KR101080360B1 - metal clad laminate and printed circuit board - Google Patents

metal clad laminate and printed circuit board Download PDF

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Publication number
KR101080360B1
KR101080360B1 KR1020090073462A KR20090073462A KR101080360B1 KR 101080360 B1 KR101080360 B1 KR 101080360B1 KR 1020090073462 A KR1020090073462 A KR 1020090073462A KR 20090073462 A KR20090073462 A KR 20090073462A KR 101080360 B1 KR101080360 B1 KR 101080360B1
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South Korea
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insulating layer
metal
circuit board
printed circuit
bending
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KR1020090073462A
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Korean (ko)
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KR20110015985A (en
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오수형
강호식
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삼성전기주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Abstract

금속적층판 및 이를 이용한 인쇄회로기판이 개시된다. 절연층, 절연층에 함몰된 휨방지부, 절연층 상에 형성된 회로패턴을 포함하는 인쇄회로기판은, 절연층에 함몰된 휨방지부가 인쇄회로기판의 두께 및 면적을 증가시키지 않고 휨을 방지할 수 있다.Disclosed are a metal laminate and a printed circuit board using the same. In a printed circuit board including an insulating layer, an anti-bending portion recessed in the insulating layer, and a circuit pattern formed on the insulating layer, the anti-bending portion recessed in the insulating layer may prevent the bending without increasing the thickness and area of the printed circuit board. have.

인쇄회로기판, 휨, 절연층 Printed Circuit Board, Bending, Insulation Layer

Description

금속적층판 및 이를 이용한 인쇄회로기판{metal clad laminate and printed circuit board}Metal clad laminate and printed circuit board using the same

본 발명은 금속적층판 및 이를 이용한 인쇄회로기판에 관한 것이다.The present invention relates to a metal laminate and a printed circuit board using the same.

전자 휴대기기의 메모리 용량이 대용량화됨에 따라서, 전자 휴대기기 내에 장착하는 반도체 패키지 내의 반도체는 점차 고집적화되고 있다. 이로 인하여, 반도체 칩의 크기는 점차 대형화되고 있다. 반면에, 전자 휴대기기의 크기가 소형화됨에 따라서, 패키지 기판에 반도체 칩을 실장하여 제조되는 반도체 패키지는 점차 소형화, 박형화 및 경량화되고 있는 추세이다. As memory capacities of electronic portable devices become larger, semiconductors in semiconductor packages mounted in electronic portable devices are becoming increasingly integrated. For this reason, the size of a semiconductor chip is gradually enlarged. On the other hand, as the size of electronic portable devices becomes smaller, semiconductor packages manufactured by mounting semiconductor chips on package substrates are gradually becoming smaller, thinner, and lighter.

그런데, 패키지 기판이 점차 박판화됨에 따라, 기판 제조 시 발생하는 열 응력 및 흡습에 의하여 휨과 비틀림 등의 변형이 더욱 커지게 되었다. 특히, 기판의 제조 과정에서 기판 외곽 테두리 부분에서의 휨이 크게 발생하게 되며, 이러한 휨으로 인하여 기판 외곽 테두리 안쪽의 반도체가 실장되는 패키지 기판 자체가 휨의 영향을 받게 되어 여러 가지 문제를 일으키게 된다However, as the package substrate is gradually thinned, deformation such as bending and torsion is further increased due to thermal stress and moisture absorption generated during substrate manufacture. In particular, during the manufacturing process of the substrate, the warpage of the outer edge of the substrate is greatly generated, and the warpage of the package substrate on which the semiconductor is mounted inside the outer edge of the substrate is affected by the warpage, causing various problems.

이를 방지하기 위하여, 종래에는 기판의 제조 시에 기판에 휨방지부재를 추 가로 붙이거나 휨방지패턴을 형성하는 방법을 사용하였다. 그러나, 이러한 방법은 기판의 두께를 두껍게 하거나 면적을 넓게 차지하는 문제가 있다.In order to prevent this, conventionally, a method of additionally attaching an anti-bending member or forming an anti-bending pattern to a substrate during the manufacture of the substrate was used. However, this method has a problem of thickening the substrate or occupying a large area.

