KR101045931B1 - Led lamp and led module - Google Patents

Led lamp and led module Download PDF

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KR101045931B1
KR101045931B1 KR1020100018699A KR20100018699A KR101045931B1 KR 101045931 B1 KR101045931 B1 KR 101045931B1 KR 1020100018699 A KR1020100018699 A KR 1020100018699A KR 20100018699 A KR20100018699 A KR 20100018699A KR 101045931 B1 KR101045931 B1 KR 101045931B1
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led
led lamp
distance
lamp
chips
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KR1020100018699A
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Korean (ko)
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유순재
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희성전자 주식회사
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

PURPOSE: An LED lamp and an LED module are provided to secure a molding uniformity by independently forming two or more LED chips respectively. CONSTITUTION: An LED lamp includes two or more LED chips(110b) in the top. Two or more LED chips of the LED lamp are formed at a certain interval. An LED module(300b) includes two or more mounted LED lamps(100b). The LED module consists of at least two or more PCBs(Printed Circuit Board,200b) with SMT(Surface Mount Technology). The LED lamp has an uniform linear light source.

Description

엘이디 램프 및 엘이디 모듈{LED LAMP AND LED MODULE}LED Lamp and LED Module {LED LAMP AND LED MODULE}

본 발명은 LED램프 및 LED모듈에 관한 것으로, 더욱 상세하게는 두 개 이상의 LED칩이 실장되는 LED램프에서 상기 LED칩을 각각 독립적으로 구성하는 LED램프 및 LED모듈에 관한 것이다.
The present invention relates to an LED lamp and an LED module, and more particularly, to an LED lamp and an LED module, each of which independently configures the LED chip in an LED lamp in which two or more LED chips are mounted.

중대형 LCD 판넬 및 백라이트 광원 시스템의 박형화가 계속해서 이루어져, 최근에는 약 15㎜ 미만의 광학거리를 가지는 백라이트 광원이 상용화되고 있다.The thinning of medium and large LCD panels and backlight light source systems has continued, and recently, backlight sources having optical distances of less than about 15 mm have been commercialized.

종래의 백라이트 광원은 측면에서 광을 조사하는, 즉 에지(Edge) 조사형 타입의 백라이트 광원에 사용할 수 있는 도광판 및 선형 LED 광원이 필요한데, 특히 대형 TV에 사용되는 대형 BLU(back light unit)처럼, 대면적을 측면에서 조사하고자 할 경우에는 고밀도의 균일한 선형 광원이 요구된다.Conventional backlight light sources require a light guide plate and a linear LED light source that can be used to illuminate the light from the side, i.e., an edge-illuminated type backlight source, especially like a large back light unit (BLU) used in large TVs. If the large area is to be examined from the side, a high density uniform linear light source is required.

그러나, 현재의 LED 광원은 하나의 리드프레임에 한 개의 LED칩을 실장, 혹은 두 개 이상을 실장 하더라도 단순히 광량을 늘리기 위하여 같은 위치에 모아서 실장을 하므로, 여러 개의 SMD형 LED 램프를 연결하여 실장하는 경우 “다크 존” 이라하여 균일한 선형 광원을 얻기 위해서는 여분의 면적이 필요하게 된다.However, current LED light sources are mounted in the same position to increase the amount of light even if one LED chip is mounted on one lead frame or two or more, so that several SMD type LED lamps are connected and mounted. In this case, an extra area is required to obtain a uniform linear light source called a "dark zone".

이러한, 종래의 LED램프(10)는 도 1에 도시한 바와 같이 LED램프(10) 상에 두 개의 LED칩(20)을 실장하는 것이 일반적인 기술이었다.In the conventional LED lamp 10, as shown in FIG. 1, it is a general technique to mount two LED chips 20 on the LED lamp 10.

하지만, 종래의 LED램프(10)는 반사구조(reflector, 30) 내부에 두 개의 LED칩(20)이 연결 실장 됨으로써, 몰딩 시 균일성을 확보하기가 어려워 결국 수율 저하 및 수율 저하로 인한 추가 비용이 발생하는 문제점이 있었다.However, in the conventional LED lamp 10, since two LED chips 20 are mounted and mounted inside the reflector 30, it is difficult to secure uniformity during molding, resulting in additional cost due to lower yield and lower yield. There was a problem that occurred.

