KR101032464B1 - Detergent composition for FPCB - Google Patents
Detergent composition for FPCB Download PDFInfo
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- KR101032464B1 KR101032464B1 KR1020090084159A KR20090084159A KR101032464B1 KR 101032464 B1 KR101032464 B1 KR 101032464B1 KR 1020090084159 A KR1020090084159 A KR 1020090084159A KR 20090084159 A KR20090084159 A KR 20090084159A KR 101032464 B1 KR101032464 B1 KR 101032464B1
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- KR
- South Korea
- Prior art keywords
- weight
- printed circuit
- flexible printed
- circuit board
- diethylene glycol
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 27
- 239000003599 detergent Substances 0.000 title claims abstract description 8
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 title abstract 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 51
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 45
- 238000004140 cleaning Methods 0.000 claims abstract description 36
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims abstract description 25
- 230000004907 flux Effects 0.000 claims abstract description 23
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 claims abstract description 16
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims abstract description 14
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000007547 defect Effects 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 2
- 229960004592 isopropanol Drugs 0.000 description 13
- 239000012535 impurity Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 7
- 239000002529 flux (metallurgy) Substances 0.000 description 7
- 239000012459 cleaning agent Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C11D2111/22—
Abstract
본 발명은 연성인쇄회로기판용 세정제 조성물에 관한 것으로, 더욱 상세하게는 이소프로필알코올(Iso-propyl Alcohol) 45-60중량%, 디에틸렌 글리콜 모노부틸 에테르(Diethylene glycol monobutyl Ether) 15-30중량%, 디에틸렌 글리콜 모노에틸 에테르(Diethylene glycol monoethyl Ether) 5-20중량%, N-메틸피롤리돈(NMP) 1-5중량%, 톨루엔(Toluene) 1-5중량%를 포함하는 연성인쇄회로기판용 세정제 조성물에 관한 것이다.The present invention relates to a cleaning composition for a flexible printed circuit board, more specifically 45-60% by weight of isopropyl alcohol, 15-30% by weight of diethylene glycol monobutyl ether , 5-20% by weight of diethylene glycol monoethyl ether, 1-5% by weight of N-methylpyrrolidone (NMP), 1-5% by weight of toluene It relates to a detergent composition for cleaning.
연성인쇄회로기판(FPCB. Flexible Printed Circuit Board)의 SMT(표면실장기술) 공정에서 FPCB에 남아있는 불순물(particle) 및 플럭스(flux)를 효과적으로 세정함으로서 연성인쇄회로기판의 불량률을 줄이고 경제적 손실을 줄일 수 있다.In the surface-mounting technology (SMT) process of flexible printed circuit boards (FPCBs), it effectively cleans the particles and fluxes remaining in the FPCBs, reducing the defect rate of the flexible printed circuit boards and reducing economic losses. Can be.
연성인쇄회로기판, FPCB, SMT, 플럭스, 색점불량 Flexible Printed Circuit Board, FPCB, SMT, Flux, Color Spot Defect
Description
본 발명은 연성인쇄회로기판용 세정제 조성물에 관한 것으로, 더욱 상세하게는 이소프로필알코올(Iso-propyl Alcohol) 45-60중량%, 디에틸렌 글리콜 모노부틸 에테르(Diethylene glycol monobutyl Ether) 15-30중량%, 디에틸렌 글리콜 모노에틸 에테르(Diethylene glycol monoethyl Ether) 5-20중량%, N-메틸피롤리돈(NMP) 1-5중량%, 톨루엔(Toluene) 1-5중량%를 포함하는 연성인쇄회로기판용 세정제 조성물에 관한 것이다.The present invention relates to a cleaning composition for a flexible printed circuit board, more specifically 45-60% by weight of isopropyl alcohol, 15-30% by weight of diethylene glycol monobutyl ether , 5-20% by weight of diethylene glycol monoethyl ether, 1-5% by weight of N-methylpyrrolidone (NMP), 1-5% by weight of toluene It relates to a detergent composition for cleaning.
