KR101009100B1 - 플라즈마 처리장치용 샤워헤드 - Google Patents
플라즈마 처리장치용 샤워헤드 Download PDFInfo
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- KR101009100B1 KR101009100B1 KR1020080114427A KR20080114427A KR101009100B1 KR 101009100 B1 KR101009100 B1 KR 101009100B1 KR 1020080114427 A KR1020080114427 A KR 1020080114427A KR 20080114427 A KR20080114427 A KR 20080114427A KR 101009100 B1 KR101009100 B1 KR 101009100B1
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- shower head
- showerhead
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- 238000005229 chemical vapour deposition Methods 0.000 title description 3
- 238000002347 injection Methods 0.000 claims abstract description 52
- 239000007924 injection Substances 0.000 claims abstract description 52
- 238000000638 solvent extraction Methods 0.000 claims abstract 2
- 239000007789 gas Substances 0.000 claims description 153
- 238000000034 method Methods 0.000 claims description 24
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 35
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000008021 deposition Effects 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (13)
- 플라즈마 처리장치용 샤워헤드에 있어서,상기 샤워헤드 내부 공간을 구획하고 서로 반대 방향으로 소스가스를 유동시키는 유로를 형성하는 복수개의 가스유로; 및상기 각 가스유로로 소스가스를 주입하는 주입구;를 포함하는 플라즈마 처리장치용 샤워헤드.
- 제1항에 있어서,상기 샤워헤드는 사각형 형태를 갖고,상기 가스유로는 상기 샤워헤드의 일측에서 시작하여 상기 샤워헤드의 중앙 부분에서 끝나는 사각 나선 나선형태를 갖는 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 제2항에 있어서,2개의 가스유로가 형성되고, 제1 가스유로는 상기 샤워헤드의 측부인 나선의 시작 부분에 상기 주입구가 형성되고 제2 가스유로는 상기 샤워헤드의 중앙 부분인 나선의 끝 부분에 상기 주입구가 형성된 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 제3항에 있어서,상기 각 가스유로에서 상기 소스가스의 유동방향을 따라 상기 주입구가 형성된 부분과 반대쪽 유출단부에는 상기 소스가스를 상기 샤워헤드 외부로 배출시키는 배기부가 더 구비된 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 제1항에 있어서,상기 샤워헤드는 제1 플레이트와 분사홀이 형성된 제2 플레이트가 결합되어 형성되며,상기 제1 플레이트의 일부가 요입되어 상기 제2 플레이트에 고정된 결합부가 형성된 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 제5항에 있어서,상기 결합부는 상기 가스유로를 구획하도록 사각 나선형태로 형성되며 상기 각 가스유로가 독립된 유로를 형성하도록 기밀성이 높게 형성된 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 제5항에 있어서,상기 결합부는 상기 제1 플레이트와 상기 제2 플레이트가 용접 결합되는 메탈실(metal seal)인 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 플라즈마 처리장치용 샤워헤드에 있어서,상기 샤워헤드를 분할하는 복수개의 셀; 및상기 각 셀에 구비되어 상기 셀 내부로 소스가스를 주입하는 주입구;를 포함하고,서로 이웃하는 셀 사이의 소스가스의 유동 방향이 서로 반대방향으로 형성되도록 상기 주입구가 형성된 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 제8항에 있어서,상기 샤워헤드는 사각형 형태를 갖고,상기 셀은 서로 맞물리는 'ㄱ'자와 'ㄴ'자 형태를 갖는 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 제8항에 있어서,상기 주입구는 상기 샤워헤드의 대각선을 따라 형성된 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 플라즈마 처리장치용 샤워헤드에 있어서,상기 샤워헤드를 분할하는 복수개의 셀;상기 셀 내부를 분할하고 서로 반대 방향으로 소스가스를 유동시키는 유로를 형성하는 복수개의 분할유로; 및상기 각 분할유로에 구비되어 상기 분할유로 내부로 소스가스를 주입하는 주입구;를 포함하는 플라즈마 처리장치용 샤워헤드.
- 제11항에 있어서,상기 샤워헤드는 사각형 형태를 갖고,상기 셀은 서로 맞물리는 'ㄱ'자와 'ㄴ'자 형태를 갖고, 상기 분할유로는 상기 셀을 이등분하도록 형성된 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
- 제12항에 있어서,상기 주입구는 상기 분할유로의 각 단부에 형성되되, 상기 샤워헤드의 대각선 방향을 따라 형성된 것을 특징으로 하는 플라즈마 처리장치용 샤워헤드.
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KR20100055617A KR20100055617A (ko) | 2010-05-27 |
KR101009100B1 true KR101009100B1 (ko) | 2011-01-18 |
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TWI848974B (zh) * | 2018-09-14 | 2024-07-21 | 美商應用材料股份有限公司 | 用於多流前驅物配分劑量的裝置 |
WO2020132208A1 (en) | 2018-12-19 | 2020-06-25 | Applied Materials, Inc. | 3d nand structures with decreased pitch |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0855802A (ja) * | 1994-08-16 | 1996-02-27 | Fujitsu Ltd | 気相処理装置及び気相処理方法 |
KR20010065193A (ko) * | 1999-12-29 | 2001-07-11 | 박종섭 | 듀플럭스 존 샤워 헤드 및 이를 적용하는 케미커리인핸스드 화학기상증착 장비 |
JP2001358135A (ja) | 2000-06-14 | 2001-12-26 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0855802A (ja) * | 1994-08-16 | 1996-02-27 | Fujitsu Ltd | 気相処理装置及び気相処理方法 |
KR20010065193A (ko) * | 1999-12-29 | 2001-07-11 | 박종섭 | 듀플럭스 존 샤워 헤드 및 이를 적용하는 케미커리인핸스드 화학기상증착 장비 |
JP2001358135A (ja) | 2000-06-14 | 2001-12-26 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
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