KR101070800B1 - Polyamide film - Google Patents

Polyamide film Download PDF

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KR101070800B1
KR101070800B1 KR1020070061171A KR20070061171A KR101070800B1 KR 101070800 B1 KR101070800 B1 KR 101070800B1 KR 1020070061171 A KR1020070061171 A KR 1020070061171A KR 20070061171 A KR20070061171 A KR 20070061171A KR 101070800 B1 KR101070800 B1 KR 101070800B1
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film
polyamide
barium sulfate
fine particles
weight
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KR1020070061171A
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KR20080112596A (en
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김성종
백배현
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코오롱인더스트리 주식회사
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/02Ingredients treated with inorganic substances
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2565/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D2565/38Packaging materials of special type or form
    • B65D2565/381Details of packaging materials of special type or form
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0812Aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/30Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045Sulfates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/16Applications used for films

Abstract

본 발명은 폴리아미드 필름에 관한 것으로, 표면이 무기화합물로 코팅된 황산바륨 미립자를 무기 충진제로 포함하는 폴리아미드 필름을 제공함으로써, 주행성이 우수하고 투명도가 저하되지 않아 제조원가 절감 및 생산속도 향상에 기여할 수 있는 발명이다.The present invention relates to a polyamide film, by providing a polyamide film including the barium sulfate fine particles coated with an inorganic compound as an inorganic filler, it is excellent in running performance and does not reduce transparency, which contributes to a reduction in manufacturing cost and an improvement in production speed. It is an invention that can be.

폴리아미드, 무기화합물, 황산바륨 Polyamide, Inorganic Compound, Barium Sulfate

Description

폴리아미드 필름 {Polyamide film}Polyamide film {Polyamide film}

본 발명은 폴리아미드 필름에 관한 것이다.The present invention relates to a polyamide film.

폴리아미드 필름은 투명성, 내핀홀성, 기체차단성, 내열성, 내유성 등이 우수하여 주로 육가공식품 또는 레토르트식품 등의 식품포장분야 및 그 밖의 공업제품 포장분야에서 광범위하게 이용되고 있다. Polyamide films have excellent transparency, pinhole resistance, gas barrier property, heat resistance, oil resistance, and the like, and are widely used in food packaging fields such as meat processed foods or retort foods, and other industrial product packaging fields.

그러나 일반적으로 폴리아미드 필름은 분자쇄중에 아미드결합이 많기 때문에 높은 흡습성을 가진다. 이로 인해 흡습의 증가에 따라 표면 흡착수가 많아지고 그 결과 주행성이 악화되는 문제가 있다. 이러한 주행성의 악화는 슬리팅, 인쇄, 증착, 적층 등의 후가공 공정에 장애를 일으키는 원인이 되어 왔다. In general, however, polyamide films have high hygroscopicity because of the large number of amide bonds in the molecular chain. As a result, the number of surface adsorption water increases as the moisture absorption increases, and as a result, there is a problem that the running performance deteriorates. Such deterioration of runability has caused obstacles in post-processing processes such as slitting, printing, deposition, and lamination.

이에 폴리아미드 필름의 주행성을 향상시키기 위하여, 폴리아미드 필름 제조시 제막 공정, 후가공 및 사용과정에 있어서 통상적으로 폴리아미드 조성물에 무기 충진제(filler)를 투입하여 필름 표면에 미세한 요철을 형성한다. 이는 표면에 충진제에 의한 요철을 생성시킴으로써 필름 표면의 마찰계수를 줄여 주행성을 부여하 는 개념으로, 사용할 수 있는 충진제로는 보통 카올린, 활석, 탄산칼슘, 실리카, 이산화티탄, 클레이, 알루미나, 칼슘실리케이트, 마이카 등의 불용성 입자를 들 수 있으며, 이들을 투입하여 제조한 필름은 그 종류, 크기 및 양에 따라 다양한 미세 표면 구조를 갖게 된다. Accordingly, in order to improve the running property of the polyamide film, an inorganic filler is usually added to the polyamide composition in the film forming process, the post-processing and the use process of the polyamide film to form fine unevenness on the surface of the film. This is a concept that gives the running property by reducing the friction coefficient of the film surface by creating irregularities by the filler on the surface. Usable fillers are usually kaolin, talc, calcium carbonate, silica, titanium dioxide, clay, alumina, calcium silicate. And insoluble particles such as mica and the like, and the film prepared by adding them has various fine surface structures depending on the type, size and amount thereof.

