KR101018108B1 - Printed Circuit Board and Camera Module Having The Same - Google Patents

Abstract

The present invention relates to a circuit board and a camera module package having the same, which can effectively prevent the camera module from being affected by the high temperature heat by effectively dissipating the high temperature heat emitted from the light emitting device module for illumination.

The present invention includes a lower layer having a circuit pattern and a lower lead pad; An upper layer stacked on the lower layer and having a pair of upper lead pads for electrical connection with a light emitting device module mounted on an upper surface thereof; A plurality of via holes electrically connecting the lower lead pad and the upper lead pad; And a coverlay covering the lower surface of the lower layer and the upper surface of the upper layer to protect the circuit pattern, wherein the via hole integrally penetrates the upper lead pad and the lower lead pad together with the upper layer and the lower layer. Thus, the heat generated from the light emitting device module is conducted to be conducted to the lower lead pad through the via hole to be discharged.

Light Emitting Device, Camera Module, Circuit Board, Via Hole

Description

Printed Circuit Board and Camera Module Having The Same}

The present invention relates to a circuit board and a camera module package having the same, and more particularly, a circuit capable of preventing a camera module from being affected by high temperature heat by effectively dissipating high temperature heat emitted from a light emitting device module. It relates to a substrate and a camera module package having the same.

As the camera module is small, it is applied to portable mobile communication devices such as camera phones, PDAs, smartphones, and various IT devices. Recently, as these devices become smaller and slimmer, the size of the camera module itself is becoming smaller and smaller. .

The camera module receives an image of an external subject through a lens barrel composed of a plurality of lenses, and then condenses the image of the object through an image sensor such as a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). Data is stored on a memory in the device, and the stored data is output as an image through a display medium such as an LCD or a PC monitor in the device.

Meanwhile, in order to meet various demands of consumers, it is essential to attach lighting having a flash function so that shooting in a dark place or at night is necessary. For this, a camera module package additionally equipped with a light emitting device (LED) module is provided. It is being released.

Such a light emitting device is a diode that emits excess energy as light when electrons or holes injected by using a p-n junction structure of a semiconductor are recombined, and have a great advantage in terms of high brightness, low power consumption, and lifespan.

However, with the miniaturization of the product, the structure of the camera module package also needs to be more compact, and therefore, the camera module and the light emitting device module should be disposed adjacent to each other in design.

In this case, a high temperature heat generated from the light emitting device module is transmitted to the camera module to raise the temperature of the image sensor, causing an operation error or outputting an undesired image to cause a quality defect.

Therefore, while miniaturization of the camera module package is required, development of a technology for designing the camera module so as not to be affected by the high temperature heat generated in the light emitting device module is required.

The present invention is to solve the above problems of the prior art, the object of which is to efficiently discharge the high temperature heat emitted from the light emitting device module for the adjacent camera module is not affected, thereby miniaturizing the camera module package The present invention provides a circuit board and a camera module package having the same.

A circuit board according to an embodiment of the present invention includes a lower layer having a circuit pattern and a lower lead pad; An upper layer stacked on the lower layer and having a pair of upper lead pads for electrical connection with a light emitting device module mounted on an upper surface thereof; A plurality of via holes electrically connecting the lower lead pad and the upper lead pad; And a coverlay covering the lower surface of the lower layer and the upper surface of the upper layer to protect the circuit pattern, wherein the via hole integrally penetrates the upper lead pad and the lower lead pad together with the upper layer and the lower layer. Thus, the heat generated from the light emitting device module may be conducted to the lower lead pad through the via hole to be discharged.

In addition, the coverlay is a photo solder resist (PSR) and may cover the outer surface of the lower layer and the upper layer except for the upper lead pad and the lower lead pad so that the upper lead pad and the lower lead pad are exposed to the outside. have.

The lower lead pad may have the same electrode as the electrode of the upper lead pad provided at a position opposite to the lower lead pad of the pair of upper lead pads.

