KR101078818B1 - Regenerating process and regenerating system toregenerate waste slurry from wafermanufacturing process - Google Patents

Abstract

PURPOSE: A method for regenerating a dispersing material in waste slurry generated from a wafer manufacturing process and an apparatus for the same are provided to improve the regenerating efficiency of the waste slurry. CONSTITUTION: A dispersing material and a polishing material are dispersed in a waste slurry generated from a wafer manufacturing process(S100). The dispersing material and the polishing material are defined and extracted in a centrifugal separating method(S200). Solid powder is eliminated from the extracted dispersing material in a filtering process(S300). Moisture contained in the dispersing material is eliminated by heating the dispersing material in a moisture eliminating process(S400). Remaining solid powder is eliminated(S500).

Description

REGENERATING PROCESS AND REGENERATING SYSTEM TOREGENERATE WASTE SLURRY FROM WAFERMANUFACTURING PROCESS}

The present invention relates to a method for regenerating a dispersant and a regenerating apparatus for regenerating the dispersant in the silicon powder and the dispersant contained in a large amount of waste slurry discharged during a wafer manufacturing process such as semiconductor and solar cell.

In general, waste slurries generated in the semiconductor manufacturing process include oil-soluble dispersing materials (PEG, DEG, Coolant, PG), silicon wafers (Si), silicon carbide (SiC), and copper wires used for cutting. Scrap is mixed in a powder form of about 10 μm or less, and the waste slurry mixed as described above is stored for a few months for a long time and for one to two years and then treated by incineration or landfilling.

However, in order to prevent environmental pollution and to reduce production costs, various techniques for regenerating and reusing silicon in waste slurry generated in semiconductor manufacturing processes and the like have been proposed.

Looking at the prior art proposed to recycle the waste slurry generated in the semiconductor manufacturing process,

Waste Slurry Regeneration Method and Regeneration System in Semiconductor Wafer Manufacturing Process of Korean Patent Registration No. 393007,

A method for producing high purity silicon carbide from waste semiconductor slurry of Korean Patent Publication No. 10-2004-0055218, and the like;

Presented by the applicant

Waste Slurry Recycling Method and Regeneration System Generated in the Semiconductor Wafer Manufacturing Process of Korean Patent Registration No. 786644, Waste Slurry Particle Disperser Using Ultrasonic of Korean Patent Registration No. 788994, and Centrifuge for Silicon Powder Purifier of Patent No. 896070 Separator and method for purifying silicon powder using the same, method for regeneration of silicon powder from slurry generated from back lapping process of Korean Patent Registration No. 896071, and water treatment method of waste sludge generated during back lapping process of Korean Patent Registration No. 958566. .

The waste slurry recycling method generated in the semiconductor wafer manufacturing process of Korean Patent Registration No. 393007 described above and the waste slurry recycling method generated in the semiconductor wafer manufacturing process presented in the recycling system are agitated with the abrasive and cutting powder (dispersion material). Stirring step of spreading the formed precipitate; A dilution step of mixing and diluting a recycled oil in the waste slurry stirred in the stirring step; A first centrifugation step of extracting abrasives by first centrifuging the waste slurry in the dilution step; A second centrifugation step of performing a second centrifugation of the first oil discharged by the first centrifugation in the first dimensional centrifugation into a second oil and cutting powder; Filtration / purification step of filtering the secondary oil by filtration to reduce the regeneration oil; The waste slurry regeneration step of regenerating the slurry by adding the abrasive extracted in the first centrifugation step prior to the regeneration oil purified in the filtration / purification step,

The waste slurry regeneration system generated in the semiconductor wafer manufacturing process comprises: a stirring tank for agitating the introduced waste slurry to disperse deposits composed of abrasives and cutting powder contained in the waste slurry; A dilution tank for mixing and diluting recycled oil to waste slurry introduced by stirring from the stirring tank; A primary centrifuge for extracting abrasives by first centrifuging the diluted waste slurry introduced from the dilution tank; A secondary centrifuge for secondary centrifugation with primary oil and cutting powder extracted from the first dimensional core and the abrasive is extracted; A filter for filtering / purifying the secondary oil from which the cutting powder is extracted in the secondary centrifuge to make recycled oil; A reconditioning tank for regenerating the regenerated slurry by adding the abrasive extracted by the primary centrifuge to the regenerated oil refined by the filter and regenerated.