이러한 충진제의 투입량이 많아지면 필름 표면에 미세요철이 많이 형성되어 필름의 주행성은 향상되나 필름의 투명성은 저하되는 문제가 있다. 뿐만 아니라 필름으로 제막할 경우 상기 충진제로 인하여 필름 표면에 돌기가 형성되어 빛을 산란시켜 필름의 투명성을 저하시키는 또 다른 원인이 되었다. 이와 달리 충진제의 함량을 낮추면 제막 공정에 있어서의 주행성 확보 곤란으로 인한 블로킹 문제에 따른 연신 불균일, 슬리팅 시 한쪽으로의 쏠림 현상이 발생하는 문제가 생긴다. When the amount of the filler is increased, fine irregularities are formed on the surface of the film, and thus the running property of the film is improved, but the transparency of the film is deteriorated. In addition, when the film is formed into a film, protrusions are formed on the surface of the film due to the filler, which causes scattering of light, which is another cause of lowering transparency of the film. On the other hand, if the content of the filler is lowered, the draw nonuniformity due to the blocking problem due to the difficulty in securing the runability in the film forming process, and a problem of pulling to one side during slitting occurs.

이러한 문제를 해결하기 위한 방법으로 폴리아미드 필름의 투명성을 저하시키지 않으면서 주행성을 향상시키기 위하여 무기 충진제의 양을 최소로 하면서 필름 표면에 활성물질을 도포하는 방법이 개발되어 이용되고 있다. 이는 블로킹 현상을 해결하면서 고투명 필름을 제조할 수 있다는 이점이 있으나, 기존의 필름제조공정 외에 하나의 코팅공정이 더 추가되기 때문에 필름의 제조원가가 상승하게 되고 생산속도의 감소, 공정관리의 어려움, 용매의 사용으로 인한 작업성 저하 등의 문제가 있다.In order to solve this problem, a method of applying an active material to the surface of the film while minimizing the amount of the inorganic filler has been developed and used in order to improve the running performance without reducing the transparency of the polyamide film. This has the advantage of being able to produce a high transparency film while solving the blocking phenomenon, but since one coating process is added in addition to the existing film manufacturing process, the manufacturing cost of the film is increased, production speed is reduced, process management difficulty, solvent There is a problem such as degradation of workability due to the use of.

일본 특공소 49-42752호에서는 무정형 실리카(SiO2)입자, 탈크(Talc), 카올린, 기타 실리케이트 등의 각종 미세한 무기 충진제를 첨가하거나 이들 첨가제들의 혼합물을 첨가하여 표면성질을 개량하는 방안을 제시하고 있다. 그러나 이 방법에 의한 경우는 폴리아미드 필름의 표면광택성 및 투명성이 저하되고, 무기첨가제 사이의 공극에 의해 필름의 기계적 강도 및 기체차단성이 감소되는 문제점이 발생한다. Japanese Patent Application No. 49-42752 proposes a method for improving surface properties by adding various fine inorganic fillers such as amorphous silica (SiO 2 ) particles, talc, kaolin, and other silicates, or by adding a mixture of these additives. have. However, in this case, the surface glossiness and transparency of the polyamide film are lowered, and the mechanical strength and the gas barrier property of the film are reduced by the voids between the inorganic additives.

본 발명은 이와 같은 문제점을 해결하기 위한 것으로, 무기 충진제 첨가에 의한 투명성 저하를 방지하고 주행성이 개선된 폴리아미드 필름을 제공하는 데 그 목적이 있다.The present invention has been made to solve the above problems, and an object thereof is to provide a polyamide film having improved runability and preventing transparency decrease due to the addition of an inorganic filler.

또한 본 발명은 필름 표면에 별도의 활성물질의 도포과정 없이도 우수한 주행성과 투명성을 유지하는 폴리아미드 필름을 제공하는 데 그 목적이 있다.It is another object of the present invention to provide a polyamide film that maintains excellent running and transparency even without applying a separate active material on the surface of the film.

본 발명은 표면이 무기화합물로 코팅된 황산바륨 미립자를 무기 충진제로 포함하는 것을 특징으로 하는 폴리아미드 필름을 제공한다.The present invention provides a polyamide film comprising a barium sulfate fine particle coated with an inorganic compound as an inorganic filler.

상기 무기화합물은 알루미늄 또는 규소를 함유한 것을 특징으로 한다.The inorganic compound is characterized by containing aluminum or silicon.

상기 무기화합물은 황산바륨 미립자 100중량부에 대하여 0.5~10중량부 사용 하는 것을 특징으로 한다. The inorganic compound is characterized by using 0.5 to 10 parts by weight based on 100 parts by weight of the barium sulfate fine particles.

