KR101022095B1 - Oblique line type mesh grounding system and method for establishing the same - Google Patents

Abstract

The present invention relates to a diagonal mesh grounding system and an installation method thereof for arranging internal ground conductors diagonally, and a pair of first outer grounding conductors buried spaced apart from each other in a horizontal direction, and buried spaced apart from each other in a vertical direction, An outer ground network composed of a pair of second outer ground conductors respectively connected to ends of the first outer ground conductor; A plurality of first inner ground conductors disposed to be inclined spaced apart from each other at a predetermined angle with respect to the first outer ground conductor; and a plurality of first inner ground conductors disposed to be inclined apart from each other so as to be symmetrical with the plurality of first inner ground conductors; A diagonal mesh grounding system comprising an inner grounding network composed of a plurality of second inner grounding conductors intersectingly connected, wherein both ends of each of the first inner grounding conductor and each of the second inner grounding conductors are connected to the outer grounding network; Its installation method is provided.

Mesh ground, diagonal, boiling gap

Description

Oblique line type mesh grounding system and method for establishing the same}

The present invention relates to a grounding system and a method of installing the same, and more particularly, to a diagonal mesh grounding system for reducing contact voltage while significantly reducing the amount of grounding conductor used, and arranging the grounding conductor diagonally for equipotentialization of the grounding system. It relates to the installation method thereof.

Grounding refers to the electrical coupling of electrical utility equipment, such as electrical, electronic and telecommunications equipment, to the ground, which is basically grounded to lower the potential rise of the earth's surface caused by an electrical accident (ground fault, short circuit or lightning strike). The resistance should be low. Ideally, the ground resistance should be 0 [Ω], but practically impossible, it is necessary to configure the grounding system so that there is no obstacle to equipment or equipment connected to the ground.

The purpose of this grounding system is to effectively prevent breakdown of equipment by distributing fault currents, transient voltages or surges caused by internal factors such as accidents occurring inside the power system and external factors such as lightning strikes. It is in terms of protecting equipment and preventing human accidents such as safety accidents by suppressing the rise of the ground potential at ground points.

In general, meshes are used for large-scale grounding systems such as power plants, substations, airports, subways, power facilities, and large buildings, and for grounding systems that require extremely small potential rises or fluctuations on the ground surface, such as intelligent buildings and hospitals. Grounding system is applied.

The mesh grounding system is to build a common ground for steel structures and electrical facilities. The mesh grounding system is a grounding system in which a bare copper wire having a lattice structure is embedded in the ground and used as a grounding electrode.

1 to 2C, an orthogonal lattice mesh grounding system according to the prior art 1 will be described. FIG. 1 is a schematic plan view of an orthogonal lattice mesh grounding system according to the prior art 1, FIG. 2A is a design specification of the orthogonal lattice mesh grounding system shown in FIG. 1, FIG. 2B is a result thereof, and FIG. 2C is Contact voltage distribution of an orthogonal lattice mesh grounding system according to FIG. 1.

1 to 2C, an orthogonal mesh grounding system consists of a plurality of transverse ground conductors H extending in the transverse direction and a plurality of longitudinal ground conductors V extending in the longitudinal direction. The plurality of transverse ground conductors H and the plurality of longitudinal ground conductors V are connected to each other in an orthogonal state. Looking at the design specifications of the orthogonal lattice mesh grounding system of the prior art 1, the ground construction area is 70 * 70 [m ² ], and the number of grounding conductors on one side is 9 (except the outermost grounding conductor), the earth resistivity (ρ) is 400 [Ω · m], buried depth is 0.5 [m], failure time is 0.5 [sec], conductor current classification rate is 1.0, and maximum ground current is 1908 [A].

As a result of the design of the grounding system of this specification, the maximum expected contact voltage is 1061.9 [V], the ground potential rise (GPR) is 5062.2 [V], the ground resistance is 2.6532 [Ω], and the length of the entire ground conductor is 1540 [ m] takes.

