KR100988421B1 - Organic electro-luminescence device - Google Patents

Abstract

In the present invention, the substrate having an organic electroluminescent layer; And a sealing substrate covering the entire surface of the substrate so that the organic light emitting layer is sealed, and a part of the sealing substrate is located between the organic electroluminescent layer when the substrate and the sealing substrate are coupled to each other, thereby sealing the substrate and the substrate. An organic light emitting device is characterized in that an adhesive line for adhering a substrate is formed, and a plurality of through holes penetrating the sealing substrate are formed in an adjacent portion of the adhesive line to expose a portion of the substrate.

In the present invention, a plurality of through holes are additionally disposed in a part of the sealing substrate main body, and through this, even in a situation before the cutting of the substrate / sealing substrate array individually by the producer side, the through holes such as an aging process, an inspection process, etc. By easily inserting jig (for example, jig, probe, etc.) for progression and guiding the flexible aging process and inspection process, the product productivity is normal even when the sheet-type sealing substrate is adopted. To keep it naturally.

In addition, in the present invention, a plurality of through holes are additionally disposed in a part of the sealing substrate main body, and in the coalescing state of the substrate and the sealing substrate, through this through hole, the gas filling the separation space between the substrate and the sealing substrate naturally falls out. By inducing exit, unnecessary deformation of the adhesion line due to the flow of the gas can be blocked in advance.

In this way, through the additional arrangement of the through-holes that can induce gas discharge, if the unnecessary deformation of the adhesive line is blocked in advance, problems caused by this on the producer side, for example, cutting dimension inaccuracy, substrate breakage problem, active cell degradation Problems can be easily avoided.

Description

Organic electroluminescence device

1A to 2B are exemplary views illustrating an organic light emitting device according to the related art.

3 to 5 are exemplary views illustrating an organic light emitting display device according to the present invention.

6 is an exemplary view conceptually showing a coalescing situation of an organic light emitting device according to the present invention;

7 is an exemplary view conceptually showing the progress of the subsequent process of the organic light emitting device according to the present invention.

The present invention relates to an organic light emitting device, and more particularly, a plurality of through holes are additionally disposed in a part of a packaging substrate body, and thus, at the producer side, the substrate / sealing substrate array is cut individually. Even in the following situation, the through-hole can easily enter a jig (eg, jig, probe, etc.) for the aging process, the inspection process, and the like to guide the aging process and the inspection process flexibly. The present invention relates to an organic electroluminescent device capable of inducing a product to naturally maintain a normal level even under the situation of adopting a sheet-type sealing substrate.

In recent years, with the rapid increase in demand for electronic and electrical equipment, the functions of various flat panel display devices such as plasma display devices, liquid crystal display devices, organic electroluminescent devices, and the like are also rapidly developing.

Among these conventional flat panel display devices, in particular, the organic light emitting device can display light in all regions in the visible light, has the advantage of high brightness and low operating voltage characteristics, contrast ratio (Contrast ratio) It has the advantages of large size, simple process, relatively low environmental pollution, fast response time, no limit of viewing angle, stable operation even at low temperature, and easy manufacturing and design of driving circuit. In recent years, it has attracted great attention as a representative flat panel display device that will lead the next generation.

In general, an organic light emitting device according to the related art is a substrate having an organic light emitting layer and a sealed substrate that encapsulates the substrate in a sealed state to protect the organic light emitting layer from external impurities such as oxygen and moisture. This combined configuration is taken.

In this case, as shown in FIGS. 1A and 1B, the sealing substrate is a piece for individually dividing and packaging an active cell 1a (eg, an organic light emitting layer) of the substrate 1 through an adhesive line 2a. Sheet type packaging package of active cell 1a of substrate 1 at a time by means of a piece type packaging substrate (2) and an adhesive line 3a as shown in FIGS. 2A and 2B. It is largely classified into a sheet type packaging substrate (3).

