KR101031415B1 - Packing film for wafer - Google Patents

Abstract

A wafer packing film is disclosed. The wafer packing film forms an accommodating part for accommodating a wafer on which semiconductor devices are formed, and is disposed outside the primary film including at least one of PET, PE, and LLDPE and the primary film, among Al PET, PE, and LLDPE. A secondary film including at least one, and the primary film and the secondary film is a nylon (Nylon) material is added. Therefore, it shows relatively improved characteristics in tensile strength, tearing strength and heat-sealing strength, so that it can be relatively prevented from being easily torn by external edges or impacts, and can be formed with a relatively thin thickness. Since it is possible to reduce the sealing performance, there is an advantage.

Wafer, Packing Film, Uninterrupted, Nylon

Description

Wafer Packing Film {PACKING FILM FOR WAFER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer packing film, and more particularly, to a wafer packing film that includes a nylon material, which can be prevented from being easily torn by edges or impacts and can prevent a decrease in sealing performance.

As semiconductors are becoming more dense and highly integrated, product quality and reliability have a major impact on corporate profit and competitiveness. For this reason, securing the quality of equipment is gaining importance from the semiconductor manufacturing process to the point of supply, and in order to secure the quality during the manufacturing process of the semiconductor device, workers, clean rooms, wafers, etching chemicals, etc. , Di-water, process gas, etc. are kept in the best condition.

Generally, semiconductor silicon wafers are produced at a production plant and then packaged and shipped to the consumer. In order to prevent contamination during transportation, the wafer is packed through a packing process in which a shipping container is sealed, the outside of the packing container is surrounded by a special film in several layers, and the aluminum foil is wrapped again on an aluminum foil and sealed. It is shipped in a shipping box. In particular, the wafer packaging container is provided with a wafer protective film between the wafers inside the wafer packaging container to protect the wafer from breakage and impact of the wafer during shipping of the wafer.

In this case, the wafer protection film not only protects the wafer from breakage, but also serves to reduce contamination of the wafer due to particulate contamination. In addition, the wafer protection film may be formed of a material that has been treated to have static-control properties including anti-static, electrostatic dissipation, and electrical properties to protect the surface by friction between the wafers. Is formed using

However, the transport box containing the silicon wafer (Si Wafer) exhibits a property that is susceptible to particle contamination from the U-bar surface (CST handle) position due to design influence. In addition, damage of the packing film due to external impacts induces a change in temperature and moisture in the product inside the transport box to promote reaction with organic materials, and the reacted material is a source of particle generation. Will act as.

The size of the contaminated particles has a characteristic of increasing in size from large size to small size. It also considers the removal of contaminants other than particulates. Such contaminants are generated when semiconductor wafers are transported between workshops during the manufacturing process of a semiconductor device, when they are temporarily stored to perform a process step, when the wafers are moved or shipped to a place where they are further processed. Therefore, a wafer packaging container has been developed that can perform the removal of contaminants from all states of manufacture, processing, transportation and storage of semiconductor wafers.

In other words, the most important thing regarding the semiconductor silicon wafer packing is a technique for preventing the penetration of external particles and moisture. Therefore, in the packing technology of the silicon wafer, a technique in which external impact tear prevention and film sealing are completely maintained is important.

Here, an example is given about the sealing defect and the damage of a film which appear in the conventional packing film as follows. 1 illustrates an example of a photograph of a moisture leaking film and a film of a tearing film due to a sealing defect in a conventional wafer packing film.

As shown in FIG. 1, a of FIG. 1 is a photograph showing that pinholes are generated due to the lifting phenomenon due to the thickness difference in the portion of the four-packing primary packing film that changes to two layers in the center of the sealing part. .

FIG. 1B illustrates a case where a sealing pin hole occurs at a portion of a four- to two-fold change in the center of the sealing portion, and FIG. 1C illustrates a case in which the film is torn due to external impact or protrusion. It is a photograph.

As shown here, conventional wafer packing films have several problems.

First, there is a problem that is easily torn by the outer edge or impact, and also has a problem that the sealing performance (Sealing Performance) is degraded due to the thick film thickness.

