KR101069802B1 - Reflective appartus for light emitting diode - Google Patents

Reflective appartus for light emitting diode

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Publication number
KR101069802B1
KR101069802B1 KR1020090089797A KR20090089797A KR101069802B1 KR 101069802 B1 KR101069802 B1 KR 101069802B1 KR 1020090089797 A KR1020090089797 A KR 1020090089797A KR 20090089797 A KR20090089797 A KR 20090089797A KR 101069802 B1 KR101069802 B1 KR 101069802B1
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KR
South Korea
Prior art keywords
light emitting
emitting diode
mounting
substrate
mounting hole
Prior art date
Application number
KR1020090089797A
Other languages
Korean (ko)
Other versions
KR20110032358A (en
Inventor
김성열
Original Assignee
주식회사 세미라인
익스팬테크주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 세미라인, 익스팬테크주식회사 filed Critical 주식회사 세미라인
Priority to KR1020090089797A priority Critical patent/KR101069802B1/en
Publication of KR20110032358A publication Critical patent/KR20110032358A/en
Application granted granted Critical
Publication of KR101069802B1 publication Critical patent/KR101069802B1/en

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Abstract

The present invention relates to a light emitting diode, and more particularly, to a reflecting device for a light emitting diode which can be mounted around the light emitting diode chip to improve the reflectivity of light.

The reflector for a light emitting diode of the present invention includes one or more mounting holes formed around a light emitting diode chip of a substrate, and includes a reflecting member mounted through the mounting hole, and the reflecting member surrounds the light emitting diode chip. A reflection side wall portion formed in a shape and having an inclined surface; A horizontal flat portion extending horizontally in an outer diameter direction from a lower end of the reflective side wall portion; And at least one mounting protrusion extending downward from an outer edge of the horizontal flat portion.

Light Emitting Diode, Reflector, Reflective Side Wall, Horizontal Flat, Mounting Projection

Description

Reflector for light emitting diodes {REFLECTIVE APPARTUS FOR LIGHT EMITTING DIODE}

The present invention relates to a light emitting diode, and more particularly, to a reflecting device for a light emitting diode which can be mounted around the light emitting diode chip to improve the reflectivity of light.

As is well known, a light emitting diode (LED) is a semiconductor device that generates a small number of carriers (electrons or holes) injected using a PN junction structure of a semiconductor and emits light energy by recombination thereof. Compared with the conventional light source, it is small and has a long lifespan, and the electrical energy is directly converted into light energy, so the luminous efficiency is high. It is widely used in lighting devices and card readers.

In order to apply to such a display device and a lighting device, a light emitting diode package having various structures that are easily mounted and used therein has been developed. In particular, since the light emitting diode chip has a high luminous efficiency, the amount of heat is also considerable, and the light emitting diode package must be provided with a heat dissipation means capable of dissipating heat from the chip to the outside. If a suitable heat dissipation means is not provided in the LED package, the temperature of the LED chip becomes too high, resulting in deterioration of the chip itself or the packaging resin, resulting in a decrease in luminous efficiency and a short lifetime of the chip.

1 is a cross-sectional view illustrating a conventional reflector for a light emitting diode. As shown in the drawing, a conventional reflector for a light emitting diode is provided around the light emitting diode chip 3 of the light emitting diode package. The light emitting diode package includes a substrate 1 and a plurality of light emitting diode chips 3 provided on an upper surface of the substrate 1, and the plurality of light emitting diode chips 3 are arranged in an array structure of various forms. A heat radiation fin 2 may be connected to each light emitting diode chip 3, and a reflecting member 4 is disposed around each light emitting diode chip 3, and the reflecting member 4 is made of an insulating material. The reflective member 4 is bonded to the upper surface of the substrate 1 through an adhesive such as silicon or epoxy, and the reflective member 4 may form a plating layer to improve the reflectance.

However, the conventional reflective device for light emitting diodes has a disadvantage in that the assembling process of the reflective member 4 is very cumbersome, and the manufacturing cost thereof is high.

The present invention has been made in view of the above, and an object thereof is to provide a reflecting device for a light emitting diode in which the manufacturing cost is reduced by assembling the reflecting member very easily on the substrate side.