핸드폰, 컴퓨터, 카메라 모듈 등에 사용되는 부품의 하나인 연성인쇄회로기판은 산업공정 중 그 세정이 필요하다. 즉, 연성인쇄회로기판에 부품을 실장을 하기 위해 솔더크림(Solder Cream)을 사용하고 리플로우(Reflow)를 통해 실장을 하고 (SMT. 표면실장기술), 그 공정 후에 세정을 실시하여 FPCB에 잔존하는 불순물 및 플럭스를 세정한다. 연성인쇄회로기판(FPCB)은 종래 생산초기 공정에 있어서는 그 세정을 하지 않았고 그로 인해 연성인쇄회로기판(FPCB)에서 나오는 불순물(Particle) 및 플럭스(flux) 잔사 등에 의해 유동성 이물이 생산공정 중에 충격, 이동 등에 의해 공정 불량율이 지속적으로 발생이 되어 세정이 필요하게 되었다. 특히 카메라 모듈용 연성인쇄회로기판의 미세정으로 인해 발생할 수 있는 불량의 항목으로 색점 불량이라는 것이 있으며, 오차가 있지만 대략 전체 불량율의 2%를 차지하고 있다. 이 문제 등을 해결하기 위해 세정제 개발이 필요한 실정이다.Flexible printed circuit boards, one of the components used in mobile phones, computers, camera modules, etc., need cleaning during industrial processes. In other words, solder cream is used to mount components on the flexible printed circuit board, and it is mounted through reflow (SMT. Surface Mount Technology), and after that process, it is cleaned and remains in the FPCB. Impurities and fluxes are cleaned. Flexible printed circuit board (FPCB) has not been cleaned in the early stage of the production process, and as a result, the flowable foreign objects are impacted during the production process due to impurities and flux residues from the flexible printed circuit board (FPCB). Process defect rate was continuously generated by the movement and the like, and cleaning was necessary. In particular, there is a color point defect, which is a defective item that may occur due to the fine fixation of a flexible printed circuit board for a camera module. In order to solve this problem and the like, it is necessary to develop a cleaning agent.
하지만, 기존의 전자재료 및 산업용 세정제는 카메라 모듈용 연성인쇄회로기판(FPCB)의 플럭스 세정제로 사용하는 것에 대한 언급 및 보고된 예가 없어, 카메라 모듈용 연성인쇄회로기판에 필요한 세정성능을 만족시키지 못하는 문제점이 있으며 기존 세정제 중 일반적으로 물이 함유되어 있는 세정제의 경우 세정 공정이 길어지는 단점이 있어 카메라 모듈용 연성인쇄회로기판 세정에 적용하기에 무리가 있다. 또한 세정제의 경우 소모품이라 저렴한 단가로 생산할 필요가 있다.However, existing electronic materials and industrial cleaners do not mention or report the use of flux cleaners for flexible printed circuit boards (FPCBs) for camera modules, and thus do not satisfy the cleaning performance required for flexible printed circuit boards for camera modules. There is a problem, and in the case of the detergent which generally contains water among the existing cleaners, there is a disadvantage in that the cleaning process is long, so it is difficult to apply it to the cleaning of the flexible printed circuit board for the camera module. In addition, since the cleaning agent is a consumable, it needs to be produced at a low price.
이에 연성인쇄회로기판(FPCB)의 잔존하는 불순물(Particle) 및 플럭스(flux)를 세정하여 제조 공정에서 발생할 수 있는 이물질과 플럭스를 제거하여 경제적 손실을 줄일 수 있는 세정제 개발이 필요하게 되었다.Accordingly, there is a need to develop a cleaner that can reduce economic losses by removing impurities and fluxes that may occur in the manufacturing process by cleaning the remaining impurities and fluxes of the flexible printed circuit board (FPCB).
이에 본 발명자들은 연성인쇄회로기판의 세정용으로 적합한 세정제를 개발하기 위하여 예의 노력한 결과 본 발명을 완성하기에 이르렀다. Accordingly, the present inventors have completed the present invention as a result of intensive efforts to develop a cleaning agent suitable for cleaning flexible printed circuit boards.
