KR100993623B1 - Device for treating of water - Google Patents

Abstract

PURPOSE: A treated water processing unit for processing the microorganism included in treated water is provided to remove the microorganism including in treated water by plasma jet, thereby maximizing the processing performance and processing efficiency of treated water and shortening the processing time which is necessary for treated water. CONSTITUTION: A treated water processing unit includes a plasma reactor(100), a treated water feed port(200), a plasma supplying unit which supplies the plasma jet occurred from the gas inside ht plasma reactor passing through the treated processing water. The plasma supply unit includes s first electrode having the penetration hole and protrusion hole arranged nearby the penetration hole. And the plasma supply unit includes a second electrode forming the plasma chamber mutually cooperative with a first electrode by being arranged separately to the first electrode, a gas supply unit which supplies air to the plasma chamber, and a water mist supply unit which supplies water mist to the plasma chamber. The plasma jet generated from the plasma chamber is provided into the plasma reactor according to the penetration hole.

Description

Treatment Water Treatment Unit {DEVICE FOR TREATING OF WATER}

The present invention relates to a treatment water treatment apparatus, and more particularly, to a treatment water treatment apparatus capable of effectively treating microorganisms contained in the treatment water having high electrical conductivity (conductivity), such as seawater.

Generally, when the ship is not loading or the load is low, the draft surface is lowered and it is difficult to maintain the balance, which makes it impossible to operate the ship safely. There is a problem that it becomes difficult to stably adjust and maintain the posture.

Accordingly, in order to reduce the variation in the center of gravity of the ship according to the loading and unloading of the cargo and to ensure safe navigation, the ballast tank is provided on the vessel, and the ballast tank is filled with seawater or fresh water. It is called.

Such ballast water can be put on board before leaving the loading port, and discharged to the outside of the ship before entering the loading port or loading the dripping port. To the ballast tank.

However, when watering the ballast water, various microorganisms such as plankton and bacteria that live in the absorption zone and aquatic organisms such as microshells are mixed together, and the ballast water is discharged to coasts and ports near the loading port. If there is a problem that the ecosystem of the surrounding area is disturbed.

In particular, since the ballast water is kept closed and light-free for a long time, the dissolved oxygen content is extremely reduced, and plankton or aerobic bacteria that require light or dissolved oxygen are difficult to reproduce, and the plankton is in a dormant state. Sieves and anaerobes tend to propagate, and these encapsulations are very durable because their outer walls are very different from those of plankton's cell walls, and when they discharge such ballast water, they adversely affect living organisms in the surrounding waters. Get mad.

In addition, the recent increase in the country's economic activity has led to a rapid increase in maritime traffic, which has led to an increase in the size of ships and a rapid increase in the number of flights.It is estimated that more than 10 billion tons of ballast water is used annually worldwide. As a result, it is reported that the destruction of marine environment and indigenous ecosystem by foreign marine species and pathogens included in ballast water and spreading to other ecosystems has reached a severe level. Accordingly, the International Maritime Organization (IMO) discussed international agreements for ballast water management centering on the MEPC and adopted the "International Convention on Ship Ballast Water and Sediment Management" to adopt eco-friendly ballast. It has led to tightening water discharge regulations.

Accordingly, various developed countries have recently attempted various developments to treat bacteria and harmful organisms contained in ballast water, and conventional treatment methods for treating ballast water include ultraviolet treatment, ozone treatment, chemical treatment, Heat treatment methods and the like are known.

However, the conventional ballast water treatment method is not effective in treating various kinds of microorganisms contained in seawater, and the discharge of treated ballast water generates secondary environmental pollutants or toxic substances harmful to the human body, which is also serious marine pollution. It was a factor that causes. In particular, in the case of a chemical treatment method using chemicals, a separate treatment process for neutralizing or removing the chemicals from the ballast water after treatment is inevitably accompanied, which is cumbersome and complicated.

In addition, the conventional ballast water treatment method has a low treatment efficiency and does not obtain expectations as much as the investment cost due to various problems such as investment cost and maintenance cost, as well as continuous management to maintain stable operation. There is a problem in that a lot of human and material support is required due to the cost and cost.

