KR100983112B1 - Jig handled in electric power semiconductor assembly of electric rail car - Google Patents

Jig handled in electric power semiconductor assembly of electric rail car Download PDF

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KR100983112B1
KR100983112B1 KR1020080083570A KR20080083570A KR100983112B1 KR 100983112 B1 KR100983112 B1 KR 100983112B1 KR 1020080083570 A KR1020080083570 A KR 1020080083570A KR 20080083570 A KR20080083570 A KR 20080083570A KR 100983112 B1 KR100983112 B1 KR 100983112B1
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power semiconductor
semiconductor assembly
jig
handling
base plate
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KR1020080083570A
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Korean (ko)
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KR20100024834A (en
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김영길
이재성
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서울메트로
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H35/00—Switches operated by change of a physical condition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2231/00—Applications
    • H01H2231/026—Car

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Arrangement Or Mounting Of Propulsion Units For Vehicles (AREA)

Abstract

본 발명은 전동차용 전력반도체 어셈블리의 취급용 지그에 관한 것으로, 전력소자 등의 구성들이 고정될 수 있는 위치를 선정하여 전력반도체 어셈블리를 배치한 상태에서 필요한 구성들을 분리할 수 있고 조립시에는 각각의 구성들을 정해진 위치에 셋팅한 후 용이하게 조립할 수 있도록 함을 목적으로 한다.The present invention relates to a jig for handling a power semiconductor assembly for an electric vehicle, by selecting a position where the components of the power device and the like can be fixed to separate the necessary components in the state in which the power semiconductor assembly is arranged, It is intended to be easy to assemble after setting the configuration in a fixed position.

본 발명에 의한 전동차용 전력반도체 어셈블리의 취급용 지그는, 전력소자(2)와, 전력소자의 양측에 각각 배치되는 제1,2절연블록(3,4)과, 제1,2절연블록(3,4)의 외측에 각각 배치되는 제1,2마감판(5,6)과, 전력소자(2)와 제1,2절연블록(3,4) 및 제1,2마감판(5,6)의 중앙에 관통 체결되는 제1고정볼트(7)와, 제1,2마감판(5,6)의 사방 모서리에 관통 체결되는 제2고정볼트(8)로 이루어진 전동차용 전력반도체 어셈블리(1)의 취급용 지그로서, 상기 전력반도체 어셈블리가 안착되는 베이스 플레이트(10)와; 상기 베이스 플레이트의 상면 둘레부에 돌출 형성되어 상기 전력반도체 어셈블리를 전후좌우 방향에서 지지하는 제1,2블록 지지부(11,12)와 제1,2마감판 지지부(13,14)로 구성된다.The jig for handling an electric power semiconductor assembly for an electric vehicle according to the present invention includes a power device 2, first and second insulating blocks 3 and 4 disposed on both sides of the power device, and first and second insulating blocks. First and second finishing plates 5 and 6 disposed outside the 3 and 4, respectively, the power device 2, the first and second insulating blocks 3 and 4, and the first and second finishing plates 5 and 6, respectively. 6) a power semiconductor assembly for an electric vehicle, comprising a first fixing bolt (7) penetratingly fastened to a center of the second and a second fixing bolt (8) penetratingly fastened to four corners of the first and second finishing plates (5,6). 1) a jig for handling, comprising: a base plate (10) on which the power semiconductor assembly is seated; The first and second block support parts 11 and 12 and the first and second finish plate support parts 13 and 14 protrudingly formed on the upper circumference of the base plate to support the power semiconductor assembly in front, rear, left and right directions.

