIG. 1.
FIG. 3A is an exemplary view showing a state in which the gear shifter shown in FIG. 1 moves the heating tube closer to the substrate than the cooling tube in the heating step, and FIG. 3B shows the gear shifter shown in FIG. It is an exemplary view showing a state in which the cooling tube is moved closer to the substrate than the heating tube in the cooling step.
4 is a schematic structural diagram schematically showing a structure of a hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus according to another embodiment of the present invention.
5A to 5D are process flowcharts showing a high temperature embossing nanoimprint lithography process performed by applying a hot plate apparatus for a high temperature embossing nanoimprint lithography apparatus according to the present invention.

Hereinafter, a hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cutaway perspective view schematically showing the structure of a hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus according to an embodiment of the present invention. FIG. 2 is an enlarged perspective view showing the moving device in the hot plate device shown in FIG. 1.

1 and 2, the hot plate device 100 of the present invention includes a hot plate body 10, a heating device 20, a cooling device 30, and a moving device 40.

Here, the hot plate main body 10 can have a rectangular parallelepiped shape etc., for example. Although not illustrated in the drawing, the hot plate body 10 may have a cylindrical shape so as to correspond to a circular substrate, for example, a semiconductor wafer. The hot plate body 10 is preferably made of a material having excellent thermal conductivity, for example, metal, in order to efficiently heat and cool the stamp (not shown) and the substrate (not shown). In order to more uniformly heat or cool the stamp (not shown) or the substrate (not shown), one surface of the hot plate body 10, that is, the working surface in contact with the stamp (not shown) or the substrate (not shown) Silver preferably has a larger area than the stamp or substrate. The hot plate body 10 has a heating device 20, a cooling device 30, and an empty inner space 11 necessary for embedding the moving device 40, and is a press for a high temperature embossing nanoimprint lithography process. It is desirable to minimize the heat load required for heating and cooling by having a minimum thickness within a range for preventing the hot plate body 10 from being deformed by pressure.

The heating device 20 includes a heating tube 21 disposed in the inner space 11 of the hot plate body 10. The heating tube 21 distributes a liquid or gaseous heating medium therein to heat the stamp or substrate. On the other hand, although not shown in the drawing, the heating tube 21 supplies power to a heating coil embedded therein, for example, a heating coil (not shown) made of sus material to heat the stamp or the substrate. It is also possible. Hereinafter, for convenience of description, the present invention will be described based on the structure of the heating tube 21 for distributing a liquid or gaseous heating medium. In order to rapidly heat the stamp and the substrate, the heating tube 21 is preferably made of a material having excellent thermal conductivity, for example, a metal material. The heating tube 21 may be disposed, for example, in a spiral shape or the like, in order to maintain high precision of the heating density of the imprint working surface to maintain the precision of the imprint pattern structure. The heating tube 21 is shown, for example, as if two heating tubes are arranged spirally in parallel, but are actually composed of one heating tube, and the inlet 23 and the outlet 25 of the heating tube 21 are arranged. ) Penetrates one side wall of the hot plate body 10 and is disposed in close proximity. Of course, in addition to the spiral, the heating tube 21 can also be arrange | positioned in the form which can ensure the high heating density uniformity of the imprint working surface.

 In addition, the heating device 20 may further include a heating medium supply unit (not shown) disposed outside the hot plate body 10. The heating medium supply unit supplies the heating medium to the heating tube 21 through an inlet pipe (not shown) connected to the inlet port 23 to supply a liquid or gaseous heating medium, and an outlet connected to the outlet port 25. The heating medium flows out from the heating tube 21 through a tube (not shown). In addition, the heating medium supply unit, for example, is installed on the working surface of the hot plate body 10, the temperature sensor (not shown) for sensing the temperature of the hot plate body 10, and the hot plate according to the temperature value sensed by the temperature sensor It is possible to include a temperature controller (not shown) for adjusting the temperature of the heating medium to keep the body 10 constant at a desired heating temperature.

The cooling device 30 includes a cooling tube 31 disposed in the internal space 11 of the hot plate body 10. The cooling tube 31 cools the stamp or the substrate through a liquid cooling medium, for example, cooling water, or a gaseous cooling medium, for example, nitrogen gas. In order to rapidly cool the stamp and the substrate, the cooling tube 31 is preferably made of a material having excellent thermal conductivity, for example, a metal material. The cooling tube 31 may be arranged in an arrangement form corresponding to the heating tube 21, for example, in a spiral shape, which ensures high cooling density uniformity of the imprint working surface to maintain the precision of the imprint pattern structure. For sake. The cooling tube 31 is shown as if two cooling tubes are arranged in a spiral in parallel, but is actually composed of one cooling tube, and the inlet 33 and the outlet 35 of the cooling tube 31 are hot plated. One side wall portion of the main body 10, for example, the inlet 23 and the outlet 25 of the heating tube 21 may be disposed close to the side wall disposed. Furthermore, in order to reduce the size of the hot plate main body 10, the cooling tube 31 is preferably arranged in parallel with the heating tube 21.