In addition, the present invention provides a reflective device for a light emitting diode that can implement a stable coupling structure between the reflective member and the substrate by applying a structure in which the bonding force between the reflective member and the substrate is not affected by the heat of the LED chip. There is a purpose.

Reflective device for a light emitting diode of the present invention for achieving the above object,

At least one mounting hole is formed around the light emitting diode chip of the substrate, and includes a reflective member mounted through the mounting hole,

The reflective member,

A reflective side wall portion formed around the light emitting diode chip and having an inclined surface;

A horizontal flat portion extending horizontally in an outer diameter direction from a lower end of the reflective side wall portion;

And one or more mounting protrusions extending downward from the outer edge of the horizontal flat portion.

Each mounting protrusion is formed in a thin and flat shape, the mounting protrusion is characterized in that the lower end is bent outward from the lower end of the mounting hole after being fitted in the mounting hole of the substrate.

Each mounting protrusion is formed in a cylindrical shape, the mounting hole of the substrate is formed in a shape and dimensions corresponding to the cylindrical image of the mounting protrusion, the mounting protrusion is inserted into the mounting hole of the substrate, the bottom of the riveting It is characterized by.

Each of the mounting protrusions is formed in a cylindrical shape having a predetermined outer diameter, the mounting hole of the substrate is formed smaller than the outer diameter of the mounting protrusion, characterized in that the mounting protrusion is forcibly pressed into the mounting hole of the substrate.

Another aspect of the invention includes a reflecting member provided around the light emitting diode chip of the substrate,

The reflective member,

A reflective side wall portion formed around the light emitting diode chip and having an inclined surface; And

And a horizontal flat portion extending horizontally in an outer diameter direction from a lower end of the reflective side wall portion.

The horizontal flat portion is characterized in that bonded to the peripheral to the light emitting diode chip of the substrate.

According to the present invention as described above, by simply assembling the reflective member on the substrate side, the assembly process can be greatly simplified, thereby reducing the manufacturing cost.

In addition, the present invention can add a heat dissipation function as well as a heat dissipation function by the heat dissipation fins by applying a metal reflective member having good thermal conductivity and reflectivity, which can greatly improve the overall heat dissipation performance There is this.

In addition, the present invention provides a module structure in which a plurality of light emitting diode chips are arranged in various structures, and due to the structure in which the reflecting member is fitted to the substrate side, the coupling force between the reflecting member and the substrate is affected by the heat of the light emitting diode chip. As it hardly receives, the bending of the substrate does not occur, and thus the light emitting quality of the light emitting diode package is not degraded.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 to 4 illustrate a reflecting device for a light emitting diode according to an embodiment of the present invention.

As shown, the reflector for a light emitting diode of the present invention includes a metal reflective member 10 having good thermal conductivity and light reflectivity, and the reflective member 10 includes a substrate 21 of the light emitting diode package 20. Fits to the side.

As shown in FIG. 4, the light emitting diode package 20 includes a substrate 21 and at least one light emitting diode chip 25 provided on an upper surface of the substrate 21, and the plurality of light emitting diode chips 25 are various. Arrayed, each light emitting diode chip 25 is installed by wire bonding or flip chip.

As shown in FIG. 2, the light emitting diode chip 25 may be installed on the heat dissipation fin 26, and the heat dissipation fin 26 may be installed through the substrate 21 to effectively dissipate heat of the light emitting diode chip 25. Configured to do so.

2 and 3, one or more mounting holes 18 are formed around each of the light emitting diode chips 25 of the substrate 21, and are reflected on the mounting holes 18 side of the substrate 21. The member 10 may be coupled in such a manner as to be fitted.

The reflective member 10 is made of a metal material having good thermal conductivity and reflectivity, and as shown in FIG. 3, the horizontal flat portion 12 connected to the lower end of the reflective side wall portion 11 and the reflective side wall portion 11, horizontally. It has one or more mounting protrusions 13 extending downward from the outer edge of the flat portion 12. And, since the reflective member 10 is made of a metal material, as shown in FIGS. 2 and 3, the respective thicknesses of the reflective side wall portion 11, the horizontal flat portion 12, and the mounting protrusion 13 may be thinly formed. Can be.