전력반도체, 지그, 베이스 플레이트, 지지부 Power Semiconductor, Jig, Base Plate, Support

Description

전동차용 전력반도체 어셈블리의 취급용 지그{JIG HANDLED IN ELECTRIC POWER SEMICONDUCTOR ASSEMBLY OF ELECTRIC RAIL CAR}JIG HANDLED IN ELECTRIC POWER SEMICONDUCTOR ASSEMBLY OF ELECTRIC RAIL CAR}

본 발명은 전동차용 전력반도체 어셈블리의 취급용 지그에 관한 것으로서, 더욱 상세하게는 전력소자 등의 구성들이 고정될 수 있는 위치를 선정하여 전력반도체 어셈블리를 배치한 상태에서 필요한 구성들을 분리할 수 있고 조립시에는 각각의 구성들을 정해진 위치에 셋팅한 후 용이하게 조립할 수 있는 한 전동차용 전력반도체 어셈블리의 취급용 지그에 관한 것이다.The present invention relates to a jig for handling a power semiconductor assembly for an electric vehicle, and more particularly, by selecting a position where components of a power device and the like can be fixed, the necessary components can be separated and assembled in a state where the power semiconductor assembly is disposed. The city relates to a jig for handling an electric power semiconductor assembly for an electric vehicle as long as it can be easily assembled after setting the respective components in a predetermined position.

GEC 초파(chopper) 전동차에는 전동차의 역행 및 제동을 위해 연속적으로 가변하는 안전된 전압 및 전류를 견인 전동기에 공급하기 위하여 전력반도체 어셈블리가 사용된다.GEC chopper electric vehicles use power semiconductor assemblies to supply traction motors with continuously varying safe voltages and currents for backing and braking the electric vehicles.

도 1에서 보이는 것처럼, 전력반도체 어셈블리(1)는 전력소자(2)와, 전력소자의 양측에 각각 배치되는 제1,2절연블록(3,4)과, 제1,2절연블록(3,4)의 외측에 각각 배치되는 제1,2마감판(5,6)과, 전력소자(2)와 제1,2절연블록(3,4) 및 제1,2마 감판(5,6)의 중앙을 관통 체결되는 제1고정볼트(7)와, 제1,2마감판(5,6)의 사방 모서리에 관통 체결되는 제2고정볼트(8)로 구성된다.As shown in FIG. 1, the power semiconductor assembly 1 includes a power device 2, first and second insulating blocks 3 and 4 disposed on both sides of the power device, and first and second insulating blocks 3, respectively. First and second finishing plates 5 and 6 disposed on the outer side of 4, respectively, the power device 2, the first and second insulating blocks 3 and 4, and the first and second finishing plates 5 and 6, respectively. The first fixing bolt 7 is fastened through the center of the fixing bolt, and the second fixing bolt 8 is fastened to the four corners of the first and second finishing plates (5, 6).

이와 같이 구성된 전력반도체 어셈블리(1)는 주기적으로 검사를 받고 이상 발생시 보수가 이루어진다.The power semiconductor assembly 1 configured as described above is periodically inspected and repaired when an abnormality occurs.

이와 같은 전력반도체 어셈블리(1)의 검사와 보수 등을 위해서는 전력반도체 어셈블리를 분해하고, 작업이 완료된 후 재조립하여야 한다.In order to inspect and repair the power semiconductor assembly 1, the power semiconductor assembly must be disassembled and reassembled after the work is completed.

그러나, 종래에는 전력반도체 어셈블리(1)를 지지하는 장비가 없기 때문에 전력소자(2)만 분리할 수 없고 전력반도체 어셈블리(1) 전체를 분해하고 재조립하여야 하는 불편함이 있다.However, in the related art, since there is no equipment supporting the power semiconductor assembly 1, only the power device 2 cannot be separated, and there is an inconvenience of disassembling and reassembling the entire power semiconductor assembly 1.

그리고, 전력소자는 일정한 압력을 받도록 지지되어야 하기 때문에 분해 후 재조립시 전력소자의 압력을 맞추는 것이 어려운 문제점도 있다.In addition, since the power device must be supported to receive a constant pressure, it is difficult to match the pressure of the power device when disassembling and reassembling.

