KR101057814B1 - Automatic Main Distributing Frame Appratus - Google Patents

Abstract

The automatic MD device of the present invention includes a movable connecting means for reciprocating by a driving screw to selectively connect a plurality of wiring patterns formed on a substrate. The movable connecting means includes a conductive contact terminal formed integrally with the slider and the slider of the insulator, and the contact terminal is formed in a convex curve toward the substrate to contact the wiring pattern; A support portion connected to the contact portion and inserted into the contact terminal groove of the slider to support the contact portion; And a separating portion in which part or all of the contact portion is divided.
The board | substrate is formed with the some wiring pattern group divided into at least two along the direction of the drive screw part, and the waiting section which a movable connection means waits is formed between the some wiring pattern group.

Description

Automatic Main Distributing Frame Appratus}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Main Distributing Frame (MDF) device and, more particularly, to an improved Automated MDP device that electrically connects or disconnects wiring between substrates.

An automatic MD device is a device which automatically performs communication connection and interruption between an exchange and a user terminal at an exchange facility. The conventional automatic MFC device is divided into a pin connection method and a slide connection method according to the connection method of the communication wiring, and in particular, the automatic MFC device according to the slide connection method is a method of driving the movable contact of the slide switch by a screw part. It has been proposed in Patent Publication No. 1997-51556 and Korean Patent Publication No. 2007-39864.

The slide connection type automatic MD device proposed in Japanese Unexamined Patent Publication No. 1997-51556 has a disadvantage in that the structure of the driving multi-contact switch is complicated as well as a large installation area.

The automatic MFC device of the slide connection type proposed in Korean Unexamined Patent Publication No. 2007-39864 has a screw-driven multi-contact switch shown in FIGS. 7-9 of the above publication, and the screw-driven multi-contact switch has a contact terminal. Since the fitting groove is inserted into the mounting groove by hand, there is a problem of productivity and quality non-uniformity caused by manual work. In addition, since the positions of the two mounting grooves are different from each other, an asymmetrical force is applied during the movement of the slider, which causes a problem such as contact failure due to detachment of the contact terminal fitted to the mounting groove.

In addition, in the automatic MFC device according to the conventional slide connection method, the unused slider is positioned at the front and rear of the substrate to stand by, leaving the input wiring pattern portion and the output wiring pattern portion in the center of the upper surface of the substrate, and at the time of connection, Is moved to the position of. At this time, since the standby position of the slider is located outside the input and output wiring pattern parts, the average moving distance becomes long, and thus the connection connection time becomes long.

The present invention has been made to solve the above problems, an object of the present invention is to provide an automatic MDF device with improved contact performance, easy production and excellent productivity.

Another object of the present invention is to change the standby position of the mobile connection means to shorten the average moving distance of the slider and to provide an automatic MD device having a short circuit connection change time.

In order to achieve these and other objects, the automatic MD device of the present invention comprises a substrate on which a plurality of wiring patterns are formed, a driving screw portion disposed above the substrate and extending in the first direction, and a movable connecting means.

The movable connecting means includes: a slider of a non-conductor having a screw groove formed so as to penetrate the driving screw portion, the lower surface including a contact surface contacting the substrate and a contact terminal groove recessed from the contact surface; And a conductive contact terminal formed in the contact terminal groove to selectively connect the wiring pattern and the connection terminal.

The contact terminal includes a contact portion formed in a convex curve toward the substrate; A support portion connected to the contact portion and inserted into the contact terminal groove of the slider to support the contact portion; Some or all of the contacts are divided.

The separator may extend to a portion of the support, and the support may be formed only on both or one side of the contact. Contact portions separated by the separating portion may contact the wiring pattern and the connection terminal, respectively.

In addition, the automatic MDF apparatus according to the embodiment of the present invention includes a guide cover mounted on the upper surface of the substrate, the upper surface of the slider is formed with an elastic portion for applying an elastic force to the guide cover can guide the mobile connection means. The elastic portion may be preferably formed integrally with the slider, and consists of a plurality of rods which are inclined upward on the upper surface of the slider.

The automatic MD device according to the embodiment of the present invention may include a bracket fixed to the substrate at one end of the substrate to support the driving screw.