The reflective side wall portion 11 is formed in a circular or polygonal shape so as to surround the light emitting diode chip 25, and is inclined upward. Accordingly, the light of the light emitting diode chip 25 may be irradiated to a wider range through the reflective side wall portion 11.

The horizontal flat portion 12 extends horizontally in the outer diameter direction from the lower end of the reflective side wall portion 11, and the horizontal flat portion 12 is in contact with the surface of the substrate 21.

The plurality of mounting protrusions 13 extend downward from the outer edge of the horizontal flat portion 12, and each mounting protrusion 13 is fitted into the mounting hole 18 of the substrate 21.

In particular, the mounting protrusion 13 of the present embodiment has a thin and flat thickness and is fitted into the mounting hole 18 of the substrate 21, and then the lower end 13a of the mounting protrusion 13 is lower than the mounting hole 18. By bending in the outward direction in the reflective member 10 can be firmly coupled to the substrate 21 side.

In addition, the mounting protrusion 13 may be formed to have a plurality of uneven parts (not shown) protruding outward from the outer circumferential surface thereof so that the mounting protrusion 13 may be more tightly fitted to the mounting hole 18 of the substrate 21. have.

In addition, after the mounting protrusion 13 is fitted into the mounting hole 18, the mounting protrusion 13 may be additionally fixed by soldering. Accordingly, the reflective member 10 of the present invention may be more firmly coupled to the substrate 21 side. have.

As described above, the present invention makes the assembling process extremely effective by fitting the reflective member 10 to the substrate 21 by the mounting projection 13 of the reflective member 10 and the mounting hole 18 of the substrate 21. Simplification can reduce manufacturing costs.

In addition, according to the present invention, by applying the metal reflective member 10 having good thermal conductivity and reflectivity, it is possible to add not only a heat dissipation function by the heat dissipation fin 15, but also a heat dissipation function through the reflection member 10. There is an advantage that can significantly improve the heat dissipation performance.

In addition, in the module structure in which the plurality of light emitting diode chips 25 are arranged in various structures as shown in FIG. 4, the reflective member 10 having a thin thickness is fitted to the substrate 21 side. Since the bonding force between the reflective member 10 and the substrate 21 is hardly affected by the heat of the LED chip 25, bending of the substrate 21 does not occur, and thus the light emitting quality of the LED package is degraded. There is no advantage.

5 is a cross-sectional view showing another embodiment of the present invention.

As shown, the mounting projections 13 of the reflective member 10 are formed in a cylindrical shape, the mounting hole 18 of the substrate 21 is formed in a shape and dimensions corresponding to the cylindrical mounting projections 13. . Accordingly, the cylindrical mounting protrusion 13 is inserted into the mounting hole 18 of the substrate 21, and then the lower end thereof is riveted 13b at the lower end of the mounting hole 18 of the substrate 21, thereby reflecting the member 10. The mounting protrusions 13 of) may be more firmly coupled to the mounting holes 18 of the substrate 21.

In addition, the mounting protrusion 13 may be formed to have a plurality of uneven parts (not shown) protruding outward from the outer circumferential surface thereof so that the mounting protrusion 13 may be more tightly fitted to the mounting hole 18 of the substrate 21. have.

In addition, after the mounting protrusion 13 is fitted to the mounting hole 18, it may be additionally fixed by soldering, so that the reflective member 10 of the present invention is firmly coupled to the substrate 21 side more firmly. Can be.

Since the rest of the configuration is the same as the preceding embodiment, a detailed description thereof will be omitted.

6 is a cross-sectional view showing yet another embodiment of the present invention.

As shown, the mounting projection 13 of the reflective member 10 is formed in a cylindrical shape of a predetermined outer diameter, the mounting hole 18 of the substrate 21 has an inner diameter slightly smaller than the outer diameter of the mounting projection 13. Have Thus, the mounting protrusion 13 of the reflective member 10 may be fitted in a manner that is forcibly pressed into the mounting hole 18 of the substrate 21.

In addition, the mounting protrusion 13 may be formed to have a plurality of uneven parts (not shown) protruding outward from the outer circumferential surface thereof so that the mounting protrusion 13 may be more tightly fitted to the mounting hole 18 of the substrate 21. have.