본 발명은 두께 및 면적의 증가 없이도 휨을 방지하는 인쇄회로기판을 제공하는 것이다.The present invention provides a printed circuit board that prevents warping without increasing thickness and area.

본 발명의 일 측면에 따르면, 절연층, 상기 절연층에 함몰된 휨방지부, 상기 절연층에 적층된 금속층을 포함하는 금속적층판이 제공된다.According to an aspect of the present invention, there is provided a metal laminate comprising an insulating layer, a bending prevention portion recessed in the insulating layer, a metal layer laminated on the insulating layer.

상기 휨방지부는, 상기 절연층의 외곽을 따라 배치된 외곽프레임을 포함할 수 있다.The bending prevention part may include an outer frame disposed along the outer side of the insulating layer.

상기 휨방지부는, 상기 절연층의 내측에 배치된 보강프레임을 포함할 수 있다.The bending preventing part may include a reinforcing frame disposed inside the insulating layer.

상기 절연층은, 프리프레그를 포함하며, 상기 휨방지부는 상기 프리프레그에 삽입될 수 있다.The insulating layer may include a prepreg, and the bending prevention part may be inserted into the prepreg.

상기 휨방지부는, 금속박(metal foil)을 포함할 수 있다.The bending prevention part may include a metal foil.

또한, 본 발명의 다른 측면에 따르면, 절연층, 상기 절연층에 함몰된 휨방지부, 상기 절연층 상에 형성된 회로패턴을 포함하는 인쇄회로기판이 제공된다.In addition, according to another aspect of the present invention, there is provided a printed circuit board including an insulating layer, a bending preventing portion recessed in the insulating layer, a circuit pattern formed on the insulating layer.

상기 휨방지부는, 상기 절연층의 외곽을 따라 배치된 외곽프레임을 포함할 수 있다.The bending prevention part may include an outer frame disposed along the outer side of the insulating layer.

상기 휨방지부는, 상기 절연층의 내측에 배치된 보강프레임을 포함할 수 있다.The bending preventing part may include a reinforcing frame disposed inside the insulating layer.

상기 절연층은, 프리프레그를 포함하며, 상기 휨방지부는 상기 프리프레그에 삽입될 수 있다.The insulating layer may include a prepreg, and the bending prevention part may be inserted into the prepreg.

상기 휨방지부는, 금속박(metal foil)을 포함할 수 있다.The bending prevention part may include a metal foil.

본 발명에 따르면, 절연층에 함몰된 휨방지부가 인쇄회로기판의 두께 및 면적을 증가시키지 않고 휨을 방지할 수 있다. According to the present invention, the warpage prevention portion recessed in the insulating layer can prevent the warpage without increasing the thickness and area of the printed circuit board.

이하에서 본 발명의 실시예를 첨부도면을 참조하여 상세하게 설명한다. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 일 실시예에 따른 금속적층판 나타낸 분해사시도이다.1 is an exploded perspective view showing a metal laminated plate according to an embodiment of the present invention.

본 발명의 일 실시예에 따른 금속적층판은, 절연층(10), 휨방지부(20) 및 금속층(32)을 포함한다. 본 실시예의 금속적층판은, 절연층(10)과 금속층(32)이 차례로 적층된 금속적층판의 절연층(10)에 휨방지부(20)가 함몰된 것을 특징으로 한다. 이에 따라, 두께 및 면적의 증가 없이도 휨을 방지할 수 있는 금속적층판을 제공할 수 있다.Metal laminate according to an embodiment of the present invention, the insulating layer 10, the bending prevention portion 20 and the metal layer 32. The metal laminate of the present embodiment is characterized in that the bending preventing portion 20 is recessed in the insulation layer 10 of the metal laminate in which the insulation layer 10 and the metal layer 32 are sequentially stacked. Accordingly, it is possible to provide a metal laminate that can prevent warpage without increasing the thickness and area.

본 실시예의 금속적층판은 패널 기판을 제조하는데 사용되는 것으로서 외곽의 더미 부분에서 발생한 휨을 억제하기 위하여, 휨방지부(20)는 절연층(10)의 외곽을 따라 배치된 외곽프레임(22)을 포함한다. The metal laminate of the present embodiment is used to manufacture a panel substrate, in order to suppress the warpage generated in the dummy portion of the outer, the bending prevention portion 20 includes an outer frame 22 disposed along the outer edge of the insulating layer (10). do.