Secondly, there is a problem that is not vulnerable to the charging phenomenon due to static electricity when the packing is released in the charging environment because there is no countermeasure against the electrostatic treatment.

In addition, the wafer protection film controls the contaminants of the substrate by mixing materials and additives with minimized contaminants that are expected from the material itself, but only serves to separate the wafers and prevent scratches on the surface, thereby preventing the wafer from complex contamination. There is a problem that is not enough to protect.

One object of the present invention for solving the above problems is to provide a wafer packing film having a relatively resistance to tearing easily by edges or impacts.

Another object of the present invention is to provide a wafer packing film that can be formed to a relatively thin thickness to reduce the sealing performance degradation.

It is still another object of the present invention to provide a wafer packing film that provides a countermeasure against electrostatic treatment and prevents the charging phenomenon due to static electricity even when the packing is released from the charging environment.

Still another object of the present invention is to provide a wafer packing film that can serve to separate wafers and prevent scratches on the surface, and to protect the wafers from complex contamination.

According to a preferred embodiment of the present invention for achieving the above object of the present invention, the wafer packing film forms a receiving portion for receiving a wafer on which semiconductor elements are formed, the primary film comprising at least one of PET, PE, LLDPE And disposed on the outside of the primary film, including a secondary film including at least one of Al PET, PE, LLDPE, the primary film and the secondary film is a nylon (Nylon) material is added.

In this case, it is preferable that the primary film is subjected to an uninterrupted treatment, and the thickness of the primary film and the secondary film is more preferably 90 μm to 110 μm.

In addition, the primary film is preferably coated with a moisture-proof coating, and the tensile strength of the primary film and the secondary film is preferably 8 to 17 Kgf / 15mm.

In addition, the tear strength of the primary film (Tearing Strength) is 70 to 95 Kgf / 10mm, the tear strength of the secondary film is more preferably 100 to 110 Kgf / 10mm.

In addition, the heat-sealing strength of the primary film is 7 to 9Kgf / 15mm, the heat-sealing strength of the secondary film is preferably 7 to 82 Kgf / 15mm.

According to another preferred embodiment of the present invention for achieving the above object of the present invention, in the wafer packing film (Si Wafer packing film) of a plurality of layers to protect the wafer in a container for packaging a silicon wafer, The wafer packing film includes a nylon material, and includes a sealing film that includes at least one layer of a moisture proof coating and an uninterruptible treatment process.

At this time, the thickness of the sealing film is preferably 90㎛ to 110㎛, the tensile strength of the sealing film is more preferably 8 to 17 Kgf / 15mm.

In addition, the tearing strength (Tearing Strength) of the sealing film is more preferably 70 to 110 Kgf / 10mm.

According to the present invention, since it is formed by including a nylon material, it shows a relatively improved characteristics in the tensile strength, tear strength and heat-sealing strength, the effect that can be relatively prevented from being easily torn by the outer edge or impact have.

In addition, since it can be formed with a relatively thin thickness, there is an advantage that can reduce the sealing performance degradation.

In addition, this not only serves to classify the wafer and prevent scratches on the surface, but also has the effect of protecting the wafer from complex contamination.

In addition, when the packing is released in the charging environment due to the electrostatic treatment, there is a relatively improved advantage in the charging phenomenon by the static electricity.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. Note that, in the following description, components that are substantially the same in structure and function and can be handled identically can be identified by the same reference numerals.

First embodiment

Referring to the wafer packing film according to the first embodiment of the present invention. 2 is a cross-sectional view illustrating a cross section of a wafer packing film according to a first embodiment of the present invention.

As shown therein, the wafer packing film includes a primary film 100 and a secondary film 200.

The primary film 100 forms a receiving portion 101 for receiving the wafer 10 on which the semiconductor devices are formed, and includes at least one material of PET, PE, and LLDPE.

The secondary film 200 is disposed on the outside of the primary film, it is formed including at least one material of AL PET, PET, PE, LLDPE.

In this case, a nylon material is added to the primary film 100 and the secondary film 200.

That is, the primary film 100 is formed including PET, PE, LLDPE, and nylon, and the secondary film 200 is formed including AL PET, PET, PE, LLDPE, and nylon.