Among these, the piece-type sealing substrate 2 has several disadvantages of, for example, poor sealing workability, inadequateness for a large area substrate, and lightness of an increase in the unit cost of the material. Relatively, the sheet-type sealing substrate 3 has many advantages of excellent sealing workability, suitable for use in a large area substrate as well as a small area substrate, and the relatively low cost of materials. Due to the variety, the frequency of use is gradually increasing.

Under the conventional system of using the sheet-shaped sealing substrate 3, on the producer side, after the procedure of aligning the sealing substrate 3 on the upper portion of the substrate 1, the substrate is pressed by pressing the sealing substrate 3 at a constant pressure P. (1) and the sealing substrate (3) are integrally integrated, and then by further proceeding with the procedure of cutting the integrally bonded substrate / sealing substrate arrays individually around the adhesive line (3a). In this way, the board / sealed board array is separated into individual products.

In the future, the producer side proceeds with a series of subsequent processes such as an aging process and an inspection process for the individually cut products, thereby improving the reliability of the final product. .

Under such a conventional system, as mentioned above, the producer side proceeds with a series of subsequent processes, for example, an aging process and an inspection process, for the individually cut products, thereby improving the reliability of the product. .

In this case, as shown in FIG. 1B, in the case of the conventional piece-type sealing substrate 2, since the substrate 1 is separately divided and packaged, a predetermined empty space B is naturally provided between the pieces. Under the type sealing board (2) system, the producer side jig (for example, jig, test pin, etc.) for the progress of the aging process, the inspection process, etc. into the empty space B even in the situation before the individual cutting of the substrate / sealed board array. By easily entering, it is possible to smoothly proceed a series of aging process, inspection process, etc. As a result, it is possible to effectively obtain the advantage that the productivity of the product is improved.

However, in the case of the conventional sheet-type sealing substrate 3, since it takes a structure that comprehensively covers the substrate 1 and cannot provide a separate empty space at all, under the sheet-type sealing substrate 3 system, Producer side can not secure the entry path of the jig (eg jig, inspection pin, etc.) for the progress of the aging process, inspection process, etc. unless the procedure of cutting the substrate / sealing substrate array individually, In the aftermath, only a series of subsequent processes can be carried out only for the products cut individually, and as a result, there is no choice but to suffer the problem that the productivity of the product is greatly reduced.

On the other hand, as mentioned above, under the conventional system, the producer side proceeds with the procedure of aligning the sealing substrate 3 on the upper part of the substrate 1, and then presses the sealing substrate 3 with a constant pressure P, thereby (1) and the sealing substrate 3 are integrated together.

Of course, in such a coalescing situation, the separation space S between the substrate 1 and the sealing substrate 3 is inevitably reduced as the sealing substrate is pressed, and as a result, the gas filling the separation space S is reduced. There is no choice but to flow severely in the direction of arrows A1, A2, A3.

At this time, since the conventional sheet-like sealing substrate 3 monotonously takes a structure that covers the substrate 1 broadly without a separate gas outflow passage, the gas flowing in the directions A1, A2, and A3 is inevitably forced. Inevitably, a strong physical shock is applied to the sieve bonding line 3a which has not escaped to the outside. As a result, the bonding line 3a has no choice but to cause unnecessary deformation.

Of course, such an adhesive line 3a is located in the vicinity of the active cell (organic electroluminescent layer) in the coalescing state of the substrate 1 and the sealing substrate 3, and thus acts as a series of cutting reference points. If the shape deformation of the adhesive line 3a is left as it is without any further action, the producer side may be caused by the shape deformation of the adhesive line 3a, for example, inaccurate cutting dimensions, breakage of the substrate, and Due to the infringement, the active cell suffers from the problem of deterioration and the like.

Thus, although the sheet-shaped sealing substrate 3 has a relatively large number of advantages over the piece-type sealing substrate 2, due to the other problems mentioned above, it is not effectively employed in the production of the actual product. I can't do it.

