KR100989075B1

KR100989075B1 - Method of manufacturing antenna using sintering of metal and antenna manufactured by the same

Info

Publication number: KR100989075B1
Application number: KR1020100041483A
Authority: KR
Inventors: 방국현
Original assignee: 주식회사 다이나트론
Priority date: 2010-05-03
Filing date: 2010-05-03
Publication date: 2010-10-25

Abstract

The antenna manufacturing method forms a base. A conductive pattern is formed on the base. The conductive pattern is sintered using microwaves to form a circuit pattern. According to the antenna manufacturing method, a circuit pattern may be formed by sintering a metal directly on a base. Therefore, the manufacturing process of the antenna is simplified, the shape of the antenna is simplified, downsized, and slim, and the plating process is omitted to prevent adverse effects on the human body, environmental pollution, etc. that may occur in the plating process.

Description

Antenna manufacturing method using metal sintering and antenna produced by the same {METHOD OF MANUFACTURING ANTENNA USING SINTERING OF METAL AND ANTENNA MANUFACTURED BY THE SAME}

The present invention relates to an antenna manufacturing method and an antenna manufactured thereby, and more particularly, to an antenna manufacturing method that can simplify the manufacturing process by using metal sintering, and an antenna manufactured thereby.

With the development of the electronics industry and with the development of communication technologies, in particular, wireless communication technologies, various mobile communication terminals capable of performing data communication anywhere are becoming common. In general, a mobile communication terminal refers to a terminal such as a mobile phone, a smart phone, a personal digital assistant (PDA), a netbook, a notebook, and the like, which is capable of implementing various functions using wireless communication and applications while being carried by an individual. .

In the past, the antenna used in the mobile communication terminal was a whip antenna made of a straight metal wire, a helical antenna spirally wound or a retractable antenna. In order to satisfy the needs of consumers according to the trend of miniaturization and slimming, a built-in antenna embedded in a mobile communication terminal has been widely applied.

Representative methods of manufacturing a built-in antenna is a heat fusion method, a double injection method.

In the heat fusion method, injection molding a synthetic resin forms a base including a plurality of protrusions, designs an antenna circuit pattern on the base, and manufactures a press mold corresponding to the designed circuit pattern to bend copper sheet or stainless steel sheet. It is a method of fixing by heat fusion by bonding to the protrusion of the base. Such a thermal fusion method has a limitation in implementing an antenna having a three-dimensional shape and a complicated shape, a manufacturing process is complicated, and there is a problem in that productivity is low and work cost is high.

In the double injection method, an antenna circuit pattern is designed on a base designed according to the shape of an antenna interior space, and a double injection is performed by linking a base injection mold and a circuit pattern injection mold to form a base on which a circuit pattern is formed. A copper plating film and a nickel plating film are formed on the circuit pattern. The double injection method has a high defect rate due to double injection, and the manufacturing process is complicated because the plating process is necessarily accompanied. In more detail, the base is mainly formed of a polycarbonate (PC) resin material, and since the base of the PC resin cannot be directly plated, acrylonitrile-butadiene-styrene (ABS) resin is used. Since a process of forming a circuit pattern from a material is required, and a process of forming a binding film for adhesion between the circuit pattern and the plating film is required, the manufacturing process is complicated.

An object of the present invention is to provide an antenna manufacturing method that can simplify the manufacturing process using metal sintering.

In addition, another object of the present invention to provide an antenna manufactured by using the antenna manufacturing method.

In order to achieve the above object of the present invention, the antenna manufacturing method according to the present invention forms a base. A conductive pattern is formed on the base. The conductive pattern is sintered using microwaves to form a circuit pattern.

In one embodiment of the invention, the base may comprise a synthetic resin.

In one embodiment of the present invention, the conductive pattern may include a conductive paste. The conductive paste may include a metal.

In one embodiment of the present invention, the conductive paste may be a silver paste.

In one embodiment of the present invention, the conductive pattern may further include a binding material to closely contact the base and the conductive pattern.

In an embodiment of the present disclosure, the forming of the conductive pattern on the base may form the conductive pattern by screen pad printing.

In one embodiment of the present invention, the microwave may be provided through a microwave oven.

In order to achieve the above object of the present invention, the antenna according to the present invention includes a base and a circuit pattern including a synthetic resin. The circuit pattern is formed by sintering a conductive pattern formed on the base using microwaves.

In one embodiment of the present invention, the circuit pattern may be formed by sintering using a microwave oven.