On the other hand, if the maximum allowable contact voltage is 900 [V], since the maximum expected contact voltage of the orthogonal mesh grounding system according to the prior art 1 exceeds the maximum allowable contact voltage, it cannot be used as it is, and a plurality of ground rods are additionally added to the ground conductor. There has been a problem that the maximum expected contact voltage must be reduced to within the maximum allowable contact voltage by connecting or increasing the ground conductor.

This additional installation of ground rods and ground conductors increases the cost of the entire mesh grounding system due to higher material costs for the ground rods and ground conductors. there was. Therefore, there is an urgent need for a mesh grounding system in which the maximum expected contact voltage of the mesh grounding system can be within the maximum allowable contact voltage without additional installation of such grounding rods and grounding conductors.

The present invention is to overcome the above-mentioned conventional problems, the problem to be solved by the present invention provides a diagonal mesh grounding system and a method of installing the same that can significantly reduce the maximum expected contact voltage while reducing the amount of grounding conductor used. It is to.

In addition, another object of the present invention is to provide an oblique mesh grounding system and an installation method thereof capable of realizing an equipotentialization of the mesh grounding system without using a grounding rod.

According to an aspect of the present invention, a pair of the first outer ground conductor buried spaced apart from each other in the horizontal direction, and a pair of buried spaced apart from each other in the longitudinal direction, each of the pair connected to the end of the first outer ground conductor An outer ground network composed of a second outer ground conductor; A plurality of first inner ground conductors disposed to be inclined spaced apart from each other at a predetermined angle with respect to the first outer ground conductor; and a plurality of first inner ground conductors disposed to be inclined apart from each other so as to be symmetrical with the plurality of first inner ground conductors; An inner ground network composed of a plurality of second inner ground conductors intersecting with the ground conductor, wherein both ends of each of the first inner ground conductor and each of the second inner ground conductors are connected to the outer ground network; A diagonal mesh grounding system is provided.

The plurality of first inner ground conductors are disposed at boiling intervals such that the mutual separation distance is gradually reduced from the center region of the outer ground network to the outer region, and the plurality of second inner ground conductors are disposed at the center region of the outer ground network. The distance from each other is gradually reduced toward the outer area.

The plurality of first inner ground conductors are disposed at equal intervals, and the plurality of second inner ground conductors are disposed at equal intervals.

The outer ground network is characterized in that the square or rectangular.

The outer ground network includes an L-shaped or T-shaped.

The plurality of first inner ground conductors is odd, at least one of the plurality of first inner ground conductors has at least one end connected to a vertex of the outer ground network, and the plurality of second inner ground conductors is odd At least one end of at least one of the plurality of second inner ground conductors is connected to a vertex of the outer ground network.

According to another aspect of the present invention, a pair of first outer ground conductors which are spaced apart from each other in the horizontal direction, and a pair of first outer ground conductors which are spaced apart from each other in the longitudinal direction, respectively connected to the ends of the first outer ground conductor Embedding an outer ground network composed of a second outer ground conductor; Connecting both ends of the plurality of first inner ground conductors spaced apart from each other at an angle with respect to the first outer ground conductor at a predetermined angle to the outer ground network; And connecting a plurality of second inner ground conductors disposed to be spaced apart from each other so as to be symmetrical with the plurality of first inner ground conductors so as to intersect with the plurality of first inner ground conductors, and connecting both ends of the plurality of second inner ground conductors. There is provided an installation method of an oblique mesh grounding system comprising the step of connecting to the outer ground network.

According to the present invention, when the mesh grounding system having the same area is configured, the use of the grounding conductor is reduced as well as the contact voltage is significantly reduced as compared to the orthogonal lattice mesh grounding system.

In addition, it is possible to obtain the effect of realizing the equipotentialization of the mesh grounding system without using a grounding rod in the diagonal boiling interval grounding.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

3 is a schematic plan view of a diagonal mesh grounding system according to a first embodiment of the present invention, FIG. 4A is a design specification of the diagonal mesh grounding system shown in FIG. 3, FIG. 4B is a resultant value thereof, and FIG. 4C is 3 is a contact voltage distribution diagram of an oblique mesh grounding system.