상기 무기 충진제는 입경이 0.1~5㎛이고, 전체 미립자 중 입경 1㎛이상인 미립자가 5~30중량%이며, 폴리아미드 수지 100중량부에 대하여 0.05~1중량부 첨가된 것을 특징으로 한다.The inorganic filler is characterized in that the particle size is 0.1 ~ 5㎛, 5 ~ 30% by weight of the fine particles having a particle size of 1㎛ or more of all the fine particles, 0.05 to 1 parts by weight based on 100 parts by weight of polyamide resin.

이하, 본 발명을 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail.

본 발명의 폴리아미드 필름은 폴리아미드 수지에 무기 충진제를 포함하는데, 특히 상기 무기 충진제로서 표면이 무기화합물로 코팅된 황산바륨 미립자를 사용하는 것을 특징으로 한다. The polyamide film of the present invention contains an inorganic filler in the polyamide resin, and in particular, the inorganic filler is characterized by using barium sulfate fine particles coated with an inorganic compound.

상기 황산바륨은 종래 무기 충진제로 사용된 탈크, 실리카, 카올린, 탄산칼슘, 실리케이트 등과 비교했을 때 폴리아미드 수지와 굴절률이 유사하므로, 폴리아미드 수지에 황산바륨 미립자를 무기 충진제로 사용할 때 폴리아미드 수지의 투명성이 저하되지 않는다.The barium sulfate has a similar refractive index with that of the polyamide resin as compared to talc, silica, kaolin, calcium carbonate, silicate, and the like, which are conventionally used as inorganic fillers. Therefore, when the barium sulfate fine particles are used as the inorganic filler in the polyamide resin, Transparency does not fall.

그러나 상기 황산바륨은 폴리아미드 수지와의 상용성에 문제가 있어 폴리아미드 수지에의 분산이 쉽지 않았으며, 이러한 문제를 개선하기 위하여 본 발명에서는 상기 황산바륨 미립자의 표면을 무기화합물로 코팅함으로서 무기 충진제로 사용한다. 상기 무기화합물은 폴리아미드 수지와의 상용성이 우수한 화합물이면 특별히 제한되지 않으나, 폴리아미드 수지와의 굴절률을 고려하여 알루미늄 또는 규소를 함유한 무기화합물로 코팅하는 것이 좋다. However, the barium sulfate has a problem in compatibility with the polyamide resin, so it is not easy to disperse it in the polyamide resin. In order to improve such a problem, the barium sulfate is coated with an inorganic compound by coating the surface of the barium sulfate fine particles with an inorganic compound. use. The inorganic compound is not particularly limited as long as it is a compound having excellent compatibility with the polyamide resin, but may be coated with an inorganic compound containing aluminum or silicon in consideration of the refractive index with the polyamide resin.

또한 황산바륨의 표면을 알루미늄 또는 규소를 함유한 무기화합물로 코팅하면 폴리아미드 수지와의 접착력이 향상되어, 필름 생산시 연신 공정에서 상기 첨가제와 폴리아미드 수지의 계면에서의 보이드 발생에 의한 굴절률 변화에 따른 투명도 저하의 문제를 방지할 수 있다.In addition, coating the surface of the barium sulfate with an inorganic compound containing aluminum or silicon improves the adhesion to the polyamide resin, and changes the refractive index caused by the generation of voids at the interface between the additive and the polyamide resin in the stretching process during film production. The problem of the fall of transparency can be prevented.

상기 무기화합물은 황산바륨 미립자 100중량부에 대하여 0.5~10중량부 사용하여 코팅하는 것이 바람직하며, 상기 무기화합물을 황산바륨 미립자 표면에 코팅하는 방법은 특별히 한정되는 것은 아니다.The inorganic compound is preferably coated using 0.5 to 10 parts by weight based on 100 parts by weight of the barium sulfate fine particles, and the method of coating the inorganic compound on the surface of the barium sulfate fine particles is not particularly limited.