The driving screw unit is coupled to the driving coupler is rotated by the driving coupler, the screw rod extending in the first direction; And a connection coupler formed at one end of the screw rod and coupled with the driving coupler. The connecting coupler is formed with a bracket fixing groove and a guide cover fixing groove indented from a cylindrical shape, so that the bracket is fitted into the bracket fixing groove of the connecting coupler and the guide cover is fitted into the guide cover fixing groove of the connecting coupler. Thus, the drive screw portion can be rotatably fixed to both the bracket and the guide cover.

According to another aspect of the present invention, an automatic MDF apparatus is mounted on a substrate on which a plurality of wiring patterns and connection terminals are formed, selectively connects the wiring patterns and the connection terminals, and is movable to reciprocate by a driving screw disposed in the first direction. It comprises a connecting means,

The substrate includes a plurality of wiring pattern groups divided into at least two along the direction of the driving screw portion; And a waiting section formed between the plurality of wiring pattern groups and waiting for the mobile connection means.

Sensing wiring portions are formed at both ends of each of the wiring pattern groups divided along the first direction, and the sensing wiring portion formed toward the standby portion of the sensing wiring portions has a predetermined signal when the mobile connection means enters or exits the standby portion. Occurs. The sensing wiring portion which is not formed toward the standby section among the sensing wiring portions generates a signal for the mobile connection means to check the movement limit.

Each sensing wiring unit comprises: sensing wiring terminals formed on the upper surface of the substrate; And a sensing wiring pattern formed on the bottom surface of the substrate.

Each of the wiring pattern groups may be formed on an upper surface of the substrate, and include a plurality of input wiring pattern pairs formed in parallel with the first direction; A plurality of output connection terminal pairs formed on an upper surface of the substrate and symmetrically formed on both sides of the pair of input wiring patterns; A plurality of output wiring pattern pairs formed on the bottom surface of the substrate and formed in parallel in a direction perpendicular to the first direction; And a plurality of via holes formed through the substrate to connect the pair of output wiring patterns and the pair of output connection terminals.

The output connection terminal pair is formed to have a predetermined length in a direction parallel to the first direction, and a via hole is formed above one of each of the output connection terminal pairs and below the other.

Input signal socket connections are formed on one side of the substrate, and are electrically connected to the pair of input wiring patterns, and output signal socket connections are formed on the one side or the other side of the substrate to provide a plurality of pairs of output wiring patterns. Electrically connected.

The substrate may be made of a multilayer substrate of three or more layers.

According to the automatic MD device of the present invention as described above, the contact terminal is integrally formed with the slider has an effect of preventing connection failure due to the separation of the contact terminal.

In addition, since the output connection terminal pairs are formed symmetrically on both sides with respect to the input wiring pattern pair, the contact reaction force acts on the slider evenly during the slider movement, thereby smoothly moving the slider. Further, the contact characteristics between the wiring pattern and the contact terminal are improved because the contact portions of the contact terminals formed integrally with the slider are in contact with the output connection terminal and the input wiring pattern, respectively, in a state divided by the separating portion.

Since an elastic portion having a spring function is formed on the upper surface of the slider to apply an elastic force to the guide cover, the slider can always move in contact with the substrate during movement, thereby maintaining the connection characteristics of the contact terminal.

In addition, the drive screw portion is supported by the elastic force of the slider portion without being directly in contact with the guide cover, thereby reducing the mechanical friction between the drive screw portion and the guide cover, thereby extending the life of the slider and the drive screw portion. have.

On the other hand, since the mobile connection means waits in the waiting section between the wiring pattern groups of the board, the average moving distance of the slider during the line connection or change is reduced, thereby reducing the switching time.

In addition, since the guide cover is fitted to the connection coupler of the drive screw portion, the forward and backward movement of the drive screw portion is prevented and only the rotational movement has the effect of improving the reliability of the slider movement.

In addition, by using a multi-layered board having three or more layers, miniaturization is possible by minimizing an area other than the portion where the input / output wiring pattern is formed. Therefore, when multiple switch devices are stacked, the volume of the entire device is reduced, thereby increasing the space utilization. There is.