In the above-described waste slurry recycling method and recycling system generated in the semiconductor wafer manufacturing process described above, when the waste slurry is solidified by long-term storage using a stirrer, the abrasive and the impurities attached to the abrasive are not dispersed and extracted with a centrifuge. Impurities adhere to the abrasives, which are disadvantageous in that they cannot extract abrasives of high purity.

In order to solve the above disadvantages, the present applicant has a waste slurry recycling method and a recycling system of the waste slurry produced in the semiconductor wafer manufacturing process of Korean Patent Registration No. 786644 and the ultrasonic slurry of the domestic patent registration No. 788994 for the waste slurry. As described above, a technique for dispersing and recycling waste slurry by using a particle disperser using ultrasonic waves was provided.

However, the techniques proposed by the applicants provided above are techniques for regenerating silicon powder or water, which is an abrasive in waste slurry, and a technique for regenerating silicon powder and water in waste slurry and regenerating a dispersant containing the remaining foreign matter. It does not provide.

As described above, the recycling efficiency of the waste slurry is lowered by not regenerating the dispersing material (cutting powder) during the recycling of the waste slurry.

(KR) Patent registration No. 393007 (Registration date 2003.07.16) (KR) Publication No. 10-2004-0055218 (published 2004.06.26) (KR) Patent registration No. 896070 (Registration date 2009.04.27) (KR) Patent registration No. 786644 (Registration date 2007.12.11) (KR) Patent registration No. 788994 (Registration date 2007.12.18) (KR) Patent registration No. 896070 (Registration date 2009.04.27) (KR) Patent Registration No. 896071 (Registration date 2009.04.27) (KR) Patent Registration No. 958566 (Registration date 2010.05.11)

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems,

An object of the present invention is to increase the recycling efficiency of waste slurry by regenerating not only the silicon powder of the abrasive contained in the waste slurry and the dispersion of the silicon powder of the abrasive, but also of the dispersion.

That is, to improve the recycling efficiency of the waste slurry by providing a method for regenerating the dispersion in the remaining waste slurry after the separation of the abrasive using a centrifuge in the waste slurry produced during the wafer manufacturing process and a regeneration apparatus therefor.

In order to achieve the above object, the present invention provides a method for regenerating dispersant in the waste slurry generated during the wafer manufacturing process, the dispersion step (S100) of dispersing the abrasive and the dispersion in the waste slurry generated during the wafer manufacturing process; A centrifugal dispersion extracting step (S200) of separating and extracting the waste slurry dispersed in the dispersing step (S100) into an abrasive and a dispersant by centrifugal separation; A filtration step (S300) for removing solids contained in the dispersion extracted in the centrifugal dispersion extracting step (S200); A water removal step (S400) of heating the dispersion obtained in the filtration step (S300) to remove moisture contained in the dispersion; In the water removal step (S400) is made of a finishing regeneration step (S500) for removing the residual solids in the dispersion from which the water is removed using a micro bag filter,

The dispersing step (S100), the first dispersing step (S110) for dispersing the abrasive and the dispersant in the waste slurry with a stirrer; It consists of a second dispersion step (S120) for redispersing the waste slurry dispersed in the first dispersion step (S110) with a particle disperser using ultrasonic waves,

The filtration step (S300) of removing the solids comprises: a first filtration step (S310) of first removing solids using a filter cloth; After the first filtration step (S310) by heating to adjust the viscosity of the dispersion, characterized in that consisting of a second filtration step (S320) for removing the residual amount of solids using diatomaceous earth.