In addition, the cooling apparatus 30 may further include a cooling medium supply unit (not shown) disposed outside the hot plate body 10. The cooling medium supply unit supplies the cooling medium to the cooling pipe 31 through an inlet pipe (not shown) connected to the inlet 33 to supply the cooling medium, and an outlet pipe (not shown) connected to the outlet 35. Through the cooling pipe 31). In addition, the cooling medium supply unit is installed on the working surface of the hot plate main body 10 and a temperature sensor (not shown) for sensing the temperature of the hot plate main body 10 and the hot plate main body 10 according to the temperature value sensed by the temperature sensor. It is possible to include a temperature control unit (not shown) for adjusting the temperature of the cooling medium to maintain a constant at a desired cooling temperature.

The moving device 40 may be configured to have a structure for vertically moving the heating tube 21 and the cooling tube 31 in the vertical direction. That is, the moving device 40 may be configured by a combination of a gear type moving device, for example, a rack gear and a pinion gear.

Here, the moving device 40 includes the first and second guide piece portions 41 and 43, the first and second rack gears 45 and 47, the pinion gear 49, and the like. The first and second guide piece portions 41 and 43, the first and second rack gears 45 and 47, and the pinion gear 49 are located on the center of the heating tube 20 and the cooling tube 30, for example. It is installed in the empty inner space of the protrusion 13 protruding upward in a substantially rectangular tube shape from a portion of the upper surface portion of the hot plate body 10. The first and second guide piece portions 41 and 43 are fastened to the inner side surfaces of the opposing side wall portions of the protruding portion 13 so that the respective guide groove portions 42 are positioned to face each other. The guide groove 42 is formed on one surface of the first and second guide pieces 41 and 43 facing each other in order to guide the vertical movement of the first and second rack gears 45 and 47 in the vertical direction. In part, it is formed in groove shape, for example, trapezoidal shape.

The first and second rack gears 45 and 47 each have a protrusion 46 of a shape corresponding to the guide groove 42. First and second guide pieces, such that the protrusions 46 of the first and second rack gears 45 and 47 move along the guide grooves 42 of the first and second guide pieces 41 and 43. It is inserted into the guide groove 42 of 41 and 43, respectively.

The pinion gear 49 is disposed between the first and second rack gears 45 and 47 and meshes with the first and second rack gears 45 and 47 simultaneously. The central shaft 48 of the pinion gear 49 extends horizontally by inserting the central hole portion of the pinion gear 49, and one extended end of the central shaft 48 penetrates the one side wall portion of the protrusion 13 to protrude. 13) It is fastened with the outer center shaft drive part, for example, the motor part 50. The motor unit 50 can rotate the central axis 48 in both directions, for example, clockwise and counterclockwise.

The first and second support parts 61 and 63 are fastened to the lower side of the first and second rack gears 45 and 47, respectively, and are positioned above the heating tube 21 and the cooling tube 31. The tube 21 and the cooling tube 31 are horizontally supported. Although only left and right ends of the first and second support parts 61 and 63 are shown as supporting the heating tube 21 and the cooling tube 31 in the drawing, the heating tube 21 and cooling are respectively shown. In order to support the tube 31 more horizontally, not only both ends of the first and second support portions 61 and 63 but also a plurality of portions support the heating tube 21 and the cooling tube 31, respectively. It is possible.

FIG. 3A is an exemplary view showing a state in which the gear shifter shown in FIG. 1 moves the heating tube closer to the substrate than the cooling tube in the heating step, and FIG. 3B shows the gear shifter shown in FIG. Exemplary diagram showing a state in which the cooling tube moved closer to the substrate than the heating tube in the cooling step.

Referring to FIG. 3A, when the pinion gear 49 is rotated by the motor unit 50 in one direction, for example counterclockwise, the first rack gear 45 meshes with the pinion gear 49 to vertically descend. In addition, the first support part 61 and the heating tube 21 are also vertically lowered. At the same time, the second rack gear 47 meshes with the pinion gear 49 to vertically rise, and at the same time, the second support portion 63 and the cooling pipe 31 also vertically rise.

Therefore, in the heating step, the substrate can be heated in a state in which the heating tube 21 is moved to a point closer to the substrate (not shown) than the cooling tube 31, so that the rapid heating capability can be increased.