In addition, the present invention can reduce the number of terminals compared to the conventional invention, by using a multi-layered substrate having an input and output wiring pattern, it is possible to miniaturize, thereby reducing the volume of the switch group of the laminated structure to improve the space utilization It has an effect.

1 is a perspective view of an automatic MD device according to the present invention,
FIG. 2 is a perspective view schematically showing only a module portion of a substrate of one layer in the automatic MD device of FIG. 1;
3 is a cross-sectional view taken along the line AA in FIG.
4 is a plan view of the substrate,
5 is a perspective view illustrating a wiring pattern of a substrate;
6 is an explanatory diagram for explaining a wiring pattern of a substrate;
7 is a bottom perspective view of the movable connecting means,
8 is a perspective view in which the movable connecting means and the driving screw portion are combined;
9 is a bottom perspective view showing another embodiment of the movable connecting means,
10 is a perspective view of a driving screw portion,
11 is an enlarged perspective view of a connection coupler portion of a drive screw portion;
12 is a perspective view of a guide cover;
13 is a perspective view of the bracket.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. In the drawings, like reference numerals are used to refer to like elements.

First, with reference to Figure 1 will be described an automatic MD device according to an embodiment of the present invention. The automatic MD device 1 of the present invention is formed by stacking a plurality of MD modules 10 in multiple layers. The drive coupler 70 is coupled to the connection coupler of the drive screw portion described later to rotate the screw rod.

2 and 3, each MD module 10 selectively connects a substrate 100 having a plurality of wiring patterns, a driving screw 240 disposed on the substrate 100, and a wiring pattern. The movable connecting means 200, the fixing part 300 for fixing the substrate 100 and the driving screw 240, and a guide cover 250 for covering the substrate. The left side of the MD module 10 of FIG. 2 is in a state without the guide cover 250.

First, the substrate 100 will be described with reference to FIGS. 4 to 6. As shown in Fig. 4, the substrate 100 has an input signal socket 101 connected at its front end with an input signal connector (not shown) on the exchange side line, and an output signal connector (shown on the subscriber side line). And an output signal socket 102 is formed.

The wiring pattern formed on the substrate 100 is divided into the first wiring pattern group 110 and the second wiring pattern group 120 along the length direction of the driving screw 240, and includes the first wiring pattern group 110 and the first wiring pattern group 110. The standby section 130 is formed between the two wiring pattern groups 120. The standby section 130 is a section in which no wiring pattern is formed between the first wiring pattern group 110 and the second wiring pattern group 120. The standby section 130 waits when the movable connecting means 200 does not contact the wiring pattern. It is a section. By thus placing the standby position of the movable connecting means in the center of the substrate, it is possible to reduce the average moving distance of the movable connecting means during line connection than when the standby position is located above or below the substrate.

In FIG. 4, the respective wiring pattern groups are also divided in the horizontal direction, but are divided for fixing the guide cover to be described later, and may not be divided. In addition, in FIG. 4, the wiring patterns are divided into two wiring pattern groups, and one standby section is formed between the two wiring pattern groups, but three or more wiring pattern groups may be formed according to a design. Two or more waiting periods may be formed between the respective wiring pattern groups.

4 and 5, each of the wiring pattern groups 110 and 120 includes a plurality of input wiring pattern pairs 140 and a plurality of connection terminal pairs in order to connect the circuit on the exchange side and the circuit on the subscriber side. 150, a plurality of output wiring pattern pairs 160, and a plurality of via holes 170 are formed. In addition, the sensing wiring units 180 are formed at the front and rear ends of the respective wiring pattern groups.

The input wiring pattern pair 140 is formed on the upper surface of the substrate 100 and is formed parallel to the length of the driving screw portion. The input wiring pattern pair 140 is connected to the input signal socket 101 and to each line on the exchange side. On the upper surface of the substrate 100, output connection terminal pairs 150 are formed symmetrically on both sides of the input wiring pattern pair 140, and the output connection terminal pairs are arranged in parallel with the input wiring pattern pair 140. It is formed with a length.

