KR101069802B1 - Reflective appartus for light emitting diode - Google Patents
Reflective appartus for light emitting diodeInfo
- Publication number
- KR101069802B1 KR101069802B1 KR1020090089797A KR20090089797A KR101069802B1 KR 101069802 B1 KR101069802 B1 KR 101069802B1 KR 1020090089797 A KR1020090089797 A KR 1020090089797A KR 20090089797 A KR20090089797 A KR 20090089797A KR 101069802 B1 KR101069802 B1 KR 101069802B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting diode
- mounting
- substrate
- mounting hole
- Prior art date
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- Led Device Packages (AREA)
Abstract
The present invention relates to a light emitting diode, and more particularly, to a reflecting device for a light emitting diode which can be mounted around the light emitting diode chip to improve the reflectivity of light.
The reflector for a light emitting diode of the present invention includes one or more mounting holes formed around a light emitting diode chip of a substrate, and includes a reflecting member mounted through the mounting hole, and the reflecting member surrounds the light emitting diode chip. A reflection side wall portion formed in a shape and having an inclined surface; A horizontal flat portion extending horizontally in an outer diameter direction from a lower end of the reflective side wall portion; And at least one mounting protrusion extending downward from an outer edge of the horizontal flat portion.
Light Emitting Diode, Reflector, Reflective Side Wall, Horizontal Flat, Mounting Projection
Description
The present invention relates to a light emitting diode, and more particularly, to a reflecting device for a light emitting diode which can be mounted around the light emitting diode chip to improve the reflectivity of light.
As is well known, a light emitting diode (LED) is a semiconductor device that generates a small number of carriers (electrons or holes) injected using a PN junction structure of a semiconductor and emits light energy by recombination thereof. Compared with the conventional light source, it is small and has a long lifespan, and the electrical energy is directly converted into light energy, so the luminous efficiency is high. It is widely used in lighting devices and card readers.
In order to apply to such a display device and a lighting device, a light emitting diode package having various structures that are easily mounted and used therein has been developed. In particular, since the light emitting diode chip has a high luminous efficiency, the amount of heat is also considerable, and the light emitting diode package must be provided with a heat dissipation means capable of dissipating heat from the chip to the outside. If a suitable heat dissipation means is not provided in the LED package, the temperature of the LED chip becomes too high, resulting in deterioration of the chip itself or the packaging resin, resulting in a decrease in luminous efficiency and a short lifetime of the chip.
1 is a cross-sectional view illustrating a conventional reflector for a light emitting diode. As shown in the drawing, a conventional reflector for a light emitting diode is provided around the light
However, the conventional reflective device for light emitting diodes has a disadvantage in that the assembling process of the
The present invention has been made in view of the above, and an object thereof is to provide a reflecting device for a light emitting diode in which the manufacturing cost is reduced by assembling the reflecting member very easily on the substrate side.
In addition, the present invention provides a reflective device for a light emitting diode that can implement a stable coupling structure between the reflective member and the substrate by applying a structure in which the bonding force between the reflective member and the substrate is not affected by the heat of the LED chip. There is a purpose.
Reflective device for a light emitting diode of the present invention for achieving the above object,
At least one mounting hole is formed around the light emitting diode chip of the substrate, and includes a reflective member mounted through the mounting hole,
The reflective member,
A reflective side wall portion formed around the light emitting diode chip and having an inclined surface;
A horizontal flat portion extending horizontally in an outer diameter direction from a lower end of the reflective side wall portion;
And one or more mounting protrusions extending downward from the outer edge of the horizontal flat portion.
Each mounting protrusion is formed in a thin and flat shape, the mounting protrusion is characterized in that the lower end is bent outward from the lower end of the mounting hole after being fitted in the mounting hole of the substrate.
Each mounting protrusion is formed in a cylindrical shape, the mounting hole of the substrate is formed in a shape and dimensions corresponding to the cylindrical image of the mounting protrusion, the mounting protrusion is inserted into the mounting hole of the substrate, the bottom of the riveting It is characterized by.
Each of the mounting protrusions is formed in a cylindrical shape having a predetermined outer diameter, the mounting hole of the substrate is formed smaller than the outer diameter of the mounting protrusion, characterized in that the mounting protrusion is forcibly pressed into the mounting hole of the substrate.
