KR100961894B1 - Flat light source with cylindrical partition member including electrode and method for manufacturing the same - Google Patents

Abstract

According to the present invention, there is provided a surface light source device and a method of manufacturing the same, whereby a non-light emitting area is minimized and a manufacturing process thereof is simplified by inserting a circular bar-shaped partition member having a discharge electrode formed between an upper substrate and a lower substrate. According to the present invention, a partition bar member having a circular rod shape for maintaining a discharge space in the unit discharge cell by separating and supporting an upper substrate and a lower substrate covering the at least one unit discharge cell up and down, and the upper substrate and the lower substrate. And a discharge electrode formed on the partition member.

Surface light source device, partition member, electrode, non-light emitting area, dark line, chamfering, alignment

Description

FIELD OF THE INVENTION A surface light source device having a partition member in the form of a circular rod including an electrode and a method of manufacturing the same. {FLAT LIGHT SOURCE WITH CYLINDRICAL PARTITION MEMBER INCLUDING ELECTRODE AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a surface light source device in which an electrode is formed on an outer surface or an inner surface of a partition member having a circular rod shape, and a manufacturing method thereof. More specifically, the partition member is formed into a circular rod to minimize the area of contact with the upper and lower substrates, thereby eliminating the non-light emitting region, and forming a discharge electrode in a simplified process on the outer surface of the partition member to improve productivity and reduce manufacturing costs. The present invention relates to a surface light source device that can be used and a method of manufacturing the same.

A flat panel display (FPD) refers to a flat and thin display having a thickness of several centimeters (cm) and a few millimeters (mm), which corresponds to a quarter or less of the screen diagonal length. The cathode ray tube (CRT), which has the longest history among displays, is increasingly being replaced by flat panel displays which are relatively thin, light and low in power consumption due to their bulky and high power consumption.

The flat panel display is classified into a non-emissive type that requires a light source separately from an emissive type that can emit light by itself. The light emitting type includes a plasma display panel (PDP), an organic light emitting display (OLED), a field emission display (FED), and the light receiving type includes a liquid crystal display (LCD). LCDs belonging to the light-receiving type cannot display an image without an external light source, and therefore, a back light unit (BLU), which is a separate light source, is necessary. The BLU has a cold cathode fluorescent lamp (CCFL) method in which ultraviolet light emitted from mercury gas excited by electrons emitted by a high voltage electric field collides with a phosphor to generate visible light. Light sources such as an LED (light emitting device) method using a phenomenon and a flat fluorescent lamp (FFL) method for emitting light by diffusing light by ultraviolet rays generated from gas discharge are widely used.

Among them, the FFL method is a surface light source method. Compared to the CCFL method, which is a conventional light source method, only one lamp is used, which greatly reduces the number of components and enables automation of the manufacturing process of the BLU and LCD panels. It is attracting attention because it is advantageous to adopt a large LCD.

1 is a view showing an example of a surface light source device 100 according to the prior art. Specifically, FIG. 1A is a plan view showing the entire configuration of the surface light source device 100, and FIG. 1B is a cross-sectional view taken along the line AA ′ of FIG. 1A.

Referring to FIGS. 1A and 1B, the surface light source device 100 spaces and supports the upper substrate 101, the lower substrate 102, and the upper and lower substrates, and forms partition member 103a and 103b to form a unit discharge cell space. And an encapsulant 104 for sealing the upper substrate 101 and the lower substrate 102, a phosphor 105 for emitting visible light by gas discharge in the discharge cell space, an electrode 107, and the like.

The basic light emission principle of the surface light source device 100, that is, FFL, is similar to that of general fluorescent lamps. Specifically, when a voltage is applied to the pair of electrodes 107, an electric field is generated in the discharge space, and thus ultraviolet rays are emitted, and the emitted ultraviolet rays activate the phosphor 105 coated around the discharge space to display visible light. Release.

According to the conventional surface light source device 100, a pair of electrodes 107 for maintaining an electric field in the discharge space is formed on the partition member (103a, 103b) so that a pair of electrodes in the unit discharge cell face each other It is possible to implement the counter electrode structure as seen. On the other hand, the partition member 103b positioned near the outermost portion of the surface light source device 100, that is, in the vicinity of the sealant portion 104 may be formed if the electrode 107 is formed only on the surface facing the discharge cell. 107 may be formed, and the electrode 107 may be formed on both surfaces of the partition member 103a except for the same.