본 발명은 상기와 같은 문제점을 해결하기 위한 것으로, 전력소자 등의 구성들이 고정될 수 있는 위치를 선정하여 전력반도체 어셈블리를 배치한 상태에서 필요한 구성들을 분리할 수 있고 조립시에는 각각의 구성들을 정해진 위치에 셋팅한 후 용이하게 조립할 수 있는 전동차용 전력반도체 어셈블리의 취급용 지그를 제공하는데 그 목적이 있다.The present invention is to solve the above problems, it is possible to separate the necessary components in the state of arranging the power semiconductor assembly by selecting a position that can be fixed, such as the power device configuration and each configuration is determined It is an object of the present invention to provide a jig for handling a power semiconductor assembly for an electric vehicle that can be easily assembled after being set in position.

전술한 바와 같은 목적을 달성하기 위한 본 발명에 의한 전동차용 전력반도체 어셈블리의 취급용 지그는, 전력소자와, 전력소자의 양측에 각각 배치되는 제1,2절연블록과, 상기 제1,2절연블록의 외측에 각각 배치되는 제1,2마감판과, 상기 전력소자와 제1,2절연블록 및 제1,2마감판의 중앙을 관통 체결되는 제1고정볼트와, 상기 제1,2마감판의 사방 모서리에 관통 체결되는 제2고정볼트로 이루어진 전동차용 전력반도체 어셈블리의 취급용 지그로서, 상기 전력반도체 어셈블리가 안착되는 베이스 플레이트와; 상기 베이스 플레이트의 상면 둘레부에 돌출 형성되어 상기 전력반도체 어셈블리를 전후좌우 방향에서 지지하는 지지부로 구성된 것을 특징으로 한다.The jig for handling an electric power semiconductor assembly for an electric vehicle according to the present invention for achieving the above object includes a power device, first and second insulating blocks disposed on both sides of the power device, and the first and second insulation. First and second finishing plates disposed outside the block, first fixing bolts penetrating through the centers of the power device, the first and second insulating blocks, and the first and second finishing plates, and the first and second finishing plates. A jig for handling a power semiconductor assembly for an electric vehicle, the second fixing bolt being penetrated through four corners of a plate, the base plate on which the power semiconductor assembly is seated; Protruding portion formed on the upper circumference of the base plate is characterized in that consisting of a support for supporting the power semiconductor assembly in front, rear, left and right directions.

본 발명에 따른 전동차용 전력반도체 어셈블리의 취급용 지그에 의하면, 전력반도체 어셈블리의 분해시 제1,2마감판을 해당 위치에 셋팅함으로써 제1,2절연블록 등이 자연스럽게 정해진 위치에 셋팅 및 베이스 플레이트에 고정되어 고정볼트를 풀더라도 제1,2절연블록과 제1,2마감판이 흐트러지지 않고 고정 상태를 유지할 수 있으므로 분해가 매우 용이하고, 반대로, 분해 상태의 제1,2절연블록과 제1,2마감판을 각각의 위치에 셋팅하여 고정한 상태에서 고정볼트를 체결함으로써 전력반도체 어셈블리를 조립할 수 있으므로 유지보수 작업이 매우 용이하다.According to the jig for handling the power semiconductor assembly for an electric vehicle according to the present invention, the first and second insulating blocks and the like are naturally set at a predetermined position and the base plate by setting the first and second finish plates at the corresponding positions when disassembling the power semiconductor assembly. The first and second insulating blocks and the first and second finishing plates can be maintained in a fixed state without being disturbed even if the fixing bolts are loosened. The maintenance work is very easy because the power semiconductor assembly can be assembled by fastening the fixing bolts in the fixed state by setting the 2 finish plates in their respective positions.

그리고, 제1,2마감판과 제1,2절연블록을 베이스 플레이트에 안정된 자세로 셋팅한 후 전력소자를 조립함으로써 전력소자를 설정 압력으로 조절할 수 있으므로 제품의 신뢰성을 향상할 수 있다.In addition, by setting the first and second finishing plates and the first and second insulating blocks in a stable posture on the base plate, the power devices can be adjusted to a set pressure by assembling the power devices, thereby improving reliability of the product.