Dispersion material regeneration device in the waste slurry generated during the wafer manufacturing process of the present invention, in the waste slurry recycling system generated during the wafer manufacturing process, the waste slurry is stirred to separate the sediment consisting of the abrasive and the dispersion in the waste slurry slurry. A slurry stirrer; A particle disperser for waste slurry which disperses waste slurry introduced by stirring with the stirrer by ultrasonic waves; A waste slurry centrifuge for separating and extracting the waste slurry dispersed by the ultrasonic wave disperser into an abrasive and a dispersion; A first filter using a filter cloth to remove the solids in the dispersion by passing the dispersion material separated and separated by the centrifuge for waste slurry through a filter cloth; A second filter including a reactor for controlling the viscosity by heating the dispersion material from which the first solids have been removed by the first filter and a diatomaceous earth filter for removing the residual amount of the solid content using the diatomaceous earth from the dispersion material having the viscosity control in the reactor; It characterized in that it comprises a moisture remover for removing the moisture contained in the dispersion by heating the dispersion passed through the second filter.

Dispersion material recycling method in the waste slurry produced during the wafer manufacturing process of the present invention made as described above has the advantage that the abrasive and the dispersion material can be regenerated by separating and extracting the waste slurry into an abrasive and a dispersion by centrifugal separation method.

That is, in the waste slurry produced during the wafer manufacturing process, a recycling method and a recycling system of the waste slurry produced in the semiconductor wafer manufacturing process of Korean Patent Registration No. 786644, filed by the applicant in advance, and a waste using the ultrasonic wave of Korean Patent Registration No. 788994. Abrasive particles by slurry disperser for slurry, centrifugal separator for silicon powder purifier of Korean Patent No. 896070 and method for refining silicon powder using the same, and regeneration method of silicon powder from slurry generated from back lapping process of Korean Patent No. 896071 It is possible to improve the recycling efficiency of the waste slurry by regenerating to the desired purity, and to recycle the dispersion from the remaining waste slurry from which the abrasive is separated, and to easily increase the purity of the abrasive and the dispersion to the desired level. .

In addition, by separately regenerating the abrasive and the dispersant, there is an advantage that it is easy to add the material and the like to improve the changed chromaticity by heating and carbonization for the viscosity control of the dispersant.

Figure 1 is a step of the dispersion material recycling method in the waste slurry generated during the wafer manufacturing process of the present invention.
Figure 2 is a block diagram of a dispersing material regeneration device in the waste slurry generated during the wafer manufacturing process of the present invention.
Figure 3 is a front view of the particle injector in the dispersant recycling apparatus in the waste slurry of the present invention.
Figure 4 is a side view of the particle injector of the present inventors dispersant recycling apparatus in the waste slurry.
Figure 5 is a schematic diagram of the waste slurry centrifuge of the present invention waste slurry recycling apparatus.
Figure 6 is a schematic diagram of a first filter using a filter cloth of the dispersant recycling apparatus in the waste slurry of the present invention.
7 is a schematic view of a second filter of the dispersant regeneration apparatus in the waste slurry of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.

The dispersing material regeneration device in the waste slurry generated during the wafer manufacturing process will be described with reference to FIG.

Stirrer 10 for agitating the waste slurry of the waste container (1 rube PE container) to collect the waste slurry generated during the wafer manufacturing process, and a particle disperser 20 for dispersing the waste slurry stirred by the agitator 10 by ultrasonic wave And a centrifuge 30 for separating and extracting the waste slurry dispersed in the particle disperser 20 into a solid and a dispersant, which are abrasives by centrifugation, respectively, and included in the dispersion separated and extracted from the centrifuge 30. Using a filter cloth to remove the solids, the first filter 40, the reactor 510 for controlling the viscosity of the dispersion is filtered by the first filter 40 and the solids removed first and the diatomaceous earth to remove the remaining solids In the second filter 50 composed of the diatomaceous earth filter 520 used, the moisture filter 60 for removing the moisture in the dispersion by heating the dispersion filtered by the second filter 50, and in the water remover 60 It consists of a bag filter filter 70 made of a micro bag filter to remove the residual solids in the dispersion material is removed moisture.

The stirrer 10 is a conventional one by rotating the stirring blade using a stirring motor to agitate the abrasive and dispersant in the waste slurry.