Therefore, it is an object of the present invention to further arrange a plurality of through holes in a part of the sealing substrate main body, whereby at the producer side, even before the cutting of the substrate / sealing substrate array individually, the through hole aging process, A tool (for example, a jig, a probe, etc.) for the progress of the inspection process can be easily entered and guided so that the series of aging processes and the inspection process can be flexibly carried out. This is to induce productivity to maintain normal levels naturally.

Another object of the present invention is to additionally arrange a plurality of through holes in a part of the sealing substrate body, and in the context of the union of the substrate and the sealing substrate, through these through holes, the gas filling the space between the substrate and the sealing substrate is naturally By inducing them to escape, it is possible to prevent unnecessary deformation of the adhesion line due to the flow of the gas in advance.

It is a further object of the present invention to further prevent unnecessary deformation of the adhesive line through the further arrangement of through-holes which can lead to gas emissions, thereby preventing problems on the producer side, resulting from inaccuracies in cutting dimensions, for example, substrates. It is intended to easily avoid breakage problems and active cell degradation problems.

Still other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

In order to achieve the above object, the present invention includes a substrate having an organic electroluminescent layer; And a sealing substrate covering the entire surface of the substrate so that the organic light emitting layer is sealed, and a part of the sealing substrate is located between the organic electroluminescent layer when the substrate and the sealing substrate are coupled to each other, thereby sealing the substrate and the substrate. An organic light emitting device is characterized in that an adhesive line for adhering a substrate is formed, and a plurality of through holes penetrating the sealing substrate are formed in an adjacent portion of the adhesive line to expose a portion of the substrate.

Hereinafter, an organic electroluminescent device according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 3 to 5, under the scheme of the present invention, an organic light emitting device is, for example, a glass substrate 11 having a plurality of active cells, for example, an organic light emitting layer 11a, and a glass. , A sealing substrate 12 having a material such as a plastic or a canister, and encapsulating the entire surface of the substrate 11 in a sealed state to protect the organic light emitting layers 11a from external impurities such as oxygen and moisture. For example, a sheet-like sealing substrate may be combined.

In this case, the adhesive lines 12a of the sealing substrate 12 are interposed between the organic electroluminescent layer 11a formed on the substrate 11 in a state in which the substrate 11 and the sealing substrate 12 are integrally coupled to each other. Located in the above, it serves to stably bond the substrate 11 and the sealing substrate 12, and also acts as a series of cutting reference points during the progress of the cutting procedure to be described later.

At this time, in order to integrate the sealing substrate 12 with the substrate 11 integrally, the operation of aligning the sealing substrate 12 at a proper position on the upper portion of the substrate 11 must be preceded.

In this case, the imager 13 (for example, a CCD camera) photographs and recognizes an alignment mark (not shown) formed on a part of the substrate 11, for example, the edge of the substrate 11, to align the sealing substrate 12. The sealing substrate aligner 14 moves the sealing substrate 12 on the basis of the alignment basic information output from the imager 13 so as to generate the alignment basic information required for the sealing substrate 12. After determining the position, a predetermined pressure is applied to perform the function of integrating the sealing substrate 12 integrally with the substrate 11.

Of course, in this coalescing situation, the separation space S between the substrate 11 and the sealing substrate 12 is forced to decrease gradually as the sealing substrate 12 is pressed at a constant pressure P, and in the aftermath, the separation space The gas filling S has no choice but to flow severely.

In this sensitive situation, in the present invention, the main body 12b of a part of the main body 12b of the sealing substrate 12, which is incorporated with the substrate 11 and seals the organic electroluminescent layer 11a, for example, is adjacent to the adhesive line 12a. While passing through 12b, measures are taken to arrange a plurality of through holes 20 exposing a portion of the substrate 11. Of course, the shape, number, size, etc. of the through holes 20 may be variously modified according to circumstances.