FIG. 2A is a process diagram illustrating a process of manufacturing such an electrode structure (that is, a structure in which electrodes 107 are formed on partition members 103a and 103b), and FIGS. 2B to 2F include the electrode structure. It is a diagram schematically showing a process of manufacturing a surface light source device.

In order to explain each step of the electrode structure manufacturing process shown in FIG. 2A, reference is made to FIGS. 2B to 2F below.

First, as shown in FIG. 2B, a plurality of metal layers 113a are formed and fired on the upper surface of the substrate 111 for fabricating the partition member (S201). Here, the metal layer 113a may be formed through screen printing or the like.

Next, as shown in FIG. 2C, the dielectric layer 113b is formed on the fired metal layer 113a and fired (S202). Here, the dielectric layer 113b may be formed by a screen printing method, a laminating method, or the like.

A protective layer (not shown) may be formed on the dielectric layer 113b by using a sputtering method, an electron beam deposition method, or the like, thereby forming the electrode 107 on the upper surface of the substrate 111.

Next, the substrate 111 is inverted in order to generate an electrode even on the lower surface of the substrate 111 (S203). At this time, the process of adjusting the alignment is essentially performed so that the electrode 107 pattern to be formed on the lower surface of the substrate 111 and the electrode 107 pattern previously formed on the upper surface of the substrate 111 are symmetric about the substrate 111. Must be (S204).

After the alignment is adjusted, the metal layer 113a is formed and calcined on the lower surface of the substrate 111 as in FIG. 2D using the same method as the electrode generation method described with reference to FIGS. 2B and 2C. After (S205) the dielectric layer 113b is formed on the metal layer 113a and fired (S206).

For reference, when manufacturing the partition member 103b positioned near the outermost portion of the surface light source device 100, the electrode 107 is formed only on one surface, so an alignment process is not required, but the partition wall positioned at the center of the unit cell is required. When the member 103a is manufactured, the electrodes 107 must be formed on both sides of the partition member 103a. Therefore, the substrate 111 must be cut only by matching the positions of the electrodes 107 to be formed on both sides by the alignment process. When it is possible to implement a desirable double-sided electrode structure.

Meanwhile, as a next step, as shown in FIG. 2E, the plurality of partition members 103a and 103b may be obtained by cutting the substrate 111 in parallel to the respective electrode patterns (S207) and then cutting. A chamfering process may be performed to soften the surface (S208).

Thereafter, the bulkhead members 103a and 103b produced in a large amount by the cutting and chamfering process are inserted between the lower substrate 101 and the upper substrate 102 of the surface light source device 100 as shown in FIG. 2F. After assembly, the manufacturing of the surface light source device 100 is completed.

The problems present in the conventional method of manufacturing the surface light source device 100 are summarized as follows.

In the conventional method for manufacturing the surface light source device 100, the electrode 107 is formed on the lower surface after forming the electrode 107 on the substrate in order to manufacture the partition member 103a having the electrodes 107 formed on both surfaces as described above. In this case, an alignment process is required to match the arrangement of the electrode 107 formed on the upper surface of the substrate and the electrode 107 formed on the lower surface of the substrate, which increases the number of processes and incurs costs. If phosphorus is not properly formed, there is a problem that difficulty in generating the electrode structure occurs.

In addition, if the substrate 111 is cut after the formation of the electrode 107, the cut surface is formed parallel to the pattern of the electrode 107 extending long, so the area of the cut surface will be considerably wider, thereby chamfering the process. There was a problem that it takes a lot of effort, time and money to carry out.

On the other hand, the problems present in the structure itself of the surface light source device 100 is summarized as follows.

The structure of the conventional surface light source device 100 is due to the presence of the partition members 103a and 103b when viewed from the front surface of the upper substrate 101 from which visible light generated by activation of the phosphor 105 is emitted. Due to this, there is a problem that a region (dark line) where visible light cannot be emitted may appear in a very large area. That is, since the ultraviolet light cannot activate the phosphor 105 in the region where the partition members 103a and 103b are formed, non-emission is not performed in the upper part of the region where the partition members 103a and 103b exist. Since a region may be generated, there is a problem in that the discharge uniformity of the surface light source device 100 is inferior.