In addition, the via hole may be formed only through the lower lead pad and the upper lead pad provided at a position facing the lower lead pad.

The apparatus may further include a thermally conductive film covering the cover lay and the lower lead pad provided on the lower surface of the lower layer so that heat conducted to the lower lead pad through the via hole is distributed along the lower surface of the lower layer. Can be.

In addition, the lower layer may further include a metal stiffener provided on the lower surface to provide rigidity to the lower layer and dissipate heat conducted to the lower lead pad.

On the other hand, the camera module package having a circuit board according to an embodiment of the present invention includes a light emitting device module having a light emitting device chip to emit light when the power is applied; A camera module for detecting an image of a subject received through a lens barrel having a lens with an image sensor; And a substrate part including a first circuit board on which the light emitting device module is mounted, a second circuit board on which the camera module is mounted, and a connection board electrically connecting the first circuit board and the second circuit board. The first circuit board includes an upper layer including a pair of upper lead pads electrically connected to the light emitting device module, and a stack structure of a lower layer including lower lead pads. Heat of the light emitting device module may be discharged through the plurality of via holes electrically connecting the lead pads.

In addition, the via hole integrally penetrates the upper lead pad and the lower lead pad together with the upper layer and the lower layer, so that heat generated in the light emitting device module is conducted to the lower lead pad through the via hole to be discharged. Can be.

In addition, the via hole may be formed only through the lower lead pad and the upper lead pad provided at a position facing the lower lead pad.

The lower lead pad may have the same electrode as the electrode of the upper lead pad provided at a position opposite to the lower lead pad of the pair of upper lead pads.

In addition, the first circuit board further includes a coverlay to cover the lower surface of the lower layer and the upper surface of the upper layer to protect the circuit pattern, wherein the coverlay is exposed to the upper lead pad and the lower lead pad to the outside The outer surfaces of the lower layer and the upper layer may be covered, except for the upper lead pad and the lower lead pad.

The first circuit board may further include a thermal conductive film covering the lower lead pad provided on the lower surface of the lower layer such that heat conducted to the lower lead pad through the via hole is distributed along the lower surface of the lower layer. It may further include.

The apparatus may further include a metal stiffener provided on the lower surfaces of the first circuit board and the second circuit board to provide rigidity.

The circuit board and the camera module package having the same according to the present invention efficiently discharge high temperature heat emitted from the light emitting device module so that the camera module is not affected by heat, and thus the proximity design of the light emitting device module and the camera module It is possible to achieve the miniaturization of the camera module package by removing the design constraints.

In addition, since the image sensor of the camera module is not affected by heat, an operation error is prevented and product reliability is improved.

A detailed description of an embodiment of a circuit board and a camera module having the same according to the present invention will be described with reference to the drawings.

1 is a perspective view schematically showing a circuit board according to an embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing a state in which a light emitting device module is mounted on the circuit board shown in FIG. 1, and FIG. FIG. 3B is a cross-sectional view schematically illustrating a stacked state of an upper layer and a lower layer including an upper lead pad and a lower lead pad in the circuit board, and FIG. 3B is a cross-sectional view schematically illustrating a through hole formed in FIG. 3A. , b is a perspective view schematically showing an upper layer and a lower layer having a coverlay.

1 to 4, the circuit board 100 according to the embodiment of the present invention includes a lower layer 101, an upper layer 102, a plurality of via holes 120, and a coverlay 130. It is configured by.

The lower layer 101 and the upper layer 102 are both made of a resin material FR4, and form a rigid PCB, a rigid-flexible PCB, or a flexible PCB through lamination.

Circuit patterns (not shown) and lower lead pads 111 are provided on the lower layer 101, respectively. The lower lead pad 111 is a metal connecting terminal member for supplying power to a light emitting device module, which will be described later, and is patterned on the lower layer 101 through a screen printing method.

