KR100957068B1 - Silicon mold and the method of manufacturing key pad rubber using the same - Google Patents

Silicon mold and the method of manufacturing key pad rubber using the same Download PDF

Info

Publication number
KR100957068B1
KR100957068B1 KR1020090093141A KR20090093141A KR100957068B1 KR 100957068 B1 KR100957068 B1 KR 100957068B1 KR 1020090093141 A KR1020090093141 A KR 1020090093141A KR 20090093141 A KR20090093141 A KR 20090093141A KR 100957068 B1 KR100957068 B1 KR 100957068B1
Authority
KR
South Korea
Prior art keywords
forming
keypad
mold
silicon
manufacturing
Prior art date
Application number
KR1020090093141A
Other languages
Korean (ko)
Inventor
최한식
Original Assignee
(주)파이온
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)파이온 filed Critical (주)파이온
Priority to KR1020090093141A priority Critical patent/KR100957068B1/en
Application granted granted Critical
Publication of KR100957068B1 publication Critical patent/KR100957068B1/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/58Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/40Moulds for making articles of definite length, i.e. discrete articles with means for cutting the article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/189Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the parts being joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/58Measuring, controlling or regulating
    • B29C2043/5816Measuring, controlling or regulating temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/46Knobs or handles, push-buttons, grips
    • B29L2031/466Keypads, keytops

Abstract

PURPOSE: A silicon mold for manufacturing a key pad and manufacturing method for keypad rubber using the same is provided to prevent scratch of a film cloth by easily separating a film sheet from a mold and reduce costs of manufacturing a metal mold by using silicon instead of metal. CONSTITUTION: A silicon mold of manufacturing a key pad comprises upper and lower molds(100,200) which include a heater plate(140, 230) and a heat sensor(160,260). A silicon forming pad(280) is formed on the lower mold and a pattern for a keypad molding is formed on the silicon forming pad. A groove, which is formed corresponding to the pattern for the keypad molding of the silicon forming pad, is formed on the bottom surface of the upper mold. A keypad film is shaped through hot pressing using the silicon forming pad.

Description

키패드 제조용 실리콘 금형 및 이를 이용한 키패드 러버의 제조 방법{Silicon mold and the method of manufacturing key pad rubber using the same}Silicon mold and the method of manufacturing key pad rubber using the same}

본 발명은 키패드 제조용 실리콘 금형 및 이를 이용한 키패드 러버의 제조 방법에 관한 것으로서, 더욱 상세하게는 키패드 러버 제조에 사용되는 포밍 금형을 실리콘으로 형성함으로써 종래의 메탈 금형의 열편차로 인해 발생되었던 포밍 변형 및 표면 주름 발생을 줄여 키패드 러버의 생산성 증대와 제품의 불량률을 감소시킬 수 있는 키패드 제조용 실리콘 금형 및 이를 이용한 키패드 러버의 제조 방법에 관한 것이다.The present invention relates to a silicone mold for manufacturing a keypad and a method for manufacturing a keypad rubber using the same, and more particularly, by forming a forming mold used for manufacturing a keypad rubber with silicon, forming deformation and surface generated due to thermal deviation of a conventional metal mold. The present invention relates to a silicone mold for manufacturing a keypad capable of reducing productivity of a keypad rubber and reducing a defect rate of a product by reducing wrinkles, and a method of manufacturing a keypad rubber using the same.

최근 통신기술의 급속한 발전으로 인해 휴대폰, PDA 등 다양한 통신장비들이 출시되고 있으며, 이러한 통신장비들은 수요자의 다양한 요구에 따라 경량화 및 경박화되고 있는 추세이다.Recently, due to the rapid development of communication technology, various communication devices such as mobile phones and PDAs are being released, and these communication devices are becoming lighter and lighter according to various demands of consumers.

이러한 통신 장비들은 신호 발생을 위한 스위칭 장치로서 키패드를 구비하고 있으며, 상기 키패드는 사용자가 용이하게 터치하여 원하는 기능을 입력할 수 있도록 표면으로 돌출된 키가 구비되어 있고, 이러한 키에는 사용자가 용이하게 작동기 능을 식별하여 선택할 수 있도록 문자나 도형이 표시되어 있다.Such communication equipment includes a keypad as a switching device for signal generation, and the keypad is provided with a key protruding to the surface so that the user can easily touch and input a desired function. Characters or figures are displayed to identify and select operating functions.

통상 핸드폰에 사용되어지는 키패드는 투명하고 터치감과 탄성복원력이 우수한 폴리우레탄으로 된 필름원단을 철(凸)부형태를 갖도록 포밍성형하고, 포밍성형된 부분에 실리콘을 충진 한 후, 접촉돌기를 성형하여 회로기판의 구비된 단자에 선택적으로 접속되어지도록 구성되어 있다.The keypad used in mobile phones is formed by forming a film fabric made of polyurethane, which is transparent and has excellent touch feeling and elasticity resilience to have an iron part shape, and after filling the formed part with silicon, forming contact protrusions. The circuit board is configured to be selectively connected to terminals provided on the circuit board.