따라서, 본 발명의 목적은 SMT 공정이후 연성인쇄회로기판에 잔존하는 자체 불순물과 플럭스를 제거하여 이물질로 인한 불량을 줄일 수 있는 연성인쇄회로기판 용 세정제 조성물을 제공하는데 그 목적이 있다.Accordingly, an object of the present invention is to provide a cleaning composition for a flexible printed circuit board which can reduce defects caused by foreign substances by removing its own impurities and flux remaining on the flexible printed circuit board after the SMT process.
본 발명의 일 측면에 따르면, According to one aspect of the invention,
이소프로필알코올(Iso-propyl Alcohol) 45-60중량%, 디에틸렌 글리콜 모노부틸 에테르 (Diethylene glycol monobutyl Ether) 15-30중량%, 디에틸렌 글리콜 모노에틸 에테르(Diethylene glycol monoethyl Ether) 5-20중량%, N-메틸피롤리돈(NMP) 1-5중량%, 톨루엔(Toluene) 1-5중량%를 포함하는 연성인쇄회로기판용 세정제 조성물이 제공된다. Iso-propyl alcohol 45-60% by weight, diethylene glycol monobutyl ether 15-30% by weight, diethylene glycol monoethyl ether 5-20% by weight Provided is a cleaning composition for a flexible printed circuit board, comprising 1-5% by weight of N-methylpyrrolidone (NMP) and 1-5% by weight of toluene.
본 발명의 일 측면에 따르면, 이소프로필알코올은 50-60 중량%의 범위 내에서 사용할 수 있다. According to one aspect of the invention, isopropyl alcohol can be used in the range of 50-60% by weight.
본 발명의 일 측면에 따르면, 디에틸렌 글리콜 모노부틸 에테르는 20-30중량%의 범위 내에서 사용할 수 있다.According to one aspect of the invention, diethylene glycol monobutyl ether can be used in the range of 20-30% by weight.
본 발명의 일 측면에 따르면, 디에틸렌 글리콜 모노에틸 에테르는 10-20중량%의 범위 내에서 사용할 수 있다. According to one aspect of the invention, diethylene glycol monoethyl ether can be used in the range of 10-20% by weight.
본 발명의 일 측면에 따르면, 상기 세정제 조성물은 연성인쇄회로기판의 플럭스를 제거하는데 사용될 수 있다.According to one aspect of the invention, the detergent composition may be used to remove the flux of the flexible printed circuit board.
본 발명의 일 측면에 따르면, 상기 세정제 조성물은 카메라 모듈용 연성인쇄회로기판에 사용될 수 있다.According to an aspect of the present invention, the detergent composition may be used in a flexible printed circuit board for a camera module.
본 발명의 바람직한 실시예에 따르면, 연성인쇄회로기판의 표면실장기술(SMT. Surface Mount Technology)공정 이후 연성인쇄회로기판에 잔존하는 자체 불순물과 플럭스를 제거하여 연성인쇄회로기판의 미세정으로 인해 발생되는 불량을 줄일 수 있는 연성인쇄회로기판용 세정제 조성물을 제공할 수 있다.According to a preferred embodiment of the present invention, after the SMT (Surface Mount Technology) process of the flexible printed circuit board to remove the impurities and flux remaining on the flexible printed circuit board generated by the fine print of the flexible printed circuit board It is possible to provide a cleaning composition for a flexible printed circuit board which can reduce defects.
이하, 본 발명을 보다 구체적으로 설명한다.Hereinafter, the present invention will be described more specifically.
본 발명의 일 측면에 따르면, 이소프로필알코올(Iso-propyl Alcohol) 45-60중량%, 디에틸렌 글리콜 모노부틸 에테르(Diethylene glycol monobutyl Ether) 15-30중량%, 디에틸렌 글리콜 모노에틸 에테르(Diethylene glycol monoethyl Ether) 5-20중량%, N-메틸피롤리돈(NMP) 1-5중량%, 톨루엔(Toluene) 1-5중량% 를 포함하는 연성인쇄회로기판의 플럭스 세정제 조성물을 제공할 수 있다.According to one aspect of the invention, isopropyl alcohol (Iso-propyl alcohol) 45-60% by weight, diethylene glycol monobutyl ether 15-30% by weight, diethylene glycol monoethyl ether (Diethylene glycol Monoethyl Ether) 5-20% by weight, N-methylpyrrolidone (NMP) 1-5% by weight, toluene (Toluene) can be provided a flux cleaning composition of a flexible printed circuit board.