3 to 4C, the diagonal mesh grounding system 100 includes an outer grounding network 50 and an inner grounding network 60. The outer ground network 50 is composed of a pair of first outer ground conductors 10 and a pair of second outer ground conductors 20, and the inner ground network 60 has a plurality of first inner ground conductors 30. ) And a plurality of second internal ground conductors 40.

The pair of first outer ground conductors 10 extend in the horizontal direction and are disposed to be spaced apart from the upper outer ground conductor 10a and the upper outer ground conductor 10a, which are embedded at a predetermined interval, and embedded in the lower outer ground conductor 10b. It consists of. In addition, the pair of second outer ground conductors 20 extend in the longitudinal direction and are disposed to be spaced apart from the left outer ground conductor 20a and the left outer ground conductor 20a at regular intervals to be embedded. 20b). The ends of each outer ground conductor are connected to each other, so that the outer ground network 50 is square or rectangular. In the present embodiment, the length of each outer ground conductor is the same as 70 [m], and the outer ground network 50 is configured in a square shape.

In the embodiments of the present invention, the outer ground network is configured as a square or a rectangle, but in the present invention, the form of the outer ground network is not limited thereto, and the outer ground network may be configured as L-shaped or T-shaped. That is, by configuring any one of the four outer ground conductors in a bent form, by forming the outer ground network as a whole L-shaped or by forming two outer ground conductors facing out of the four outer ground conductors in a bent form, The outer grounding network can be configured as a T-shape as a whole.

The internal grounding network 60 is composed of a plurality of first inner grounding conductors 30 and a plurality of second inner grounding conductors 40, wherein the plurality of first inner grounding conductors 30 connects the outer grounding network 50. As a reference, the plurality of second internal ground conductors 40 are inclined to be spaced apart from each other at a predetermined angle (45 degrees in this embodiment), and the plurality of second internal ground conductors 40 are inclined to be spaced apart from each other to be symmetrical with respect to the plurality of first internal ground conductors 30. And intersect with a plurality of first internal ground conductors 30. And, both ends of each of the first inner ground conductor 30 and each of the second inner ground conductor 40 are connected to the outer ground network (50). In this case, the plurality of first inner ground conductors 30 are disposed at equal intervals, and the plurality of second inner ground conductors 40 are also disposed at equal intervals.

Looking at the design specifications of the diagonal mesh grounding system of the first embodiment of the present invention, the ground construction area is 70 * 70 [m ² ], the number of grounding conductors on one side is 11 (except the outermost grounding conductor), The resistivity (ρ) is assumed to be 400 [Ω · m], the buried depth is 0.5 [m], the failure duration time is 0.5 [sec], the conductor current classification rate is 1.0, and the maximum ground current is 1908 [A]. Such design specifications differ only in the number of grounding conductors on one side and the arrangement of the grounding conductors, and the remaining conditions are the same as in the prior art 1.

Referring to the results of the first embodiment of the present invention, the maximum expected contact voltage is 837.75 [V], the ground potential rise (GPR) is 5029.4 [V], the ground resistance is 2.6359 [Ω], and the length of the entire ground conductor is 1467.9 [ m] takes. Contact voltage refers to the voltage between the operator's hands and feet due to a short circuit between the charged conductor and the enclosure when the operator is touching the grounded enclosure.

According to the first embodiment of the present invention, unlike the prior art, even if the ground rod is not used, the maximum expected contact voltage falls within the maximum allowable contact voltage range, the ground potential rise, the ground resistance are also reduced, and the length of the entire ground conductor is also reduced. It works. The maximum expected contact voltage was reduced by about 20 [%] compared to the prior art 1, and the use of the ground conductor was also reduced by about 5 [%].