또한, 종래의 LED램프(10)는 두 개 이상의 LED칩(20)이 일정한 거리를 가지도록 고려되지 않아 광 출력 효율 저하 및 미세 선형광원 제작이 어렵고, 그러므로 여러 개의 LED램프(10)를 연결 실장 하더라도 균일한 선형 광원을 얻기 힘든 문제점이 있었다.
In addition, the conventional LED lamp 10 is not considered to have two or more LED chips 20 to have a constant distance, so it is difficult to reduce the light output efficiency and to produce a fine linear light source, and therefore connect and mount several LED lamps 10. Even if it was difficult to obtain a uniform linear light source.

상기한 종래 문제점을 해결하기 위한 본 발명의 목적은 두 개 이상의 LED칩이 일정한 거리를 가지도록 구성하여 광 출력 효율을 높이고, 미세 선형 광원을 제작할 수 있는 LED램프 및 LED모듈을 제공하는데 있다.An object of the present invention for solving the above problems is to provide an LED lamp and an LED module that can be configured to have two or more LED chips having a constant distance to increase the light output efficiency, and to produce a fine linear light source.

본 발명의 또 다른 목적은 LED램프를 연결 실장하는 경우에도 균일한 선형 광원을 얻을 수 있는 LED모듈을 제공하는데 있다.Still another object of the present invention is to provide an LED module which can obtain a uniform linear light source even when the LED lamp is connected and mounted.

본 발명의 또 다른 목적은 LED램프에서 두 개 이상의 LED칩을 각각 독립적으로 구성함으로써, 몰딩 시 균일성 확보 및 수율을 높일 수 있는 LED램프 및 LED모듈을 제공하는데 있다.
Still another object of the present invention is to provide an LED lamp and an LED module which can secure uniformity and increase yields by molding two or more LED chips independently from each other.

상기한 종래 문제점을 해결하고 상기 목적을 달성하기 위한 본 발명의 제1실시예에 따른 LED램프는 두 개 이상의 LED칩이 실장되는 LED램프에 있어서, 상기 LED칩간 거리는 하기 [조건식 1]을 만족하는 것을 특징으로 한다.In the LED lamp according to the first embodiment of the present invention for solving the conventional problems and to achieve the above object, in the LED lamp having two or more LED chips, the distance between the LED chips satisfy the following [Condition 1] It is characterized by.

[조건식 1] [Condition 1]

Figure 112010013418664-pat00001
Figure 112010013418664-pat00001

a : LED램프에서 LED칩간의 거리.a: Distance between LED chips in LED lamp.

b : LED램프에서 두 LED칩에서 각각 LED램프 두 끝과의 거리 중 가까운 거리.b: The shorter distance between the two ends of the LED lamps in the LED lamps.

본 발명의 제1실시예에 따른 LED램프에 있어서, 상기 LED램프에서 실장되는 두 개 이상의 LED칩은 전극리드를 각각 독립적으로 구성하는 것을 특징으로 한다.In the LED lamp according to the first embodiment of the present invention, two or more LED chips mounted in the LED lamp is characterized in that the electrode leads are configured independently.

본 발명의 제2실시예에 따른 LED모듈은 두 개 이상의 LED칩이 실장되는 LED램프 및 상기 LED램프를 적어도 두 개 이상 SMT(surface mount technology)하는 모 회로 기판(PCB)으로 구성되는 LED모듈에 있어서, 상기 LED램프에 실장하는 LED칩간 거리는 하기 [조건식 2]을 만족하는 것을 특징으로 한다.The LED module according to the second embodiment of the present invention is an LED module consisting of a LED lamp on which two or more LED chips are mounted and a mother circuit board (PCB) for at least two SMT (surface mount technology) mounting the LED lamps. In the above, the distance between the LED chip mounted on the LED lamp is characterized by satisfying the following [Condition Formula 2].

[조건식 2][Condition Formula 2]

Figure 112010013418664-pat00002
Figure 112010013418664-pat00002

a' : LED램프에서 LED칩간의 거리.a ': Distance between LED chips in LED lamp.

b' : LED램프에서 LED칩과 LED램프 두 끝과의 거리 중 가까운 거리.b ': The shorter distance between the LED chip and the two ends of the LED lamp.

c' : LED모듈에서 LED램프간 거리.
c ': Distance between LED lamps in LED module.

