KR100995751B1 - Glass structure attached particle cutting off heat - Google Patents

Abstract

It provides a glass structure that attaches heat-blocking particles to the surface that can utilize the characteristics of the glass itself and can block light such as infrared rays. The structure includes heat-transmitting particles supported on a porous carrier having fine pores attached to a substrate that is changed to a liquid state while the glass structure does not show a constant melting point when temperature is applied and the viscosity decreases.

Glass structures, thermal barriers, porous carriers

Description

Glass structure attached particle cutting off heat}

The present invention relates to a glass structure to which the thermal barrier particles are attached, and more particularly, to a glass structure to which the thermal barrier particles such as ITO and ATO are attached to the surface.

Glass structures are one of the important materials for articles used throughout our lives. The glass structure is excellent in durability, chemically stable, and has no harm to human body. In addition, the transparent characteristics of the glass structure can be utilized in many fields such as interior and exterior materials of buildings, vehicles, medical equipment, tableware, packaging containers. In particular, the use of heat-resistant glass structures that are harmless to the human body in recent well-being hot air has been increasing.

Thermal barrier particles are infrared rays blocking effect to reduce the solar energy flowing into the window or car, and to block the incoming heat applied to other sun visors, containers, etc. The thermal barrier particles include tin oxide, antimony oxide, indium oxide doped with tin (hereinafter referred to as ITO) and tin oxide doped with antimony (hereinafter referred to as ATO).

Therefore, when the thermal barrier particles are attached to the surface of the glass structure described above, the glass structure can exhibit a light blocking effect such as infrared rays. However, glass has a smooth surface, high hardness, and brittleness, making it difficult to directly attach thermal barrier particles. In addition to the direct attachment method, a method of coating the surface of the glass structure by using a binder may be considered, but this method makes the coating layer difficult to utilize the characteristics of the glass itself, and the thermal barrier particles are buried in the binder layer to prevent the thermal barrier. In addition, the binder resin is not organic enough, there is a problem that the thermal barrier particles are decomposed to the binder.

Therefore, the technical problem to be achieved by the present invention is to provide a glass structure that is attached to the surface of the thermal barrier particles that can take advantage of the characteristics of the glass itself, and can block the light, such as infrared.

The glass structure of the present invention for achieving the above technical problem is a substrate that is changed to a liquid state while the viscosity is reduced without a certain melting point when the temperature is applied, a porous carrier having a fine pores attached to the substrate and supported on the porous carrier Contains thermal barrier particles. In this case, the thermal barrier particles may be any one selected from tin oxide, antimony oxide, tin-doped indium oxide (hereinafter referred to as ITO), and antimony-doped tin oxide (hereinafter referred to as ATO), or a combination thereof.

In the glass structure of the present invention, the base material may have any one selected from flat plates having flat surfaces, molds appearing in the shape of gold molds, porous shapes having integral cylindrical shapes, or porous shapes having integral pores, or the shapes thereof. It can be made in combination.

In a preferred glass structure of the present invention, the carrier may be attached to the surface of the substrate or embedded in a portion of the substrate and the remainder may be exposed to the surface of the substrate.

According to the glass structure of the present invention, the thermal barrier particles are attached to the surface of the glass structure in a state supported on the carrier to maintain the properties of the glass as it is, the thermal barrier particles are exposed to the outside so that they can react directly with external materials By securing the surface area, the function of the thermal barrier particles can be efficiently exhibited. Therefore, the present invention can be applied to all glass structures aimed at the function of thermal barrier particles.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. Embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

Embodiments of the present invention will propose a structure and a method of implementing the same, the thermal barrier particles are supported on a carrier (carrier) attached to the surface of the glass structure. In addition, it describes a method of using the glass structure to which the thermal barrier particles are attached.

1 is a cross-sectional view for conceptually explaining a glass structure according to the present invention.

Referring to FIG. 1, the glass structure of the present invention includes a substrate 10, a carrier 20 attached to the surface of the substrate 10, and thermal barrier particles 30 supported on the carrier 20. The thermal barrier particle 30 is supported on the carrier 20 by ion exchange method or wet method. The carrier 20 carrying the thermal barrier particles 30 is bonded to the surface of the substrate 10 by heat, and a portion thereof is buried in the substrate 10, and a portion thereof may be exposed out of the substrate 10.