The particle disperser 20 is to disperse the abrasive and the dispersant in the waste slurry by generating ultrasonic waves, using a particle slurry for waste slurry using the ultrasonic wave of the registered patent No. 788994 filed by the applicant. That is, the particle disperser installs a plurality of oscillators for generating ultrasonic waves inside the storage tank in which waste slurry is stored, and installs the vibrators on side and bottom to precisely disperse abrasive and dispersant (cutting powder). . In addition, the particle disperser is provided with a stirring device capable of stirring the waste slurry to be more precise dispersion by ultrasonic and stirring. Waste sludge discharged from the particle disperser by the vibrator installed in the lower portion is made to be dispersed in the ultrasonic wave even up to the moment of discharge.

Turning to the particle disperser 20 with reference to the attached Figs. 3 and 4, which show a schematic diagram of the particle disperser applied to the regenerator of the present invention,

The particle disperser 20 is formed to store the supplied waste slurry, the inlet 211 is formed in which waste slurry is introduced in the upper side, the storage tank in which the outlet 212 is formed so that the waste slurry dispersed in the lower side is discharged 210; An ultrasonic generator is installed to generate and disperse ultrasonic waves in the waste slurry stored in the storage tank 210. The ultrasonic generator is installed on both side vibrators 221 and the lower surface of the storage tank 210. The lower oscillator 222, the oscillator 221, 222 consisting of the oscillator 223, each of which is spoken, the stirring device 240 for stirring the waste slurry stored in the storage tank 210 is installed, A plurality of level sensors 250 for detecting the level of waste slurry in the storage tank 210, and a temperature sensor 260 for measuring the waste slurry temperature are installed, and the control unit 230 for controlling the components and the configuration Frame 280 or the like for supporting the element.

The lower vibrator 222 is installed to be placed in the groove 213 formed in the lower portion of the storage tank 210, and is formed through the discharge port 212 by forming an outlet 212 on one side of the groove 213. The waste slurry is dispersed by ultrasonic waves.

The centrifuge (30) is to separate and extract the waste slurry dispersed in the particle disperser (20) with abrasive and dispersant by centrifugal force. It is configured to separate the two mixed materials from each other using the difference of.

Referring to the attached centrifugal separator 30 is shown a schematic cross-sectional view of the centrifugal separator applied to the inventors of the present invention,

The centrifuge 30 includes a housing 300, an inner cylinder 301 embedded in the housing 300, and a helical screw 302 installed in the inner cylinder 301. A relatively large abrasive contained in the waste slurry is a screw 302 that rotates the waste slurry that is introduced through the formed supply path 310 and discharged to the outlet 311 by a motor (not shown). ) Is conveyed toward the progressively reduced width is discharged through the first outlet 314 in the lower portion, the second small dispersion material is transferred in the opposite direction to the second end formed at the end of the larger width of the screw 302 It is configured to be discharged through the outlet 313.

The first filter 40 is to remove the solids in the dispersion primarily by passing through the filter cloth of the multiple layers of the dispersion material separated and extracted in the centrifuge 30.

Usually, the dispersant separated and extracted by the centrifuge 30 contains about 30% by weight of solids, and the first filter 40 removes such solids by about 5% by weight or less.

Referring to the accompanying FIG. 6, which shows a schematic diagram of the first filter applied to the regenerator of the present invention, the first filter 40 will be described.

The first filter 40 has a housing 410 formed with an inlet 411 through which the dispersant is introduced and an outlet 412 through which the dispersant introduced into the inlet is discharged, and is installed in the housing 410 and has an inlet 411. It is composed of a plurality of filter cloth (non-woven fabric) 420 is installed to pass through the dispersant introduced into the discharge 412.

The first filter 40 removes the solids in the dispersion by dispersing material is introduced into the inlet 411 and passed through the filter cloth 420 of the plurality of layers and then discharged to the outlet 412.

The second filter 50 is to adjust the viscosity and color by reacting the dispersant that is primarily filtered out of the first filter 40, to remove the solids that are not removed in the primary filter 40.