Accordingly, some measures have recently been proposed to improve the treatment efficiency and reduce the treatment cost of microorganisms contained in ballast water used in ships as well as microorganisms contained in various other treated waters. However, it is still insufficient and development of this is urgently required.

The present invention provides a treatment water treatment apparatus capable of improving treatment performance and treatment efficiency of treatment water.

In particular, the present invention provides an untreated water treatment apparatus capable of effectively treating microorganisms contained in untreated water having high electrical conductivity, such as seawater.

In addition, the present invention provides a treatment water treatment apparatus capable of stably and continuously supplying an optimum plasma for treating treatment water.

In addition, the present invention provides a treatment water treatment apparatus that is simple in structure and can minimize power consumption and reduce maintenance costs.

In addition, the present invention provides a treatment water treatment apparatus capable of optimizing the treatment water discharged after the microorganism is treated.

In addition, the present invention provides a treatment water treatment apparatus that can improve the treatment efficiency of the microorganisms contained in the ballast water (Ballast Water) used in the vessel, and can shorten the treatment time required for treating the microorganisms.

According to a preferred embodiment of the present invention for achieving the above object of the present invention, the treatment water treatment apparatus for treating the microorganisms contained in the treatment water, the plasma reactor, to supply the treatment water to the plasma reactor A treatment water supply unit and a plasma supply unit provided to the plasma reactor and supplying a plasma jet on a flow path of the treated water flowing along the interior of the plasma reactor.

The treatment water treatment apparatus according to the present invention may be used to treat microorganisms such as bacteria contained in the treatment water. As an example, the treatment water treatment apparatus according to the present invention may be used to treat seawater used as ballast water in a ship. In some cases, it can be used to treat river water, agricultural and industrial water, sewage, etc. instead of sea water, the present invention is not limited or limited by the application field and the installation site of the treatment water treatment device. For reference, treating the microorganism in the present invention may be understood as killing the microorganism, such as removing or erasing the microorganism.

In the present invention, the water to be treated may mean contaminated water including microorganisms to be removed, and the water to be treated may have a specific electrical conductivity because it includes microorganisms or other minerals or substances. For example, seawater having an electrical conductivity of about 30,000 μS / cm may be used as treated water, and in some cases, river water, agricultural and industrial water (about 2,000 μS / cm), and sewage, which have relatively low electrical conductivity, may be used. have.

In the present invention, that the plasma jet is supplied on the flow path of the water to be treated is not limited to a specific position among the paths through which the water is flowed inside the plasma reactor. It can be changed in various ways. For example, in a structure in which the plasma reactor is vertically disposed so that the water to be treated flows from the lower end to the upper end of the plasma reactor, the plasma supply unit may provide a plasma jet at the lower end of the plasma reactor, as well as at the central or upper end of the plasma reactor. It can be configured to supply a plasma jet.

As the plasma supply unit, various plasma supply units capable of supplying plasma as a high speed jet into the plasma reactor may be used. For example, the plasma supply unit includes a first electrode having a through hole, a second electrode including a protrusion disposed adjacent to the through hole and spaced apart from the first electrode to form a plasma chamber in cooperation with the first electrode, and It may include a gas supply for supplying a gas to the plasma chamber, the plasma jet generated in the plasma chamber may be provided into the plasma reactor along the through hole.

One of the first electrode and the second electrode may be a high voltage electrode, and the other of the first electrode and the second electrode may be a ground electrode. For example, the first electrode may be a ground electrode and the second electrode may be a high voltage electrode. A high voltage power may be applied to the second electrode, and a small low capacity power supply may be used as a power supply for applying power to the second electrode. For example, the capacity of the power supply unit for supplying power to the second electrode may be 0.5 ~ 3Kw, preferably, the capacity of the power supply unit may be 1Kw.

Conventional air may be used as the gas supplied from the gas supply unit, and in some cases, functional gases such as oxygen and nitrogen may be used together or alone.