Meanwhile, in order to eliminate the non-light emitting area, a method of covering the non-light emitting area by diffusely reflecting visible light by disposing a diffuser plate, a diffusion sheet, a diffusion film, or a prism sheet on the surface light source device 100 is conventionally disclosed. Although mainly used, this also has a problem of increasing the manufacturing cost of the surface light source device and the complexity of the process due to the additional arrangement of the components.

Accordingly, there is a demand for development of a surface light source device which can minimize a non-light emitting area and can be manufactured at low cost.

The present invention is to solve the problems of the prior art as described above, by providing a surface light source device having a non-light emitting area by minimizing the area of the partition member and the upper and lower substrates in the form of a circular bar partition member of the surface light source device. For that purpose.

In addition, another object of the present invention, in the manufacturing method of the surface light source device, by forming the electrode of the surface light source device on the outer surface or the inner surface of the partition member in the form of a circular rod to eliminate the alignment process that has been essential to the conventional electrode formation. It is possible to provide a method for manufacturing a surface light source device that can improve productivity and reduce manufacturing cost.

Further, another object of the present invention, in the manufacturing method of the surface light source device, it is possible to manufacture the partition member including the electrode structure only by the step of cutting a circular bar having an electrode formed on the outer surface or the inner surface to a certain size, In this case, since the area of the cut surface is narrowed, the cutting process and the chamfering process for the cut surface are simplified, thereby providing a method of manufacturing a surface light source device that can improve its productivity and reduce manufacturing cost.

In addition, another object of the present invention, since the electrode of the surface light source device can be continuously formed on the outer surface or the inner surface of the circular rod-shaped partition member to be drawn (drawing) and then cut to a certain size, continuous production is possible To improve productivity.

In order to achieve the object of the present invention as described above, and to perform the characteristic functions of the present invention described below, the characteristic configuration of the present invention is as follows.

According to an aspect of the present invention, the upper and lower substrates covering at least one unit discharge cell up and down, a circular rod shape to maintain the discharge space in the unit discharge cells by separating and supporting the upper substrate and the lower substrate Provided is a surface light source device including a partition member and a discharge electrode formed on the partition member.

According to another aspect of the present invention, a hollow circular shape which maintains a discharge space in the unit discharge cell by separating and supporting an upper substrate and a lower substrate covering the at least one unit discharge cell up and down, and the upper substrate and the lower substrate. Provided is a surface light source device including a pipe-shaped partition wall member and a discharge electrode formed inside the partition wall member.

According to another aspect of the method, a barrier member for maintaining a discharge space in the unit discharge cell by separating and supporting the upper substrate and the lower substrate covering the at least one unit discharge cell up and down, and the upper substrate and the lower substrate; A method of manufacturing a light source device comprising: (a) providing the partition member in the form of a circular rod, (b) forming a discharge electrode on an outer surface of the partition member, and (c) forming the partition member Provided is a method of manufacturing a surface light source device comprising the step of inserting between the upper substrate and the lower substrate.

According to another aspect of the method, a barrier member for maintaining a discharge space in the unit discharge cell by separating and supporting the upper substrate and the lower substrate covering the at least one unit discharge cell up and down, and the upper substrate and the lower substrate; A method of manufacturing a light source device, comprising: (a) providing the partition member in the form of a hollow circular pipe, (b) forming a discharge electrode on an inner surface of the partition member, and (c) the partition wall A method of manufacturing a surface light source device is provided, comprising inserting a member between the upper substrate and the lower substrate.

In the surface light source device according to the present invention, as the partition member is formed in the shape of a circular rod, the area where the partition member is in contact with the upper and lower substrates may be minimized, thereby reducing the non-light-emitting region, and thus the luminance uniformity of the surface light source device may be reduced. It can be improved.

In addition, in the method for manufacturing a surface light source device according to the present invention, by forming an electrode on a partition member having a circular rod shape, the alignment process, which is an essential step for conventional electrode formation, can be omitted, and the upper surface of the substrate and the lower surface of the substrate Since the entire surface can be formed at one time without having to separately perform the electrode forming process , the process can be simplified and productivity can be improved.