이소프로필알코올(IPA)의 경우 대표적인 유기용제로 인쇄회로기판의 불순물(particle)을 제거하는 목적으로 사용하며, 60% 이상으로 사용을 하면 휘발이 빨라 공비가 깨어지며 45% 이하로 사용을 하면 세정제의 단가 상승이 유발된다.Isopropyl alcohol (IPA) is a representative organic solvent used to remove particles from printed circuit boards. When used at 60% or more, the volatilization is broken due to rapid volatilization. This raises the unit price.
상기 이소프로필알코올은 바람직하게는 50-60중량%의 범위내에서 사용할 수 있다. The isopropyl alcohol is preferably used in the range of 50-60% by weight.
디에틸렌 글리콜 모노부틸 에테르의 경우 지문과 같은 유기이물과 플럭스를 제거함에 있어서 용이하다. 15% 이하로 사용하면 원하는 수준의 세정력을 얻지 못 하고, 30% 이상으로 사용을 하면 점도가 높아져 젖음성이 떨어질 수 있다.In the case of diethylene glycol monobutyl ether, it is easy to remove organic foreign substances such as fingerprints and flux. If it is used at 15% or less, the desired level of cleaning power is not obtained, and if it is used at 30% or more, the viscosity may increase and the wettability may be reduced.
상기 디에틸렌 글리콜 모노부틸 에테르는 바람직하게는 20-30 중량%의 범위 내에서 사용할 수 있다. The diethylene glycol monobutyl ether may preferably be used in the range of 20-30% by weight.
디에틸렌 글리콜 모노에틸 에테르의 경우 5-20%의 함유량일 때 유기이물과 플럭스를 제거함에 용이하다.In the case of diethylene glycol monoethyl ether in an amount of 5-20%, it is easy to remove organic matter and flux.
상기 디에틸렌 글리콜 모노에틸 에테르는 바람직하게는 10-20 중량%의 범위 내에서 사용할 수 있다.The diethylene glycol monoethyl ether may preferably be used in the range of 10-20% by weight.
N-메틸피롤리돈(NMP)의 경우 유기이물을 제거하는데 있어서 촉진제로 사용된다. N-메틸피롤리돈(NMP)을 추가하면 미세하게 잔존하는 플럭스 제거에 탁월한 효과를 준다. 1% 이하로 사용하는 경우 원하는 수준의 세정력을 얻지 못하며 5% 이상으로 사용하는 경우 단가가 상승되며 점도가 높아져 세정력이 떨어질 수 있다.N-methylpyrrolidone (NMP) is used as an accelerator in removing organic foreign matter. The addition of N-methylpyrrolidone (NMP) has an excellent effect on the removal of finely remaining fluxes. If it is used below 1%, the desired level of cleaning power is not obtained. If it is used at 5% or more, the unit price increases and the viscosity may increase, resulting in poor cleaning power.
톨루엔의 경우 세정제의 침투력을 높이기 위해 사용하며 플럭스와 외부접속단자(Bump)의 계면에 침투력을 높여 세정력을 상승시키는 역할을 한다. 1% 이하로 사용하는 경우 원하는 침투력을 얻을 수 없으며 5% 이상으로 사용하는 경우 휘발성의 차이로 공비가 깨질 수 있다.Toluene is used to increase the penetrating power of the cleaning agent and increases the cleaning power by increasing the penetration power at the interface between the flux and the external connection terminal (Bump). If it is used below 1%, the desired penetration can not be obtained. If it is used above 5%, azeotropy may be broken due to the difference in volatility.
본 발명의 바람직한 일 실시예에 따르면, 상기 세정제 조성물은 연성인쇄회로기판의 플럭스를 제거하는데 사용될 수 있다. According to a preferred embodiment of the present invention, the detergent composition may be used to remove the flux of the flexible printed circuit board.
본 발명의 바람직한 일 실시예에 따르면, 상기 세정제 조성물은 카메라 모듈용 연성인쇄회로기판에 사용될 수 있다.According to a preferred embodiment of the present invention, the cleaning composition may be used in a flexible printed circuit board for a camera module.