Here, a conventional wafer packing film is presented as a comparative example to compare the wafer packing film according to the first embodiment of the present invention. Table 1 shows the technical features of the wafer packing film according to the comparative example and the first embodiment as follows.

to be.

As shown therein, the wafer packing film according to the first embodiment of the present invention has a relatively thin thickness, and a nylon material is added to the wafer packing film according to the comparative example.

Here, the wafer packing film according to the first embodiment will be described in more detail as follows.

First, the primary film 100 is formed by an uninterruptible treatment, and the thickness t1 of the primary film 100 and the thickness t2 of the secondary film 200 are 90 μm to 110 μm. do. More preferably, the thickness t1 of the primary film 100 and the thickness t2 of the secondary film 200 are provided as 100 μm to 105 μm.

In addition, the primary film 100 is provided in a state of the moisture-proof coating treatment, to prevent the moisture is further moisture-permeable to the wafer packed by the wafer packing film.

In addition, the tensile strength of the primary film 100 and the secondary film 200 is 8 to 17 Kgf / 15mm, tearing strength (Tearing Strength) of the primary film 100 is 70 to 95 Kgf / 10mm The tear strength of the secondary film 200 is preferably 100 to 110 Kgf / 10mm.

In addition, the heat sealing strength of the primary film 100 is 7 to 9 Kgf / 15mm, the heat sealing strength of the secondary film 200 is provided to 7 to 82 Kgf / 15mm.

In addition, the strength of the film itself is improved due to the nylon material included in the primary film 100 and the secondary film 200, and has been subjected to an uninterrupted treatment to prevent the charging phenomenon by static electricity.

At this time, Table 2 comparing the electrostatic charging phenomenon according to the comparative example and the first embodiment is as follows.

to be.

As shown here, compared to the wafer packing film according to the comparative example, the charging phenomenon of the unpacking of the primary film in the actual environment in which the artificial friction of the wafer packing film according to the first embodiment exists is improved compared to the conventional value. Seemed. At this time, the above-mentioned static electricity value is compared with the assumption that the static electricity value under the actual ionizer is relatively zero.

That is, when the packing is released in the charging environment due to the electrostatic treatment for the primary film, there is a relatively improved advantage in the charging phenomenon by the static electricity.

Here, FIG. 3 is provided to explain the contamination of the wafer packing film according to the comparative example and the first embodiment. 3 is a graph showing a measurement result before and after particles (particles) after Kazumi Run of the wafer packing film according to the comparative example and the first embodiment.

As shown in the drawing, after the Kazumi Run of the wafer packing film according to the first embodiment before and after the particle (particle) measurement results show that no particle contamination phenomenon.

In addition, Table 3 for explaining the organic material analysis results of the wafer packing film according to the comparative example and the first embodiment are as follows.

to be.

As shown in this, in the case of the wafer packing film according to the first embodiment of the present invention compared to the wafer packing film according to the comparative example, it can be seen that the organic material analysis results improved. Here, the unit is ng / cm 2 * min.

Therefore, the wafer packing film not only serves to classify the wafer and prevent scratching of the surface, but also protects the wafer from complex contamination.

Second embodiment

Referring to the wafer packing film according to the second embodiment of the present invention. 4 is a cross-sectional view illustrating a cross section of a wafer packing film according to a second embodiment of the present invention.

As shown therein, the wafer packing film 300 is provided to form a plurality of layers to protect the wafer in a container for packaging the silicon wafer 10, and the wafer packing film 300 includes a nylon material. And a sealing film 350 that has undergone at least one layer of a moisture proof coating and an uninterruptible treatment process.

In the present exemplary embodiment, the wafer packing film is illustrated as two layers, but is not limited thereto. Here, the thickness t3 of the sealing film 350 is preferably 90 μm to 110 μm, and the thickness of the wafer packing film is similar to the thickness of the sealing film 350 overlapping two times, but is not limited thereto. Does not.

That is, the sealing film 350 may be provided with different materials, and the wafer may be accommodated therein, and may be provided as an inner sealing film which is directly adjacent to the adjacent sealing film and an outer sealing film which is disposed outside the inner sealing film. .