도 2와 도 3에서 보이는 것처럼, 본 발명에 의한 전동차용 전력반도체 취급용 지그는, 베이스 플레이트(10)와; 베이스 플레이트(10)의 상면에 형성되어 전력반도체 어셈블리(1)가 전후 좌우로 움직이지 않도록 지지하는 지지부로 구성된다.2 and 3, the jig for handling electric power semiconductors for an electric vehicle according to the present invention includes a base plate 10; It is formed on the upper surface of the base plate 10 is composed of a support for supporting the power semiconductor assembly 1 does not move forward, backward, left and right.

전력반도체 어셈블리(1)의 구조상 제1,2절연블록(3,4)과 제1,2마감판(5,6)을 각각 지지하여야 할 것이며, 따라서, 상기 지지부는 블록 지지부와 마감판 지지부로 구분된다. 상기 블록 지지부는 제1,2절연블록(3,4)의 전후 방향 움직임과 좌우 방향 움직임을 막기 위한 제1,2블록 지지부(11,12)로 구분되고, 상기 마감판 지지부는 제1,2마감판(5,6)의 전후 방향 움직임과 좌우 방향 움직임을 막아주는 제1,2마감판 지지부(13,14)로 구분된다.Due to the structure of the power semiconductor assembly 1, the first and second insulating blocks 3 and 4 and the first and second finish plates 5 and 6 should be supported, respectively. Are distinguished. The block support part is divided into first and second block support parts 11 and 12 for preventing forward and backward movements of the first and second insulating blocks 3 and 4 and the first and second insulating blocks 3 and 4, and the closing plate support part is provided as a first and second block. It is divided into first and second finishing plate support parts 13 and 14 which prevent the front and rear movements of the closing plates 5 and 6 and the left and right movements.

베이스 플레이트(10)는 전력반도체 어셈블리(1)가 안착되도록 상면이 평평하게 형성되며, 별도의 테이블 등에 볼트로 고정될 수 있다.The base plate 10 is formed to have a flat upper surface so that the power semiconductor assembly 1 is seated, and may be bolted to a separate table or the like.

전력반도체 어셈블리(1)는 제1,2블록 지지부(11,12)와 제1,2마감판 지지부(13,14)에 의해 베이스 플레이트(10)에서 전후 좌우로 움직이지 않을 수 있지만, 상하 흔들림이 발생될 수 있으므로 상하 흔들림을 막기 위하여 베이스 플레이트(10)에 볼트(20)로 고정될 수도 있다.The power semiconductor assembly 1 may not move back, forth, left, and right on the base plate 10 by the first and second block supports 11 and 12 and the first and second finish plate supports 13 and 14, but may move up and down. Since this may occur may be fixed to the base plate 10 with a bolt 20 to prevent up and down shaking.

볼트(20)는 전력반도체 어셈블리(1)의 제1,2절연블록(3,4)에 형성된 볼트 공(3a,4a)에 각각 관통되어 베이스 플레이트(10)에 형성된 볼트공(10a)에 체결된다.The bolt 20 penetrates through the bolt holes 3a and 4a formed in the first and second insulating blocks 3 and 4 of the power semiconductor assembly 1 to be fastened to the bolt holes 10a formed in the base plate 10, respectively. do.

도 2, 도 3 및 도 4에서 보이는 것처럼, 제1,2블록지지부(11,12)는 제1,2절연블록(3,4)의 전후 좌우 4곳에서 제1,2절연블록(3,4)을 지지하여 제1,2절연블록(3,4)이 전후 좌우로 움직이지 않도록 하는 것이며, 이를 위하여 베이스 플레이트(10)의 상면에 상부로 돌출 형성된다.As shown in FIGS. 2, 3, and 4, the first and second block supporting parts 11 and 12 may be formed at four front, rear, left and right positions of the first and second insulating blocks 3 and 4. 4) to support the first and second insulating blocks (3,4) to move back and forth and left and right, for this purpose is formed to protrude upward on the upper surface of the base plate (10).