The upper layer 102 is stacked on the lower layer 101, and a pair of upper lead pads 112 for electrical connection with the light emitting device module 10 are disposed on an upper surface on which the light emitting device module 10 is mounted. Is provided.

The upper lead pads 112 are electrically connected to the lead wires 13 of the light emitting device module 10 to be mounted through solder and are provided in pairs to have different electrodes. A circuit pattern (not shown) is formed around the upper lead pad 112.

That is, unlike a single lower lead pad 111 in the lower layer 101, a pair of upper lead pads 112 having different polarities is provided on the upper layer 102. 111 has the same electrode as the electrode of the upper lead pad 112b provided at a position facing the lower lead pad 111 among the pair of upper lead pads.

Accordingly, as shown in FIGS. 3A and 3B, the lower lead pads 111 and the upper lead pads 112b having the same electrode as the lower lead pads 111 correspond to each other with the upper and lower layers interposed therebetween. It is disposed on.

Here, when the lower lead pad 111 and the upper lead pad 112b having the same electrode are both positive (+), the other upper lead pad 112a has a negative electrode (−), opposite to each other. It may have an electrode of.

The surface of the upper lead pad 112 may further include a gold plated layer 122 to strengthen the connection with the solder.

The upper lead pad 112 and the lower lead pad 111 are electrically connected to each other through a plurality of via holes 120 passing through the stacked upper layer 102 and the lower layer 101.

In this case, as shown in FIG. 3B, the via hole 120 is formed through the upper lead pad 112 and the lower lead pad 111 together with the upper layer 102 and the lower layer 101. It is formed through only the lower lead pad 111 and the upper lead pad 112b provided at a position opposite to the lower lead pad 111.

The via hole 120 is plated 121 with an inner circumferential surface of copper or copper, and thus electrically connects the upper lead pad 112 and the lower lead pad 111 to the upper lead pad 112. The high temperature heat generated by the mounted light emitting device module 10 passes through the via hole 120 and is conducted to the lower lead pad 111 so as to be discharged.

The coverlay 130 covers the lower surface of the lower layer 101 and the upper surface of the upper layer 102 to protect the circuit pattern exposed to the outside.

In particular, the cover lay 130 has a lower portion except for the lower and upper lead pads 111 and 112 so that the lower and upper lead pads 111 and 112 are exposed to the outside for smooth heat dissipation as shown in FIGS. 4A and 4B. The outer surface of the layer 101 and the upper layer 102 is provided to cover.

The coverlay 130 is preferably a photo solder resist (PSR).

Meanwhile, as shown in FIGS. 2 and 5, the heat conductive to the lower lead pad 111 through the via hole 130 is distributed along the lower surface of the lower layer 101. It further includes a thermal conductive film 140 that integrally covers the cover lay 130 and the lower lead pad 111 provided on the lower surface.

Therefore, the heat conducting to the lower lead pad 111 is concentrated only in a predetermined region, thereby preventing deformation due to thermal stress, and spreading in a wider range.

Further, a metal stiffener 150 provided on the lower surface of the lower layer 101 is further provided to provide rigidity to the lower layer 101 and to increase the efficiency of dissipating heat conducted to the lower lead pad. It may include.

The metal reinforcing material 150 is provided on the lowermost surface of the lower layer 101 in contact with the thermal conductive film 140 so that heat can be released to the outside more quickly.

The metal reinforcement 150 may be omitted when the lower layer 101 and the upper layer 102 are rigid-flexible PCBs or rigid PCBs.

On the other hand, a camera module package having a circuit board according to an embodiment of the present invention will be described with reference to FIG.

6A and 6B are cross-sectional views and plan views schematically illustrating a camera module package including a circuit board according to an exemplary embodiment of the present invention.

As shown in FIGS. 6A and 6B, a camera module package 1 including a circuit board according to an embodiment of the present invention includes a light emitting device module 10, a camera module 20, and a substrate portion 100 ′. .