According to the antenna manufacturing method and the antenna manufactured according to the present invention configured as described above, it is possible to form a circuit pattern by sintering the metal directly on the base. Thus, the manufacturing process of the antenna is simplified.

In addition, the shape of the antenna can be simplified, downsized, and slim.

In addition, the metal plating process may be omitted, and adverse effects on the human body and environmental pollution, which may occur in the plating process, may be prevented.

1 is a perspective view showing an antenna according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the antenna taken along the line II ′ of FIG. 1.
3 is a flowchart illustrating a method of manufacturing the antenna of FIG. 1.
4A to 4C are diagrams for describing a manufacturing process of the antenna of FIG. 1.
5 is a perspective view illustrating a part of an antenna according to another embodiment of the present invention.
6A through 6C are diagrams for describing a manufacturing process of the antenna of FIG. 5.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the microparticle processing apparatus according to the embodiments of the present invention. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

When a component is said to be "connected" or "connected" to another component, it may be directly connected to or connected to another component, but it should be understood that there may be another component in between. something to do. On the other hand, if a component is described as being "directly connected" or "directly connected" to another component, it may be understood that there is no other component in between. Other expressions describing the relationship between the components, such as "between" and "directly between" or "adjacent to" and "directly adjacent to", may be interpreted as well.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a perspective view showing an antenna according to an embodiment of the present invention.

Referring to FIG. 1, an antenna 100 according to an embodiment of the present invention includes a base 120 and a circuit pattern 140.

The base 120 may be formed in various forms according to the shape of the mobile communication terminal or the shape of the installation portion of the antenna 100 of the mobile communication terminal. The base 120 may be integrally formed on one surface of the mobile communication terminal, and the base 120 may be one surface of the mobile communication terminal.

The base 120 may include a synthetic resin. The base 120 is a polycarbonate (PC) resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl alcohol resin, vinyl chloride resin, ionomer resin, polyamide resin, acrylonitrile Butadiene-styrene (ABS) resins and the like. The base 120 preferably comprises a PC resin.

The shape of the base 120 may correspond to the shape of the circuit pattern 140.

The circuit pattern 140 is formed on the base 120. The circuit pattern 140 may have a planar shape as shown in FIG. 1, and may have a bar shape that is bent and extended a plurality of times. However, the shape of the circuit pattern 140 may be formed differently according to the shape and frequency range of the mobile communication terminal, it is not limited to the form shown in FIG.

The circuit pattern 140 is formed using a conductive paste. The circuit pattern 140 may be formed using an ink including the conductive paste. The conductive paste includes a metal component. The conductive paste may include gold (Au), silver (Ag), platinum (Pt), palladium (Pd), copper (Cu), and the like having high electrical conductivity. The conductive paste preferably contains silver.

The conductive paste may comprise a binding material. When the conductive paste includes a binding material, the circuit pattern 140 may be in close contact with the base 120, and a process of forming a separate binding film may be omitted.

The circuit pattern 140 is formed by printing the ink including the conductive paste and then sintering the ink using microwaves. This will be described later in detail with reference to FIG. 3.

FIG. 2 is a cross-sectional view of the antenna taken along the line II ′ of FIG. 1.

1 and 2, the circuit pattern 140 protrudes from the base 120. Since a separate carrier film including ABS resin and the like and a binding film for closely contacting the carrier film and the circuit pattern 140 are not formed on the base 120, the shape of the antenna 100 is simplified, miniaturized, and the like. It can be slimmed down.

In FIG. 2, the circuit pattern 140 protrudes from the base 120. Alternatively, the base 120 includes a recess, and the circuit pattern 140 includes the base 120. Is formed on the depression of the may be formed so that the circuit pattern 140 does not protrude from the base 120. Furthermore, an upper surface of the circuit pattern 140 may be formed to coincide with an upper surface of the base 120.

3 is a flowchart illustrating a method of manufacturing the antenna of FIG. 1. 4A to 4C are diagrams for describing a manufacturing process of the antenna of FIG. 1.

3 and 4A, the base 120 of the antenna 100 is formed (step S100). The base 120 may be formed by injection molding. Specifically, after forming a mold corresponding to the shape of the base 120 and injecting the molten synthetic resin, a predetermined time passes to form the base 120. As already mentioned, the shape of the base 120 may be formed in various shapes in addition to the rectangular plate shape shown.

3 and 4B, the conductive pattern 130 is formed on the base 120 (step S200). The conductive pattern 130 includes the conductive paste and has a shape corresponding to the shape of the circuit pattern 140. The conductive paste may include a metal component and a binding material. The conductive paste preferably contains silver.