제1,2블록지지부(11,12)는 도면에서 보이는 것처럼, 베이스 플레이트(10)에 전체적으로 형성될 수도 있고, 다수개가 일정간격을 두고 형성될 수도 있는 것이다.As shown in the drawing, the first and second block supporting parts 11 and 12 may be formed on the base plate 10 as a whole, and a plurality of the first and second block supporting parts 11 and 12 may be formed at regular intervals.

그리고, 제1,2블록지지부(11,12)는 막대 형상으로 형성되어 베이스 플레이트(10)에 고정되어 사용되거나 베이스 플레이트(10)에 일체로 형성될 수도 있다.In addition, the first and second block supporting parts 11 and 12 may be formed in a rod shape and fixed to the base plate 10 or may be integrally formed with the base plate 10.

여기서 전력반도체 어셈블리(1)는 제1,2블록지지부(11,12)의 사이에 형성된 공간에 하단 일부분이 삽입되어 거치되는 것으로 전력반도체 어셈블리(1)를 쉽게 거치할 수 있도록 제2블록지지부(12)는 일측이 힌지(12a)를 통해 회전 가능하게 결합되어 자유단부가 벌어지도록 구성될 수 있다. Here, the power semiconductor assembly 1 has a lower portion inserted into the space formed between the first and second block supports 11 and 12 so that the power semiconductor assembly 1 can be easily mounted on the second block support part ( 12 may be configured so that one side is rotatably coupled through the hinge 12a to open the free end.

제2블록지지부(12)가 힌지(12a) 결합되는 경우 자유단부는 추후 볼트 등으로 고정될 수 있을 것이다.When the second block support portion 12 is coupled to the hinge 12a, the free end may be fixed later with a bolt or the like.

지금까지는 제2블록지지부(12)만 힌지 결합되는 것으로 설명하였으나, 제1블록지지부(11)도 일측이 회동 가능하게 결합될 수 있다.So far, only the second block support part 12 has been described as being hinged, but the first block support part 11 may also be rotatably coupled to one side.

제1마감판 지지부(13)는 제2블록 지지부(12)의 상면에 일체로 형성되거나 고정될 수 있으며, 제2블록 지지부(12)에 안착된 제1,2마감판(5,6)의 전후면을 지지한다. 제1마감판 지지부(13)는 제2블록 지지부(12)에 형성되지 않고 베이스 플레이트(10)에 직접 형성될 수도 있다.The first finishing plate support 13 may be integrally formed or fixed to an upper surface of the second block supporting part 12, and the first and second finishing plates 5 and 6 seated on the second block supporting part 12 may be fixed. Support front and back. The first finish plate support 13 may be formed directly on the base plate 10 without being formed on the second block support 12.

제2마감판 지지부(14)는 제2블록지지부(12)의 외측에 상부를 향해 돌출 형성되어 제1,2마감판(5,6)의 외측을 지지함으로써 제1,2마감판(5,6)이 좌우로 이탈되지 않도록 한다.The second finish plate support 14 is protruded upward on the outside of the second block support 12 to support the outside of the first and second finish plates 5 and 6, thereby supporting the first and second finish plates 5, 6) should not be separated from side to side.

이와 같이 구성된 본 고안에 의한 전동차용 전력반도체 취급용 지그의 작용은 다음과 같다.The action of the jig for handling electric power semiconductors according to the present invention configured as described above is as follows.

1. 분해시1.Disassembly

전력반도체 어셈블리(1)의 제1,2마감판(5,6)을 제1,2마감판 지지부(13,14)의 사이에 올리면, 제1,2절연블록(3,4)의 하부가 제1,2블록 지지부(11,12)의 사이에 자연스럽게 삽입된다. 이때, 제2블록 지지부(12)가 힌지(12a) 결합된 경우 제2블록 지지부(12)의 자유단부를 벌린 후 전력반도체 어셈블리(1)를 거치할 수 있다.When the first and second finish plates 5 and 6 of the power semiconductor assembly 1 are placed between the first and second finish plate supports 13 and 14, the lower portions of the first and second insulating blocks 3 and 4 It is naturally inserted between the first and second block supports 11 and 12. In this case, when the second block support part 12 is coupled to the hinge 12a, the free end of the second block support part 12 may be opened and then mounted on the power semiconductor assembly 1.

