KR101081065B1

KR101081065B1 - Solar cell aparatus

Info

Publication number: KR101081065B1
Application number: KR1020090058830A
Authority: KR
Inventors: 박희선
Original assignee: 엘지이노텍 주식회사
Priority date: 2009-06-30
Filing date: 2009-06-30
Publication date: 2011-11-07
Also published as: KR20110001335A

Abstract

A photovoltaic device is disclosed. The solar cell apparatus includes a substrate; A plurality of first sub modules disposed in a first row on the substrate; A plurality of second sub-modules arranged in a second row in parallel with the first sub-modules on the substrate; And a bus bar directly connected to one of the first sub modules and directly connected to one of the second sub modules.

Line, sub, module, solar cell, parallel, series

Description

Solar Power Plant {SOLAR CELL APARATUS}

Embodiments relate to a photovoltaic device.

Recently, as energy demand increases, development of a solar cell converting solar energy into electrical energy is in progress.

In particular, CIGS-based solar cells that are pn heterojunction devices having a substrate structure including a glass substrate, a metal back electrode layer, a p-type CIGS-based light absorbing layer, a high resistance buffer layer, an n-type window layer, and the like are widely used.

Research is underway to improve the performance of such solar cells.

Embodiments provide a photovoltaic device that can be easily manufactured, includes a sub-module that can be cut into various sizes, can easily repair defects, and can be designed in various forms.

Photovoltaic device according to one embodiment includes a substrate; A plurality of first sub modules disposed in a first row on the substrate; A plurality of second sub-modules arranged in a second row in parallel with the first sub-modules on the substrate; And a bus bar directly connected to one of the first sub modules and directly connected to one of the second sub modules.

Photovoltaic device according to one embodiment includes a substrate; A plurality of first sub modules disposed in a first row on the substrate; A plurality of second sub-modules arranged in a second row in parallel with the first sub-modules on the substrate; And a connection member connecting one of the first sub modules and one of the second sub modules in series.

In one embodiment, a solar cell apparatus includes: a substrate on which a first line region and a second line disposed in parallel with the first line region are defined; A first sub module disposed in the first line region; A second submodule disposed in the first line region and arranged in line with the first submodule; A third sub module disposed in the second line region; A fourth sub module disposed in the second line region and arranged in line with the third sub module; And a bus bar disposed on an upper surface of the first sub module and the third sub module.

In one embodiment, a solar cell apparatus includes: a substrate on which a first line region and a second line disposed in parallel with the first line region are defined; A first sub module disposed in the first line region; A second submodule disposed in the first line region and arranged in line with the first submodule; A third sub module disposed in the second line region; A fourth submodule disposed in the second line region and arranged in line with the third submodule; A first connecting member connecting the first sub module and the third sub module in series; And a second connection member connecting the first sub module and the second sub module in series.

The solar cell apparatus according to the embodiment includes first sub-modules arranged in a first row and second sub-modules arranged in a second row.

That is, the solar cell apparatus according to the embodiment includes a plurality of sub modules. In this case, the sub modules may be cut into various sizes, and sub modules having low performance may be cut and replaced with other sub modules.

In addition, the solar cell apparatus according to the embodiment may connect the sub-modules in various ways such as a series or parallel connection by using a connection member.

In addition, the sub-modules can be easily manufactured by a mask or the like, and the solar cell apparatus according to the embodiment can be easily manufactured.

In the description of the embodiment, each substrate, panel, member, layer, electrode, or cell is formed on or under the "on" of each substrate, panel, member, layer, electrode, or cell, or the like. When described as being "in" and "under" includes both those that are formed "directly" or "indirectly" through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is a plan view illustrating a solar cell apparatus according to an embodiment. 2 is a plan view illustrating a submodule. 3 is a cross-sectional view illustrating a cross section taken along line AA ′ in FIG. 1. 4 is a cross-sectional view illustrating a cross section taken along line B-B 'of FIG. 1.

1 to 4, a photovoltaic device according to an embodiment includes a support substrate 10, first submodules 100, second submodules 200, and third submodules 300. And fourth sub modules 400, a first bus bar 600, and a second bus bar 700.

The support substrate 10 has a plate shape. The support substrate 10 supports the first to fourth sub modules 100... 400, the first bus bar 600, and the second bus bar 700.

The support substrate 10 may be rigid or flexible. The support substrate 10 may be, for example, a metal substrate, a plastic substrate, or a glass substrate. The support substrate 10 may be, for example, a soda lime glass substrate.