An output wiring pattern pair 160 is formed on a bottom surface of the substrate 100 in a direction perpendicular to the input wiring pattern pair 140. The output wiring pattern pair 160 is connected to the output signal socket 102 and to each line on the subscriber side.

A plurality of via holes 170 are formed through the substrate 100 to connect the output connection terminal pair 150 and the output wiring pattern pair 160.

At this time, as shown in FIG. 6, in order for the output connection terminal pair 150 and the output wiring pattern pair 160 to be connected to the via hole 170, the length l of the output connection terminal pair is equal to the output wiring pattern pair ( Each pattern width 2d of 160 and the distance s between the pattern pairs should be longer than the sum. In addition, the via hole 170 should be formed above one of each output connection terminal pair 160 and below the other. Since the output connection terminal pair 150 is formed symmetrically on both sides with respect to the input wiring pattern 140, the contact portion (hatched portion in the dotted line in Fig. 6) is also symmetrical while the mobile connection means is moving. Therefore, the contact reaction force acting on the movable connection means acts evenly, and the movement of the movable connection means becomes smooth. That is, in the prior art, it is possible to solve the problem that the output connection terminal pair is asymmetrically formed around the input wiring pattern.

4 and 5, the sensing wiring unit 180 is formed in front and rear of each of the wiring pattern groups, and the sensing wiring terminal pair 181 formed on the upper surface of the substrate 100 and the lower surface of the substrate 100. The formed sensing wiring pattern pair 182 and the via hole 183 connecting the sensing wiring terminal pair 181 and the sensing wiring pattern pair 182 are formed. The sensing wiring terminal pair 181 may be formed of four terminals to correspond to the input wiring pattern pair 140 and the output connection terminal pair 150, or may be formed of three terminals as illustrated in FIG. 5. . The sensing wiring pattern pair 182 may be formed in parallel with the output wiring pattern pair 160. Since the sensing wiring unit 180 functions to detect that the mobile connection means described later is out of the wiring pattern group, the sensing wiring unit 180 is not limited to the wiring pattern as described above, and the sensing wiring terminal pair and the sensing wiring pattern pair are each formed as a single terminal. It may be.

The sensing wiring unit formed toward the waiting section 130 among the sensing wiring units 180 generates a predetermined signal when the movable connecting means 200 enters or exits the waiting section 130, and the sensing wiring unit 180 is formed. Sensing wires formed on the front and rear sides of the substrate 100 generate a signal for checking that the mobile connection means 200 no longer goes out, so that the mobile connection means 200 exits forward or backward out of the wiring group. prevent.

In this case, the input signal socket connection part 101, the output signal socket connection part 102, the input wiring pattern 140, the output connection terminal 150, the output wiring pattern 160, and the sensing wiring part formed on the substrate 100 ( 180 and the like are circuits formed by plating on the substrate 100. In addition, since the substrate 100 uses three or more multilayer substrates, the area of the substrate 100 can be minimized except for a portion in which a wiring pattern and the like are formed. It can be miniaturized and the space utilization is increased.

Next, the driving screw 240, the movable connecting means 200, the guide cover 250, the bracket 300 and the like will be described with reference to FIGS. 3 and 7-12.

As shown in FIGS. 3 and 10, the driving screw part 240 is made of a plastic material, and has a screw rod 242 extending in the longitudinal direction and a cylindrical connecting coupler 244 formed at the tip of the screw rod 242. ) As shown in FIG. 11, the connection coupler 244 has a larger radius than a threaded rod, and a guide groove 246 is formed at the tip thereof to which the driving coupler 70 is coupled. In addition, the cylindrical outer peripheral surface of the connection coupler 244 is formed with a fixing part fixing groove 248 and the guide cover fixing groove 249 indented from the cylindrical outer peripheral surface.

7 and 8, the movable connecting means 200 includes a slider 210 and a contact terminal 220. The slider 210 is a substantially rectangular parallelepiped, and a screw groove 211 is formed in the middle thereof so that the driving screw portion 240 penetrates, and a contact surface 213 and a contact surface (contacting the substrate 100) are formed on the lower surface thereof. A contact terminal groove 215 indented from 213 is formed.