Referring to the attached second filter 50 with reference to FIG. 7,

The second filter 50 is a reactor 510 for adjusting the viscosity and chromaticity of the dispersant filtered in the first filter 40, and removes the solids in the dispersion having a viscosity and chromaticity adjusted in the reactor 510 with diatomaceous earth. The diatomaceous earth filter 520 and the heat medium supply device 530 for heating by supplying a heat source to the reactor 510.

Looking back at the configuration for the reactor 510 and the diatomaceous earth filter 520,

The reactor 510 has an inlet 514 formed at one side thereof, a reactor body 511 having an outlet 515 formed at a lower side thereof, a heating jacket 512 formed outside the body 511, and the reactor body. It is composed of a stirring device 513 for stirring the dispersion material introduced into 511,

The diatomaceous earth filter 520 is connected to the reactor 510 on one side is formed with an inlet 524 which is introduced into the reactant dispersion and an outlet 525 is discharged after the solid content of the dispersion introduced into the inlet 524 is removed Outlet 525 through the body 521, a plurality of diatomaceous earth lamination plate 522 of the disk form to be laminated in the body 521, the diatomaceous earth laminated on the diatomaceous earth lamination plate 522 to the outlet 525 It consists of a perforated pipe 523 installed in the central portion connected to the outlet 525 to be discharged to). The plurality of diatomaceous earth laminates 522 are installed spaced apart from the other hole 523 as shown in the figure.

Dispersant in which the viscosity control and chromaticity control by the reaction in the reactor 510 is discharged to the outlet 515 of the reactor 510 is introduced into the inlet 524 of the diatomaceous earth filter 520 through a pipe, the diatomaceous earth filter ( Dispersant introduced to 520 is discharged to the outlet 525 after the solids are removed by the diatomaceous earth. The dispersant discharged to the outlet 525 of the diatomaceous earth filter 520 may be supplied to the water remover 600 which is the next device through a pipe, or may be bypassed to the bypass pipe 540.

The dispersant bypassed to the bypass pipe 540 may be supplied to the reactor 510 through the first branch pipe 541 or re-supplied to the diatomaceous earth filter 520 through the second branch pipe 542. have.

The heat medium supply device 530 supplies the heat medium to the heating jacket 512 of the reactor 510 to heat the dispersant supplied in the reactor 510.

The water remover 60 is to remove the water in the dispersion filtered by the second filter 50, the dispersion is boiled at a temperature of 130 ℃ or more when heated to 130 ℃ or less of the dispersion filtered by the second filter 50 Only the moisture contained in the dispersion evaporates, leaving only the pure dispersion.

Dispersion recycling method in the waste slurry generated during the wafer manufacturing process consists of the steps shown in FIG.

1. Dispersion stage ( S100 )

Dispersing the waste slurry of the waste container (1 rube PE container) in which the waste slurry generated during the wafer manufacturing process is collected in order to separate the abrasive and the dispersion, by stirring with a stirrer (10) to disperse the abrasive and dispersant precipitated The first dispersion step (S110), and the second dispersion step (S120) for redispersing the waste slurry dispersed in the first dispersion step (S110) to the particle disperser 20 using ultrasonic waves.

The first dispersion step (S110) using the stirrer 10 is to rotate the stirring blades of the stirrer to separate by stirring the abrasive and dispersant precipitated by the storage for a long time.

The second dispersion step (S120) is further dispersed in the particle disperser 20 using ultrasonic waves, the abrasive and the dispersion separated by stirring in a stirrer.

2. Centrifugation Dispersant  Extraction step ( S200 )

The waste slurry, which is dispersed in the stirrer 10 and the particle disperser 20 using ultrasonic waves, is separated and extracted from the abrasive and the dispersion by the centrifuge 30, respectively.

The waste slurry dispersed by the particle disperser 20 using the ultrasonic wave is well dispersed in the abrasive and the dispersant, so that the dispersant separated and extracted from the centrifuge 30 can reduce the content of solids.

