KR101057340B1 - LED lighting device provided with UV blocking film - Google Patents

Abstract

Provide LED lighting device. The LED lighting device includes a LED module having a circuit board and a plurality of LED packages mounted on the circuit board. An organic passivation film is provided on the LED module. The floodlight plate is disposed on the organic passivation film. An ultraviolet blocking film is disposed above or below the floodlight plate. By applying an organic passivation film, it is possible to greatly improve the moisture-proof and anti-oxidation characteristics of the LED lighting device. In addition, by installing an ultraviolet blocking film on the upper or lower portion of the floodlight plate of the LED lighting device, it is possible to prevent the organic passivation film deterioration by the ultraviolet light.

Description

LED lighting device with UV protection film {LED illumination system including UV protecting layer}

The present invention relates to an LED lighting device, and more particularly to an LED lighting device having an ultraviolet blocking film.

Light emitting diodes (LEDs) are attracting attention as light sources for next generation lighting due to their low power consumption, long lifetime, low driving voltage, and environmental friendliness. LED lighting apparatuses employing such LEDs as light sources have been widely applied to industrial, agricultural and commercial applications.

Such an LED lighting device includes an LED module in which an LED package is arranged on a printed circuit board. Since the LED package and the printed circuit board are electrically connected by soldering or the like, when a large amount of moisture or oxygen flows into the LED lighting apparatus, the electrical connection may be broken.

The problem to be solved by the present invention is to provide an LED lighting device excellent in moisture proof and anti-oxidation properties.

One aspect of the present invention to achieve the above object provides an LED lighting device. The LED lighting device includes a LED module having a circuit board and a plurality of LED packages mounted on the circuit board. An organic passivation film is provided on the LED module. The floodlight plate is disposed on the organic passivation film. An ultraviolet blocking film is disposed above or below the floodlight plate.

The organic passivation layer may be a parylene layer.

The UV blocking film may be a film including a benzotriazoles, benzophenones, salicylic acids, or cyanoacrylates.

The LED lighting apparatus further includes a main body accommodating the LED module, a first support disposed on the rear surface of the main body, and a second support disposed under the first support and connected to the first support by hinge coupling. can do.

According to the present invention, by applying the organic passivation film it is possible to greatly improve the moisture-proof and anti-oxidation characteristics of the LED lighting device. In addition, by installing an ultraviolet blocking film on the upper or lower portion of the floodlight plate of the LED lighting device, it is possible to prevent the organic passivation film deterioration by the ultraviolet light.

The effects of the present invention are not limited to the above-mentioned effects, and other effects that are not mentioned will be clearly understood by those skilled in the art from the following description.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to describe the present invention in more detail. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1A and 1B are respectively a perspective view and an exploded perspective view showing a light emitting diode (LED) lighting apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line I-I 'of FIG. 1A.

1A, 1B, and 2, the LED lighting device 100 includes a main body 10 having a bar shape. The main body 10 may have a U-shape, but may be disposed such that the open portion faces upward. The body 10 may be made of a material having excellent heat dissipation properties, for example, aluminum.

The LED module 20 is inserted into the main body 10 by way of example in a sliding manner. The LED module 20 includes a circuit board 21 and a plurality of LED packages 22 mounted on the circuit board 21. The circuit board 21 may have a bar shape extending along the extending direction of the support 10, and the LED packages 22 may be arranged in a line on the circuit board 21. Although the LED packages 22 are arranged in one row, the LED packages 22 may be arranged in a plurality of rows.

The circuit board 21 and the LED package 22 may be electrically connected by using a solder 23 or the like. Specifically, the circuit board 21 is a base substrate 21a, bonding pads 21b disposed on the base substrate 21a, and the bonding pads 21b disposed on the base substrate 21a. It may be provided with a solder resist layer (21c) for exposing the upper portion of the). In addition, the LED package 22 is disposed on a package substrate 22a, a lead frame 22b disposed on the package substrate 22a and having an anode lead and a cathode lead, and an upper portion of the lead frame 22b. An LED chip 22c disposed and electrically connected to the anode lead and the cathode lead, a reflecting cup 22d disposed on the lead frame 22b and exposing the LED chip 22c, and the reflecting cup 22d. It may be provided with a lens 22e disposed in the cover to cover the LED chip (22c). Leads of the lead frame 22b may be electrically connected to the bonding pad 21b by soldering 23 or the like. The specific shape of the LED package 22 and the connection relationship between the LED package 22 and the circuit board 21 are not limited thereto and may be variously changed.