이렇게 되면 전력반도체 어셈블리(1)가 베이스 플레이트(10) 상에서 전후 좌우로 움직이지 않으며, 이어서, 볼트(20)를 제1,2절연블록(3,4)에 관통 및 베이스 플레이트(10)에 체결하여 전력반도체 어셈블리(1)가 상하로 움직이지 않도록 함으로써 전력반도체 어셈블리(1)를 안정되게 셋팅할 수 있다.In this case, the power semiconductor assembly 1 does not move back and forth and left and right on the base plate 10, and then the bolt 20 passes through the first and second insulating blocks 3 and 4 and is fastened to the base plate 10. The power semiconductor assembly 1 can be stably set by preventing the power semiconductor assembly 1 from moving up and down.

이 상태에서 제1고정볼트(7)를 풀면 전력소자(2)와 제1,2절연블록(3,4) 및 제1,2마감판(5,6)이 서로 분리 상태가 되며, 단 제2고정볼트(8)에 의해 제1,2마감판(5,6)들 사이에서 이탈하지 않는다. 이때, 전력소자(2)만을 분리할 수 있을 것이며, 단 전력소자(2)를 쉽게 빼낼 수 있도록 제1,2절연블록(5,6)의 볼트(20)를 체결하지 않을 수도 있다. 볼트(20)를 체결하지 않으면 전력소자(2)를 빼낼 수 있을 정도로 제1,2절연블록(3,4)이 움직이기 때문이다.When the first fixing bolt 7 is released in this state, the power device 2, the first and second insulating blocks 3 and 4, and the first and second finishing plates 5 and 6 are separated from each other. The two fixing bolts 8 do not separate between the first and second finishing plates 5 and 6. In this case, only the power device 2 may be separated, but the bolts 20 of the first and second insulating blocks 5 and 6 may not be fastened so that the power device 2 can be easily removed. This is because the first and second insulating blocks 3 and 4 move to the extent that the power device 2 can be pulled out if the bolt 20 is not fastened.

전력반도체 어셈블리(1) 전체를 분해할 경우에는 제2고정볼트(8)를 풀어 제1,2마감판(5,6)의 고정력을 해소함으로써 제1,2마감판(5,6)을 분리할 수 있고, 볼트(20)를 제거한 후 제1,2절연블록(3,4)도 분리할 수 있다.When disassembling the entire power semiconductor assembly 1, remove the second fixing bolt 8 to release the fixing force of the first and second finishing plates 5 and 6 to separate the first and second finishing plates 5 and 6. After the bolt 20 is removed, the first and second insulating blocks 3 and 4 may also be separated.

2. 조립시2. When Assembling

제1,2절연블록(3,4)을 제1,2블록 지지부(11,12)의 사이 공간에 삽입하고, 제1,2절연블록(11,12)의 사이에 전력소자(2)를 개재하며, 제1,2마감판(5,6)을 제1,2마감판 지지부(13,14) 사이에 끼워 각 구성들을 각각의 자리에 맞춰 배치한다.The first and second insulating blocks 3 and 4 are inserted into the space between the first and second block supports 11 and 12, and the power device 2 is inserted between the first and second insulating blocks 11 and 12. The first and second finishing plates 5 and 6 are interposed between the first and second finishing plate supports 13 and 14 to arrange the respective components at respective positions.

이어서, 4개의 제2고정볼트(8)를 제1,2마감판(5,6)에 체결하여 제1,2마감판(5,6)들을 서로 고정하며, 제1고정볼트(7)를 제1마감판(5)에서부터 제1절연블록(3) - 전력소자(2) - 제2절연블록(4) - 제2마감판(6)에 걸쳐 관통 체결한다. 이때, 전력소자(2)의 압력을 체크하면서 제1고정볼트(7)의 체결력을 조절하여 전력소자(2)를 설정 압력으로 셋팅한다.Subsequently, the four second fixing bolts 8 are fastened to the first and second finishing plates 5 and 6 to fix the first and second finishing plates 5 and 6 to each other, and the first fixing bolts 7 are fastened to each other. From the first finishing plate (5) to the first insulating block (3)-the power element (2)-the second insulating block (4)-through the second closing plate (6). At this time, while checking the pressure of the power device (2) by adjusting the tightening force of the first fixing bolt (7) to set the power device 2 to a set pressure.