Another aspect of the invention includes a reflecting member provided around the light emitting diode chip of the substrate,
The reflective member,
A reflective side wall portion formed around the light emitting diode chip and having an inclined surface; And
And a horizontal flat portion extending horizontally in an outer diameter direction from a lower end of the reflective side wall portion.
The horizontal flat portion is characterized in that bonded to the peripheral to the light emitting diode chip of the substrate.
According to the present invention as described above, by simply assembling the reflective member on the substrate side, the assembly process can be greatly simplified, thereby reducing the manufacturing cost.
In addition, the present invention can add a heat dissipation function as well as a heat dissipation function by the heat dissipation fins by applying a metal reflective member having good thermal conductivity and reflectivity, which can greatly improve the overall heat dissipation performance There is this.
In addition, the present invention provides a module structure in which a plurality of light emitting diode chips are arranged in various structures, and due to the structure in which the reflecting member is fitted to the substrate side, the coupling force between the reflecting member and the substrate is affected by the heat of the light emitting diode chip. As it hardly receives, the bending of the substrate does not occur, and thus the light emitting quality of the light emitting diode package is not degraded.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
2 to 4 illustrate a reflecting device for a light emitting diode according to an embodiment of the present invention.
As shown, the reflector for a light emitting diode of the present invention includes a metal
As shown in FIG. 4, the light
As shown in FIG. 2, the light
2 and 3, one or
The
The reflective
The horizontal
The plurality of
In particular, the
In addition, the
In addition, after the
As described above, the present invention makes the assembling process extremely effective by fitting the
In addition, according to the present invention, by applying the metal
In addition, in the module structure in which the plurality of light
5 is a cross-sectional view showing another embodiment of the present invention.
As shown, the mounting
In addition, the mounting
In addition, after the mounting
Since the rest of the configuration is the same as the preceding embodiment, a detailed description thereof will be omitted.
6 is a cross-sectional view showing yet another embodiment of the present invention.
As shown, the mounting
In addition, the mounting
In addition, after the mounting
Since the rest of the configuration is the same as the preceding embodiments, a detailed description thereof will be omitted.
7 and 8 illustrate another embodiment of the present invention.
As shown, the mounting
Since the rest of the configuration is the same as the preceding embodiments, a detailed description thereof will be omitted.
1 is a cross-sectional view illustrating a conventional reflector for a light emitting diode.
2 is a cross-sectional view showing a reflecting device for a light emitting diode according to an embodiment of the present invention.
3 is an exploded perspective view showing a reflecting device for a light emitting diode according to an embodiment of the present invention.
4 is a perspective view illustrating a light emitting diode package provided with a reflecting device for a light emitting diode of the present invention.
5 is a cross-sectional view showing a reflecting device for a light emitting diode according to another embodiment of the present invention.
6 is a cross-sectional view showing a reflecting device for a light emitting diode according to another embodiment of the present invention.
7 and 8 are a perspective view and a cross-sectional view showing a reflecting device for a light emitting diode according to another embodiment of the present invention.
Brief description of symbols for the main parts of the drawings
10: reflection member 11: reflection side wall portion
12: horizontal flat part 13: mounting protrusion
20: light emitting diode package 21: substrate
25: light emitting diode chip
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090089797A KR101069802B1 (en) | 2009-09-22 | 2009-09-22 | Reflective appartus for light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090089797A KR101069802B1 (en) | 2009-09-22 | 2009-09-22 | Reflective appartus for light emitting diode |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110032358A KR20110032358A (en) | 2011-03-30 |
KR101069802B1 true KR101069802B1 (en) | 2011-10-04 |
Family
ID=43937113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090089797A KR101069802B1 (en) | 2009-09-22 | 2009-09-22 | Reflective appartus for light emitting diode |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101069802B1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005183531A (en) * | 2003-12-17 | 2005-07-07 | Sharp Corp | Semiconductor light emitting device |
-
2009
- 2009-09-22 KR KR1020090089797A patent/KR101069802B1/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005183531A (en) * | 2003-12-17 | 2005-07-07 | Sharp Corp | Semiconductor light emitting device |
Also Published As
Publication number | Publication date |
---|---|
KR20110032358A (en) | 2011-03-30 |
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