The conductive pattern 130 may be formed by screen printing, pad printing, inkjet printing, or the like.

In the screen printing method, a metal or polymer mask is disposed on the base 120 using the screen printing method, and then the conductive paste is applied onto the mask. Thereafter, the conductive paste is squeezed to form the conductive pattern 130.

In the pad printing method, the ink including the conductive paste having the shape of the circuit pattern 140 is absorbed on a flat pad, and then transferred to the base 120 to form the conductive pattern 130. The pad may be a silicon pad.

Meanwhile, in the inkjet printing method, a shape corresponding to the circuit pattern 140 is input to a computer, and ink is ejected through an inkjet printer including an ink ejection nozzle to form the conductive pattern 130 on the base 120. To form.

3, 4B and 4C, the conductive pattern 130 is sintered using microwaves to form the circuit pattern 140 (S300). Microwave ovens may be used in the sintering process.

Sintering is a phenomenon in which a non-metal or metal powder is heat-treated at a temperature below the melting point, and a bond is formed between the powders to cure into a shaped shape. The driving force of the sintering is the extra surface energy of the powder. When the powder is simply collected, the sum of the surface energies is not minimal and is thermodynamically unbalanced. The heat treatment causes material movement in the direction of decreasing the surface energy, that is, in the direction of decreasing the surface area, so that the particles bind to each other.

Microwave is an electromagnetic wave having a wavelength between radio waves and infrared rays and has a wavelength of 1 mm to 10 cm, which is smaller than radio waves and larger than infrared rays. Microwave heating is an internal heating method in which the object to be heated becomes a heating element by the dielectric heating principle. That is, when the heated object is placed in a microwave electric field, the molecules constituting the heated object polarize an electrically neutral permanent dipole under the force of propagation to vibrate violently in response to the frequency of the microwave. At this time, friction heat between the molecules is generated, and the entire heated object is heated to increase the temperature.

As such, when the conductive pattern 130 is sintered using the microwaves, the conductive paste of powder shape having little strength is assembled and densified to be bonded to each other, or a part is deposited and connected to each other. It becomes a lump. The surface area of the conductive pattern 130 is reduced by the sintering and the strength is increased. In addition, the electrical conductivity of the conductive pattern 130 is increased and the resistance is reduced to operate as a circuit. As a result, the circuit pattern 140 formed by sintering the conductive pattern 130 has an appropriate resistance value to operate as a circuit.

In addition, when heated to a high temperature close to the melting point of the conductive paste to sinter the conductive pattern 130, the base 120 formed of the synthetic resin may be physically or chemically damaged. However, in the present invention, the sintering process may be performed at a lower temperature since the sintering is performed using microwaves. Therefore, the circuit pattern 140 may be formed by sintering the conductive pattern 130 without damaging the base 120.

According to the antenna manufacturing method according to the present embodiment, the circuit pattern 140 may be formed by sintering the conductive pattern 130 directly on the base 120. Therefore, forming a carrier on a base required in a general antenna manufacturing process, forming a binding film on the carrier, and forming a plating film on the binding film can be omitted, thereby greatly simplifying the manufacturing process of the antenna. Therefore, the shape of the antenna 100 can be simplified, downsized, and slim.

In addition, it is possible to prevent adverse effects on the human body, environmental pollution, etc. that may occur in the metal plating process.

5 is a perspective view illustrating a part of an antenna according to another embodiment of the present invention.

Referring to FIG. 5, an antenna 200 according to another embodiment of the present invention includes a base 220 and a circuit pattern 240.

The antenna 200 of the present embodiment is substantially the same as the antenna 100 of the embodiment of FIG. 1 except that the shape of the antenna 200 is three-dimensional. Therefore, duplicate descriptions are omitted.

The base 220 may be formed in various forms according to the shape of the mobile communication terminal or the shape of the installation portion of the antenna 200 of the mobile communication terminal.

The base 220 may include a synthetic resin, preferably PC resin.

The shape of the base 220 may be formed to correspond to the shape of the circuit pattern 240.

The circuit pattern 240 is formed on one surface of the base 220. The circuit pattern 240 may have a planar shape as shown in FIG. 5, but may have a three-dimensional shape. That is, the circuit pattern 240 may be formed to correspond to various surfaces of the base 220, and some surfaces of the base 220 may be formed to cover only a part of the partial surfaces. In addition, the shape of the circuit pattern 240 may be formed differently according to the shape and frequency range of the mobile communication terminal.

The circuit pattern 240 is formed using a conductive paste. The circuit pattern 240 may be formed using an ink including the conductive paste. The conductive paste preferably contains silver.