A gas chamber may be formed in the first electrode to be spaced apart from the plasma chamber, and a plurality of gas guide holes may be formed in the partition wall between the gas chamber and the plasma chamber. Therefore, the gas supplied from the gas supply part to the gas chamber may be supplied to the plasma chamber through the gas guide hole. Here, the gas guide hole may be formed to be inclined along a tangentially corresponding to each other, so that the gas passing through each gas guide hole can be swirled inside the plasma chamber and form a vortex like a vortex. have. The amount of gas supplied from the gas supply unit may be variously changed depending on the required conditions and the processing environment. For example, the gas supply unit may supply gas at 20 to 60 l / min, and preferably, the supply amount of gas may be 30 to 40 l / min.

In addition, the plasma supply unit may include a water mist supply unit for supplying water mist to the plasma chamber. The water mist supply unit may be configured to supply the water mist to the plasma chamber in various ways depending on the required conditions and design specifications. For example, the water mist supply unit may be connected to the gas supply unit, and the water mist may be supplied to the plasma chamber in a mixed state with the gas. The amount of water mist supplied from the water mist supply unit may be variously changed depending on the required conditions and the processing environment. For example, the water mist supply unit may supply the water mist at 5 ~ 30g / min, preferably, the supply amount of the water mist may be 8 ~ 12g / min. In some cases, the water mist may be directly supplied to the plasma chamber without being mixed with gas.

Depending on the conditions and the processing environment, only one plasma supply may be provided in the plasma reactor, or alternatively, a plurality of plasma supplies may be provided. For example, a plurality of plasma supplies may be provided at a predetermined interval along a circumferential direction or a longitudinal direction of the plasma reactor, and plasma jets may be simultaneously supplied from each plasma supply unit. In addition, a guide plate may be provided inside the plasma reactor for defining a flow flow of the water to be treated, and the plasma supply unit may be provided adjacent to the water to be treated passage defined by the guide plate.

According to the treatment water treatment apparatus according to the present invention, the treatment performance and treatment efficiency of the treatment water can be improved.

In particular, according to the present invention, by supplying a plasma jet on the flow path of the water to be treated so that the microorganisms contained in the water can be removed by the plasma jet, to maximize the treatment performance and treatment efficiency of the water to be treated. Can be. Therefore, it is possible to improve the removal efficiency of the microorganisms contained in the ballast water (Ballast Water) used in ships, and to shorten the treatment time required for removing the microorganisms.

 In addition, according to the present invention, since the plasma jet for treating the water to be treated can be continuously and stably supplied without being intermittently or randomly supplied, the treatment efficiency of the water can be maximized. For example, since seawater has a very high electrical conductivity of about 30,000 μS / cm, plasma discharge is very difficult because the leakage of current from the electrode to seawater before the plasma discharge occurs inside the seawater is very difficult, and the plasma discharge is continuous inside the seawater. Since it is difficult to make stable, there is a problem in that the treatment efficiency of the water to be treated is low. However, in the present invention, since the treated water can be treated using a plasma jet which is stably and continuously supplied from the plasma supply unit, the treatment efficiency of the treated water can be maximized.

Further, according to the present invention, since there is no need to arrange a separate filter or net material inside the plasma reactor (or flow tube) through which the water to be treated flows, It is possible to prevent the pressure drop and to eliminate the use of a high performance pump or an additional pump to compensate for the pumping force according to the pressure drop of the water to be treated.

In addition, according to the present invention, since water mist may be supplied to the plasma supply unit together with air, plasma generation efficiency and sterilizing power may be improved, and sufficient processing efficiency may be achieved without increasing the specific gravity of specific functional gases such as oxygen and nitrogen. Can have

In addition, according to the present invention, since a small low-capacity power supply unit can be used as a power supply unit for supplying power to the plasma supply unit, the energy consumption can be reduced, and the plasma supply unit according to the required conditions and the treatment capacity of the water to be treated. There is an advantage that it is easy to further expand and deploy. In particular, since a small low-capacity power supply unit is used, the plasma supply unit can be easily expanded and disposed even in a ship having limited installation space. In other words, in the case of the low-capacity power supply, the size of the low power supply itself is small, and the size of related equipment such as a transformer is also small, and there is an advantage in that the installation space is small. .