As in the present invention, when the inner ground conductor is diagonally connected to the outer ground network, the length of the ground conductor embedded per unit area increases around the outer ground network than when the inner ground conductor is disposed orthogonally. As the resistance increases, the current path becomes narrower. As a result, since the potential difference between the outer region and the center region of the external ground network is reduced, the maximum expected contact voltage is also reduced, although the use length of the ground conductor is reduced.

5A is a schematic plan view of an oblique mesh grounding system according to a second embodiment of the present invention, and FIG. 5B is a contact voltage distribution diagram of an evenly spaced diagonal mesh grounding system. The second embodiment shown in FIG. 5 has a different separation distance between the inner ground conductors compared to the first embodiment, and the rest of the configuration is similar, and the following description will focus on different configurations.

The diagonal mesh grounding system 200 according to the second embodiment of the present invention includes an outer grounding network 150 and an inner grounding network 160. The outer ground network 150 includes a pair of first outer ground conductors 110 and a pair of second outer ground conductors 120, and the inner ground network 160 includes a plurality of first inner ground conductors 130. ) And a plurality of second internal ground conductors 140.

The pair of first outer ground conductors 110 extend in the horizontal direction and are disposed to be spaced apart from the upper outer ground conductor 110a and the upper outer ground conductor 110a which are embedded at predetermined intervals, and embedded in the lower outer ground conductor 110b. It consists of. In addition, the pair of second outer ground conductors 120 extend in the longitudinal direction and are disposed to be spaced apart from the left outer ground conductor 120a and the left outer ground conductor 120a at a predetermined interval to be embedded. It consists of 120b. The ends of each outer ground conductor are connected to each other, so that the outer ground network 150 is square or rectangular.

The internal grounding network 160 is composed of a plurality of first inner grounding conductors 130 and a plurality of second inner grounding conductors 140, wherein the plurality of first inner grounding conductors 130 is configured to form the outer grounding network 150. The plurality of second internal ground conductors 140 are disposed to be spaced apart from each other at an angle of 45 degrees, and the plurality of second internal ground conductors 140 are disposed to be spaced apart from each other so as to be symmetrical with the plurality of first internal ground conductors 130. Are intersected with In addition, both ends of each of the first inner ground conductor 130 and the second inner ground conductor 140 are connected to the outer ground network 150.

In this case, the plurality of first inner ground conductors 130 are disposed at a boiling interval between each other, and the plurality of second inner ground conductors 140 are also configured to be disposed at boiling intervals of each other. That is, the plurality of first inner ground conductors 130 are disposed to decrease from each other toward the outer region from the center region of the outer ground network 150, and the plurality of second inner ground conductors 140 are disposed on the outer ground network. As the distance from the central region of 150 to the outer region is reduced to each other.

FIG. 5B is a contact voltage distribution diagram of the boiling spaced diagonal mesh grounding system. Referring to the design specifications of the boiling spaced diagonal mesh grounding system shown in FIG. 5B, the ground construction area is 70 * 70 [m ² ], and the number of grounding conductors on one side is shown. Is 13 (except outermost ground conductor), earth resistivity (ρ) is 400 [Ω · m], buried depth is 0.5 [m], failure time is 0.5 [sec], conductor current classification rate is 1.0 The maximum ground current is assumed to be 1908 [A].

In the results of Fig. 5b, the maximum expected contact voltage is 699.52 [V], the ground potential rise (GPR) is 5033.3 [V], the ground resistance is 2.638 [Ω], and the length of the entire ground conductor is 1459.9 [m]. . The number of internal ground conductors is increased from 11 to 13 compared to an equally spaced diagonal mesh grounding system, but the actual length of the boiling spacing is reduced from 1467.9 [m] to 1459.9 [m].

The path of the current flowing out of the ground through the ground conductor is wider, or the corner of the ground grid has a wider resistance, and the narrower the portion, the larger the resistance, and the narrower the current path. Therefore, when a current flows toward a wide passage, the voltage is lowered, and thus the ground resistance and the GPR value can be lowered. Therefore, it is more effective to narrow the corners at the intervals of the grounding conductors to the boiling intervals and to arrange the centers wider than to arrange the intervals of the grounding conductors at equal intervals.