3. Filtration step ( S300 )

Removing the solids contained in the dispersant separated from the abrasive and extracted from the principle separator 30, the dispersant extracted in the dispersant extraction step (S200) usually contains about 30% by weight solids.

Filtration step (S300) for removing the solids contained in the dispersant is a first filtration step (S310) using a filter cloth (non-woven fabric), and the remainder of the dispersion material filtered in the first filtration step (S310) using diatomaceous earth ( Residual) consists of a second filtration step (S320) for removing the solids.

In the first filtration step (S310) by supplying the dispersant extracted in the dispersant extraction step (S200) to the first filter 40 made to pass through the filter cloth of a plurality of layers to disperse the solids in the first dispersant, In the first filtration step (S310) to lower the solids contained in about 30% by weight in the dispersion to about 5% by weight or less.

In the second filtration step (S320), after supplying the dispersion material first filtered in the first filtration step (S310) to the reactor 510, using a fluid of 100 ~ 180 ℃ heat medium of the heat medium supply device 530 ( 510) is indirectly heated to maintain 2-10 hours at 100-150 ° C. to control the moisture content in the dispersion (reducing the moisture content from 7wt% to 3.8wt% or less), and when the moisture control is complete, the dispersion is 30 ~ Heat to 80 ° C. to lower the viscosity.

In the reactor 510, the viscosity-adjusted dispersion is supplied to the diatomaceous earth filter 520 using diatomaceous earth to remove the remaining solids.

In the second filtration step (S320) to lower the viscosity of the first dispersion in the reactor 510, by removing the solids in the diatomaceous earth filter 520 can increase the removal efficiency of the solids.

The dispersant supplied in the reactor 510 may be heated to adjust the viscosity, and to improve chromaticity, the chromaticity of color change by carbonization may be improved by adding chromaticity improving materials such as activated carbon (palm), clay, and zeolite. .

In the second filtration step (S320) it can be ensured by the SS standard (0 mg / L) of the dispersant from which the solid content is removed to about 5% by weight or less in the first filtration step (S310).

The second filtration step (S320) may supply the dispersion discharged from the reactor 510 to the diatomaceous earth filter 520 to supply the dispersion from which the solids are removed to the moisture remover 60 to execute the water removal step (S400). Alternatively, the second filtration step S320 may be repeatedly supplied to the reactor 510 or may be supplied to the diatomaceous earth filter 520 to re-execute the process of removing solids.

4. Water removal step ( S400 )

The water removal step (S400) is a step of removing water in the dispersion material from which the solids have been removed in the filtration step (S300), the dispersion material from which the solids have been removed in the filtration step (S300) (temperature range, time and moisture content concentration) Heat to remove moisture

Usually, the boiling point of the dispersant is 130 ° C. or more, so that the moisture remover 60 removes moisture by heating at a temperature of 130 ° C. or lower when removing moisture.

5. Finish playback step ( S500 )

The finishing regeneration step (S500) is to remove foreign substances, such as solids contained in the dispersion from which the moisture is removed, the bag filter filter 70 made of a micro bag filter the dispersion is water removed through the moisture remover 60 This is a finishing regeneration step to remove impurities by passing through).

S100: dispersion step S110: first dispersion step
S120: second dispersion step S200: dispersion material extraction step
S300: filtration step S310: first filtration step
S320: second filtration step S400: water removal step
S500: finishing playback step
10: stirrer 20: particle disperser
30: centrifuge 40: first filter
50: second filter 60: moisture remover
70: bag filter strainer
410: housing 420: filter cloth
510 reactor 520 diatomaceous earth filter
530: heating medium supply device 540: bypass pipe

Claims (6)