이하, 본 발명을 실시 예를 통해 더욱 상세히 설명하겠는바, 본 발명의 범위가 하기 실시예에 의해 제한되거나 한정되는 것은 아니다. 하기 실시 예에 있어서 별도의 언급이 없으면 백분율 및 혼합비는 중량을 기준으로 한 것이다.Hereinafter, the present invention will be described in more detail with reference to Examples, but the scope of the present invention is not limited or limited by the following Examples. In the following examples, unless otherwise stated, percentages and mixing ratios are based on weight.
실시예Example 1. One.
이소프로필알코올(Iso-propyl Alcohol) 55 중량% 디에틸렌 글리콜 모노부틸 에테르 (Diethylene glycol monobutyl Ether)25 중량%, 디에틸렌 글리콜 모노에틸 에테르( Diethylene glycol monoethyl Ether)15 중량%, N-메틸피롤리돈(NMP) 1중량%, 톨루엔(Toluene) 1 중량%를 혼합하여 세정용 조성물을 제조하였다. Iso-propyl alcohol 55 wt% Diethylene glycol monobutyl Ether 25 wt%, Diethylene glycol monoethyl Ether 15 wt%, N-methylpyrrolidone 1% by weight of (NMP) and 1% by weight of toluene were mixed to prepare a cleaning composition.
실시예Example 2. 2.
이소프로필알코올(Iso-propyl Alcohol) 50 중량% 디에틸렌 글리콜 모노부틸 에테르 (Diethylene glycol monobutyl Ether)20 중량%, 디에틸렌 글리콜 모노에틸 에테르( Diethylene glycol monoethyl Ether)10 중량%, N-메틸피롤리돈(NMP) 3중량%, 톨루엔(Toluene) 3 중량%를 혼합하여 세정용 조성물을 제조하였다. Iso-propyl alcohol 50% by weight diethylene glycol monobutyl ether 20% by weight, diethylene glycol monoethyl ether 10% by weight, N-methylpyrrolidone 3% by weight of (NMP) and 3% by weight of toluene were mixed to prepare a cleaning composition.
실시예Example 3. 3.
이소프로필알코올(Iso-propyl Alcohol) 45 중량% 디에틸렌 글리콜 모노부틸 에테르 (Diethylene glycol monobutyl Ether)15 중량%, 디에틸렌 글리콜 모노에틸 에테르( Diethylene glycol monoethyl Ether)5 중량%, N-메틸피롤리돈(NMP) 5중량 %, 톨루엔(Toluene) 5 중량%를 혼합하여 세정용 조성물을 제조하였다. Iso-propyl alcohol 45 wt% Diethylene glycol monobutyl Ether15 wt%, Diethylene glycol monoethyl Ether 5 wt%, N-methylpyrrolidone (NMP) 5% by weight, toluene (Toluene) 5% by weight was mixed to prepare a cleaning composition.
비교예Comparative example 1. One.
이소프로필알코올(Iso-propyl Alcohol) 60 중량% 디에틸렌 글리콜 모노부틸 에테르 (Diethylene glycol monobutyl Ether)30 중량%, 디에틸렌 글리콜 모노에틸 에테르( Diethylene glycol monoethyl Ether)20 중량%, N-메틸피롤리돈(NMP) 0중량%, 톨루엔(Toluene) 0중량%를 혼합하여 세정용 조성물을 제조하였다. Iso-propyl Alcohol 60% by weight Diethylene glycol monobutyl Ether 30% by weight, Diethylene glycol monoethyl Ether 20% by weight, N-methylpyrrolidone 0% by weight (NMP) and 0% by weight of toluene were mixed to prepare a cleaning composition.
비교예Comparative example 2. 2.