On the other hand, the performance comparison between the linear mesh grounding system according to the prior art and the equally spaced and boiling interval diagonal mesh grounding system according to an exemplary embodiment of the present invention are shown in Table 1 below.

TABLE 1

division Equal interval
Grid (j = 10) Equal interval
Oblique line (j = 12) Boiling interval
Grid (j = 10) Boiling interval
Oblique line (j = 12) Expected
Contact voltage [V] 1039.41 783.66 711.39 V 699.52 V GPR [V] 5062.2V 5029.4V 4998.7 V 5033.3 V Resistance [Ω] 2.6531 2.6359 2.6198 2.638 Copper conductor total length [m] 1540 1467.9 1540 1459.9

6A is a contact voltage distribution diagram according to the prior art 2, FIG. 6B is a contact voltage distribution diagram according to the third embodiment of the present invention, FIG. 7A is a contact voltage distribution diagram according to the prior art 3, and FIG. 4 is a contact voltage distribution diagram according to the fourth embodiment, FIG. 8A is a contact voltage distribution diagram according to the prior art 4, FIG. 8B is a contact voltage distribution diagram according to the fifth embodiment of the present invention, and FIG. 9A is a contact voltage distribution according to the prior art 5 9B is a contact voltage distribution diagram according to a sixth embodiment of the present invention, FIG. 10A is a contact voltage distribution diagram according to the prior art 6, FIG. 10B is a contact voltage distribution diagram according to a seventh embodiment of the present invention. 11A is a contact voltage distribution diagram according to an eighth embodiment of the present invention, FIG. 11B is a contact voltage distribution diagram according to a ninth embodiment of the present invention, FIG. 12A is a contact voltage distribution diagram according to the prior art 7, and FIG. 12B is a Tenth aspect of the present invention And the contact time is it according to the voltage distribution, and Fig. 12c is a contact voltage distribution according to an eleventh embodiment of the present invention.

6A to 12C and Tables 2 to 5, the results of the third to eleventh embodiments of the present invention, comparison results with the prior arts 2 to 7, and contact voltage distributions will be described.

TABLE 2

division Area (m * m) Ground
Current (A) Conductor thickness
(mm ² ) Earth
Resistivity (Ωm) Buried
Depth (m) inside
Conductor shape 2 70 * 70 1000 22 400 0.5 9 Straight Example 3 70 * 70 1000 22 400 0.5 11 diagonal Conventional 3 70 * 70 1000 22 400 0.5 11 Straight Example 4 70 * 70 1000 22 400 0.5 13 diagonal 4 70 * 70 1000 100 400 0.5 9 Straight Example 5 70 * 70 1000 100 400 0.5 11 diagonal Conventional 5 70 * 70 1000 22 1000 0.5 9 Straight Example 6 70 * 70 1000 22 1000 0.5 11 diagonal 6 70 * 70 1000 22 400 3 9 Straight Example 7 70 * 70 1000 22 400 3 11 diagonal Example 8 70 * 70 1000 22 400 0.5 10 Diagonal (even) Example 9 70 * 70 1000 22 400 0.5 12 Diagonal (even)

[Table 3]

division Contact voltage (V) GPR (V) Earth resistance (Ω) Overall length (m) Contact voltage
Reduction rate Copper wire
Reduction rate 2 556.55 2653.2 2.6532 1540 - - Example 3 430.55 2642.6 2.6426 1467.9 22.64% 4.68% Conventional 3 528.53 2615.3 2.6153 1820 - - Example 4 420.77 2613.6 2.6136 1665.9 20.39% 4.68% 4 500.85 2616.3 2.6163 1540 Example 5 378.91 2606.4 2.6064 1467.9 24.35% 4.68% Conventional 5 1391.36 6632.9 6.6329 1540 Example 6 1076.37 6606.4 6.6064 1467.9 22.64% 4.68% 6 707.807 2493.2 2.4932 1540 Example 7 644.77 2477.5 2.4775 1467.9 8.90% 4.68% Example 8 715.87 3234.5 3.2345 1359.9 Example 9 684.05 3197 3.197 1559.2

Table 3 is a design specification of the diagonal mesh grounding system according to the embodiment 3 to 9 of the present invention and the design specifications of the orthogonal grid type mesh grounding system according to the prior art, Table 2 is the result of the grounding system according to each design specification to be.