In addition, in the manufacturing method of the surface light source device according to the present invention, the partition member and the electrode of the surface light source device can be manufactured only by cutting the electrode formed on the partition member of the circular rod shape to a certain size, in this case cutting Since the area of the cut surface becomes narrower, the chamfering process for the cutting surface can be simplified. Therefore, the productivity of the surface light source device can be improved and the manufacturing cost thereof can also be reduced.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of the present invention.

3 is a cross-sectional view showing the configuration of a surface light source device 200 according to an embodiment of the present invention.

Referring to FIG. 3, the surface light source device 200 supports the upper substrate 210, the lower substrate 220, and spaces apart from and supports the upper substrate 210 and the lower substrate 220 to form a unit discharge space. 230, the encapsulant 240 sealing the upper substrate 210 and the lower substrate 220, a discharge electrode 250 generating an electric field for discharging the discharge gas in the discharge cell space, and visible light by the gas discharge. Emitting phosphor 270 and the like.

The surface light source device 200 is composed of at least one discharge cell, and for convenience of description, the surface light source device 200 will be described with reference to one unit discharge cell as an example.

In the surface light source device 200 according to the present invention, the partition member 230 is formed in a circular bar shape, and the discharge electrode 250 generating an electric field in the discharge space is formed on an outer surface of the partition member 230. It is done. The discharge electrodes 250 are formed on the outer surface of the barrier rib members 230 arranged side by side to form a counter electrode structure in which the discharge electrodes 250 formed on the neighboring barrier rib members 230 face each other in the unit discharge cell. It becomes possible.

On the other hand, as shown in Figure 3, the discharge electrode 250 may include a metal layer 251 and the dielectric layer 253, the metal layer 251 may be formed in a manner surrounding the outer surface of the partition member 230 The dielectric layer 253 may be formed to surround the outer surface of the metal layer 251. Meanwhile, a protective layer (not shown) for protecting the electrode layer 251 and the dielectric layer 253 may be further formed on the dielectric layer 253.

Meanwhile, in FIG. 3, the case in which the partition member 230 is a circular rod filled with solid inside is not limited thereto. In a modified embodiment, the partition member 230 may be in the form of a hollow pipe or a hollow tube. Of course.

In this case, the metal layer 251 may be formed on the inner wall of the partition member 230 or may be formed to fill an inner space of the partition member 230. In this case, the dielectric layer 253 may be formed to surround the outer surface of the partition member 230.

In addition, as another modified embodiment, the metal layer 251 may be formed to surround the outer surface of the partition member 230 even when the partition member 230 is in the form of a hollow pipe or a hollow tube. In this case, the dielectric layer 253 may be formed to surround the metal layer 251.

The light emitting process of the surface light source device 200 will be described below. First, when an appropriate voltage is applied to the discharge electrode 250 on the partition member 230, partial discharge starts. When the voltage is applied for a sufficient time, the discharge electrodes 250 that face each other in the unit discharge cell are separated. A thin band-shaped initial discharge path is formed. When the applied voltage is increased after the initial discharge path is formed, the discharge path extends in the vertical direction in the space between the electrodes, and the expanded discharge path merges with the adjacent discharge paths to fill the discharge space to form a uniform front discharge.

On the other hand, in the conventional surface light source device during the light emission, since the phosphor 270 is not formed in the region where the partition member 230 is located, visible light emitted from the phosphor 270 as a result is the upper substrate 210. When passing through), a non-light emitting area (dark line) may be formed in an upper portion of the area where the partition member 230 is located.

However, since the partition member 230 of the surface light source device 200 of the present invention has a circular rod shape, as shown in FIG. 3, the area where the partition member 230 is in contact with the upper substrate 210 and the lower substrate 220 may be increased. Is minimized. As a result, the non-emission region generated due to the phosphor 270 not positioned disappears, and uniformity of discharge is secured. In addition, it is possible to minimize the use of a diffusion sheet, an optical film, or the like disposed to compensate for non-uniform brightness of the surface light source device due to the non-light emitting area.

Hereinafter, a manufacturing process of the partition member 230 including the discharge electrode 250 of the surface light source device 200 will be described with reference to FIGS. 4 and 5.

4 is a process diagram illustrating a process of manufacturing the partition member 230 according to the present invention, and FIGS. 5A to 5D schematically illustrate an example of the partition member 230 manufactured by the process of FIG. 4 according to the present invention. Drawing.