The support substrate 10 may be divided into a plurality of line regions LA1... LA4. For example, the support substrate 10 may include a first line area LA1, a second line area LA2, a third line area LA3, and a fourth line area LA4.

The first line area LA1 has a shape extending in a first direction.

The second line area LA2 has a shape extending in the first direction. The second line area LA2 is disposed in parallel with the first line area LA1.

The third line area LA3 has a shape extending in the first direction. The third line area LA3 is disposed adjacent to the second line area LA2 in parallel with the second line area LA2.

The fourth line area LA4 has a shape extending in the first direction. The fourth line area LA4 is disposed adjacent to the third line area LA3 in parallel with the third line area LA3.

The first submodules 100 are disposed in the first line area LA1. The first submodules 100 are arranged in a first row. For example, four first sub-modules are arranged in a row in the first direction in the first line area LA1.

As shown in FIG. 2, each first submodule 100 includes a plurality of cells C1... C5. The cells C1 ... C5 are connected in series with each other.

As shown in FIG. 3, the first submodules 100 include a back electrode layer 110, a light absorbing layer 120, a buffer layer 130, a high resistance buffer layer 140, and a window layer 150. .

The back electrode layer 110 is disposed on the support substrate 10. The back electrode layer 110 is the first back electrode layer 110 is a conductor, and examples of the material used as the back electrode layer 110 may include molybdenum and the like.

The light absorbing layer 120 is disposed on the back electrode layer 110. The light absorbing layer 120 may include a group I-III-VI compound. For example, the light absorbing layer 120 may be formed of copper-indium-gallium-selenide (Cu (In, Ga) Se ₂ ). ; CIGS-based) may have a crystal structure, a copper-indium-selenide-based or a copper-gallium-selenide-based crystal structure.

The energy band gap of the light absorbing layer 120 may be about 1 eV to 1.8 eV.

The buffer layer 130 is disposed on the light absorbing layer 120. Examples of the material used as the buffer layer 130 include cadmium sulfide and the like.

The high resistance buffer layer 140 is disposed on the buffer layer 130. Examples of the material used as the high resistance buffer layer 140 include undoped zinc oxide and the like.

The window layer 150 is disposed on the high resistance buffer layer 140. Examples of the material used as the window layer include aluminum doped zinc oxide and the like.

The first sub-module 100 is divided into the cells C1... C5 by the groove patterns formed in the layers 110.

As shown in FIG. 1 and FIG. 3, the first sub modules 100 are connected in series with each other. Two first sub-modules 100a and 100b adjacent to each other are connected in series with each other by the connection member 500.

In more detail, two first sub-modules 100a and 100b adjacent to each other are connected in series with each other by the connection member 500.

The connection member 500 is in contact with the back electrode layer 110a of one first submodule 100a and in contact with the window layer 150b of the adjacent first submodule 100b.

In more detail, the top surface of the back electrode layer 110a of the first sub module 100a is exposed, and the connection member 500 directly contacts the top surface of the exposed back electrode layer 110a. In addition, the connection member 500 directly contacts the upper surface of the window layer 150b of the adjacent first submodule 100b.

The connection member 500 is a conductor, and may be, for example, a conductive tape or a conductive paste.

The second submodules 200 are disposed in the second line area LA2. The second submodules 200 are arranged in a second row. For example, four second sub-modules 200 are arranged in a row in the first direction in the second line area LA2.

In addition, each of the second submodules 200 includes a plurality of cells connected in series with each other, like the first submodules 100.

In addition, each of the second submodules 200 includes a back electrode layer, a light absorbing layer, a buffer layer, a high resistance buffer layer, and a window layer that are sequentially stacked and formed like the first submodules 100.

In addition, the second sub-modules 200 are connected to each other in series. In the same manner as the first sub-modules 100, the second sub-modules adjacent to each other are connected in series to each other by the connecting member 500.

The third sub modules 300 are disposed in the third line area LA3. The third submodules 300 are arranged in a third row. For example, four third sub-modules are arranged in a row in the first direction in the third line area LA3.

In addition, each of the third submodules 300 includes a plurality of cells connected in series with each other, like the first submodules 100.

Each of the third submodules 300 includes a back electrode layer, a light absorbing layer, a buffer layer, a high resistance buffer layer, and a window layer that are sequentially stacked and formed like the first submodules 100.