Looking at the design specifications of the diagonal mesh grounding system of the third embodiment of the present invention, the ground construction area is 70 * 70 [m ² ], the number of grounding conductors on one side is 11 (except the outermost grounding conductor), The resistivity (ρ) is 400 [Ω · m], the buried depth is 0.5 [m] , and the maximum ground current is 1000 [A]. In comparison, the grounding system according to the related art 2 has 9 ground conductors on one side (except the outermost ground conductor), and differs only in that they are arranged in an orthogonal shape, and the remaining conditions are the same.

Referring to the results of the prior art 2 and the third embodiment of the present invention, the maximum expected contact voltage of the grounding system according to the prior art 2 is 556.55 [V], the GPR is 2653.2 [V], the ground resistance is 2.6532 [Ω] and the total ground. While the conductor length is 1540 [m], the maximum expected contact voltage of the diagonal mesh grounding system according to the third embodiment of the present invention is 430.55 [V], GPR is 2642.6 [V], and ground resistance is 2.6426 [Ω]. And the length of the entire ground conductor is 1467.9 [m]. Accordingly, it can be seen that the third embodiment of the present invention reduces the GPR and the ground resistance as well as the contact voltage by 22.64 [%] and the ground conductor usage by 4.68 [%], compared to the related art 2.

The fourth embodiment of the present invention is different from the third embodiment in that 13 (except for the outermost grounding conductor) is disposed by increasing the number of inner conductors, and the remaining design specifications are the same as in the third embodiment. Compared to prior art 3 also increased the number of internal conductors to eleven.

Comparing the results of the prior art 3 and the fourth embodiment of the present invention, the fourth embodiment of the present invention reduces the GPR and grounding resistance as well as the contact voltage by 20.39%, compared to the prior art 3, and the ground conductor. It can be seen that the usage has also decreased by 4.68%. In addition, when comparing the fourth embodiment and the third embodiment of the present invention, it can be seen that increasing the number of internal conductors increases ground conductor usage, but decreases contact voltage, GPR, and ground resistance.

The fifth embodiment of the present invention is different from the third embodiment in that the conductor thickness is arranged to be larger (100 [mm ² ]), and the remaining design specifications are the same as those of the third embodiment. 4 also increased the conductor thickness to 100 [mm ² ].

Comparing the results of the prior art 4 and the fifth embodiment of the present invention, the fifth embodiment of the present invention reduces the GPR and ground resistance as well as the contact voltage by 24.35 [%] compared to the prior art 4, It can be seen that the conductor usage was also reduced by 4.68 [%]. In addition, when comparing the fifth embodiment and the third embodiment of the present invention, it can be seen that increasing the conductor thickness decreases the contact voltage, the GPR, and the ground resistance.

The sixth embodiment of the present invention differs in that the earth resistivity is increased compared to the third embodiment, and the remaining design specifications are the same as in the third embodiment, and the related art 5 also increases the earth resistivity to 1000. . In addition, the seventh embodiment of the present invention is different in that the buried depth is increased compared to the third embodiment, the remaining design specifications are the same as the third embodiment, and compared with the prior art 6 also increased the buried depth .

As can be seen from the results of Table 3, even if the ground resistivity or the buried depth is increased, the diagonal mesh grounding system according to the present invention reduces GPR and grounding resistance as compared to the orthogonal grid mesh system according to the prior art, as well as contact voltage and grounding. It can be seen that the conductor usage is also reduced. On the other hand, when comparing the seventh embodiment and the third embodiment of the present invention, it can be seen that as the buried depth of the ground conductor is lowered, the contact voltage, GPR and ground resistance decrease.