본 발명에서 무기 충진제는 입경이 0.1~5.0㎛인 것이 바람직한데, 무기 충진제의 입경이 0.1㎛ 미만이면 황산바륨 입자의 표면 에너지가 증가하게 되어 서로 응집되는 문제가 발생하게 되고, 필름의 권취시에 블로킹 현상이 발생하게 되어 주행성이 나빠지는 문제가 있으며, 반대로 입경이 5.0㎛를 초과하면 최종 필름 표면의 조도가 불량하게 되어 무기입자에 의한 필름의 외관이 저하되고, 필름과 입자 간에 보이드 발생에 의한 투명성 및 분산성이 저하되는 문제가 있다. 특히 안티블로킹성을 확보하면서 필름의 활성을 배가하여 최종필름의 마찰계수를 감소시키면서 필름의 투명성을 해치지 않도록 전체 미립자 중 입경 1㎛이상인 미립자가 5~30%를 유지하도록 하는 것이 바람직하다.In the present invention, the inorganic filler preferably has a particle diameter of 0.1 to 5.0 μm, but when the particle size of the inorganic filler is less than 0.1 μm, the surface energy of the barium sulfate particles increases, causing a problem of coagulation with each other. The blocking phenomenon occurs and the running performance is deteriorated. On the contrary, when the particle size exceeds 5.0 μm, roughness of the final film surface becomes poor, and the appearance of the film by the inorganic particles is deteriorated. There exists a problem that transparency and dispersibility fall. In particular, it is desirable to maintain 5-30% of the fine particles having a particle size of 1 μm or more among the total fine particles so as not to impair the transparency of the film while doubling the activity of the film while reducing the anti-blocking property while reducing the coefficient of friction of the final film.

상기 무기 충진제의 첨가량은 폴리아미드 수지 100중량부 기준으로 0.05 내지 1중량부이며, 더욱 바람직하게는 0.07 내지 0.25중량부이다. 폴리아미드 수지 100중량부에 대한 황산바륨 미립자의 첨가량이 0.05중량부 미만이면, 표면 조도가 불충분해져서 양호한 주행성을 획득하기 힘들고, 1중량부를 초과하면, 필름의 투명성이 나빠지는 문제가 있다.The addition amount of the said inorganic filler is 0.05-1 weight part with respect to 100 weight part of polyamide resins, More preferably, it is 0.07-0.25 weight part. If the amount of the barium sulfate fine particles added to 100 parts by weight of the polyamide resin is less than 0.05 parts by weight, the surface roughness becomes insufficient, so that it is difficult to obtain good runability, and if it is more than 1 part by weight, the transparency of the film is deteriorated.

또한, 본 발명에서는 무기 충진제를 분산시키는 분산제를 포함 할 수 있다. 적절한 분산제의 예로서 STPP(Sodium Tripolyphosphate) 또는 KTPP(Kalium Tripolyphosphate)를 사용할 수 있으며 첨가량은 황산바륨 미립자 100중량부에 대하여 0.1~5 중량부를 사용하는 것이 좋으며 더 바람직하게는 0.5~2중량부를 사용하는 것이 좋다. 황산바륨 미립자에 대한 분산제의 첨가량이 0.5중량부 미만이면 미립자인 황산바륨이 응집하는 등 원하는 분산성을 얻기 어려우며, 2중량부를 초과하면 필름의 물성이 저하될 뿐만 아니라 경제적으로도 좋지 않다. In addition, the present invention may include a dispersant for dispersing the inorganic filler. As an example of a suitable dispersant, Sodium Tripolyphosphate (STPP) or Kallium Tripolyphosphate (KTPP) may be used, and the amount of addition may be 0.1 to 5 parts by weight based on 100 parts by weight of barium sulfate fine particles, and more preferably 0.5 to 2 parts by weight. It is good. When the amount of the dispersant added to the barium sulfate fine particles is less than 0.5 parts by weight, it is difficult to obtain desired dispersibility such as aggregation of barium sulfate as fine particles. When the amount of the dispersant is more than 2 parts by weight, the physical properties of the film are not only lowered but also economically unfavorable.

본 발명에서 이용할 수 있는 폴리아미드 수지서로는 특별히 제한되지 않으며, 나일론 6, 나일론 7, 나일론 11, 나일론 12, 나일론 66, 나일론 6T, 나일론 MXD6, 나일론 46 등의 폴리아미드 수지 및 이들 폴리아미드 수지의 공중합체, 수지 혼합물, 중합체 얼로이 등을 들 수 있다.The polyamide resins usable in the present invention are not particularly limited, and polyamide resins such as nylon 6, nylon 7, nylon 11, nylon 12, nylon 66, nylon 6T, nylon MXD6, nylon 46 and the like Copolymers, resin mixtures, polymer alloys, and the like.

이와 같이 얻은 폴리아미드 필름의 헤이즈(haze) 값은 필름의 투명도를 고려하여 2.0 이하가 적절하다.The haze value of the polyamide film thus obtained is appropriately 2.0 or less in consideration of the transparency of the film.