도 1은 전력반도체 어셈블리의 구성도.1 is a configuration diagram of a power semiconductor assembly.

도 2는 본 고안에 의한 전동차용 전력반도체 취급용 지그의 사시도.Figure 2 is a perspective view of a jig for handling power semiconductors for electric vehicles according to the present invention.

도 3은 본 고안에 의한 전동차용 전력반도체 취급용 지그의 정면도.Figure 3 is a front view of the jig for handling power semiconductors for electric vehicles according to the present invention.

도 4는 본 고안에 의한 전동차용 전력반도체 취급용 지그의 측면도.Figure 4 is a side view of the jig for handling power semiconductors for electric vehicles according to the present invention.

< 도면의 주요 부분에 대한 부호 설명><Description of Signs for Main Parts of Drawings>

1 : 전력반도체 어셈블리, 10 : 베이스 플레이트1: power semiconductor assembly, 10: base plate

11,12 : 제1,2블록 지지부, 13,14 : 제1,2마감판 지지부11,12: first and second block support, 13,14: first and second finish plate support

20 : 볼트,20 bolts,

Claims (7)

전력소자(2)와, 상기 전력소자의 양측에 각각 배치되는 제1,2절연블록(3,4)과, 상기 제1,2절연블록의 외측에 각각 배치되는 제1,2마감판(5,6)과, 상기 전력소자와 제1,2절연블록 및 제1,2마감판의 중앙에 관통 체결되는 제1고정볼트(7)와, 상기 제1,2마감판의 사방 모서리에 관통 체결되는 제2고정볼트(8)로 이루어진 전동차용 전력반도체 어셈블리(1)의 취급용 지그로서,The power device 2, the first and second insulating blocks 3 and 4 disposed on both sides of the power device, respectively, and the first and second finish plates 5 disposed outside the first and second insulating blocks, respectively. And 6, a first fixing bolt 7 penetrated at the center of the power device, the first and second insulating blocks, and the first and second finishing plates, and a through fastening at all four corners of the first and second finishing plates. As a jig for handling the electric power semiconductor assembly 1 for an electric vehicle, which is composed of a second fixing bolt (8), 상기 전력반도체 어셈블리가 안착되는 베이스 플레이트(10)와;A base plate 10 on which the power semiconductor assembly is seated; 상기 베이스 플레이트의 상면 둘레부에 돌출 형성되어 상기 전력반도체 어셈블리를 전후좌우 방향에서 지지하는 지지부로 구성된 것을 특징으로 하는 전동차용 전력반도체 어셈블리의 취급용 지그.A jig for handling a power semiconductor assembly for an electric vehicle, wherein the jig is formed to protrude from the upper circumference of the base plate to support the power semiconductor assembly in front, rear, left and right directions. 청구항 1에 있어서, 상기 지지부는 상기 전력반도체 어셈블리의 제1,2절연블록의 전후좌우를 지지하는 제1,2블록 지지부(11,12), 상기 전력반도체 어셈블리의 제1,2마감판의 전후좌우를 지지하는 제1,2마감판 지지부(13,14)로 구성되는 것을 특징으로 하는 전동차용 전력반도체 어셈블리의 취급용 지그.2. The method of claim 1, wherein the support part includes first and second block support parts 11 and 12 supporting front, rear, left, and right sides of the first and second insulating blocks of the power semiconductor assembly, and the front and rear of the first and second finish plates of the power semiconductor assembly. A jig for handling a power semiconductor assembly for an electric vehicle, comprising: first and second finish plate supports (13, 14) supporting left and right. 