In addition, according to the present invention, it is possible to optimize the treated water discharged after the microorganisms are treated, and the treatment efficiency of the treated water is very high and the structure is simple and can be applied to various fields and places.

1 is a view showing the structure of a water treatment apparatus according to the present invention.
2 is a view illustrating a structure of a plasma generating unit as an apparatus to be treated according to the present invention.
3 is a cross-sectional view taken along the line II of FIG. 2.
4 to 6 is a view showing the treatment water treatment apparatus according to another embodiment of the present invention.
7 is a photograph showing an actual treatment process of the water to be treated by the water treatment apparatus according to the present invention.
8 to 10 are photographs and graphs showing the results before and after the treatment of the water to be treated by the water treatment apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. In describing the present invention, a detailed description of well-known functions or constructions may be omitted for clarity of the present invention.

1 is a view showing the structure of the treatment water treatment apparatus according to the present invention, Figure 2 is a treatment water treatment apparatus according to the present invention, a view showing the structure of the plasma generating unit, Figure 3 It is sectional drawing of line I-I.

As shown in Figures 1 to 3, the treatment water treatment apparatus according to the present invention includes a plasma reactor 100, the treatment water supply unit 200 and the plasma supply unit 300.

The plasma reactor 100 may be provided in a cylindrical shape having a predetermined space therein, and the shape and structure of the plasma reactor 100 may be variously changed according to required conditions and design specifications. Hereinafter, an example in which the plasma reactor 100 is provided in a hollow cylindrical shape having a predetermined length and disposed vertically will be described.

The water to be treated 200 is connected to the plasma reactor 100 to supply the water to be treated in the plasma reactor 100. The treatment water supply unit 200 is provided on a storage tank 210 in which the treatment water is stored, a connection line connecting the storage tank 210 and the plasma reactor 100, and a pump to provide a pumping force. (P) may be included. In some cases, a separate washing water storage tank 220 may be connected to the connection line of the water treatment unit 200, and may remain in the storage tank and the connection line using the washing water of the washing water storage tank 220. The water to be treated can be washed. In the embodiment of the present invention, the treatment water treatment apparatus is described as an example of a kind of experimental apparatus. However, when the treatment water treatment apparatus is used for treating the ballast water of a ship, one or more ballasts are stored. The two storage tanks may be connected in series or in parallel to the plasma reactor, and the treated ballast water may be stored in a separate storage tank or discharged out of the ship.

For reference, in the present invention, the treated water may mean contaminated water including microorganisms to be removed, and the treated water may have a specific electrical conductivity because it includes microorganisms, other minerals, and substances. . For example, seawater having an electrical conductivity of about 30,000 μS / cm may be used as treated water, and in some cases, river water, agricultural and industrial water (about 2,000 μS / cm), and sewage, which have relatively low electrical conductivity, may be used. have.

The part where the water treatment unit 200 is connected to the plasma reactor 100 may be variously changed according to required conditions and design specifications. For example, the treated water supply unit 200 may be horizontally connected to the lower end of the plasma reactor 100 to supply the treated water, and the treated water supplied into the plasma reactor 100 may be the plasma reactor 100. After colliding with the inner wall of the), it is filled from below the plasma reactor 100 and may be discharged to the outside of the plasma reactor 100 through the treated water discharge portion provided in the upper end of the plasma reactor 100.

In the above-described and illustrated embodiments of the present invention, the plasma reactor 100 is vertically arranged and the water treatment unit 200 is connected to the lower end of the plasma reactor 100. However, in some cases, the plasma reactor May be arranged horizontally or inclined at a predetermined inclination angle, and the position where the treated water supply unit is connected to the plasma reactor may also be variously changed, such as an upper end and a side end of the plasma reactor.

The plasma supply unit 300 is provided on the plasma reactor 100, and supplies a plasma jet on a flow path of the water to be treated flowing along the interior of the plasma reactor 100.

As the plasma supply unit 300, various plasma supply units 300 capable of supplying plasma to the plasma reactor 100 as a high speed jet may be used. Hereinafter, the plasma supply unit 300 will be described with an example including the first electrode 310, the second electrode 320, and the gas supply unit 330.