상기한 바와 같이, 본 발명에 따른 LED램프 및 LED모듈은 두 개 이상의 LED칩이 일정한 거리를 가지도록 구성함으로써, 광 출력 효율 향상과, 미세 선형 광원 제작이 가능한 효과가 있다.As described above, the LED lamp and the LED module according to the present invention is configured to have two or more LED chips have a constant distance, thereby improving the light output efficiency, it is possible to produce a fine linear light source.

또한, 본 발명에 따른 LED램프 및 LED모듈은 모 회로 기판에 LED램프를 연결 실장하는 경우에도 LED칩간의 거리를 일정하게 유지하여 균일한 선형 광원을 얻을 수 있는 효과가 있다.In addition, the LED lamp and the LED module according to the present invention has the effect of obtaining a uniform linear light source by maintaining a constant distance between the LED chip even when the LED lamp is connected to the mother circuit board.

그리고, 본 발명에 따른 LED램프 및 LED모듈은 LED램프에서 두 개 이상의 LED칩을 각각 독립적으로 구성함으로써, 몰딩 시 균일성 확보와 제작 수율을 높이는 효과가 있다.
In addition, the LED lamp and the LED module according to the present invention by independently configuring two or more LED chips in the LED lamp, there is an effect to secure uniformity and increase the production yield when molding.

도 1은 종래 LED 램프를 나타낸 도면이다.
도 2는 본 발명의 제1실시예에 따른 LED램프를 나타낸 도면이다.
도 3는 본 발명의 제2실시예에 따른 LED모듈을 나타낸 도면이다.
도 4는 본 발명의 제2실시예에 따른 LED램프의 광 출력 형상을 나타낸 도면이다.1 is a view showing a conventional LED lamp.
2 is a view showing an LED lamp according to a first embodiment of the present invention.
3 is a view showing an LED module according to a second embodiment of the present invention.
4 is a view showing the light output shape of the LED lamp according to a second embodiment of the present invention.

이하, 첨부된 도면을 참조하여 본 발명에 따른 구체적인 실시 예를 상세하게 설명하면 다음과 같다. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 제1실시예에 따른 LED램프를 나타낸 도면이다.2 is a view showing an LED lamp according to a first embodiment of the present invention.

도 2에 도시한 바와 같이 본 발명의 제1실시예에 따른 LED램프(100)는 상부에 두 개 이상의 LED칩(110)을 구성한다.As shown in FIG. 2, the LED lamp 100 according to the first embodiment of the present invention configures two or more LED chips 110 thereon.

여기서, LED램프(100)는 LED칩(110)간의 거리를 하기 [조건식 1]을 만족하여 구성하는 것이 바람직하다.Here, the LED lamp 100 is preferably configured to satisfy the following [Condition 1] the distance between the LED chip 110.

[조건식 1] [Condition 1]

Figure 112010013418664-pat00003
Figure 112010013418664-pat00003

a : LED램프(100)에서 LED칩(110)간의 거리.a: Distance between the LED lamp 110 in the LED lamp 100.

b : LED램프(100)에서 LED칩(110)과 LED램프(100) 두 끝과의 거리 중 가까운 거리.b: The close distance of the distance between the LED chip 110 and the two ends of the LED lamp 100 in the LED lamp 100.

또한, LED램프(100)에서 실장되는 두 개 이상의 LED칩(110)은 전극리드(미도시)를 각각 독립적으로 구성한다.In addition, two or more LED chips 110 mounted in the LED lamp 100 constitute electrode leads (not shown) independently of each other.

본 발명의 제1실시예에 따른 LED램프(100)는 두 개 이상의 LED칩(110)이 일정한 거리를 가지도록 구성함으로써, 광 출력 효율 향상과, 미세 선형 광원 제작이 가능한 효과가 있다.The LED lamp 100 according to the first embodiment of the present invention is configured to have two or more LED chips 110 to have a constant distance, thereby improving the light output efficiency and producing a fine linear light source.