청구항 1 또는 청구항 2에 있어서, 상기 전력반도체 어셈블리의 제1,2절연블 록을 관통하여 상기 베이스 플레이트에 나사 체결되는 볼트에 의해 상기 전력반도체 어셈블리가 상기 베이스 플레이트에 고정되는 구조인 것을 특징으로 하는 전동차용 전력반도체 어셈블리의 취급용 지그.The power semiconductor assembly of claim 1 or 2, wherein the power semiconductor assembly is fixed to the base plate by bolts which are screwed to the base plate through the first and second insulating blocks of the power semiconductor assembly. Jig for handling electric power semiconductor assembly. 청구항 3에 있어서, 상기 제1,2블록 지지부(11,12)는 상기 베이스 플레이트의 상면에 상호 간에 일정 간격을 두고 상부를 향해 돌출 형성되어 상기 전력반도체 어셈블리의 제1,2절연블록을 지지하는 구조인 것을 특징으로 하는 전동차용 전력반도체 어셈블리의 취급용 지그.The method of claim 3, wherein the first and second block support parts 11 and 12 are formed on the upper surface of the base plate protruding upwards at regular intervals to support the first and second insulating blocks of the power semiconductor assembly. A jig for handling an electric power semiconductor assembly for an electric vehicle, characterized by a structure. 청구항 4에 있어서, 상기 제1,2블록 지지부와 제1,2마감판 지지부 중 하나 이상은 일측이 상기 베이스 플레이트에 힌지 결합되어 자유단부가 회동하는 구조인 것을 특징으로 하는 전동차용 전력반도체 어셈블리의 취급용 지그.The power semiconductor assembly of claim 4, wherein at least one of the first and second block supports and the first and second finish plate supports has a structure in which one end is hinged to the base plate and the free end rotates. Jig for handling. 청구항 4에 있어서, 상기 제1마감판 지지부는 상기 제2블록 지지부의 상면에 상부를 향해 돌출 형성되는 구조인 것을 특징으로 하는 전동차용 전력반도체 어셈블리의 취급용 지그.The jig for handling an electric power semiconductor assembly of claim 4, wherein the first finish plate support portion protrudes upward from an upper surface of the second block support portion. 청구항 4에 있어서, 상기 제2마감판 지지부는 상기 베이스 플레이트의 상면에 상부를 향해 돌출되어 상기 전력반도체 어셈블리의 제1,2마감판의 좌우측을 지지하는 구조인 것을 특징으로 하는 전동차용 전력반도체 어셈블리의 취급용 지그.The power semiconductor assembly of claim 4, wherein the second finish plate support part protrudes upward on an upper surface of the base plate to support left and right sides of the first and second finish plates of the power semiconductor assembly. Handling jig.
KR1020080083570A 2008-08-26 2008-08-26 Jig handled in electric power semiconductor assembly of electric rail car KR100983112B1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930007327A (en) * 1991-09-16 1993-04-22 강진구 PCB fixing holder
KR200407671Y1 (en) * 2005-11-19 2006-02-01 (주)로드테크 A jig
KR20060075755A (en) * 2004-12-29 2006-07-04 엘지전자 주식회사 Jig set for assembling organic electroluminescent device kit
KR20060093751A (en) * 2005-02-22 2006-08-25 엔 하이테크 주식회사 Jig for pcb auto-soldering
JP2007059902A (en) * 2005-08-24 2007-03-08 Semikron Elektronik Gmbh & Co Kg Power semiconductor modules having fixation devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930007327A (en) * 1991-09-16 1993-04-22 강진구 PCB fixing holder
KR20060075755A (en) * 2004-12-29 2006-07-04 엘지전자 주식회사 Jig set for assembling organic electroluminescent device kit
KR20060093751A (en) * 2005-02-22 2006-08-25 엔 하이테크 주식회사 Jig for pcb auto-soldering
JP2007059902A (en) * 2005-08-24 2007-03-08 Semikron Elektronik Gmbh & Co Kg Power semiconductor modules having fixation devices
KR200407671Y1 (en) * 2005-11-19 2006-02-01 (주)로드테크 A jig

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