In addition, after the mounting protrusion 13 is fitted to the mounting hole 18, it may be additionally fixed by soldering, so that the reflective member 10 of the present invention is firmly coupled to the substrate 21 side more firmly. Can be.

Since the rest of the configuration is the same as the preceding embodiments, a detailed description thereof will be omitted.

7 and 8 illustrate another embodiment of the present invention.

As shown, the mounting projection 13 of the reflective member 10 and the mounting hole 18 of the substrate 21 are omitted, and the horizontal flat portion 12 of the reflective member 10 is placed on the substrate 21 side. It may be directly bonded through soldering or adhesives or the like. Accordingly, the reflective member 10 has a thin thickness of the reflective side wall portion 11 and the horizontal flat portion 12, so that the reflective member 10 is easily adhered to the substrate 21, and the coupling force of the reflective member 10 is increased. There is a significant advantage.

Since the rest of the configuration is the same as the preceding embodiments, a detailed description thereof will be omitted.

1 is a cross-sectional view illustrating a conventional reflector for a light emitting diode.

2 is a cross-sectional view showing a reflecting device for a light emitting diode according to an embodiment of the present invention.

3 is an exploded perspective view showing a reflecting device for a light emitting diode according to an embodiment of the present invention.

4 is a perspective view illustrating a light emitting diode package provided with a reflecting device for a light emitting diode of the present invention.

5 is a cross-sectional view showing a reflecting device for a light emitting diode according to another embodiment of the present invention.

6 is a cross-sectional view showing a reflecting device for a light emitting diode according to another embodiment of the present invention.

7 and 8 are a perspective view and a cross-sectional view showing a reflecting device for a light emitting diode according to another embodiment of the present invention.

Brief description of symbols for the main parts of the drawings

10: reflection member 11: reflection side wall portion

12: horizontal flat part 13: mounting protrusion

20: light emitting diode package 21: substrate

25: light emitting diode chip

Claims (5)

At least one mounting hole is formed around the light emitting diode chip of the substrate, and includes a reflective member mounted through the mounting hole, The reflective member, A reflective side wall portion formed around the light emitting diode chip and having an inclined surface; A horizontal flat portion extending horizontally in an outer diameter direction from a lower end of the reflective side wall portion; Reflecting device for a light emitting diode comprising a; at least one mounting projection extending in the downward direction from the outer edge of the horizontal flat portion. The method of claim 1, Each of the mounting projections is formed in a thin and flat shape, the mounting projection is a light emitting diode reflector, characterized in that the lower end is bent outward from the lower end of the mounting hole after being fitted in the mounting hole of the substrate. The method of claim 1, Each mounting protrusion is formed in a cylindrical shape, the mounting hole of the substrate is formed in a shape and dimensions corresponding to the cylindrical image of the mounting protrusion, the mounting protrusion is inserted into the mounting hole of the substrate, the bottom of the riveting Reflector for a light emitting diode, characterized in that. The method of claim 1, Each mounting protrusion is formed in a cylindrical shape having a predetermined outer diameter, the mounting hole of the substrate is formed smaller than the outer diameter of the mounting projection, the mounting projection for the light emitting diode, characterized in that the forced indentation in the mounting hole of the substrate Reflector. delete
KR1020090089797A 2009-09-22 2009-09-22 Reflective appartus for light emitting diode KR101069802B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090089797A KR101069802B1 (en) 2009-09-22 2009-09-22 Reflective appartus for light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090089797A KR101069802B1 (en) 2009-09-22 2009-09-22 Reflective appartus for light emitting diode

Publications (2)

Publication Number Publication Date
KR20110032358A KR20110032358A (en) 2011-03-30
KR101069802B1 true KR101069802B1 (en) 2011-10-04

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090089797A KR101069802B1 (en) 2009-09-22 2009-09-22 Reflective appartus for light emitting diode

Country Status (1)

Country Link
KR (1) KR101069802B1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183531A (en) * 2003-12-17 2005-07-07 Sharp Corp Semiconductor light emitting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183531A (en) * 2003-12-17 2005-07-07 Sharp Corp Semiconductor light emitting device

Also Published As

Publication number Publication date
KR20110032358A (en) 2011-03-30

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