The eighth and ninth embodiments of the present invention differ from the third embodiment (odd number arrangement) in that the number of internal ground conductors is even. The remaining design specifications are the same as those in the third embodiment. In the eighth embodiment, ten fewer ones were disposed than in the third embodiment, and the ninth embodiment has one more eleven than the third embodiment.

Compared with the results of the eighth and ninth embodiments of the present invention and the third embodiment, the total length of the ground conductor was reduced in the eighth embodiment compared with the third embodiment, but the contact voltage, the GPR, and the ground resistance were increased. In addition, in the ninth embodiment, the contact voltage, the GPR, and the ground resistance were all increased, although the total length of the ground conductor was increased in comparison with the third embodiment. Therefore, the internal grounding conductor is composed of an odd number, the inner grounding conductor disposed in the center is preferably configured to be connected to the vertex of the outer grounding network, it is preferably configured to increase the resistance of the vicinity of the outer grounding network.

[Table 4]

division Area (m * m) Ground
Current (A) Conductor thickness
(mm ² ) Earth resistivity (Ωm) Buried depth (m) shape 7 100 * 200 1000 100 500 One Straight Example 10 100 * 200 1000 100 500 One 45 degrees Example 11 100 * 200 1000 100 500 One 63 degrees

TABLE 5

division Contact voltage (V) GPR (V) Earth resistance (Ω) Overall length (m) Contact voltage
Reduction rate Copper wire
Reduction rate 7 290.25 1543.8 1.5438 5100 - - Example 10 239.9 1544.6 1.5446 4559.8 17.35% 10.59% Example 11 252.44 15523 1.5523 4177.7 13.03% 18.09%

Table 4 shows the design specifications of the diagonal mesh grounding system according to the tenth and eleventh embodiments of the present invention, and the design specifications of the orthogonal lattice mesh grounding system according to the prior art 7, and Table 5 shows the results of the grounding system according to each design specification. .

Looking at the design specifications of the diagonal mesh grounding system of the tenth embodiment of the present invention, the ground construction area is a rectangle of 100 * 200 [m ² ], the earth resistivity (ρ) is 500 [Ω · m], buried depth 1 m, The maximum ground current is 1000 [A] and the slope of the internal ground conductor is 45 degrees. On the other hand, the eleventh embodiment of the present invention is the inclination of the internal ground conductor is 63 degrees, the remaining design specifications are the same as the tenth embodiment, the prior art 7 is the internal ground conductor is arranged in an orthogonal state, The configuration was the same as in the tenth embodiment.

Comparing the results of the prior art 7 and the tenth embodiment of the present invention, the tenth embodiment of the present invention shows that the contact voltage is reduced by 17.35 [%] and the ground conductor usage is also reduced by 10.59 [%] compared with the conventional technology 7. Can be. In addition, in the eleventh embodiment, it can be seen that the contact voltage is reduced by 13.03 [%] and the use of the ground conductor is also reduced by 18.09 [%], compared to the prior art 7.

What has been described above is only an exemplary embodiment of the diagonal mesh grounding system and its installation method according to the present invention, the present invention is not limited to the above embodiment, as claimed in the following claims, the present invention Without departing from the gist of the present invention, those skilled in the art to which the present invention pertains to the technical spirit of the present invention to the extent that various modifications can be made.

1 is a schematic plan view of an orthogonal lattice mesh grounding system according to prior art 1.

FIG. 2A is a design specification of the orthogonal lattice mesh grounding system shown in FIG. 1, FIG. 2B is a result thereof, and FIG. 2C is a contact voltage distribution diagram of the orthogonal lattice mesh grounding system according to FIG. 1.

3 is a schematic plan view of an oblique mesh grounding system according to a first embodiment of the present invention.

4A is a design specification of the diagonal mesh grounding system shown in FIG. 3, FIG. 4B is a resultant value, and FIG. 4C is a contact voltage distribution diagram of the diagonal mesh grounding system in FIG. 3.