또한 본 발명의 폴리아미드 필름의 동마찰계수는 가공성과 권취의 용이성을 고려하여 상대 습도 60%에서 0.3 내지 0.6이하가 적절하다.In addition, the dynamic friction coefficient of the polyamide film of the present invention is preferably 0.3 to 0.6 or less at 60% relative humidity in consideration of processability and ease of winding.

본 발명의 필름용 폴리아미드 수지 조성물을 사용한 폴리아미드 필름성형은 일반적으로 알려진 티-다이(T-die)법 또는 인플레이션(Inflation)법에 의해 행할 수 있다. 예를 들면, 호퍼를 통해 압출기로 공급된 폴리아미드계 수지를 가열 용융시킨 후 압출다이로부터 압출시킨 다음 이를 냉각, 고화시켜 미연신 원단을 제조하고, 이어서 필름의 진행방향(MD) 및 폭방향(TD)으로 동시 또는 축차 연신한 후 열 고정하여 필름으로 제조할 수 있다. 이때 필름의 연신방법으로는 텐터방식 및 튜브방식 모두 사용 가능하다.Polyamide film molding using the polyamide resin composition for films of the present invention can be carried out by a generally known T-die method or inflation method. For example, the polyamide-based resin supplied to the extruder through a hopper is heated and melted and then extruded from the extrusion die, and then cooled and solidified to prepare an unstretched fabric, and then the advancing direction (MD) and width direction ( TD) can be simultaneously or sequentially drawn and then heat-fixed to produce a film. At this time, both the tenter method and the tube method can be used as a method of stretching the film.

이하, 본 발명을 실시예를 참조하여 보다 상세히 설명하나, 본 발명이 하기 실시예에 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the following Examples.

<실시예 1>&Lt; Example 1 >

ε-카프로락탐을 반응기에 투입하고 ε-카프로락탐 100중량부에 대하여 4중량부의 증류수를 투입하여 85℃에서 용융시키고 60rpm이상으로 교반하였다. 교반 시 시스템이 항상 질소로 충진되도록 하여 산화를 방지하였다. ε-caprolactam was added to the reactor, 4 parts by weight of distilled water was added to 100 parts by weight of ε-caprolactam, melted at 85 ° C, and stirred at 60 rpm or more. Upon stirring, the system was always filled with nitrogen to prevent oxidation.

호모믹서에 산화알루미늄(Al2O3)으로 코팅됨으로써 표면 개질된 황산바륨 미립자(상표명: hombright, 독일, Sachtleben Chemie GnbH 제조)를 폴리아미드 수지 100 중량부에 대하여 0.07중량부가 되도록 넣고, 분산제(STPP: Sodium Tripolyphosphate)를 표면 개질된 황산바륨 미립자 100중량부에 대하여 1중량부를 투입한 후, 상기 황산바륨 미립자 및 분산제로 이루어진 고형분의 농도가 10중량%가 되도록 증류수를 혼합하여 수분산 시킨 후 상기의 반응기에 투입하였다.
상기 표면 개질된 황산바륨 미립자는 입경이 0.1~5.0㎛ 범위이며, 전체 미립자 중 입경이 1㎛ 이상인 미립자를 5~30중량% 범위에서 조절하여 평균 입경이 0.7㎛가 되도록 하였다.
Barium sulfate particles (trade name: hombright, Germany, manufactured by Sachtleben Chemie GnbH) surface-modified by coating the homomixer with aluminum oxide (Al 2 O 3 ) were added so as to 0.07 part by weight with respect to 100 parts by weight of the polyamide resin, and a dispersant (STPP) : 1 part by weight of sodium tripolyphosphate) is added to 100 parts by weight of the surface-modified barium sulfate fine particles, and mixed with distilled water so that the solid content of the barium sulfate fine particles and the dispersant is 10 wt% Into the reactor.
The surface-modified barium sulfate fine particles have a particle size ranging from 0.1 μm to 5.0 μm, and the average particle size is adjusted to 0.7 μm by controlling particles having a particle size of 1 μm or more from 5 to 30 wt%.