이소프로필알코올(Iso-propyl Alcohol) 40 중량% 디에틸렌 글리콜 모노부틸 에테르 (Diethylene glycol monobutyl Ether)10 중량%, 디에틸렌 글리콜 모노에틸 에테르( Diethylene glycol monoethyl Ether)0 중량%, N-메틸피롤리돈(NMP) 10중량%, 톨루엔(Toluene) 10중량%를 혼합하여 세정용 조성물을 제조하였다. Iso-propyl Alcohol 40% by weight Diethylene glycol monobutyl Ether 10% by weight, Diethylene glycol monoethyl Ether 0% by weight, N-methylpyrrolidone 10 wt% (NMP) and 10 wt% of toluene were mixed to prepare a cleaning composition.
상기의 실시예와 비교예를 정리하면 하기 표1 과 같다.The above Examples and Comparative Examples are summarized in Table 1 below.
상기 실시예에서 제조된 각각의 조성물을 비커500㎖을 넣고 연성인쇄회로기판 시험편(test piece)을 10개를 넣은 다음 40㎑ 초음파 세정기에 넣고 아래의 주어진 시간만큼 세정을 실시하였다. 세정 후 자연건조를 하였다. 하기 표 2는 FPCB 면에 불순물 및 플럭스가 제거되었는지를 실체현미경(배율40)을 사용하여 관찰한 결과이다.500 ml of the beaker was added to each of the compositions prepared in the above example, and 10 test pieces of the flexible printed circuit board were put into the 40 kHz ultrasonic cleaner, and the cleaning was performed for a given time below. After washing, natural drying was performed. Table 2 shows the results of observing whether impurities and fluxes were removed from the FPCB surface using a stereo microscope (magnification 40).
○ : FPCB 면의 불순물 및 플럭스가 완전히 제거 된 경우○: When impurities and flux on the FPCB side are completely removed
△ : FPCB 면의 불순물 및 플럭스가 일부 남은 경우(Triangle | delta): When the impurity and the some flux of FPCB surface remain
X : FPCB 면의 불순물 및 플럭스가 거의 제거되지 않은 경우X: When impurities and flux on FPCB side are hardly removed
상기 표를 보면, 실시예 1, 2의 경우 세정시간에 상관없이 연성인쇄회로기판의 불순물 및 플럭스의 제거능력이 우수하며 실시예 3 의 경우도 10분 후에는 연성인쇄회로기판의 불순물 및 플럭스가 완전히 제거되어 세정력이 우수한 것을 알 수 있다.As shown in the above table, in Examples 1 and 2, impurities and fluxes of the flexible printed circuit board were excellent regardless of cleaning time, and in Example 3, the impurities and fluxes of the flexible printed circuit board were It can be seen that it is completely removed and the cleaning power is excellent.
상기에서는 본 발명의 바람직한 실시예를 참조하여 설명하였지만, 해당 기술 분야에서 통상의 지식을 가진 자라면 하기의 특허 청구의 범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다. 전술한 실시예 외의 많은 실시예들이 본 발명의 특허청구범위 내에 존재한다. 따라서 본 발명의 실질적인 범위는 첨부된 청구항들과 그것들의 등가물에 의해 정의된다고 할 것이다.It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It will be understood that the invention may be varied and varied without departing from the scope of the invention. Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention. Thus, the substantial scope of the present invention will be defined by the appended claims and their equivalents.
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| KR100410612B1 (en) | 2001-04-03 | 2003-12-18 | 동우 화인켐 주식회사 | Post-stripping cleaning solution |
| KR20050113140A (en) * | 2002-01-11 | 2005-12-01 | 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 | Cleaning composition for a positive or negative photoresist |
| US20060063687A1 (en) | 2004-09-17 | 2006-03-23 | Minsek David W | Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate |
| KR20090030491A (en) * | 2007-09-20 | 2009-03-25 | 삼성전자주식회사 | Cleaing solution for immersion photolithography system and immersion photolithography process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100410612B1 (en) | 2001-04-03 | 2003-12-18 | 동우 화인켐 주식회사 | Post-stripping cleaning solution |
| KR20050113140A (en) * | 2002-01-11 | 2005-12-01 | 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 | Cleaning composition for a positive or negative photoresist |
| US20060063687A1 (en) | 2004-09-17 | 2006-03-23 | Minsek David W | Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate |
| KR20090030491A (en) * | 2007-09-20 | 2009-03-25 | 삼성전자주식회사 | Cleaing solution for immersion photolithography system and immersion photolithography process |
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