The base material 10 constituting the present invention is a hard material which is generally fragile, and has high quality at room temperature, so that there is no absorbency, water permeability, air permeability, and the like. However, when it reaches a certain temperature range by applying heat, it becomes a soft material such as rubber, and if it keeps applying heat, it may be in a fluid-like state. At this time, the base material 10 is reduced in viscosity at a unique temperature according to the kind and changes smoothly, the temperature at this time is called the glass transition temperature.

Typically, the substrate 10 may be applied to glass, and the general glass is composed of a mesh forming material constituting the tissue and a mesh tree oxide, which is an auxiliary material showing the special properties of the glass in combination therewith. In this case, the silicate glass, borosilicate glass, phosphate glass, etc. are divided according to the network forming material, and silicate glass is the most widely used. In addition, the mesh tree oxide is a substance that imparts properties such as solubility, coloring, transparency, durability and conductivity of the glass, and corresponds to an oxide of an alkali metal such as sodium and potassium or an alkaline earth metal such as magnesium, calcium and barium. For example, soda (Na ₂ O), lime (CaO), magnesium oxide (MgO) and the like. In addition, lead oxides, aluminum oxides such as alumina (Al ₂ O ₃ ), etc., are also used as mesh oxides.

The carrier 20 is preferably made of a ceramic material such as zeolite, silica, alumina, zirconium phosphate, and may be a porous metal in some cases. That is, the porous material may be used as the carrier 20, and may support the thermal barrier particles 30 applied to the present invention in the pupil formed in the carrier 20.

The thermal barrier particle 30 is a particle having an infrared ray blocking effect to reduce solar energy introduced into a window or a car, and block heat introduced by applying to other sun visor plates and containers. The thermal barrier particles 30 include tin oxide, antimony oxide, tin-doped indium oxide (hereinafter referred to as ITO), and antimony-doped tin oxide (hereinafter referred to as ATO).

The thermal barrier particle 30 may have a fine powder shape and vary the size of the particle according to the type of synthetic resin to be attached and the conditions to be attached thereto. Even nano-sized particles can be applied under appropriate conditions. The thermal barrier particles 30 in powder form may be prepared by conventional methods.

2 is a cross-sectional view showing a method of manufacturing a glass structure of the present invention. The method proposed here is to attach the carrier 20 carrying the thermal barrier particles 30 to the flat substrate 130 which is a glass structure. In this case, the glass structure refers to FIG. 1.

In general, when looking at the glass manufacturing process, the raw materials suitable for glass molding are first compounded in a certain ratio, and the sufficiently mixed compound raw materials are heated to a temperature of 1500 ° C. or more to melt the moldable forms. Next, the raw material melted appropriately for molding the product is divided by a predetermined weight and molded into the product using various molding machines. At this time, when the melted blended raw material is quenched, the structure becomes irregular, but the glass is hard but liquid.

As a result, the quenched molded article has an annealing process. That is, the quenched glass molding is heated again to a constant temperature, which is an annealing point, and then the furnace is maintained. ) Can be cooled to eliminate uneven structure. The glass that has undergone the slow cooling process has transparency and strong strength. Processes applicable to the scope of the present invention may be various in addition to those described above.

Referring to FIG. 2, the substrate 130 is placed on the roller 140 disposed at regular intervals on the support 150, and is moved or stopped. Such a device may be arranged in a furnace for heating or cooling the substrate, the glass. In this case, the glass, which is the substrate 130, is divided into a soft layer 132 having flexibility and a hard layer 131 having no flexibility while being properly heated. In other words, the glass is gradually reduced in viscosity from the portion to which direct heat is applied, thereby providing flexibility. Therefore, the soft layer 132 having such flexibility becomes a portion to which the carrier 20 of the present invention can adhere to glass. In particular, since the carrier 20 is a porous material, it may be easily combined with the soft layer 132.

At a predetermined distance from the substrate 130, an apparatus capable of spraying and attaching the carrier 20 carrying the thermal barrier particles 30 is disposed. The device is a storage unit 110 for storing the carrier 20 on which the thermal barrier particles 30 are loaded, a pressurizing unit for applying pressure to the carrier 20 stored in the storage unit 110 to push toward the substrate 130 ( 100) and the injection unit 120 for injecting the carrier 20 to the substrate (130).

The soft layer 132 is embedded with a carrier 20 carrying the thermal barrier particles 30 injected by the pressure of the device, and then the carrier 20 is bonded to the substrate 130 in a predetermined condition. In this case, the injection unit 120 may move or rotate up, down, left, and right to supply the carrier 20 at an appropriate density according to the size, shape, or use of the flat substrate 130.