Dispersing step (S100) for dispersing the abrasive and the dispersion in the waste slurry generated during the wafer manufacturing process;
A centrifugal dispersion extracting step (S200) of separating and extracting the waste slurry dispersed in the dispersing step (S100) into an abrasive and a dispersant by centrifugal separation;
A filtration step (S300) for removing solids contained in the dispersion extracted in the centrifugal dispersion extracting step (S200);
It includes a water removal step (S400) to remove the moisture contained in the dispersion by heating the dispersion obtained in the filtration step (S300),
The filtration step (S300) for removing the solids,
A first filtration step (S310) of firstly removing solids by passing through a plurality of filter cloths;
The heating jacket 512 is formed on the outside after the first filtration step (S310) is formed of a heatable reactor body 511, and a stirring device 513 for stirring the dispersant introduced into the reactor body (511) A reactor 510 for controlling the viscosity by heating the dispersant; A body 521 having an inlet 524 and an outlet 525 into which the dispersant reacted in the reactor 510 is introduced, and a plurality of diatomaceous earth laminates 522 installed in the body 521 to stack diatomaceous earth. ), A perforated pipe 523 installed at the central portion of the diatomaceous earth laminate 522 and guiding the dispersant from which solids are removed by diatomaceous earth to the outlet 525, and the dispersant discharged in communication with the outlet 525. A second filter 520 composed of a bypass tube 540 capable of resupplying the reactor 510 or the body 521 to remove the residual amount of solids by using diatomaceous earth in a viscosity-adjusted dispersion; Controlling the viscosity of the dispersant by heating using a second filter 50 including a heating medium supply device 530 for supplying a heating medium to a heating jacket 512 for heating the reactor 510; And a second filtration step (S320) comprising a step of removing the residual solids using diatomaceous earth after adjusting the viscosity. The method of claim 1,
The dispersing step (S100),
A first dispersion step (S110) for dispersing the abrasive and the dispersion in the waste slurry with a stirrer;
Dispersing material recycling method in the waste slurry produced during the wafer manufacturing process, characterized in that consisting of a second dispersion step (S120) for redispersing the waste slurry dispersed in the first dispersion step (S110) with a particle disperser using ultrasonic waves. The method according to claim 1 or 2,
After the water removal step (S400) using a micro bag filter to finish the regeneration step (S500) to remove the remaining solids further comprises a waste material in the waste slurry produced during the manufacturing process. The method of claim 1,
The second filtration step (S320) is a method for regenerating dispersant in the waste slurry produced during the wafer manufacturing process, characterized in that the chromaticity is restored by the addition of a color improving material to the color change. In the waste slurry recycling system generated during the wafer manufacturing process,
A waste slurry stirrer (10) for agitating the introduced waste slurry to separate a precipitate composed of an abrasive and a dispersion in the waste slurry; A particle disperser for waste slurry, which disperses waste slurry introduced by stirring with the stirrer by ultrasonic waves; A waste slurry centrifuge (30) for separating and extracting the waste slurry dispersed by the ultrasonic wave disperser into an abrasive and a dispersion; A first filter (40) configured to remove solids by allowing the dispersion material separated and extracted by the centrifuge to pass through a plurality of layers of filter cloth; A second filter (50) for heating the dispersant from which the first solids have been removed with the first filter to adjust the viscosity, and removing the residual amount of the solids using the diatomaceous earth with the viscosity control; Including a moisture remover 60 for heating the dispersion passed through the second filter to remove the moisture contained in the dispersion,
The second filter 50,
Heating reactor 512 formed on the outside is formed of a reactor body 511 which can be heated and a stirring device 513 to agitate the dispersion material injected into the reactor body 511 to heat the dispersion material to adjust the viscosity 510; A body 521 having an inlet 524 and an outlet 525 into which the dispersant reacted in the reactor 510 is introduced, and a plurality of diatomaceous earth laminates 522 installed in the body 521 to stack diatomaceous earth. ), A perforated pipe 523 installed at the central portion of the diatomaceous earth laminate 522 and guiding the dispersant from which solids are removed by diatomaceous earth to the outlet 525, and the dispersant discharged in communication with the outlet 525. A second filter 520 composed of a bypass tube 540 capable of resupplying the reactor 510 or the body 521 to remove the residual amount of solids by using diatomaceous earth in a viscosity-adjusted dispersion; And a heating medium supplying device (530) for supplying a heating medium to a heating jacket (512) for heating the reactor (510). delete

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