5A is a schematic plan view of an oblique mesh grounding system according to a second embodiment of the present invention, and FIG. 5B is a contact voltage distribution diagram of an evenly spaced diagonal mesh grounding system.

6A is a contact voltage distribution diagram according to the related art 2, and FIG. 6B is a contact voltage distribution diagram according to the third embodiment of the present invention.

7A is a contact voltage distribution diagram according to the related art 3, and FIG. 7B is a contact voltage distribution diagram according to the fourth embodiment of the present invention.

FIG. 8A is a contact voltage distribution diagram according to the prior art 4, and FIG. 8B is a contact voltage distribution diagram according to the fifth embodiment of the present invention.

9A is a contact voltage distribution diagram according to the prior art 5, and FIG. 9B is a contact voltage distribution diagram according to the sixth embodiment of the present invention.

10A is a contact voltage distribution diagram according to the related art 6, and FIG. 10B is a contact voltage distribution diagram according to the seventh embodiment of the present invention.

11A is a contact voltage distribution diagram according to an eighth embodiment of the present invention, and FIG. 11B is a contact voltage distribution diagram according to a ninth embodiment of the present invention.

12A is a contact voltage distribution diagram according to the prior art, FIG. 12B is a contact voltage distribution diagram according to a tenth embodiment of the present invention, and FIG. 12C is a contact voltage distribution diagram according to an eleventh embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

10: first outer ground conductor

20: second outer ground conductor

30: first internal ground conductor

40: second internal ground conductor

50: outer ground network

60: internal grounding network

Claims (7)

An outer pair consisting of a pair of first outer ground conductors buried apart from each other in the horizontal direction, and a pair of second outer ground conductors buried apart from each other in the longitudinal direction and connected to ends of the first outer ground conductors respectively; Grounding network; A plurality of first inner ground conductors disposed to be inclined spaced apart from each other at a predetermined angle with respect to the first outer ground conductor; and a plurality of first inner ground conductors disposed to be inclined apart from each other so as to be symmetrical with the plurality of first inner ground conductors; An internal grounding network composed of a plurality of second internal grounding conductors intersected with the grounding conductor, Diagonal mesh grounding system, characterized in that both ends of each of said first inner ground conductor and said second inner ground conductor are connected to said outer ground network. The method of claim 1, The plurality of first inner ground conductors are disposed to decrease from each other toward the outer region from the center region of the outer ground network, and the plurality of second inner ground conductors are disposed from the center region of the outer ground network to the outer region. Diagonal mesh grounding system characterized in that the mutually gradually spaced apart distance. The method of claim 1, And wherein the plurality of first inner ground conductors are disposed at equal intervals, and the plurality of second inner ground conductors are disposed at equal intervals. The method according to any one of claims 1 to 3, The outer mesh is a diagonal mesh grounding system, characterized in that the square or rectangular. The method according to any one of claims 1 to 3, Diagonal mesh grounding system, characterized in that the outer ground network is L-shaped or T-shaped. The method according to any one of claims 1 to 3, The plurality of first inner ground conductors is an odd number, at least one of the plurality of first inner ground conductors has at least one end connected to a vertex of the outer ground network, Wherein the plurality of second inner ground conductors is an odd number, and at least one of the plurality of second inner ground conductors has at least one end connected to a vertex of the outer ground network. An outer pair consisting of a pair of first outer ground conductors that are spaced apart from each other in a horizontal direction, and a pair of second outer ground conductors that are spaced apart from each other in a vertical direction and connected to ends of the first outer ground conductors, respectively; Embedding the grounding network; Connecting both ends of the plurality of first inner ground conductors spaced apart from each other at an angle with respect to the first outer ground conductor at a predetermined angle to the outer ground network; And Connecting a plurality of second inner ground conductors disposed to be spaced apart from one another so as to be symmetrical with the plurality of first inner ground conductors so as to intersect with the plurality of first inner ground conductors, and connecting both ends of the plurality of second inner ground conductors to each other; Installing a diagonal mesh grounding system comprising the step of connecting to the outer ground.

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