The carrier 20 embedded in the soft layer 132 is bonded to the soft layer 132 by heat. In other words, since the carrier 20 is a ceramic material such as zeolite, silica, alumina, zirconium phosphate, the carrier 20 is easily bonded by heat with the same ceramic material. Specifically, the carrier 20 is melted by heat while being in contact with the heated soft layer 132 to be fused with the soft layer 132, or a part of the soft layer 132 is fused by entering into the cavity of the carrier 20 to be fused. Can be.

The thickness of the soft layer 132 may vary depending on the type of the glass and the carrier and the pressure applied to the pressing unit 100. For example, if the combination of the carrier 20 and the soft layer 132 is easy to combine, the thickness of the soft layer 132 can be reduced. On the contrary, if the combination is rather difficult, the soft layer 132 can be thickened. The binding force can be increased. In addition, in order to maximize the ratio of the thermal barrier particles 30 included in the carrier 20, it is preferable to reduce the depth of the carrier 20 embedded in the soft layer 132.

In some cases, the carrier 20 of the present invention may be embedded in the soft layer 132 by free fall by its own weight without the pressing portion 100. That is, the carrier 20 can be combined with the soft layer even with a simple structure that does not include the pressing unit 100. In addition, the substrate 10 applied to the present invention is presented only the substrate 130 of the flat type, it is possible to apply the curved type or all possible forms according to the use of the glass structure in the scope of the present invention.

Hereinafter, a method of applying the glass structure of the present invention will be described with an example. Here, only a part of the field of application of the glass structure of the present invention is illustrated, so it may be applied to various fields within the scope of the present invention.

Figure 3 is a perspective view showing an example of the field of application of the glass structure of the present invention.

The application field presented here is to attach the carrier 20 carrying the thermal barrier particles 30 to the substrate 200 for a mold. At this time, the description of the device for supplying the glass structure and the carrier 20 refer to FIGS.

According to FIG. 3, the substrate 200 for a mold may be applied to a process of manufacturing a container by fixing the substrate 200 by a separate mold 300 and bonding the substrate 200 by heat. The mold substrate 200 is divided into a hard layer 210 and a soft layer 212 as described above.

In addition, the manner in which the carrier 20 on which the thermal barrier particles 30 are supported is attached to the mold substrate 200 which is a glass structure is the same as that of the flat substrate (130 of FIG. 2). At this time, the carrier 20 adjusts the pressure of the pressurizing part 100 of the device to be sprayed, and moves or rotates the sprayer 120 up, down, left, and right so as to have a suitable density and an appropriate depth on the surface of the substrate 20 for a mold. Can be attached.

As mentioned above, the present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications are made by those skilled in the art within the scope of the technical idea of the present invention. It is possible. For example, the application field of the present invention is only an example of a mold substrate, but all forms that can be made of a glass structure, such as a cylindrical substrate made by a blowing technique, are possible, and in some cases grooves, grooves or holes are formed on the surface of the glass structure. Various types of glass structures can be formed.

       1 is a cross-sectional view showing a glass structure to which the thermal barrier particles of the present invention are attached.

2 is a cross-sectional view illustrating a method of manufacturing the glass structure of FIG. 1.

Figure 3 is a perspective view showing an example of the application of the glass structure of the present invention.

* Explanation of symbols for main parts of drawing *

10: base material 20: carrier

30: thermal barrier particle 100: pressurization

110: storage unit 120: injection unit

130: flat substrate 131, 210: hard layer

132, 212: soft layer 140: roller

150: support 200: base material for mold

300: mold

Claims (4)

A substrate which is changed to a liquid state with a decrease in viscosity without a certain melting point when temperature is added; A porous carrier having fine pores attached to the substrate; And Glass structure is attached to the porous carrier, the heat shield particles are attached to the heat shield particles including heat shielding particles for blocking heat through the substrate. The method of claim 1, wherein the thermal barrier particles are any one selected from tin oxide, antimony oxide, tin-doped indium oxide (hereinafter referred to as ITO) and antimony-doped tin oxide (hereinafter referred to as ATO) or a combination thereof. Glass structure with a thermal barrier particles, characterized in that. The method of claim 1, wherein the base material has any one selected from among a flat type having a flat surface, a mold appearing in the shape of a mold, a porous type having an integral cylindrical shape, or a micropore, or a combination of the above shapes. Glass structure is attached to the thermal barrier particles, characterized in that. The glass structure according to claim 1, wherein the carrier is attached to the surface of the substrate or partially embedded in the interior of the substrate and the remainder is exposed to the surface of the substrate.

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