In addition, the third submodules 300 are connected to each other in series. In the same manner as the first sub modules 100, the third sub modules adjacent to each other are connected in series to each other by the connection member 500.

The fourth submodules 400 are disposed in the fourth line area LA4. The fourth submodules 400 are arranged in a fourth row. For example, four fourth sub-modules 400 are arranged in a row in the first direction in the fourth line area LA4.

In addition, each of the fourth submodules 400 includes a plurality of cells connected in series with each other, like the first submodules 100.

In addition, each of the fourth submodules 400 includes a back electrode layer, a light absorbing layer, a buffer layer, a high resistance buffer layer, and a window layer that are sequentially stacked and formed like the first submodules 100.

In addition, the fourth sub-modules 400 are connected to each other in series. In the same manner as the first sub modules 100, the fourth sub modules adjacent to each other are connected in series to each other by the connecting member 500.

As shown in FIGS. 1 and 4, the first bus bar 600 is disposed at one end of the support substrate 10. The first bus bar 600 has a shape extending in a second direction. The first bus bar 600 may be a conductor, and the first bus bar 600 may be, for example, a conductive tape or a conductive paste.

The first bus bar 600 is disposed over the first to fourth line regions LA1... LA4. The first bus bar 600 is disposed on the first to fourth sub modules 100... 400. In more detail, the first bus bar 600 may include one of the first sub-modules 100, one of the second sub-modules 200, one of the third sub-modules 300 and the first sub-module. Disposed on one of the four sub-modules 400.

In addition, the first bus bar 600 is in contact with the top surface of the first to fourth sub-modules 100. In more detail, the first bus bar 600 may include one of the first sub-modules 100, one of the second sub-modules 200, one of the third sub-modules 300 and the first sub-module. The upper surface of one of the four sub-modules 400 is in direct contact.

In addition, the first bus bar 600 is electrically connected to the first to fourth sub-modules 100... 400. In more detail, the first bus bar 600 may include one of the first sub-modules 100, one of the second sub-modules 200, one of the third sub-modules 300 and the first sub-module. Is directly connected to one of the four sub modules 400.

In more detail, the first bus bar 600 is directly connected to the upper surface of the outermost cell C5 of the first submodule 101 disposed at one end. Similarly, the first bus bar 600 is directly connected to the upper surface of the outermost cell of the second to fourth sub modules 201, 301, 401 disposed at one end.

The second bus bar 700 is disposed at the other end of the support substrate 10. The second bus bar 700 has a shape extending in a second direction. The second bus bar 700 may be a conductor, and the second bus bar 700 may be, for example, a conductive tape or a conductive paste.

The second bus bar 700 is disposed over the first to fourth line areas LA1... LA4. The second bus bar 700 is disposed on the first to fourth sub modules 100... 400. In more detail, the second bus bar 700 may include one of the first sub-modules 100, one of the second sub-modules 200, one of the third sub-modules 300 and the first sub-module. Disposed on one of the four sub-modules 400.

In addition, the second bus bar 700 is in contact with the top surface of the first to fourth sub-modules (100 ... 400). In more detail, the second bus bar 700 may include one of the first sub-modules 100, one of the second sub-modules 200, one of the third sub-modules 300 and the first sub-module. The upper surface of one of the four sub-modules 400 is in direct contact.

In addition, the second bus bar 700 is electrically connected to the first to fourth sub-modules 100... 400. In more detail, the second bus bar 700 may include one of the first sub-modules 100, one of the second sub-modules 200, one of the third sub-modules 300 and the first sub-module. Is directly connected to one of the four sub modules 400.

In more detail, the second bus bar 700 is directly connected to the upper surface of the outermost cell C1 of the first submodule 102 disposed at the other end. Similarly, the first bus bar 600 is directly connected to the upper surface of the outermost cell of the second to fourth submodules 202, 302, 402 disposed at one end.

The first sub-module 100, the second sub-module 200, the third sub-module 300 and the fourth sub-module 400 are the first bus bar 600 and the By the second bus bar 700, they are connected in parallel.

The solar cell apparatus according to the embodiment includes the first to fourth sub modules 100... 400. In this case, some of the first to fourth sub modules 100... 400 may be cut.

Thus, sub modules with very low power can be easily removed or replaced. Therefore, the photovoltaic device according to the embodiment can prevent the performance degradation of the entire photovoltaic device by the sub module having a very low output.