Referring to FIG. 3B, when the pinion gear 49 is rotated by the motor unit 50 in one direction, for example clockwise, the first rack gear 45 meshes with the pinion gear 49 to vertically rise. In addition, the first support part 61 and the heating tube 21 also rise vertically. At the same time, the second rack gear 47 is engaged with the pinion gear 49 and descends vertically, and at the same time, the second support portion 63 and the cooling pipe 31 are also lowered vertically.

Therefore, in the cooling step, the substrate can be cooled in a state where the cooling tube 31 is moved to a point closer to the substrate (not shown) than the heating tube 21, so that the rapid cooling capability can be increased.

Therefore, this invention can raise both a rapid heating capability and a rapid cooling capability compared with the conventional.

4 is a schematic structural diagram schematically showing a structure of a hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus according to another embodiment of the present invention.

Referring to FIG. 4, the hot plate device 200 of the present invention is similar to the hot plate device 100 of FIG. 1 except that the cylindrical moving device 140 is used instead of the gear type moving device 40 of FIG. 1. Do.

Here, the cylindrical moving device 140 is a device for vertically moving the heating tube 21 and the cooling tube 31 vertically in the empty inner space 111 of the hot plate body 110, and a plurality of pairs. For example, three pairs of the first and second cylinder parts 141 and 143, the first and second support parts 161 and 163, and the like. The first and second cylinder parts 141 and 143 move the first and second support parts 161 and 163 in directions opposite to each other. Of course, it is also possible to use one pair of first and second cylinder parts 141 and 143 instead of three pairs of first and second cylinder parts 141 and 143.

The pair of first and second support portions 161 and 163 are fastened to the lower ends of the cylinder shafts (not shown) of the first and second cylinder portions 141 and 143, respectively, to heat the heating tube 21. And it is located above the cooling tube 31, and supports the heating tube 21 and the cooling tube 31 horizontally.

 In the figure, each pair of first and second support portions 161 and 163 are shown as supporting only three portions of the heating tube 21 and the cooling tube 31, respectively, but the heating tube 21 and cooling are shown. In order to support the tube 31 more horizontally, more than three pairs of first and second support portions 161, 163 are provided for the corresponding plurality of portions of the heating tube 21 and the cooling tube 31. It is also possible to support each.

In the hot plate device 200 configured as described above, the first cylinder portion 141 vertically lowers the first support portion 161, and the second cylinder portion 143 vertically raises the second support portion 163. When the heating tube 21 is lowered vertically, the cooling tube 31 is vertically raised. When the first cylinder portion 141 vertically raises the first support portion 161 and the second cylinder portion 143 vertically lowers the second support portion 163, the heating tube 21 is vertically raised. The cooling tube 31 is then vertically lowered.

 Therefore, in the heating step, the substrate can be heated while the heating tube is moved to a point closer to the substrate than the cooling tube, so that the rapid heating capability can be increased. Further, in the cooling step, the substrate can be cooled in a state in which the cooling tube is moved to a point closer to the substrate than the heating tube, so that the rapid cooling capability can be increased.

Therefore, this invention can raise both the rapid heating capability and the rapid cooling capability compared with the prior art.

Hereinafter, for convenience of description, a process of forming a nanopattern on a substrate based on a high temperature embossed nanoimprint lithography apparatus having a hot plate device to which a gear type moving device is applied will be described with reference to FIGS. 5A to 5C.

5A to 5D are process flowcharts showing a high temperature embossing nanoimprint lithography process performed by applying a hot plate apparatus for a high temperature embossing nanoimprint lithography apparatus according to the present invention. On the other hand, for convenience of description, in order to help understand the vertical movement of the heating tube 21 and the cooling tube 31, the inside of the upper hot plate 510 and the lower hot plate 520, respectively, the heating tube 21 and Only cooling tube 31 is shown as present.

Referring to FIG. 5A, first, a high temperature embossing nanoimprint lithography apparatus (not shown) includes an upper hot plate 510, for example, the same upper hot plate 510 as the hot plate apparatus 100 of the present invention shown in FIGS. 1 to 2. And a lower hot plate 520, for example, the same as the hot plate device 100 shown in FIGS. 1 and 2. In addition, the stamp 530 is installed on the working surface of the upper hot plate 510. Here, a pattern corresponding to a pattern for imprinting the substrate 550, for example, a nanometer pattern, is formed on one surface of the stamp 530, for example, the surface in contact with the substrate 550.

In this state, the substrate 550 is placed on the lower hot plate 520. Subsequently, the upper hot plate 510 and the lower hot plate 520 are heated. That is, the heating tube 21 is moved closer to the substrate 550 than the cooling tube 31 by the moving device, for example, the gear type moving device 40 of FIG. 3A, and the cooling tube ( 31) the flow of the cooling medium is stopped, and the upper hot plate 510 and the lower hot plate 520 are heated by flowing the heating medium into the heating tube 21 by the heating medium supply unit. Accordingly, the heat of the upper hot plate 510 and the lower hot plate 520 is transferred to the stamp 530 and the substrate 550.