또한, 본 발명의 제1실시예에 따른 LED램프(100)는 두 개 이상의 LED칩(110)을 각각 독립적으로 구성함으로써, 몰딩 시 균일성 확보와 제작 수율을 높이는 효과가 있다.In addition, the LED lamp 100 according to the first embodiment of the present invention by independently configuring two or more LED chips 110, there is an effect to secure uniformity and increase the production yield when molding.

도 3는 본 발명의 제2실시예에 따른 LED모듈을 나타낸 도면이고, 도 4는 본 발명의 제2실시예에 따른 LED램프의 광 출력 형상을 나타낸 도면이다.3 is a view showing an LED module according to a second embodiment of the present invention, Figure 4 is a view showing the light output shape of the LED lamp according to the second embodiment of the present invention.

도 3 또는 도 4에 도시한 바와 같이 본 발명의 제2실시예에 따른 LED모듈(300b)은 두 개 이상의 LED칩(110b)이 실장되는 LED램프(100b) 및 상기 LED램프(100b)를 적어도 두 개 이상 SMT(surface mount technology)하는 모 회로 기판(PCB, 200b)으로 구성한다. 모 회로 기판(200b)에는 LED모듈(300b)이 마운팅 되어 서로 전기적으로 연결될 수 있는 직렬, 병렬, 또는 직병렬 회로 패턴이 형성되어 있다.As shown in FIG. 3 or 4, the LED module 300b according to the second embodiment of the present invention includes at least an LED lamp 100b and two LED lamps 100b on which two or more LED chips 110b are mounted. It is composed of a mother circuit board (PCB, 200b) for at least two surface mount technology (SMT). The mother circuit board 200b is provided with a series, parallel, or parallel circuit pattern in which the LED module 300b is mounted and electrically connected to each other.

여기서, LED램프(100b)에 실장하는 LED칩(110b)간의 거리를 하기 [조건식 2]을 만족하여 구성하는 것이 바람직하다.Here, the distance between the LED chips 110b mounted on the LED lamp 100b is preferably configured to satisfy the following [Condition Formula 2].

[조건식 2][Condition Formula 2]

Figure 112010013418664-pat00004
Figure 112010013418664-pat00004

a' : LED램프(100b)에서 LED칩(110b)간의 거리.a ': distance between the LED lamp (100b) and the LED chip (110b).

b' : LED램프(100b)에서 LED칩(110b)과 LED램프(100b) 두 끝과의 거리 중 가까운 거리.b ': The shorter distance between the LED chip 100b and the two ends of the LED chip 110b and the LED lamp 100b.

c' : LED모듈(300b)에서 LED램프(100b)간 거리.c ': Distance between the LED lamps (100b) from the LED module (300b).

본 발명의 제2실시예에 따른 LED램프(100b)는 두 개 이상의 LED칩(110b)이 일정한 거리를 가지도록 구성함으로써, 광 출력 효율 향상과, 미세 선형 광원 제작이 가능한 효과가 있다.According to the LED lamp 100b according to the second embodiment of the present invention, two or more LED chips 110b are configured to have a constant distance, thereby improving light output efficiency and producing a fine linear light source.

또한, 본 발명의 제2실시예에 따른 LED램프(100b)는 두 개 이상의 LED칩(110b)을 각각 독립적으로 구성함으로써, 몰딩 시 균일성 확보와 제작 수율을 높이는 효과가 있다.In addition, the LED lamp (100b) according to the second embodiment of the present invention by configuring two or more LED chips (110b) independently, there is an effect to secure uniformity and increase the production yield when molding.

그리고, 본 발명의 제2실시예에 따른 LED램프(100b)는 모 회로 기판(200b)에 LED램프(100b)를 SMT(surface mount technology)하여 연결 실장할 때 필요한 거리까지 고려함으로써, LED칩(110b)간의 거리를 일정하게 유지하여 균일한 선형 광원을 얻을 수 있는 효과가 있다.In addition, the LED lamp 100b according to the second embodiment of the present invention considers the LED chip 100 by considering the distance required when connecting and mounting the LED lamp 100b to the mother circuit board 200b by surface mount technology (SMT). It is effective to obtain a uniform linear light source by keeping the distance between 110b) constant.

또한, 본 발명의 제2실시예에 따른 LED램프(100b)는 균일한 선형 광원을 가짐으로써 광의 분해능이 이루어지는 거리(dark zone, 400)을 좁히는 효과가 있다.In addition, the LED lamp 100b according to the second embodiment of the present invention has an effect of narrowing the distance (dark zone, 400) at which the resolution of light is achieved by having a uniform linear light source.