The conductive paste may comprise a binding material. When the conductive paste includes a binding material, the circuit pattern 240 may be in close contact with the base 120, and a process of forming a separate binding film may be omitted.

The circuit pattern 240 is formed by printing the ink including the conductive paste and then sintering the ink using microwaves.

6A through 6C are diagrams for describing a manufacturing process of the antenna of FIG. 5.

The manufacturing method of the antenna 200 of the present embodiment is substantially the same as the manufacturing method of the antenna 100 of FIG. 1 except that the shape of the antenna 200 is three-dimensional. Therefore, duplicate descriptions are omitted.

3 and 6A, the base 220 of the antenna 200 is formed (step S100). The base 220 may be formed by injection molding.

3 and 6B, the conductive pattern 230 is formed on the base 220 (step S200). Although the circuit pattern 240 is formed on one surface of the base 220, the circuit pattern 240 may be formed to correspond to various surfaces of the base 220 and the base 220. For some surfaces of the may be formed to cover only a portion of the partial surface.

The conductive pattern 230 includes the conductive paste and has a shape corresponding to the shape of the circuit pattern 240. The conductive paste may include a metal component and a binding material. The conductive paste preferably contains silver.

The conductive pattern 130 is formed by screen printing, pad printing, inkjet printing, or the like.

The screen printing method may form the conductive pattern 130 using a metal or polymer mask, and the pad printing method absorbs the ink including the conductive paste on a flat pad and transfers the ink to the base 120. The conductive pattern 130 may be formed, and the inkjet printing method forms the conductive pattern 130 on the base 120 using an inkjet printer including an ink jet nozzle.

3, 6B and 6C, the circuit pattern 240 is formed by sintering the conductive pattern 230 using microwaves (step S300). Microwave ovens may be used in the sintering process.

When the conductive pattern 230 is sintered using the microwave, the surface area of the conductive pattern 230 is reduced, the strength is increased, the electrical conductivity is increased, and the resistance is reduced, thereby operating as a circuit. As a result, the circuit pattern 240 formed by sintering the conductive pattern 230 has an appropriate resistance value to operate as a circuit.

When the conductive pattern 230 is heated to a high temperature close to the melting point of the conductive paste to sinter the conductive pattern 230, the base 220 formed of the synthetic resin is physically or chemically damaged. However, since the present invention sinters using microwaves, the circuit pattern 240 may be formed by sintering the conductive pattern 230 without damaging the base 220.

According to the antenna manufacturing method according to the present embodiment, the circuit pattern 240 may be formed by sintering the conductive pattern 230 directly on the base 220. Therefore, forming a carrier on a base required in a general antenna manufacturing process, forming a binding film on the carrier, and forming a plating film on the binding film can be omitted, thereby greatly simplifying the manufacturing process of the antenna. .

In particular, in the case of an antenna having a three-dimensional shape, it is difficult to use another antenna manufacturing method such as a thermal fusion method, and thus the antenna manufacturing method of the present invention may be appropriately and conveniently used.

In addition, according to the antenna manufacturing method, the shape of the antenna 200 may also be simplified, downsized, and slim.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

As described above, according to the present invention, a circuit pattern may be formed by sintering a metal directly on a base. Thus, the manufacturing process of the antenna is simplified.

In addition, the shape of the antenna can be simplified, downsized, and slim.

100, 200: antenna 120, 220: base
130, 230: conductive pattern 140, 240: circuit pattern

Claims

Forming a base;
Forming a conductive pattern on the base;
Sintering the conductive pattern using microwaves to form a circuit pattern,
The conductive pattern comprises a conductive paste, the conductive paste comprises a metal,
The conductive pattern further comprises a binding material to closely contact the base and the conductive pattern.

The method of claim 1, wherein the base comprises a synthetic resin.

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The method of claim 1, wherein the conductive paste is a silver paste.

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The method of claim 1, wherein the forming of the conductive pattern on the base comprises forming the conductive pattern by screen pad printing.

The method of claim 1, wherein the microwave is provided through a microwave oven.

A base comprising a synthetic resin;
A circuit pattern formed by sintering a conductive pattern formed on the base using microwaves,
The conductive pattern comprises a conductive paste, the conductive paste comprises a metal,
The conductive pattern further includes a binding material to closely contact the base and the conductive pattern.

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The antenna of claim 8, wherein the conductive paste is a silver paste.

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The antenna of claim 8, wherein the circuit pattern is formed by sintering using a microwave oven.