Therefore, the present invention moves the heating tube 21 closer to the substrate 550 than the cooling tube 31 and heats the upper hot plate 510 and the lower hot plate 520 as compared with the related art, thereby increasing the rapid heating capability. Furthermore, the time of a heating step can be shortened.

Referring to FIG. 5B, after the upper hot plate 510 and the lower hot plate 520 are sufficiently heated, the upper hot plate 510 is lowered toward the lower hot plate 520 so that the substrate 550, for example, a substrate made of a polymer material. Press. Accordingly, a pattern corresponding to the pattern of the stamp 530 is imprinted on the substrate 550.

Referring to FIG. 5C, after the pattern of the substrate 550 is imprinted, the upper hot plate 510 and the lower hot plate 520 are cooled. That is, the cooling tube 31 is moved closer to the substrate 550 than the heating tube 21 by the moving device, for example, the gear type moving device 40 of FIG. 3B, and the heating tube ( 21, the heating medium is stopped, and the upper hot plate 510 and the lower hot plate 520 are cooled by flowing the cooling medium into the cooling tube 31 by the cooling medium supply unit.

Therefore, in the present invention, since the cooling tube 31 is moved closer to the substrate 550 than the heating tube 21 and the upper hot plate 510 and the lower hot plate 520 are cooled, the rapid cooling ability can be improved. Furthermore, the time of the cooling step can be shortened.

 Referring to FIG. 5D, after the upper hot plate 510 and the lower hot plate 520 are sufficiently cooled, the upper hot plate 510 is raised to separate the upper hot plate 510 from the substrate 550.

Therefore, this invention can raise both the rapid heating capability and the rapid cooling capability of a high temperature embossing nanoimprint lithography apparatus. In addition, in the high temperature embossed nanoimprint lithography process, both the heating step and the cooling step can be shortened.

As described above, the present invention described the features and technical advantages of the present invention with reference to the preferred embodiments in order to better understand the claims of the present invention described below, but changes, modifications, and variations of the present invention It can be implemented by those skilled in the art without departing from the spirit or scope of the invention as defined only by the claims.

100, 200: hot plate device 320: unit probe module
10, 110: hot plate body
20: heating device
21: heating tube
23: heating medium inlet 25: heating medium outlet
30: cooling device
31: cooling tube
33: cooling medium inlet 35: cooling medium outlet
40, 140: mobile device
41, 43: First and second guide part
42: guide groove
45, 47: 1st, 2nd rack gear
46: protrusion
49: pinion gear 50: motor unit
141, 143: 1st, 2nd cylinder part
161 and 163: first and second support parts

Claims (6)

A high temperature embossed nanoimprint lithography apparatus having upper and lower hot plates respectively disposed above and below a center of a substrate to heat and cool the substrate.
Each of the upper and lower hot plates,
Hot plate body having an empty interior space;
A heating tube disposed in an inner space of the hot plate body to heat the substrate;
A cooling tube disposed in an inner space of the hot plate body to cool the substrate; And
And a moving device for moving one of the heating tube and the cooling tube closer to the substrate than the other one.
The apparatus of claim 1, wherein the moving device moves the heating tube closer to the substrate than the cooling tube in order to increase the rapid heating ability, and moves the cooling tube more than the heating tube in order to increase the rapid cooling ability. A hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus, characterized in that it moves closer to the substrate.
The heating tube according to claim 1, wherein the heating tube is any one of a heating tube for distributing a heating medium and a heating tube incorporating a heating coil.
The cooling tube is a hot plate apparatus for a high temperature embossed nanoimprint lithography apparatus, characterized in that the cooling tube for distributing a cooling medium.
The hot plate apparatus according to claim 1, wherein the heating tube and the cooling tube are arranged in parallel to each other in a helical manner.
The hot plate device of claim 1, wherein the moving device is one of a gear moving device and a cylindrical moving device. A high temperature embossing nanoimprint lithography apparatus having a hot plate disposed on one side of a substrate and heating and cooling one side of the substrate,
The hot plate,
Hot plate body having an empty interior space;
A heating tube disposed in an inner space of the hot plate body to heat the substrate;
A cooling tube disposed in an inner space of the hot plate body to cool the substrate; And
And a moving device for moving one of the heating tube and the cooling tube closer to the substrate than the other one.
KR1020100075151A 2010-08-04 2010-08-04 Hot plate for hot embossing nano imprinting lithography apparatus KR101093285B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112379579A (en) * 2020-11-10 2021-02-19 芯米(厦门)半导体设备有限公司 Substrate cold and hot processing device

Citations (3)

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