이상에서 설명한 바와 같이, 본 발명의 상세한 설명에서는 본 발명의 바람직한 실시 예에 관하여 설명하였으나, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 본 발명의 범주에서 벗어나지 않는 한도 내에서 여러 가지 변형이 가능함은 물론이다. 따라서 본 발명의 권리 범위는 설명된 실시 예에 국한되어 정해져서는 안되며, 후술하는 청구범위뿐만 아니라, 이와 균등한 것들에 의해 정해져야 한다.
As described above, in the detailed description of the present invention has been described with respect to preferred embodiments of the present invention, those skilled in the art to which the present invention pertains various modifications without departing from the scope of the present invention Of course this is possible. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the equivalents as well as the claims to be described later.

10, 100, 100b : LED램프 20, 110, 110b : LED칩
30 : 반사구조(reflector) 200b : 모 회로 기판(PCB)
300b : LED모듈10, 100, 100b: LED lamp 20, 110, 110b: LED chip
30: reflector 200b: mother circuit board (PCB)
300b: LED module

Claims (3)

두 개 이상의 LED칩이 실장되는 LED램프에 있어서,
상기 LED칩간 거리는 하기 [조건식 1]을 만족하는 것을 특징으로 하는 LED 램프.
[조건식 1]
Figure 112010013418664-pat00005

a : LED램프에서 LED칩간의 거리.
b : LED램프에서 두 LED칩에서 각각 LED램프 두 끝과의 거리 중 가까운 거리.
In the LED lamp that two or more LED chips are mounted,
LED lamp, characterized in that the distance between the LED chip satisfies the following [Condition Formula 1].
[Condition 1]
Figure 112010013418664-pat00005

a: Distance between LED chips in LED lamp.
b: The shorter distance between the two ends of the LED lamps in the LED lamps.
제 1항에 있어서,
상기 LED램프에서 실장되는 두 개 이상의 LED칩은 전극리드를 각각 독립적으로 구성하는 것을 특징으로 하는 LED램프.
The method of claim 1,
LED lamps, characterized in that the two or more LED chips mounted on the LED lamp to configure the electrode lead each independently.
두 개 이상의 LED칩이 실장되는 LED램프 및
상기 LED램프를 적어도 두 개 이상 SMT(surface mount technology)하는 모 회로 기판(PCB)으로 구성되는 LED모듈에 있어서,
상기 LED램프에 실장하는 LED칩간 거리는 하기 [조건식 2]을 만족하는 것을 특징으로 하는 LED모듈.
[조건식 2]
Figure 112010013418664-pat00006

a' : LED램프에서 LED칩간의 거리.
b' : LED램프에서 LED칩과 LED램프 두 끝과의 거리 중 가까운 거리.
c' : LED모듈에서 LED램프간 거리.
LED lamps in which two or more LED chips are mounted
In the LED module consisting of a mother circuit board (PCB) for at least two or more surface mount technology (SMT) of the LED lamp,
The LED module, characterized in that the distance between the LED chip mounted on the LED lamp satisfies the following [Condition Formula 2].
[Condition Formula 2]
Figure 112010013418664-pat00006

a ': Distance between LED chips in LED lamp.
b ': The shorter distance between the LED chip and the two ends of the LED lamp.
c ': Distance between LED lamps in LED module.
KR1020100018699A 2010-03-02 2010-03-02 Led lamp and led module KR101045931B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080046376A (en) * 2006-11-22 2008-05-27 엘지디스플레이 주식회사 White led package and liquid crystal display using the same
KR20090104511A (en) * 2008-03-31 2009-10-06 서울반도체 주식회사 Light emitting diode package
KR20110010990A (en) * 2009-07-27 2011-02-08 주식회사 디에스엘시디 Planar light source device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080046376A (en) * 2006-11-22 2008-05-27 엘지디스플레이 주식회사 White led package and liquid crystal display using the same
KR20090104511A (en) * 2008-03-31 2009-10-06 서울반도체 주식회사 Light emitting diode package
KR20110010990A (en) * 2009-07-27 2011-02-08 주식회사 디에스엘시디 Planar light source device

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