The first electrode 310 may be provided to have a disc shape having a predetermined thickness, and a through hole 312 having a predetermined size penetrates through a center portion of the first electrode 310.

The second electrode 320 is spaced apart from the first electrode 310 at a predetermined interval to form a plasma chamber 302 cooperatively with the first electrode 310. The second electrode may be provided in the same or similar shape as the first electrode, and in some cases, the second electrode and the first electrode may be provided to have different shapes. Hereinafter, an example in which the second electrode 320 is provided to have a relatively smaller size than the first electrode 310 and coaxially arranged with the first electrode 310 based on the through hole 312 will be described. Let's do it.

In addition, a plasma between the first electrode 310 and the second electrode 320 may be generated in the vicinity of the through hole 312 so as to be adjacent to the through hole 312 at the center of the second electrode 320. A protrusion 322 may be formed, and the protrusion 322 may be disposed coaxially with the through hole 312. Substantially, plasma generation between the first electrode 310 and the second electrode 320 may be implemented at corners of the protrusion 322 and the through hole 312 closest to each other.

A general insulator such as a ceramic may be interposed between the first electrode 310 and the second electrode 320, and the second electrode 320 is surrounded by the insulator, and only a part of the first electrode is partially disposed. And may be exposed to 310.

In addition, any one of the first electrode 310 and the second electrode 320 may be a high voltage electrode, and the other one of the first electrode 310 and the second electrode 320 may be a ground electrode. Hereinafter, an example in which the first electrode 310 is a ground electrode and the second electrode 320 is a high voltage electrode will be described. Alternatively, the first electrode may be a high voltage electrode and the second electrode may be a ground electrode.

A high voltage power may be applied to the second electrode 320, and a capacity of the power supply unit 350 that applies power to the second electrode 320 may have a very small capacity. For example, the capacity of the power supply unit 350 for applying power to the second electrode 320 may be 0.5 to 3 Kw, and preferably, the capacity of the power supply unit 350 may be 1 Kw.

The gas supply unit 330 is provided to supply gas to the plasma chamber 302. The gas supply unit 330 may be provided in various structures capable of supplying gas to the plasma chamber 302, and the structure of the gas supply unit 330 may be variously changed according to required conditions and design specifications. For example, the gas supply unit 330 may include a storage tank 332 in which gas is stored, and a connection line connecting the storage tank 332 and the plasma chamber 302, the connection line of the first electrode 310. It may be connected to the plasma chamber 302 in a structure penetrating the side. Conventional air may be used as the gas supplied from the gas supply unit 330, and in some cases, functional gases such as oxygen and nitrogen may be used together or alone.

As such, after generating plasma in the plasma chamber 302, when gas is supplied to the plasma chamber 302, a high-speed jet gas including a plasma body is generated. The plasma jet generated as described above may be supplied into the plasma reactor 100 along the above-described through hole 312. In addition, one end of the connecting portion 360 may be connected to the through hole 312, and the other end of the connecting portion 360 may be connected to the inside of the plasma reactor 100, and the plasma jet passing through the through hole 312 may be connected. May be supplied into the plasma reactor 100 along the connection portion 360.

In addition, a gas chamber 304 may be formed in the first electrode 310 to be spaced apart from the plasma chamber 302, and a plurality of partitions 306 may be formed in the partition wall 306 between the gas chamber 304 and the plasma chamber 302. The gas guide hole 306a may be formed. Therefore, the gas supplied from the gas supply part 330 to the gas chamber 304 may be supplied to the plasma chamber 302 through the gas guide hole 306a.

The gas chamber 304 may be provided to have a circular or other shape depending on the required conditions and design specifications. Hereinafter, an example in which the gas chamber 304 is formed to have a substantially ring shape will be described. In addition, the number and spacing interval of the gas guide hole 306a may also be appropriately changed according to required conditions and design specifications.