First, as shown in FIG. 5A, a circular rod 310 to be used as the partition member 230 is prepared (S401), and a metal layer 251 is formed on the outer surface of the circular rod 310 by coating and fired. (S402).

Here, the circular rod 310 may be made of an insulating material such as a glass rod. Meanwhile, the metal layer 251 may be made of a conductive material such as pure metal, alloy, metal compound, carbon, but is not limited thereto.

In step S402, the metal layer 251 may be formed using a known coating method. For example, a dip coating method that may thickly coat the metal layer 251 to a predetermined thickness or more may be used, but is not limited thereto.

Next, as shown in FIG. 5B, the dielectric layer 253 is formed on the metal layer 251 by coating and fired (S403).

Specifically, the dielectric layer 253 is formed to surround the outer surface of the metal layer 251, the dielectric layer 253 is preferably made of a material having a high dielectric constant and excellent polarization characteristics. In addition, the dielectric layer 253 may also be formed by a known coating method such as a dip coating method, but is not limited thereto.

After the dielectric layer 253 is formed, a process of forming a protective layer (not shown) for protecting the metal layer 251 and the dielectric layer 253 may be further performed on the dielectric layer 253.

After the discharge electrode 250 including the metal layer 251 and the dielectric layer 253 is formed on the outer surface of the circular rod 310 for the partition member 230, the circular rod 310 is formed as shown in FIG. 5C. By cutting to a predetermined size, the partition member 230 in which the discharge electrode 250 is formed is completed (S404).

For example, according to the step S404, when manufacturing the partition member 230 to be arranged in the horizontal direction in the unit discharge cell in the surface light source device 200 to cut to an appropriate size to fit the horizontal length of the surface light source device, the vertical direction When manufacturing the partition member 230 to be disposed in accordance with the longitudinal length of the surface light source device may be cut. The cutting may be performed by a cutting method using a diamond or tungsten alloy material saw, a high pressure water jet cutting method, or a laser cutting method, but is not limited thereto.

The order of manufacturing steps described with reference to FIGS. 4 and 5A to 5C may be reversed. For example, after cutting the circular rod 310 to the length of the desired partition member 230, the metal layer 251 and the dielectric layer 253 may be formed, or the metal layer 251 is formed on the outer surface of the circular rod 310. The dielectric layer 253 may be formed after cutting to a predetermined size.

On the other hand, after the cutting process as shown in Figure 5c, a chamfering process for smoothing the cutting surface by the cutting is performed. In this case, since the cut surface is only a small circular portion, the area subject to the chamfering process is reduced.

The bulkhead member 230 produced in a large amount by this method is inserted between the upper substrate 210 and the lower substrate 220 of the surface light source device 200, as shown in FIG. 5D, and then assembled. 200 can be completed.

Up to now, the case where the discharge electrode 250 is formed outside the partition member 230 has been described as an example, but the discharge electrode 250 is formed inside the hollow tube-shaped partition member 230 as shown in FIG. 6. In the case of forming it may be similarly applied, detailed description thereof will be omitted. However, the peculiarity of manufacturing the partition member in the form of a hollow tube is that the partition member may serve as a dielectric, so that the partition member having the discharge electrode can be manufactured simply by forming a metal layer therein. Is there.

On the other hand, according to the manufacturing method as described above, the bulkhead member 230 having the discharge electrode 250 is formed in a large amount by only forming the metal layer 251 and the dielectric layer 253 on the long circular rod 310. Because it can be produced as, the productivity of the surface light source device can be improved and the manufacturing cost can be reduced.

In addition, since only the metal layer 251 and the dielectric layer 253 surrounding the circular bar 310 are formed on the circular rod 310, the barrier member 230 capable of both functions as the discharge electrode 250 can be obtained. The alignment process, which was necessary for the formation of the discharge electrode of the conventional surface light source device, is unnecessary, and the process can be simplified.

In addition, in the conventional surface light source device, since the electrode patterns were formed on both sides or one surface of the substrate for fabricating the partition member side by side and then cut along the long formed electrode pattern to obtain the partition member, the cutting length is also lengthened according to the length of the electrode pattern. In this case, the area of the cutting surface to be chamfered is also increased, but according to the manufacturing method of the present invention, the circular bar 310 having the metal layer 251 and the dielectric layer 253 formed thereon is cut in a direction perpendicular to the longitudinal direction. If only the partition member 230 including the discharge electrode 250 is obtained, the area of the cutting surface is small, thereby simplifying the cutting process.