반응기에 투입된 혼합물을 교반하여 온도를 250℃까지 상승시켜 압력을 17.5kgf/㎠로 유지하고 1시간 동안 반응시켰다. 반응기 내의 압력을 1시간 동안 서서히 제거하여 상압을 만든 뒤 0.3kgf/㎠의 압력으로 30분 동안 감압하여 중합을 완결시켰다. 이때, 중합물의 상대점도가 1.9 ~ 3.9가 되도록 중합온도 및 진공도를 조절하였다. 중합이 완료된 뒤 3kgf/㎠의 가압에 의해 중합물을 배출하여 이를 칩으로 제조하였고 95℃에서 12시간 열수로 세척하여 미반응물을 제거한 뒤 100℃로 진공건조 하였다. 건조된 칩의 수분함량은 0.5중량% 이하로 하여 250℃ 온도에서 용융압출기를 이용하여 미연신 시트를 제조하였다. 이때 냉각롤의 온도는 15℃로 유지하였으며 제조된 시트를 80℃에서 30초간 예열한 뒤 이축으로 각 동시 연신하여 두께 15㎛인 폴리아미드 필름을 제조하였다.The mixture introduced into the reactor was stirred to raise the temperature to 250 ° C., maintaining the pressure at 17.5 kgf / cm 2, and reacting for 1 hour. The pressure in the reactor was slowly removed for 1 hour to create an atmospheric pressure, and the polymerization was completed by depressurizing for 30 minutes at a pressure of 0.3 kgf / cm 2. At this time, the polymerization temperature and the vacuum degree were adjusted so that the relative viscosity of the polymer is 1.9 ~ 3.9. After the polymerization was completed, the polymer was discharged by pressurization of 3kgf / cm 2, which was prepared as a chip, washed with hot water at 95 ° C. for 12 hours to remove unreacted material, and then vacuum dried at 100 ° C. The moisture content of the dried chip was 0.5% by weight or less to prepare an unstretched sheet using a melt extruder at a temperature of 250 ℃. At this time, the temperature of the cooling roll was maintained at 15 ℃ and pre-heated the prepared sheet at 80 ℃ for 30 seconds and then simultaneously stretched biaxially to prepare a polyamide film having a thickness of 15 ㎛.

<실시예 2~5><Examples 2-5>

상기 실시예 1에서 Al2O3로 코팅된 황산바륨 미립자의 함량을 하기 표 1과 같이 변경한 것을 제외하고, 동일한 조건과 방법으로 폴리아미드 필름을 제조하였다. Except for changing the content of the barium sulfate fine particles coated with Al 2 O 3 in Example 1 as shown in Table 1, a polyamide film was prepared under the same conditions and methods.

<실시예 6~8><Examples 6-8>

상기 실시예 2에서 분산제(STPP)의 조성을 하기 표 1과 같이 변경한 것을 제외하고, 동일한 조건과 방법으로 폴리아미드 필름을 제조하였다. Except for changing the composition of the dispersant (STPP) in Example 2 as shown in Table 1, a polyamide film was prepared under the same conditions and methods.

<실시예 9~10><Examples 9-10>

상기 실시예 2에서 Al2O3로 코팅된 황산바륨 미립자의 입경을 하기 표 1과 같이 변경한 것을 제외하고, 동일한 조건과 방법으로 폴리아미드 필름을 제조하였다. Except for changing the particle diameter of the barium sulfate fine particles coated with Al 2 O 3 in Example 2 as shown in Table 1, a polyamide film was prepared under the same conditions and methods.

<실시예 11~13><Examples 11-13>

상기 실시예 2에서 황산바륨 미립자를 표 1의 조성으로 SiO2로 코팅한 것을 제외하고, 동일한 조건과 방법으로 폴리아미드 필름을 제조하였다. Except that the barium sulfate particles in Example 2 was coated with SiO 2 in the composition of Table 1, a polyamide film was prepared under the same conditions and methods.

<비교예 1>Comparative Example 1

상기 실시예 2에서 표면에 무기화합물로 코팅되지 않은 황산바륨 미립자를 첨가한 것을 제외하고, 동일한 조건과 방법으로 폴리아미드 필름을 제조하였다. Except for adding the barium sulfate fine particles not coated with an inorganic compound on the surface in Example 2, a polyamide film was prepared under the same conditions and methods.

<비교예 2~4><Comparative Example 2-4>

상기 실시예 2에서 무기 충진제로서 실리카 미립자를 표1의 조성과 같이 첨가한 것을 제외하고, 동일한 조건과 방법으로 폴리아미드 필름을 제조하였다. A polyamide film was prepared under the same conditions and methods except for adding silica fine particles as an inorganic filler in Example 2, as shown in Table 1.