Here, the gas guide hole 306a may be formed to penetrate the partition wall 306 at a predetermined angle. Hereinafter, the four gas guide holes 306a will be described as an example in which the four gas guide holes 306a are inclined along a tangentially corresponding to each other. Accordingly, the gas passing through each gas guide hole 306a may be tangentially supplied to the plasma chamber 302, and the gas passing through each gas guide hole 306a may be inside the plasma chamber 302. It can orbit and form a swirl-like vortex. As such, a vortex caused by a gas may be formed in the plasma chamber 302, and the plasma body generated at a corner of the protrusion 322 and the through hole 312 may have the protrusion 322 and the through hole by vortex. Move along the edge area of 312. As a result, since the plasma body can be moved along the vortex, the plasma generation at the corners of the protrusions 322 and the through holes 312 can be made evenly in the entire area (the entire area of the corresponding corners of the protrusions and the through holes) rather than a specific area. Can be. Furthermore, since the plasma body generated at the corners of the protrusion 322 and the through hole 312 can move along the vortex, it can be supplied to the plasma reactor 100 more quickly and stably.

The gas supply amount from the gas supply unit 330 may be variously changed according to the required conditions and the processing environment. For example, the gas supply unit 330 may supply a gas at 20 ~ 60ℓ / min. That is, when the supply amount of gas is less than 20 l / min or larger than 60 l / min, since the optimum plasma jet is difficult to be generated and the processing efficiency is lowered, the gas from the gas supply part 330 is 20 to 60 l / min. Is preferably supplied. More preferably, the amount of gas supplied may be 30-40 l / min.

The plasma supply unit 300 may include a water mist supply unit 340 for supplying water mist to the plasma chamber 302 so that the plasma jet can be more effectively generated.

The water mist supply unit 340 may be configured to supply the water mist to the plasma chamber 302 in various ways according to the required conditions and design specifications. For example, the water mist supply unit 340 may include a storage tank 342 in which the water mist is stored, and a connection line connecting the storage tank 342 and the plasma chamber 302 to the gas supply unit 330. ), And the water mist may be supplied to the plasma chamber 302 in a mixed state with gas (air). In some cases, the water mist may be directly supplied to the plasma chamber without being mixed with gas.

As such, when the water mist is supplied together with the air, there is an advantage in that the generation efficiency of the plasma is higher than when the air is supplied alone, and the plasma generation efficiency is not increased even if the specific gravity of the functional gas such as oxygen or nitrogen is not increased in the gas. Of course, there is an advantage that the sterilization power is increased.

The amount of water mist supplied from the water mist supply unit 340 may be variously changed according to a required condition and a processing environment. For example, the water mist supply unit 340 may supply the water mist at 5 ~ 30g / min. That is, when the water mist supply amount is less than 5g / min, there is a problem that the activation of the plasma jet according to the water mist supply is not effective, on the contrary, when the water mist supply amount is greater than 30g / min in the plasma chamber Since there is a problem that the plasma discharge efficiency is lowered, the water mist is preferably supplied at 5 ~ 30g / min. More preferably, the supply amount of the water mist may be 8 ~ 12g / min.

In addition, the position of the inlet of the plasma supply unit 300 to which the plasma jet is supplied from the plasma reactor 100 and the inlet of the treated water supply unit 200 to which the treated water is supplied along the flow direction of the treated water are required. And can be variously changed according to design specifications. For example, in order to maximize the efficiency of passing the treated water supplied to the plasma reactor 100 through the plasma jet supplied to the plasma reactor 100, that is, the plasma of the treated water supplied to the plasma reactor 100. In order to minimize the amount of flow that cannot be processed by the jet, the inlet of the plasma supply unit 300 may be located in front of the inlet of the treated water supply unit 200 along the flow direction of the treated water. That is, as shown in FIG. 1, the inlet of the plasma supply unit 300 may be disposed above the inlet of the treated water supply unit 200 with a predetermined height difference, and the treated water supplied from the treated water supply unit 200. May flow through the plasma jet supplied from the plasma supply unit 300 effectively. In addition, the inlet of the plasma supply unit 300 may be disposed on substantially the same straight line as the inlet of the to-be-processed water supply unit 200. In some cases, the inlet of the plasma supply unit and the inlet of the water treatment unit may be configured to have the same height, and the inlet of the plasma supply unit and the inlet of the processing unit may be arranged to cross each other.