In addition, the first to fourth sub-modules 100... 400 may be connected in various ways by the connection member 500, the first bus bar 600, and the second bus bar 700. Can be. The solar cell apparatus according to the embodiment may be modified into various connection structures in addition to the connection structure shown in FIG. 1.

5 to 8 are cross-sectional views illustrating a method of manufacturing the solar cell apparatus according to the embodiment. In the description of the present manufacturing method, reference is made to the description of the foregoing photovoltaic device.

Referring to FIG. 5, a back electrode layer is formed on the support substrate 10. The back electrode layer 110 is formed on the entire surface of the support substrate 10. Molybdenum may be deposited on the support substrate 10 by sputtering fixing to form the back electrode layer 110.

Referring to FIG. 6, a mask 20 is disposed on the back electrode layer 110. Thereafter, the light absorbing layer 120, the buffer layer 130, the high resistance buffer layer 140, and the window layer 150 are formed on the back electrode layer 110 through the mask 20.

The light absorbing layer 120 evaporates copper, indium, gallium, and selenium simultaneously or separately to evaporate the light absorbing layer 120 of copper-indium-gallium-selenide (Cu (In, Ga) Se ₂ ; CIGS-based). It may be formed by a method of forming and a method of forming a metal precursor film and then forming it by a selenization process.

Thereafter, the buffer layer 130 may be formed by the sputtering process through the mask 20.

Subsequently, zinc oxide without impurity doping is deposited on the buffer layer 130 through the mask 20, and the high resistance buffer layer 140 is formed on the buffer layer 130.

Thereafter, zinc oxide doped with aluminum is deposited on the high resistance buffer layer 140 through the mask 20 to form the window layer 150.

In response to the mask 20, a first groove pattern 160 is formed in the light absorbing layer 120, the buffer layer 130, the high resistance buffer layer 140, and the window layer 150. First to fourth sub-modules 100... 400 are divided by the first groove pattern 160.

Unlike this, the mask 20 may not be used, and the first groove pattern 160 may be formed. That is, the first groove pattern 160 may be formed by mechanical scribing or laser.

Referring to FIG. 7, a second groove pattern 170 is formed on the back electrode layer 110, and the back electrode layer 110 is first to fourth sub-modules by the second groove pattern 170. (100..400).

The first groove pattern 160 may be formed, the second groove pattern 170 may be formed, and conversely, after the second groove pattern 170 is formed, the first groove pattern 160 may be formed. Can be. That is, after the back electrode layer 110 is patterned, the light absorbing layer 120, the buffer layer 130, the high resistance buffer layer 140, and the window layer 150 may be formed.

Referring to FIG. 8, a connection member 500, a first bus bar 600, and a second bus bar 700 directly contacting the exposed back electrode layer 110a and the adjacent window layer 150b are formed.

In this case, before the connection member 500, the first bus bar 600, and the second bus bar 700 are formed, a sub module having a very low output may be removed or replaced.

In the method of manufacturing the solar cell apparatus according to the embodiment, the first groove pattern 160 may be formed by a mask.

Therefore, the embodiment can easily provide a solar cell apparatus capable of removing defects and repairable.

9 is a plan view illustrating a solar cell apparatus according to another embodiment. 10 is a plan view illustrating a process in which a first submodule and a second submodule are connected in series. FIG. 11 is a cross-sectional view taken along the line CC ′ in FIG. 9. 12 is a cross-sectional view illustrating a cross section taken along line D-D` in FIG. 9. FIG. 13 is a cross-sectional view taken along the line E-E` in FIG. 10. In the description of the present embodiment, with reference to the above-described embodiments, the connection structure of the first to fourth sub-modules, the second connection member, and the first and second bus bars will be further described. The description of the foregoing embodiments can be essentially combined with the description of this embodiment except for the changed part.

9 to 13, the first sub-modules 100, the second sub-modules 200, the third sub-modules 300 and the fourth sub-modules 400 each other. Are connected in series.

That is, the first sub modules 100 are not only connected in series with each other, but also connected in series with the second sub modules 200. In more detail, the first submodule 101 disposed at one end is connected in series to the second submodule 201 disposed at one end.

In addition, the second submodules 200 are not only connected in series with each other, but also connected in series with the third submodules 300. In more detail, the second submodule 202 disposed at the other end is connected in series to the third submodule 302 disposed at the other end.

Similarly, the third submodules 300 are not only connected in series with each other, but also connected in series with the fourth submodules 400. In more detail, the third submodule 301 disposed at one end is connected in series to the fourth submodule 401 disposed at one end.