상기의 실시예 및 비교예에서 제조된 폴리아미드 필름의 물성평가방법은 다음과 같으며 그 결과는 표2에 나타내었다.The physical property evaluation method of the polyamide film prepared in the above Examples and Comparative Examples is as follows and the results are shown in Table 2.

(1)마찰계수(1) Friction coefficient

25℃, 상대습도 60% 조건하에서 동 마찰계수를 ASTM D1894에 준하여 측정하였다. 하부 시편의 길이(mm)는 250× 130, 상부 시편의 길이(mm)는 65×60으로 하였고 150㎜/min의 속도로 5회 측정하여 최대값과 최소값을 제외한 나머지 값의 평균값으로 구하였다.The coefficient of friction was measured in accordance with ASTM D1894 at 25 ° C. and 60% relative humidity. The length of the lower specimens (mm) was 250 × 130 and the length of the upper specimens (mm) was 65 × 60. Five measurements were made at a speed of 150 mm / min to obtain the average of the remaining values except for the maximum and minimum values.

(2)상대점도(2) relative viscosity

폴리아미드 수지를 0.25g/㎗의 농도로 진한 황산(98%)에 녹여 용액을 제조한 후, 25℃의 항온조에서 캐논-펜스케(Cannon-Fenske)점도계를 사용하여 상대점도를 측정하였다.The polyamide resin was dissolved in concentrated sulfuric acid (98%) at a concentration of 0.25 g / dl, and a solution was prepared. Relative viscosity was measured using a Cannon-Fenske viscometer in a 25 ° C thermostat.

상대점도 = 용액의 낙류시간(sec) / 순수 황산의 낙류시간(sec)Relative viscosity = Falling time of solution (sec) / Falling time of pure sulfuric acid (sec)

(3)헤이즈 (3) haze

ASTM D1003에 준하여 측정하고 백분율로 표시하였다. 헤이즈미터(일본, TOYOSEIKI)를 사용하여 가시광선 영역에서 필름의 헤이즈를 측정하였다.Measured according to ASTM D1003 and expressed as a percentage. The haze of the film was measured in the visible region using a haze meter (TOYOSEIKI, Japan).

(4)무기입자의 분산성(4) dispersibility of inorganic particles

중합된 폴리에스테르 수지에서의 황산바륨 입자의 분산도는 SEM-IA를 이용하여 분석하였으며, 다음과 같이 평가하였다.Dispersion of the barium sulfate particles in the polymerized polyester resin was analyzed using SEM-IA, and evaluated as follows.

우수 ← ◎ > ○ > △ > × → 나쁨 Excellent ← ◎> ○> △> × → Poor

Figure 112007045069331-pat00001
Figure 112007045069331-pat00001

구 분division 분산성Dispersibility 헤이즈(%)Haze (%) 빛투과율(%)Light transmittance (%) 상대점도Relative viscosity 동 마찰계수Dynamic friction coefficient 실시예1Example 1 0.40.4 89.189.1 3.383.38 0.530.53 실시예2Example 2 0.50.5 88.988.9 3.293.29 0.470.47 실시예3Example 3 1.41.4 86.286.2 3.333.33 0.410.41 실시예4Example 4 0.10.1 89.889.8 3.303.30 0.610.61 실시예5Example 5 2.02.0 85.785.7 3.273.27 0.320.32 실시예6Example 6 0.60.6 89.489.4 3.273.27 0.480.48 실시예7Example 7 0.50.5 89.389.3 3.333.33 0.470.47 실시예8Example 8 0.70.7 87.687.6 3.323.32 0.500.50 실시예9Example 9 0.30.3 89.289.2 3.293.29 0.650.65 실시예10Example 10 1.11.1 85.685.6 3.303.30 0.570.57 실시예11Example 11 0.70.7 88.888.8 3.313.31 0.550.55 실시예12Example 12 1.21.2 87.787.7 3.333.33 0.610.61 실시예13Example 13 0.90.9 88.588.5 3.353.35 0.490.49 비교예1Comparative Example 1 ×× 3.73.7 75.475.4 3.343.34 0.610.61 비교예2Comparative Example 2 2.12.1 80.480.4 3.283.28 0.560.56 비교예3Comparative Example 3 2.72.7 77.677.6 3.303.30 0.480.48 비교예4Comparative Example 4 4.24.2 68.968.9 3.363.36 0.400.40

상기 물성 측정 결과, 표면을 알루미늄 또는 규소를 함유한 무기화합물로 코팅한 황산바륨 미립자를 무기 충진제로 사용한 실시예의 폴리아미드 필름은 표면을 무기화합물로 코팅하지 않은 황산바륨 미립자를 무기 충진제로 사용한 비교예 1보다 분산성이 매우 향상되었으며, 따라서 분산이 잘 되지 않음으로 인해 생긴 투명성 저하 문제도 현저하게 개선된 것을 볼 수 있다. As a result of measuring the physical properties, the polyamide film of the example in which the barium sulfate fine particles coated with the inorganic compound containing aluminum or silicon was used as the inorganic filler, and the comparative example using the barium sulfate fine particles without the surface coated with the inorganic compound as the inorganic filler. Dispersibility is significantly improved than that of 1, and thus, the problem of reduced transparency due to poor dispersion can be seen to be remarkably improved.