As such, when a high voltage power is applied to the second electrode 320, plasma discharge may be generated between the first electrode 310 and the second electrode 320. It is supplied to the plasma reactor 100 to allow the microorganisms contained in the water to be treated to be removed.

On the other hand, the treated water can be discharged to the outside of the plasma reactor 100 through the discharge unit 400 connected to the upper end of the plasma reactor 100, and then sent to the discharge tank 410 (or outside), The gas contained in the plasma jet may be discharged to the outside of the plasma reactor 100 through the gas discharge unit 500 connected to the other side of the upper end of the plasma reactor 100.

In the above-described and illustrated embodiments of the present invention, the plasma reactor 100 is provided with an example in which only one plasma supply unit is provided. However, in some cases, a plurality of plasma supply units may be simultaneously applied according to a required condition and a processing environment. In addition, the position at which each plasma supply unit is mounted may also be appropriately changed.

4 to 6 is a view showing the treatment water treatment apparatus according to another embodiment of the present invention. In addition, the same or equivalent portions as those in the above-described configuration are denoted by the same or equivalent reference numerals, and a detailed description thereof will be omitted.

Referring to FIG. 4, an apparatus to be treated according to another embodiment of the present invention includes a plasma reactor 100, a treated water supply unit 200, and a plasma supply unit 300 supplying a plasma jet. Including but not limited, the plasma supply unit 300 may be provided in a plurality spaced apart from each other at predetermined intervals along the circumferential direction of the plasma reactor 100. The number and spacing interval of the plasma supply unit 300 may be appropriately changed according to the required conditions and the treatment capacity of the water to be treated. For example, three plasma supplies 300 may be provided around the plasma reactor 100 at a predetermined interval, and plasma jets may be simultaneously supplied from the respective plasma supplies 300.

In addition, referring to Figure 5, the treatment water treatment apparatus according to another embodiment of the present invention, the plasma reactor 100, the treatment water supply unit 200, and the plasma supply unit 300 for supplying a plasma jet (plasma jet) Including), a plurality of plasma supply unit 300 may be provided to be spaced apart at a predetermined interval along the longitudinal direction of the plasma reactor (100). The number and spacing interval of the plasma supply unit 300 may be appropriately changed according to the required conditions and the treatment capacity of the water to be treated. For example, the plasma reactor 100 may be provided with three plasma supply units 300 spaced apart at regular intervals along the length direction. In addition, each of the plasma reactors 100 may be alternately disposed at positions facing each other, and plasma jets may be simultaneously supplied from each plasma supply unit 300.

In addition, referring to Figure 6, the treatment water treatment apparatus according to another embodiment of the present invention, the plasma reactor 100, the treatment water supply unit 200, and the plasma supply unit 300 for supplying a plasma jet (plasma jet) Including the), the inside of the plasma reactor 100 may be provided with a guide plate for forcibly defining the flow of the water to be treated, the plasma supply unit 300 is the water to be defined by the guide plate It may be provided adjacent to the passage section.

In addition to such a structure, various structures for optimally supplying the plasma jet on the flow path of the water to be treated may be applied, and the present invention is not limited or limited by the number and position of the plasma supply unit 300.

As is already known, since seawater has a very high electrical conductivity of about 30,000 μS / cm, there is a problem that the plasma discharge is very difficult because the current leaks from the electrode to the seawater before the plasma discharge occurs in the seawater, and the energy consumption increases accordingly. . Moreover, since the plasma discharge is difficult to be made continuously and stably in the seawater, there is a problem in that the treatment efficiency of the water to be treated is low.

However, in the present invention, since the water to be treated can be treated using the plasma jet supplied from the plasma supply unit 300, the treatment efficiency of the water to be treated can be improved. In addition, the present invention can maximize the treatment efficiency of the water to be treated because the plasma jet for treating the water to be treated can be supplied continuously and stably without being intermittently or randomly supplied.

Further, in the present invention, since there is no need to arrange a separate filter or net material inside the plasma reactor 100 (or a flow pipe) through which the water to be treated flows, the water to be treated by the filter or the net material. The pressure drop can be prevented, and the use of a high performance pump to compensate for the pumping force according to the pressure drop of the water to be treated can be eliminated.