As described above, in a situation in which a plurality of through holes 20 are flexibly formed in the main body 12b of the sealing substrate 12, the sealing substrate 12 is pressed at a constant pressure P, and, in the aftermath, the substrate 11 and the sealing substrate. When the separation space between the 12 is gradually reduced, as shown in Figure 6, the gas filling the separation space S, unlike the conventional, through the through holes 20, to easily secure its own discharge path, Along with the sieve, arrows C1, C2 that do not apply a separate physical impact to the adhesive line 12a provided in the main body 12b, it is possible to quickly exit to the outside.

As such, the gas discharge is made flexible by performing the function of the through holes 20 which provide the outflow path of the gas existing between the substrate 11 and the main body 12b. When it is possible to naturally avoid the shape deformation due to the physical impact with the producer side, the producer side also suffers from problems caused by the shape deformation of the adhesive line 12a, such as cutting dimension inaccuracy problem, substrate breakage problem, active cell degradation. Problems can be easily avoided.                     

On the other hand, under the system of the present invention, in order to improve the reliability of the product, an aging process, an inspection process, etc. should be further progressed.

In this sensitive situation, in the present invention, as mentioned above, a part of the main body 12b of the sealing substrate 12, for example, the adhesive line 12a, which is integrated with the substrate 11 and seals the organic electroluminescent layer 11a. Measures for arranging a plurality of through holes 20 exposing a part of the substrate 11 while penetrating the main body 12b in the vicinity of the.

Of course, in a situation in which a plurality of through holes 20 are flexibly formed in the main body 12b of the sealing substrate 12 as described above, on the producer side, as shown in FIG. Even in the situation before cutting, the through holes 20 easily enter a jig 31, for example, a jig 31, an inspection pin 32, etc. for the progress of an aging process, an inspection process, and the like. The inspection process can be flexibly advanced.

Of course, by performing the function of the through-holes 20 that can provide the entry path of the jig for operating the substrate, a series of aging process, inspection process, etc. can proceed smoothly even under the condition that the products are not cut individually. If so, the producer side can naturally enjoy the effect of improving the productivity of the product.

Subsequently, the producer side will proceed with the process of cutting the board / sealed board array integrally bonded to each bonding line 12a, and then separately, and then separate the board / sealed board array into individual products for shipment. .

 As described in detail above, in the present invention, a plurality of through holes are additionally disposed in a part of the sealing substrate main body, thereby aging the through holes even in a situation before the individual cutting of the substrate / sealing substrate array on the producer side. Even when the sheet-type sealing substrate is employed, the jig (probe, jig, probe, etc.) for easily entering the process and inspection process can be easily entered and the series of aging processes and inspection processes can be flexibly carried out. Product productivity can be induced to maintain normal levels.

In addition, in the present invention, a plurality of through holes are additionally disposed in a part of the sealing substrate main body, and in the coalescing state of the substrate and the sealing substrate, through this through hole, the gas filling the separation space between the substrate and the sealing substrate naturally falls out. By inducing exit, unnecessary deformation of the adhesion line due to the flow of the gas can be blocked in advance.

In this way, through the additional arrangement of the through-holes that can induce gas discharge, if the unnecessary deformation of the adhesive line is blocked in advance, problems caused by this on the producer side, for example, cutting dimension inaccuracy, substrate breakage problem, active cell degradation Problems can be easily avoided.

While specific embodiments of the invention have been described and illustrated above, it will be apparent that the invention may be embodied in various modifications by those skilled in the art.

Such modified embodiments should not be understood individually from the technical spirit or point of view of the present invention, and such modified embodiments should fall within the scope of the appended claims of the present invention.

Claims (2)

A substrate having an organic electroluminescent layer; A sealing substrate covering a front surface of the substrate to seal the organic light emitting layer, A portion of the sealing substrate is formed between the organic electroluminescent layer and the bonding line to bond the substrate and the sealing substrate when the substrate and the sealing substrate are bonded to each other, the adjacent portion of the bonding line is formed of the substrate And a plurality of through holes penetrating the sealing substrate so that a portion thereof is exposed. The organic electroluminescent device according to claim 1, wherein a jig, a test pin, or the like is inserted into the through holes, and an aging and various tests are performed using the jig.

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