패널 기판의 제조 공정에서 열 응력 및 흡습에 의하여 금속적층판에 휨이 발생하게 되며, 특히 금속적층판의 외곽 부분에서 국부적으로 휨이 크게 발생하게 된다. 이러한 국부적인 휨은 금속적층판이 지그에 고정된 채 열 및 흡습 환경에 노출되는 공정에서 주로 발생하게 되며, 금속적층판이 지그에 고정되는 외곽 부분 주위에서 휨이 크게 발생하는 경향을 보인다. In the manufacturing process of the panel substrate, warpage is generated in the metal laminate due to heat stress and moisture absorption, and in particular, the warpage is largely generated in the outer portion of the metal laminate. Such local warpage occurs mainly in a process in which a metal laminate is fixed to a jig and exposed to a heat and moisture absorption environment, and warpage tends to occur around an outer portion where the metal laminate is fixed to a jig.

따라서, 외곽프레임(22)을 절연층(10)의 외곽 측에 함몰되게 배치시켜 패널 기판의 제조 공정에서 금속적층판의 휨을 효과적으로 방지할 수 있다. 또한, 지그에 고정되는 더미 부분은 패널 기판 제조 후에 제거될 부분이므로, 외곽프레임(22)과 금속층(32)과의 간섭을 피하기 위하여 절연층(10)을 두껍게 할 필요는 없으므로, 휨방지를 위해 금속적층판을 두께를 하지 않아도 된다.Accordingly, the outer frame 22 may be recessed on the outer side of the insulating layer 10 to effectively prevent the bending of the metal laminate in the manufacturing process of the panel substrate. In addition, since the dummy part fixed to the jig is a part to be removed after fabrication of the panel substrate, it is not necessary to thicken the insulating layer 10 to avoid interference between the outer frame 22 and the metal layer 32, so as to prevent bending. It is not necessary to thickness the metal laminate.

한편, 제조될 패널 기판의 취약부분에 위치에 상응하여 절연층(10)의 내측에도 보강프레임(24)이 함몰되게 배치될 수 있다.On the other hand, the reinforcing frame 24 may be disposed in the inner side of the insulating layer 10 in correspondence with the position of the weak part of the panel substrate to be manufactured.

여기서, 휨방지부(20)는 금속적층판의 금속층(32) 형성에 사용되는 금속박을 재단하여 사용할 수 있다. Here, the bending prevention portion 20 may be used by cutting the metal foil used to form the metal layer 32 of the metal laminated plate.

또한, 절연층(10)은 프리프레그를 포함하여 이루어질 수 있다. 반경화 상태의 프리프레그에 휨방지부(20)를 삽입한 후 에 금속박을 적층함으로써, 휨방지부(20)를 포함하는 금속적층판을 용이하게 형성할 수 있다.In addition, the insulating layer 10 may include a prepreg. By inserting the metal foil after inserting the anti-bending portion 20 into the prepreg of the semi-cured state, it is possible to easily form a metal laminated plate including the anti-bending portion 20.

도 2는 본 발명의 일 실시예에 따른 인쇄회로기판을 나타낸 단면도이다.2 is a cross-sectional view illustrating a printed circuit board according to an exemplary embodiment of the present invention.

상술한 금속적층판을 이용하면, 절연층(10)에 함몰된 휨방지부(20)를 포함하는 인쇄회로기판을 형성할 수 있다. 이에 따라, 두께 및 면적의 증가 없이도 휨을 방지할 수 있는 인쇄회로기판을 제공할 수 있다. 이 경우에, 절연층(10) 상에는 상술한 금속층(32)을 이용하여 형성된 회로패턴(30)이 형성된다. By using the above-described metal laminate, a printed circuit board including the warpage preventing part 20 recessed in the insulating layer 10 can be formed. Accordingly, it is possible to provide a printed circuit board capable of preventing warpage without increasing thickness and area. In this case, the circuit pattern 30 formed using the above-mentioned metal layer 32 is formed on the insulating layer 10.