In addition, since the discharge electrode can be continuously formed on the outer surface or the inner surface of the circular bar-shaped partition member to be drawn and cut to a predetermined size, continuous production is possible and productivity can be improved.

The present invention has been described so far with respect to the surface light source device, but is not necessarily limited thereto, and includes a unique partition member, that is, a circular rod-shaped partition member including a discharge electrode. It goes without saying that the light source apparatus may also have the right scope of the present invention.

In the present invention as described above has been described by the specific embodiments, such as specific components and limited embodiments and drawings, but this is provided to help a more general understanding of the present invention, the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations are possible from these descriptions.

Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and all of the equivalents or equivalents of the claims, as well as the claims described below, belong to the scope of the present invention. something to do.

1A is a plan view showing the overall configuration of a surface light source device according to the prior art.

1B is a cross-sectional view taken along the line AA ′ of the surface light source device of FIG. 1A;

FIG. 2A is a flowchart illustrating a process of manufacturing a partition member including the electrode structure of FIG. 1. FIG.

2B to 2F are exemplary views illustrating a process of manufacturing the surface light source device of FIG. 1 step by step.

3 is a cross-sectional view showing the configuration of a surface light source device according to an embodiment of the present invention.

4 is a flowchart illustrating a process of manufacturing a partition member including the electrode structure of FIG. 3.

5A to 5D are views illustrating a process of manufacturing the surface light source device of FIG. 3.

6 is an illustration of a partition member in which a metal layer is formed inside a partition member having a tube shape, and the partition member serves as a dielectric.

<Description of the symbols for the main parts of the drawings>

200: surface light source device 210: upper substrate

220: lower substrate 230: partition member

250: discharge electrode 251: metal layer

      253 dielectric layer 240 encapsulant

      270: phosphor

Claims (18)

An upper substrate and a lower substrate covering the at least one unit discharge cell up and down; A partition member having a circular rod shape to space and support the upper substrate and the lower substrate to maintain a discharge space in the unit discharge cell; Including a discharge electrode formed on the partition member, The discharge electrode, A metal layer surrounding an outer surface of the partition member, and Surface light source device comprising a dielectric layer surrounding the outer surface of the metal layer. delete The method of claim 1, The discharge electrode, Surface protection device further comprises a protective layer surrounding the dielectric layer. The method of claim 1, The metal layer is a surface light source device, characterized in that the conductive material containing at least one of metal, alloy, metal compound, carbon. The method of claim 1, A cross section of the partition member is a surface light source device, characterized in that the circular cross section or hollow pipe cross section. delete delete delete An upper substrate and a lower substrate covering the at least one unit discharge cell up and down, and In the manufacturing method of the light source device including a partition member for separating and supporting the upper substrate and the lower substrate to maintain the discharge space in the unit discharge cell, (a) providing the partition member in the form of a circular rod, (b) forming a discharge electrode on an outer surface of the partition member, and (c) inserting the partition member between the upper substrate and the lower substrate, In step (b), Forming a metal layer on an outer surface of the partition member, and Forming a dielectric layer on the outer surface of the metal layer, characterized in that the manufacturing method of the surface light source device. delete 10. The method of claim 9, In step (b), Forming a protective layer on the outer surface of the dielectric layer further comprising the manufacturing method of the surface light source device. 10. The method of claim 9, In step (b), And cutting the partition member on which the metal layer and the dielectric layer are formed to a predetermined size. The method of claim 12, In step (c), The cut partition member is inserted between the upper substrate and the lower substrate manufacturing method of the surface light source device. The method of claim 12, The cutting may be performed by at least one of a cutting method using a diamond or tungsten alloy material saw, a high pressure water jet cutting method, and a laser cutting method. Way. The method of claim 12, In step (b), And chamfering a cut surface of the cut partition member. 10. The method of claim 9, In step (b), The forming of the metal layer and the forming of the dielectric layer are performed by a dip coating method. 10. The method of claim 9, In the step (a), The partition member is a method of manufacturing a surface light source device, characterized in that provided in at least one of the form of a hollow circular rod or a hollow circular pipe. delete

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