The light emitting device module 10 performs a flash light or an illumination function and includes a light emitting device chip 12 inside the main body 11 to emit light when the power is applied, and a pair of lead wires having different electrodes for this purpose. 13) is provided exposed to the outside.

The pair of lead wires 13 are electrically connected to the lead pads on the substrate portion 100 'through solder.

The camera module 20 accommodates a lens barrel 22, an image sensor 23, an optical filter 24, etc. having a plurality of lenses L in a housing 21 formed by injection molding a plastic resin. Image of the subject.

The image of the subject photographed through the lens barrel 22 is collected by the image sensor 23, converted into an electrical signal, and then transmitted to an external display device (not shown).

In particular, the camera module package 1 according to the present invention includes the light emitting device module 10 as a component so that photographing is possible even in a dark place or at night.

The substrate unit 100 ′ includes a first circuit board 100a on which the light emitting device module 10 is mounted, a second circuit board 100b on which the camera module 20 is mounted, and the first circuit board 100a. ) And a connecting board 100c connecting the second circuit board 100b.

The first circuit board 100a, the second circuit board 100b, and the connection board 100c may all be made of a flexible PCB or a rigid-flexible PCB. Only the first circuit board and the second circuit board are rigid PCBs. It may be made of.

Alternatively, the first circuit board 100a, the second circuit board 100b, and the connection board 100c may be formed of one single circuit board.

In the case of the first circuit board 100a on which the light emitting device module 10 is mounted, the light emitting device module 10 has a structure for dissipating heat emitted from the light emitting device module 10. It is substantially the same as the structure of the substrate 100.

Therefore, the same components will be described using the same identification numbers, and detailed drawings will be omitted.

That is, the first circuit board 100a includes an upper layer 102 having a pair of upper lead pads 112 that make electrical connection with the light emitting device module 10, and a lower lead pad 111. The lower layer 101 is laminated, and emits heat of the light emitting device module 10 through a plurality of via holes 120 electrically connecting the upper lead pad 112 and the lower lead pad 111. .

The lower lead pad 111 has the same electrode as the electrode of the upper lead pad 112b provided at a position facing the lower lead pad among the pair of upper lead pads 112, and the via hole 120 has the The upper lead pad 112 and the lower lead pad 111 are integrally penetrated together with the upper layer 102 and the lower layer 101, and are provided at positions opposite to the lower lead pad 111 and the lower lead pad. Only through the upper lead pad 112b is to be formed.

Therefore, heat generated in the light emitting device module 10 is conducted to the lower lead pad 111 through the via hole 120 to be discharged to the outside.

The first circuit board 100a covers the lower surface of the lower layer 101 and the upper surface of the upper layer 102 through the coverlay 130 to protect the exposed circuit patterns. The upper lead pads 111 and 112 cover the outer surfaces of the lower layer 101 and the upper layer 102 except for the lead pad so that the upper lead pads 111 and 112 are exposed to the outside.

In addition, the first circuit board 100a may be configured such that heat transmitted to the lower lead pad 111 through the via hole 120 is distributed along the lower surface of the lower layer 101. It is preferable to further include a thermal conductive film 140 covering the lower lead pad 111 provided on the lower surface, it is provided on the lower surface of the first circuit board (100a) and the second circuit board (100b). It may further include a metal stiffener 150 to provide rigidity.

The second circuit board 100b is connected to the first circuit board 100a through a connection board 100c, and the connection board 100c is a flexible PCB so as to be easily mounted in a terminal (not shown). It is preferable to make.

As described above, the circuit board and the camera module package having the same according to the present invention transfer the high temperature heat radiated from the light emitting device module to the lower surface of the substrate through a plurality of via holes to release the heat effect of the camera module. It has an excellent effect of increasing design freedom while improving reliability.

1 is a perspective view schematically showing a circuit board according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view schematically illustrating a state in which a light emitting device module is mounted on a circuit board shown in FIG. 1.