An upper organic passivation layer 25a is coated on the LED module 20, that is, the LED packages 22 and / or the circuit board 21. In addition, the lower organic passivation layer 25b may be coated on the lower surface of the circuit board 21. Accordingly, the electrical connection between the LED packages 22 and the circuit board 21 may be covered by the organic passivation film 25.

The organic passivation film 25 is a film having excellent moisture blocking and oxygen blocking properties, and can form a uniform film regardless of the morphology at the bottom of the inorganic passivation film. Accordingly, the electrical connection between the LED packages 22 and the circuit board 21 can be sufficiently protected against moisture and oxygen. Thus, the LED packages 22, the circuit board 21, and the electrical connection therebetween can be prevented from deteriorating due to moisture or oxygen. In particular, when the LED lighting device 100 is installed outdoors, it is highly likely that the rain penetrates into the support 10, but in this case, the LED packages 22, the circuit board 21, and the space therebetween. The electrical connections may not be directly exposed to moisture. In summary, the organic passivation layer 25 may significantly improve the moisture-proof and anti-oxidation characteristics of the LED lighting device 100. However, since the organic passivation layer 25 is an organic material, it may be vulnerable to ultraviolet rays.

An example of the organic passivation layer 25 may be a parylene layer. The parallel film can be formed using chemical vacuum deposition, there is no pinhole in the film, gas barrier properties and mechanical properties are also excellent.

The floodlight plate 40 is disposed on the LED packages 22. The floodlight plate 40 may be inserted into the main body 10 by way of example, in a sliding manner. The ultraviolet blocking film 41 is coated on the upper or lower portion of the floodlight plate 40. The ultraviolet blocking layer 41 may selectively reflect or absorb ultraviolet rays to block external ultraviolet rays from reaching the organic passivation layer 25, thereby preventing deterioration of the organic passivation layer 25.

The UV blocking layer 41 is at least one selected from the group consisting of benzotriazoles, benzophenones, salicylic acids, and cyanoacrylates having excellent ultraviolet absorption properties. It may be a film containing my ultraviolet absorber.

In detail, the UV blocking layer 41 may be formed by directly coating a solution containing the UV absorber on the upper or lower surface of the floodlight plate 40. On the contrary, the UV blocking film 41 is coated with a solution containing the UV absorber on a base film such as PET (polyethleneterephtalate), PC (polycarbonate) or PMMA (Polymethylmethacrylate) to prepare a separate UV blocking film, and then The UV blocking film may be formed by attaching the upper or lower surface of the floodlight plate 40.

A heat sink (not shown) may be further disposed in the main body 10 under the LED module 20. Removable side caps 50 may be disposed at both sides of the main body 10 by bolts or the like.

A pair of first supports 60 may be disposed on the rear surface of the main body 10. A pair of second supports 70 may be disposed below the first supports 60, respectively. The first support 60 and the second support 70 may be hinged. Therefore, the light emitting direction of the LED module installed in the main body 10 can be adjusted. Specifically, through holes 60a and 70a corresponding to each other are formed in the first support 60 and the support 70, respectively, and the hinge shafts 80 may be inserted into the through holes 60a and 70a. have. The end of the hinge shaft 80 may be a screw, it may be fixed by a nut. The central portion of the hinge shaft 80 may be protected by the housing 85.

The second supporters 70 are connected to each other under the second supports 70, and further includes a through hole for installing and fixing the LED lighting device 100 to another structure. The third support 75 may be connected.

While the invention has been described above with reference to specific preferred embodiments, it is intended that the specific modifications and variations of the invention fall within the scope of the invention and the specific scope of the invention will be apparent from the appended claims.

1A and 1B are respectively a perspective view and an exploded perspective view showing a light emitting diode (LED) lighting apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line I-I 'of FIG. 1A.

Claims (4)

An LED module having a circuit board and a plurality of LED packages mounted on the circuit board, an organic passivation film provided on the LED module, a light transmitting plate disposed on the organic passivation film, and an upper or lower portion of the light transmitting plate Including the sunscreen, The organic passivation film is a parylene layer, The UV blocking film is a film containing at least one UV absorber selected from the group consisting of benzotriazoles, benzophenones, salicylic acids, or cyanoacrylates. , The LED module is a main body for accommodating the LED module, A first support disposed on the back of the body and The LED lighting device having a UV blocking film, characterized in that it comprises a second support disposed below the first support and connected to the first support by a hinge coupling. delete delete delete

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