The photovoltaic device according to the embodiment includes a first connection member 510 and a second connection member 520.

The first connection member 510 connects the first sub modules 100 to each other, the second sub modules 200 to each other, the third sub modules 300 to each other, and the fourth The sub modules 400 are connected to each other.

As shown in FIG. 11, the first connection member 510 connects the back electrode layer 110a and the window layer 150b of the first sub-modules 100a and 100b adjacent to each other. In this case, the first connection member 510 is in contact with the exposed region 111 of the back electrode layer 110a of the first sub module 100a. In addition, the first connection member 510 is in contact with an upper surface of the window layer 150b of the adjacent first submodule 100b.

As illustrated in FIG. 12, the first connection member 510 is connected to the back electrode layer 210b and the window layer 250a of the second submodules 200a and 200b adjacent to each other. In this case, the first connection member 510 is in contact with the top surface of the window layer 250a of one second submodule 200a. In addition, the first connection member 510 is in contact with the exposed area 211 of the back electrode layer 210b of the adjacent second submodule 200b.

Here, the exposed regions 111 and 211 of the back electrode layer are disposed in the direction in which the electrons move. 10 to 12, the direction in which the exposed regions of the back electrode layers of the first sub-modules 100 and the third sub-modules 300 are disposed is the second sub-modules 200. ) And a direction in which the exposed areas of the back electrode layers of the fourth sub-modules 400 are disposed.

That is, when viewed in a plane, directions of currents flowing through the first submodules 100 and the third submodules 300 are the second submodules 200 and the fourth submodules 400. This is opposite to the direction of the current flowing in).

As shown in FIGS. 9, 10, and 13, the second connection member 520 connects the first sub-modules 100 and the second sub-modules 200 in series. In addition, the second connection member 520 connects the second submodules 200 and the third submodules 300 in series. In addition, the second connection member 520 connects the third sub modules 300 and the fourth sub modules 400 in series.

In more detail, the second connection member 520 connects the back electrode layer 110b of the first submodule 101 disposed at one end and the window layer 250 of the second submodule 201 disposed at one end. . In more detail, the second connection member 520 is an exposed upper surface of the back electrode layer 110a of the first sub module 101 disposed at one end and the window layer 250 of the second sub module 201 disposed at one end. Contact with the upper surface of the

The second connection member 520 connects the second sub module 202 disposed at the other end and the third sub module 302 disposed at the other end in the same manner as described above. Similarly, the second connection member 520 connects the third sub module 301 disposed at one end and the fourth sub module 401 disposed at one end.

The first connection member 510 and the second connection member 520 are conductors, and for example, may be a conductive tape or a conductive paste.

The first bus bar 600 is connected to a first sub module 102 disposed at the other end, and the second bus bar 700 is connected to a fourth sub module 402 disposed at the other end.

In this embodiment, the first to fourth sub modules 100... 400 are connected in series. The first to fourth sub-modules 100... 400 may be connected in various ways by the first connection member 510 and the second connection member 520.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. In addition, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

Although described above with reference to the embodiment is only an example and is not intended to limit the invention, those of ordinary skill in the art to which the present invention does not exemplify the above within the scope not departing from the essential characteristics of this embodiment It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is a plan view illustrating a solar cell apparatus according to an embodiment.

2 is a plan view illustrating a submodule.

3 is a cross-sectional view illustrating a cross section taken along line AA ′ in FIG. 1.

4 is a cross-sectional view illustrating a cross section taken along line B-B 'of FIG. 1.

5 to 8 are cross-sectional views illustrating a method of manufacturing the solar cell apparatus according to the embodiment.

9 is a plan view illustrating a solar cell apparatus according to another embodiment.

10 is a plan view illustrating a process in which a first submodule and a second submodule are connected in series.

FIG. 11 is a cross-sectional view taken along the line CC ′ in FIG. 9.

12 is a cross-sectional view illustrating a cross section taken along line D-D` in FIG. 9.

FIG. 13 is a cross-sectional view taken along the line E-E` in FIG. 10.

Claims

Board;

A plurality of first sub modules disposed in a first row on the substrate;

A plurality of second sub-modules arranged in a second row in parallel with the first sub-modules on the substrate; And

A bus bar connected directly to one of the first sub-modules, and directly connected to one of the second sub-modules,

The first sub modules are spaced apart from each other,

The second submodules are spaced apart from each other,

The first submodules and the second submodules, respectively,

A back electrode layer disposed on the substrate;

A light absorbing layer disposed on the back electrode layer; And

A window layer disposed on the light absorbing layer,

The back electrode layers included in the first sub modules and the second sub modules are disposed on the same plane as each other.