In the contact terminal groove 215, a conductive contact terminal 220 is inserted and formed integrally with the slider 210. The contact terminal 220 selectively connects a predetermined connection terminal pair 150 with the input wiring pattern pair 140 as shown in FIG. 6. The contact terminal 220 includes a contact part 222 formed in a convex curve toward the substrate, and a support part 224 supporting the contact part 222, and a separation part 226 in which part or all of the contact part 222 is divided. ). Separation 226 may extend to support 224. Since the contact terminal 220 is integrally formed by inserting the slider 210, the contact terminal 220 can be prevented from being separated from the slider.

7 and 8 illustrate that the support part 224 is formed on one side of the contact part 222, but as shown in FIG. 9, the support part 224 may be formed on both sides of the contact part 222.

When the support portion 224 is formed on one side of the contact portion 222, the elasticity of the contact terminal 220 is better than that formed on both sides of the same length, the spring coefficient of the contact terminal has the following equation Is the same as

Where E is the Young's modulus, I is the area moment of inertia, and L is the length of the contact terminal 220.

In addition, as shown in FIG. 6, the contact parts 222 are separated by the separating part 226, and the separated contact parts 222 contact the input wiring pattern 140 and the output connection terminal 150, respectively. The connection is smooth.

7 to 9, an elastic portion 217 is formed on the upper surface of the slider 220 to apply an elastic force to the guide cover 250. The elastic portion 217 may be molded integrally with the slider, and consists of a plurality of rods which are formed to be inclined upwardly. In addition, although the elastic part is shown integrally formed with the slider in the figure, the elastic part may be formed separately from the slider and may be fixed to the upper surface of the slide. For example, an appropriate elastic force may be applied to the guide cover 250 by appropriately fixing an elastic member such as a separate spring and a leaf spring to the upper surface of the slider. The elastic part 217 formed on the upper surface of the slider 220 allows the slider 220 to always move in contact with the substrate 100 during the movement, so that the connection characteristics of the contact terminal 220 are kept constant.

The guide cover 250 is mounted on the upper surface of the substrate to guide the movable connecting means 200. One guide cover may cover the entire substrate, or a plurality of guide covers may be used to cover the substrate.

The bracket 300 is fixed to the substrate at one end of the substrate 100 to support the end of the driving screw 240. The bracket 300 is fitted by the bracket fixing groove 248 of the connection coupler 244 of the driving screw 240 so that the screw rod 242 is rotatably fixed to the bracket 300. In addition, the bracket 300 also serves to fix the MD module 10 to the entire MD device.

The guide cover 250 is fitted and fixed to the guide cover fixing groove 249 of the connection coupler 244 so that the screw rod 242 is rotatably fixed to the guide cover 250. That is, as shown in Figure 12, the guide cover 250 has a lower surface and the front and rear surface is open, the projection cover 252 is formed in front of the guide cover 250 of the connection coupler 244 of the driving screw 240 It is inserted into the guide cover fixing groove 249 and fixed. In addition, the guide cover 250 is preferably formed with a plurality of guide grooves 254 of the size that the slider 210 can move at regular intervals.

Operation of the automatic MD device according to an embodiment of the present invention is as follows.

The driving coupler 70 rotates the predetermined driving screw part 240 under control of a control unit (not shown). That is, the driving coupler 70 is coupled to the guide groove 246 of the connection coupler 244 of the driving screw unit 240, and rotates the driving screw unit 240 clockwise and counterclockwise. When the driving screw unit 240 is rotated in the clockwise and counterclockwise directions, the slider 210 coupled through the screw rod 242 and the screw hole 212 of the driving screw unit 240 is connected to the substrate 100 along the guide cover 250. Sliding back and forth on the upper surface of).

At this time, the contact terminal 220 installed in the contact terminal groove 215 of the lower surface of the slider 210 is in mechanical contact with the input wiring pattern 140 adjacent to each output connection terminal 150. At this time, since the contact portion 222 of the contact terminal 220 is formed in a convex curve toward the substrate, even when the substrate plane is uneven, the contact is smooth. Furthermore, since the contact portion 222 is separated into two parts by the separating portion 226, the separated contact portions may contact the input wiring pattern 140 and the output wiring terminal 150, respectively, thereby improving contact performance. In addition, since the contact surface 213 of the slider is in contact with the substrate 100 when the slider 210 is moved, there is an effect that can remove dust, contaminants, etc. attached to the wiring of the substrate. In addition, since the contact reaction force acts equally on the slider during the movement of the slider because the output connection terminal pair 150 is formed symmetrically on both sides with respect to the input wiring pattern pair 140, the movement of the slider is smooth.