In addition, the tensile strength of the sealing film 350 is 8 to 17 Kgf / 15mm, and the tearing strength (Tearing Strength) of the sealing film 350 is preferably 70 to 110 Kgf / 10mm.

Here, FIG. 5 is provided to explain the sealing performance of the wafer packing film according to the conventional comparative example and the wafer packing film according to the embodiment of the present invention. 5 is an exemplary view illustrating a comparison between a wafer packing film according to a comparative example and a wafer packing film according to an embodiment of the present invention.

As shown, first, the sealing performance of the inner sealing film, as described above, the problem that the sealing performance (Sealing Performance) is reduced due to the thick film thickness of the wafer packing film according to the comparative example is improved You can see that.

That is, it can be seen that the lifting phenomenon due to the thickness difference does not occur in the portion of the four-layer film that is changed into two layers in the center of the sealing part, and also, the pin hole is not generated due to this. have.

In addition, looking at the sealing performance of the outer sealing film, there is also an effect that the problem that the sealing performance (Sealing Performance) is reduced due to the thick film thickness of the wafer packing film according to the comparative example.

Therefore, since the wafer packing film according to the first and second embodiments is formed of a nylon material, the wafer packing film is relatively improved in tensile strength, tear strength, and heat-sealing strength. There is an effect that can be relatively prevented from tearing easily.

In addition, since it can be formed with a relatively thin thickness, there is an advantage that can reduce the sealing performance degradation.

As described above, although described with reference to the preferred embodiment of the present invention, those skilled in the art various modifications and variations of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

1 illustrates an example of a photograph of a moisture leaking film and a film of a tearing film due to a sealing defect in a conventional wafer packing film.

2 is a cross-sectional view illustrating a cross section of a wafer packing film according to a first embodiment of the present invention.

3 is a graph showing a measurement result before and after particles (particles) after Kazumi Run of the wafer packing film according to the comparative example and the first embodiment.

4 is a cross-sectional view illustrating a cross section of a wafer packing film according to a second embodiment of the present invention.

5 is an exemplary view illustrating a comparison between a wafer packing film according to a comparative example and a wafer packing film according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: wafer 100: primary film

101: accommodating part 200: secondary film

300: wafer packing film 350: sealing film

Claims (11)

Forming an accommodating portion for receiving the wafer on which the semiconductor elements are formed, including a PET, PE and LLDPE, the primary film is moisture-coated; And A secondary film disposed on the outside of the primary film and including Al PET, PE, and LLDPE; To include, The primary film and the secondary film is a wafer packing film to which a nylon (Nylon) material is added. The method of claim 1, The primary film is a wafer packing film, characterized in that the uninterrupted treatment. The method of claim 1, Wafer packing film, characterized in that the thickness of the primary film and the secondary film is 90㎛ to 110㎛. delete The method of claim 1, The tensile strength of the primary film and the secondary film is a wafer packing film, characterized in that 8 to 17 Kgf / 15mm. The method of claim 1, Tearing strength of the primary film (Tearing Strength) is 70 to 95 Kgf / 10mm, the tear strength of the secondary film is a wafer packing film, characterized in that 100 to 110 Kgf / 10mm. The method of claim 1, The heat-sealing strength of the primary film is 7 to 9 Kgf / 15mm, the heat-sealing strength of the secondary film is 7 to 82 Kgf / 15mm wafer packing film. A plurality of layered wafer packing film (Si Wafer packing film) for protecting the wafer in a container for packaging a silicon wafer, the wafer packing film comprising a nylon material, at least one layer of a moisture proof coating and Wafer packing film comprising a sealing film subjected to an uninterrupted treatment process. The method of claim 8, The thickness of the sealing film is a wafer packing film, characterized in that 90 to 110 ㎛. The method of claim 8, The tensile strength of the sealing film is a wafer packing film, characterized in that 8 to 17 Kgf / 15mm. The method of claim 8, The tearing strength (Tearing Strength) of the sealing film is a wafer packing film, characterized in that 70 to 110 Kgf / 10mm.

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