The light absorbing layers included in the first submodules and the second submodules are disposed on the same plane as each other.

The solar cell apparatus of claim 1, wherein the window layers included in the first sub-modules and the second sub-modules are disposed on the same plane.

Forming a back electrode layer on the substrate;

Forming a light absorbing layer on the back electrode layer;

Forming a window layer on the light absorbing layer;

Patterning the back electrode layer, the light absorbing layer, and the window layer to form a plurality of sub modules spaced apart from each other; And

Connecting the sub-modules to each other using a connection member.

The method of claim 2, wherein the connection member is directly attached to the sub modules after the sub modules are formed.

The method of manufacturing a photovoltaic device according to claim 2, wherein the part of the sub-modules is removed.

Board;

A plurality of first sub modules disposed in a first row on the substrate;

A connection member connecting one of the first sub modules and one of the second sub modules in series;

The first sub modules are spaced apart from each other,

The second submodules are spaced apart from each other,

The first submodules and the second submodules, respectively,

A back electrode layer disposed on the substrate;

A light absorbing layer disposed on the back electrode layer; And

A window layer disposed on the light absorbing layer,

The method of claim 5,

And the connection member directly contacts an upper surface of one window layer of the first submodules and an upper surface of a back electrode layer of one of the second submodules.

The solar cell apparatus according to claim 5, wherein the connection member is directly connected to a first submodule disposed at the far end and directly connected to a second submodule disposed at the far end.

A substrate defining a first line region and a second line region disposed in parallel with the first line region;

A first sub module disposed in the first line region;

A second submodule disposed in the first line region and arranged in line with the first submodule;

A third sub module disposed in the second line region;

A fourth submodule disposed in the second line region and arranged in line with the third submodule; And

A bus bar disposed on an upper surface of the first sub module and the third sub module,

The first sub module, the second sub module and the third sub module are spaced apart from each other,

The first sub module, the second sub module and the third sub module are each,

A back electrode layer disposed on the substrate;

A light absorbing layer disposed on the back electrode layer; And

A window layer disposed on the light absorbing layer,

The back electrode layers included in the first sub module, the second sub module, and the third sub module are disposed on the same plane as each other.

The light absorbing layers included in the first sub module, the second sub module, and the third sub module are disposed on the same plane as each other.

The solar cell apparatus of claim 1, wherein the window layers included in the first sub module, the second sub module, and the third sub module are disposed on the same plane.

The method of claim 8, wherein the first sub-module

A first back electrode layer disposed on the substrate;

A first light absorbing layer disposed on the first backside electrode layer; And

A window layer disposed on the first light absorbing layer,

The third submodule is

A third back electrode layer disposed on the substrate;

A third light absorbing layer disposed on the third back electrode layer; And

A third window layer disposed on the third light absorbing layer,

The bus bar contacts the window layer and the third window layer.

The method of claim 9, further comprising a connection member for connecting the first sub-module and the second sub-module in series,

The second sub module

A second back electrode layer disposed on the substrate;

A second light absorbing layer disposed on the second back electrode layer; And

A second window layer disposed on the second light absorbing layer,

And the connection member connects the first back electrode layer and the second window layer.

A first sub module disposed in the first line region;

A third sub module disposed in the second line region;

A fourth submodule disposed in the second line region and arranged in line with the third submodule;

A first connecting member connecting the first sub module and the third sub module in series; And

A second connection member connecting the first sub module and the second sub module in series;

The first sub module, the second sub module and the third sub module are each,

A back electrode layer disposed on the substrate;

A light absorbing layer disposed on the back electrode layer; And

A window layer disposed on the light absorbing layer,

The method of claim 11, wherein the first sub-module

A first back electrode layer disposed on the substrate;

A window layer disposed on the first light absorbing layer,

The third submodule is

A third back electrode layer disposed on the substrate;

A third light absorbing layer disposed on the third back electrode layer; And

A third window layer disposed on the third light absorbing layer,

The first connection member is in contact with the window layer and the third back electrode layer.

13. The method of claim 12,

The second sub module

A second back electrode layer disposed on the substrate;

A second light absorbing layer disposed on the second back electrode layer; And

A second window layer disposed on the second light absorbing layer,

And the second connection member connects the first back electrode layer and the second window layer.