According to the above-described operation of the slider, the output wiring pattern 160 on the bottom surface of the substrate 100 connected to the output connection terminal 150 and the input wiring pattern 140 on the top surface of the substrate 100 are electrically connected. That is, the electrical communication signal is transmitted from the input wiring pattern 140 to the output wiring pattern 160.

According to this connection method, the electrical signal input through the terminal of the input signal socket connection unit 101 is transmitted to the terminal of the output signal socket connection unit 102 through a specific position frame.

At this time, in the standby state before the slider 210 moves to the specific position for connecting the electrical signal of the specific position, the standby section 130 always waits. That is, the slider 210 is moved and the movement is connected to the sensing wiring unit 180 while leaving the standby section 160 installed in the center of the substrate 100 described above, and a signal generated at this time is applied to a controller (not shown). On the basis of this, the driving screw unit 240 is rotated by the calculation rotation amount for moving to the predetermined position. Since the slider 210 is positioned in the standby section 130 positioned between each of the wiring pattern groups during the standby, the average moving distance of the slider can be reduced, thereby greatly reducing the operation time.

Although the technical features of the present invention have been described above with reference to specific embodiments, those skilled in the art to which the present invention pertains may make various changes and modifications within the scope of the technical idea according to the present invention. It is obvious.

100: substrate
101: input signal socket 102: output signal socket
110: first wiring pattern group 120: second wiring pattern group
130: waiting section
140: input wiring pattern pair 150: connection terminal pair
160: output wiring pattern pair 170: via hole
180: sensing wiring sections 181, 182: sensing wiring terminal pair
183: Via Hole
210: slider 220: contact terminal
222: contact portion 224: support portion
226: separation

Claims (6)

An automatic MFC device comprising a substrate having a wiring pattern formed thereon and movable connecting means mounted on the substrate and selectively connecting the wiring pattern while reciprocating in a first direction.
The substrate
A plurality of wiring pattern groups divided into at least two along the first direction; And
A waiting section formed between the plurality of wiring pattern groups and waiting for the mobile connection means
Including
Sensing wiring portions are formed at both ends of each of the wiring pattern groups divided along the first direction.
The sensing wiring unit formed toward the waiting section of the sensing wiring unit generates a predetermined signal when the mobile connecting means enters or exits the waiting section,
And a sensing wiring portion which is not formed toward the waiting section of the sensing wiring portion, generates a signal for the mobile connection means to check a movement limit. The method of claim 1,
Each sensing wiring part
A sensing wiring terminal formed on the upper surface of the substrate; And
Detection wiring pattern formed on the bottom surface of the board
Automatic MD device comprising a. The method of claim 1,
A plurality of input wiring pattern pairs formed on an upper surface of the substrate and formed in parallel with the first direction;
A plurality of output connection terminal pairs formed on an upper surface of the substrate and symmetrically formed on both sides of the input wiring pattern pair;
A plurality of output wiring pattern pairs formed on the bottom surface of the substrate and formed in parallel to the first direction; And
A plurality of via holes formed through the substrate to connect the pair of output wiring patterns and pairs of output connection terminals;
Automatic MD device comprising a. The method of claim 3,
The output connection terminal pair is formed to have a predetermined length in a direction parallel to the first direction,
And the via hole is formed at an upper side of one of each pair of output connection terminals, and formed at a lower side of the other output connection terminal pair. The method of claim 3,
On one side of the substrate, an input signal socket connection portion electrically connected to the pair of the plurality of input wiring patterns is formed,
And an output signal socket connection portion electrically connected to the pair of the plurality of output wiring patterns on one side or the other side of the substrate. The method of claim 1,
And said substrate is a multilayer substrate of three or more layers.

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