In addition, in the present invention, since the water mist may be supplied to the plasma supply unit 300 together with the gas, even if air is used as the gas without using a specific functional gas such as oxygen and nitrogen, it may have sufficient processing efficiency.

In addition, since the small low-capacity power supply unit 350 can be used as the power supply unit 350 for supplying power to the plasma supply unit 300, the energy consumption can be reduced, and the required conditions and the water to be treated. Depending on the processing capacity of the plasma supply unit 300 there is an advantage that it is easy to further expand and deploy. In particular, since a small low-capacity power supply unit 350 is used even in a ship with limited installation space, there is an advantage in that the plasma supply unit 300 is easily expanded and disposed.

On the other hand, Figure 7 is a photograph showing the actual treatment process of seawater by the treatment water treatment apparatus according to the invention, Figure 8 is a control photograph of bacteria contained in the seawater before treatment, Figure 9 is in accordance with the present invention It is a photograph of the experimental group of bacteria included in the treated seawater, Figure 10 is a graph showing the results before and after the treatment of seawater by the treatment water treatment apparatus according to the present invention.

As shown in FIG. 7, the treated water supply unit 200 supplies seawater (US seawater salinity: 135 g / gal) at 2.5 l / min, and the gas supply unit 330 of the plasma supply unit 300 supplies air at 28 l / min. The water mist supply unit 340 of the plasma supply unit 300 supplies the water mist at 30 g / min, and treats the seawater under the condition that the power supply unit 350 capacity of the plasma supply unit 300 has a capacity of 1 Kw.

As can be seen from the comparison of FIG. 8 and FIG. 9 and FIG. 10, it can be seen that bacteria contained in the seawater treated by the plasma jet are removed approximately 95% or more compared to the seawater before treatment. In addition, when water is not supplied and only air is supplied alone, the removal rate of bacteria contained in seawater may be somewhat lowered.Because water mist is supplied with air, more than 95% of bacteria in seawater are removed. can confirm.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

100: plasma reactor 200: water to be treated
300: plasma supply unit 310: first electrode
320: second electrode 330: gas supply unit
340: water mist supply unit

Claims (11)

In the treatment water treatment apparatus for treating microorganisms contained in the treatment water,
Plasma reactor;
An untreated water supply unit supplying untreated water to the plasma reactor; And
And a plasma supply unit provided outside the plasma reactor and supplying a plasma jet generated in a gas into the plasma reactor through which the water to be treated passes.
The plasma supply unit,
A first electrode having a through hole; A second electrode including a protrusion disposed adjacent to the through hole, the second electrode being spaced apart from the first electrode to form a plasma chamber in cooperation with the first electrode; A gas supply unit supplying gas to the plasma chamber; And a water mist supply unit supplying water mist to the plasma chamber,
The plasma jet generated in the plasma chamber is provided to the inside of the plasma reactor along the through hole. delete The method of claim 1,
A gas chamber is formed in the first electrode to be spaced apart from the plasma chamber, and a plurality of gas guide holes are formed in the partition wall between the gas chamber and the plasma chamber to be inclined along a tangentially corresponding to each other.
The gas supplied from the gas supply unit to the gas chamber is tangentially supplied to the plasma chamber through the gas guide hole, and the gas passed through the gas guide hole is swirled in the plasma chamber and vortexed. and a vortex. delete delete delete The method of claim 3,
The water mist supply unit is connected to the gas supply unit,
And the water mist is mixed with the gas and is passed through the gas guide hole and tangentially supplied to the plasma chamber. delete The method of claim 1,
The inlet of the plasma supply unit to which the plasma jet is supplied in the plasma reactor is located in front of the inlet of the to-be-processed water supply unit to which the to-be-processed water is supplied along the flow direction of the to-be-processed water. Device. The method of claim 1,
And a plurality of plasma supply units are provided at a plurality of spaced intervals along a circumferential direction or a longitudinal direction of the plasma reactor. The method of claim 1,
Inside the plasma reactor is provided with a guide plate for defining the flow flow of the water to be treated,
And the plasma supply unit is provided adjacent to an untreated water passage section defined by the guide plate.

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