본 실시예의 인쇄회로기판은 패널 기판으로서, 휨방지부(20)는 절연층(10)의 외곽을 따라 배치된 외곽프레임(22)을 포함할 수 있다. 또한, 도 2에 나타난 바와 같이, 절연층(10)의 내측에 배치된 보강프레임(24)을 포함할 수 있다.The printed circuit board of the present exemplary embodiment is a panel substrate, and the bending preventing portion 20 may include an outer frame 22 disposed along the outer side of the insulating layer 10. In addition, as shown in Figure 2, it may include a reinforcing frame 24 disposed inside the insulating layer (10).

여기서, 휨방지부(20)로 금속박이 사용할 수 있으며, 절연층(10)은 프리프레그를 포함하여 이루어질 수 있다.Here, the metal foil may be used as the warpage prevention part 20, and the insulating layer 10 may include a prepreg.

상기에서는 본 발명의 실시예를 참조하여 설명하였지만, 해당 기술 분야에서 통상의 지식을 가진 자라면 하기의 특허 청구의 범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although the above has been described with reference to embodiments of the present invention, those skilled in the art may variously modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. And can be changed.

전술한 실시예 외의 많은 실시예들이 본 발명의 특허청구범위 내에 존재한다.Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

도 1은 본 발명의 일 실시예에 따른 금속적층판을 나타낸 분해사시도.1 is an exploded perspective view showing a metal laminated plate according to an embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 인쇄회로기판을 나타낸 단면도.2 is a cross-sectional view showing a printed circuit board according to an embodiment of the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10: 절연층10: insulation layer

20: 휨방지부20: bending prevention part

22: 외곽프레임22: outer frame

24: 보강프레임24: reinforcement frame

30: 회로패턴30: circuit pattern

32: 금속층32: metal layer

Claims (10)

절연층; 및Insulating layer; And 상기 절연층에 적층된 금속층을 포함하고,A metal layer laminated on the insulating layer, 상기 금속층의 외곽에는 지그에 의해 고정되는 더미 영역이 형성되며,The dummy region is formed on the outer side of the metal layer is fixed by a jig, 상기 더미 영역에 배치된 상기 절연층에는 외각프레임이 삽입된 것을 특징으로 하는 금속적층판.The metal laminated plate, characterized in that the outer frame is inserted into the insulating layer disposed in the dummy region. 삭제delete 제1항에 있어서,The method of claim 1, 상기 절연층의 내측에 배치된 보강프레임을 더 포함하는 것을 특징으로 하는 금속적층판.Metal laminate plate further comprises a reinforcing frame disposed inside the insulating layer. 제1항 또는 제3항에 있어서,The method according to claim 1 or 3, 상기 절연층은, 프리프레그를 포함하며,The insulating layer includes a prepreg, 상기 외각프레임은, 상기 프리프레그에 삽입된 것을 특징으로 하는 금속적층판.The outer frame is a metal laminated plate, characterized in that inserted into the prepreg. 제1항 또는 제3항에 있어서,The method according to claim 1 or 3, 상기 외각프레임은, 금속박(metal foil)을 포함하는 것을 특징으로 하는 금속적층판.The outer frame is a metal laminate, characterized in that it comprises a metal foil (metal foil). 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete
KR1020090073462A 2009-08-10 2009-08-10 metal clad laminate and printed circuit board KR101080360B1 (en)

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Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2000013019A (en) * 1998-06-23 2000-01-14 Sharp Corp Built-up multilayer printed wiring board and its manufacture
JP2003152289A (en) 2001-11-13 2003-05-23 Nec Corp Printed wiring board and multi-layer printed wiring board
JP2004253546A (en) * 2003-02-19 2004-09-09 Nippon Mektron Ltd Multilayer printed circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000013019A (en) * 1998-06-23 2000-01-14 Sharp Corp Built-up multilayer printed wiring board and its manufacture
JP2003152289A (en) 2001-11-13 2003-05-23 Nec Corp Printed wiring board and multi-layer printed wiring board
JP2004253546A (en) * 2003-02-19 2004-09-09 Nippon Mektron Ltd Multilayer printed circuit board

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