아울러 본 발명의 실시예에서 제조된 폴리아미드 필름은, 비교예 2~4, 즉 무기 충진제로 실리카 미립자를 사용한 폴리아미드 필름에서 나타난 투명성 저하문제가 현저하게 개선되었으며, 동시에 주행성과 분산성이 동등정도로 우수한 것을 알 수 있다.In addition, the polyamide film prepared in the embodiment of the present invention, the comparative problems 2 to 4, that is, the problem of lowering the transparency of the polyamide film using silica fine particles as an inorganic filler significantly improved, while at the same time running and dispersibility It can be seen that it is excellent.

이상에서 설명한 바와 같이 본 발명은 폴리아미드 필름 제조시 표면이 무기화합물로 코팅된 황산바륨 미립자를 무기 충진제로 사용함으로써, 주행성이 우수하면서 투명도가 저하되지 않는 폴리아미드 필름을 제공하였다.As described above, the present invention provides a polyamide film having excellent runability and no drop in transparency by using barium sulfate fine particles coated with an inorganic compound on the surface of the polyamide film as an inorganic filler.

또한 본 발명은 필름 표면에 별도의 활성 물질의 도포 없이도 주행성을 유지하면서 투명성 저하를 방지할 수 있어 제조원가 절감 및 생산속도 향상에 기여할 수 있는 폴리아미드 필름을 제공하였다.In another aspect, the present invention provides a polyamide film that can contribute to the reduction in manufacturing cost and the production speed can be prevented by reducing the transparency while maintaining the runability without applying a separate active material on the film surface.

Claims (5)

알루미늄 또는 규소를 함유하는 무기화합물로 표면이 코팅된 황산바륨 미립자를 무기 충진제로 포함하고, Including an inorganic compound containing aluminum or silicon barium sulfate fine particles coated on the surface as an inorganic filler, 상기 무기화합물은 황산바륨 미립자 100중량부에 대하여 0.5~10중량부 사용되며, The inorganic compound is used 0.5 to 10 parts by weight based on 100 parts by weight of the barium sulfate fine particles, 상기 무기 충진제는 입경이 0.1~5.0㎛이고, 전체 미립자 중 입경이 1㎛이상인 미립자가 5~30중량%인 폴리아미드 필름.The inorganic filler is a polyamide film having a particle size of 0.1 ~ 5.0㎛, 5-30% by weight of the fine particles having a particle size of 1㎛ or more of all the fine particles. 삭제delete 삭제delete 삭제delete 제 1 항에 있어서, The method of claim 1, 무기 충진제는 폴리아미드 수지 100중량부에 대하여 0.05~1중량부 첨가된 것을 특징으로 하는 폴리아미드 필름.Inorganic filler is 0.05 to 1 parts by weight based on 100 parts by weight of polyamide resin, polyamide film.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021221374A1 (en) * 2020-04-29 2021-11-04 에스케이씨 주식회사 Polyamide-based composite film and display device comprising same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006064729A1 (en) * 2004-12-17 2006-06-22 Maruo Calcium Company Limited Filler for porous film and porous film wherein such filler is blended
WO2007039625A1 (en) * 2005-10-04 2007-04-12 Solvay (Société Anonyme) Use of barium sulfate or calcium carbonate particles in transparent polymer compositions, transparent polymer compositions and process for manufacturing these compositions

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006064729A1 (en) * 2004-12-17 2006-06-22 Maruo Calcium Company Limited Filler for porous film and porous film wherein such filler is blended
WO2007039625A1 (en) * 2005-10-04 2007-04-12 Solvay (Société Anonyme) Use of barium sulfate or calcium carbonate particles in transparent polymer compositions, transparent polymer compositions and process for manufacturing these compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021221374A1 (en) * 2020-04-29 2021-11-04 에스케이씨 주식회사 Polyamide-based composite film and display device comprising same

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