3A is a cross-sectional view schematically illustrating a stacked state of an upper layer and a lower layer including an upper lead pad and a lower lead pad in the circuit board shown in FIG. 1.

FIG. 3B is a cross-sectional view schematically illustrating a through hole formed in FIG. 3A.

4A and 4B are perspective views schematically showing an upper layer and a lower layer having a coverlay.

FIG. 5 is an enlarged cross-sectional view of region A in FIG. 2.

6A and 6B are cross-sectional views and a plan view schematically illustrating a camera module package having a circuit board according to an exemplary embodiment of the present invention.

Claims (13)

A lower layer having a circuit pattern and a lower lead pad; An upper layer stacked on the lower layer and having a pair of upper lead pads for electrical connection with a light emitting device module mounted on an upper surface thereof; The lower lead pad and the upper lead pad are electrically connected to each other, and the upper lead pad and the lower lead pad are integrally formed together with the upper layer and the lower layer so that heat generated from the light emitting device module is conducted to the lower lead pad. A plurality of via holes formed through the holes; And And a coverlay covering the lower surface of the lower layer and the upper surface of the upper layer to protect the circuit pattern. The cover lay is a photo solder resist (PSR), and covers the outer surfaces of the lower layer and the upper layer except for the upper lead pad and the lower lead pad so that the upper lead pad and the lower lead pad are exposed to the outside. Circuit board. delete The method of claim 1, And the lower lead pad has the same electrode as the electrode of the upper lead pad provided at a position facing the lower lead pad among the pair of upper lead pads. The method of claim 1, And the via hole penetrates only the lower lead pad and an upper lead pad provided at a position facing the lower lead pad. The method of claim 1, And a thermally conductive film covering the cover lay and the lower lead pad provided on the lower surface of the lower layer so that heat conducted to the lower lead pad through the via hole is distributed along the lower surface of the lower layer. Circuit board. 6. The method according to claim 1 or 5, And a metal stiffener provided on a lower surface of the lower layer to provide rigidity to the lower layer and dissipating heat conducted to the lower lead pad. A light emitting device module having a light emitting device chip and emitting light when power is applied; A camera module for detecting an image of a subject received through a lens barrel having a lens with an image sensor; And a substrate part including a first circuit board on which the light emitting device module is mounted, a second circuit board on which the camera module is mounted, and a connection board electrically connecting the first circuit board and the second circuit board. , The first circuit board has a stack structure of an upper layer including a pair of upper lead pads electrically connected to the light emitting device module, and a lower layer including lower lead pads. Emits heat of the light emitting device module through a plurality of via holes electrically connecting the The via hole integrally penetrates the upper lead pad and the lower lead pad together with the upper layer and the lower layer, and heat generated from the light emitting device module is conducted to the lower lead pad through the via hole to be discharged. The first circuit board further includes a cover lay that covers a lower surface of the lower layer and an upper surface of the upper layer to protect a circuit pattern, wherein the cover lay is configured to expose the upper lead pad and the lower lead pad to the outside. A camera module package comprising an outer surface of the lower layer and the upper layer except for an upper lead pad and a lower lead pad. delete The method of claim 7, wherein The via hole is a camera module package, characterized in that the through-hole formed only in the lower lead pad and the upper lead pad provided in a position facing the lower lead pad. The method of claim 7, wherein And the lower lead pad has the same electrode as the electrode of the upper lead pad provided at a position facing the lower lead pad among the pair of upper lead pads. delete The method of claim 7, wherein The first circuit board further includes a thermal conductive film covering the lower lead pad provided on the lower surface of the lower layer so that heat conducted to the lower lead pad through the via hole is distributed along the lower surface of the lower layer. Camera module package, characterized in that. The method of claim 7, wherein And a metal stiffener provided on the lower surfaces of the first circuit board and the second circuit board to provide rigidity.

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