이러한 키패드를 제조하기 위해서는 폴리우레탄으로 된 필름원단에 문자 또는 숫자를 인쇄하는 인쇄공정과, 필름원단을 철부형태의 키돌출부를 갖도록 포밍시키는 포밍공정, 필름원단의 키돌출부 내부에 실리콘을 압착시키는 성형공정 및 컷팅공정을 거치게 된다.In order to manufacture such a keypad, a printing process for printing letters or numbers on a film fabric made of polyurethane, a forming process for forming the film fabric to have a key protrusion in the form of a convex portion, and a molding process for pressing silicon into the key protrusion of the film fabric It goes through the process and cutting process.

이때, 포밍공정은 실리콘을 필름원단에 압착시키는 성형공정 이전에 이루어지는 공정으로서, 실리콘 성형 작업시 키패드에 실리콘이 충진되는 공간을 형성할 수 있도록 필름원단을 가열압착하여 철부형상을 만들어 주는 공정이다. 따라서 약간의 온도 편차나 위치 틀어짐이 발생하여도 실리콘이 충진될 위치가 틀어지게 됨으로써 키패드의 문안 틀어짐이 발생하게 된다.In this case, the forming process is a process made before the molding process of pressing silicon onto the film fabric, and is a process of making the iron shape by heat-compressing the film fabric to form a space filled with silicon on the keypad during the silicon molding operation. Therefore, even if a slight temperature deviation or position shift occurs, the position of the silicon filling becomes distorted, causing the text of the keypad to be distorted.

그러나 종래의 포밍공정은 금속재를 절삭가공하여 제작된 메탈 금형에 의해 수행됨으로써, 공정이 진행됨에 따라 메탈 금형 내의 온도 편차가 심하였다. 이러한 열편차로 인하여 키패드 제조 시 도 1의 (a)에 도시된 바와 같은 형상 위치 틀어짐 및 포밍 주름 불량 발생 빈도가 높게 나타났으며, 또한 메탈 금형 면에 필름원단이 접착되어 쉽게 분리되지 않아 다량의 불량품이 발생하는 문제점이 있었다.However, the conventional forming process is performed by a metal mold manufactured by cutting a metal material, so that the temperature variation in the metal mold is severe as the process proceeds. Due to such thermal deviation, the frequency of shape position distortion and foaming wrinkle defects was high when the keypad was manufactured, as shown in FIG. 1 (a). Also, a film fabric adhered to the metal mold surface, which was not easily separated, resulting in a large amount of defective products. There was a problem that occurred.

본 발명은 상기한 종래 기술에 따른 문제점을 해결하기 위한 것이다. 즉, 본 발명의 목적은, 키패드 러버 제조에 사용되는 포밍 금형을 실리콘으로 형성함으로써 종래의 메탈 금형의 열편차로 인해 발생되었던 포밍 변형 및 표면 주름 발생을 줄여 키패드 러버의 생산성 증대와 제품의 불량률을 감소시킬 수 있는 키패드 제조용 실리콘 금형 및 이를 이용한 키패드 러버의 제조 방법을 제공함에 있다.The present invention is to solve the above problems according to the prior art. That is, an object of the present invention is to form a forming mold used in the manufacture of keypad rubber with silicon to reduce the forming deformation and surface wrinkles caused by the thermal deviation of the conventional metal mold to increase the productivity of the keypad rubber and reduce the defective rate of the product The present invention provides a silicone mold for manufacturing a keypad and a method of manufacturing a keypad rubber using the same.

상기의 목적을 달성하기 위한 기술적 사상으로서 본 발명은, 열히터판과 열센서를 포함하여 구성된 상단금형부와, 열히터판과 열센서를 포함하여 구성된 하단금형부를 포함하여 구성되되, 상기 하단금형부의 상면에는 실리콘으로 제조되어, 상면에 키패드 성형용 패턴이 형성된 실리콘 포밍 패드가 장착되고, 상기 상단금형부의 하면에는 상기 하단금형부에 장착된 실리콘 포밍 패드에 형성된 키패드 성형용 패턴에 대응되는 형상의 홈이 형성되도록 구성함으로써, 실리콘 포밍 패드를 이용한 가열압착을 통해 키패드용 필름원단을 성형하는 것을 특징으로 하는 키패드 제조용 실리콘 금형을 제공한다.As a technical idea for achieving the above object, the present invention comprises a top mold portion comprising a heat heater plate and a thermal sensor, and a bottom mold portion comprising a heat heater plate and a thermal sensor, the bottom mold The upper surface of the part is made of silicon, the silicon forming pad is formed on the upper surface is formed with a pattern for forming the keypad, the lower surface of the upper mold portion of the shape corresponding to the keypad forming pattern formed on the silicon forming pad mounted on the lower mold portion The groove is formed to provide a silicone mold for keypad production, characterized in that the film fabric for the keypad is formed by hot pressing using a silicon forming pad.

또한, 본 발명은 필름원단 표면 및 배면에 인쇄층을 형성하는 필름인쇄 공정과, 인쇄된 필름원단에 금형을 이용한 가열압착을 통해 키돌출부를 성형시키는 포밍공정과, 인쇄된 필름 저면에 액상 실리콘을 충진 한 후, 가열압착을 통해 키돌출부 저면에 누름돌기, 연결리브 및 접촉돌기를 형성하는 성형공정과, 필름 표면에 코팅층을 형성하는 코팅공정과, 제품의 형상에 따라 테두리를 절단하는 컷팅공정을 포함하여 구성되되, 상기 포밍공정은 상면에 키패드 성형용 패턴이 형성된 실리콘 포밍 패드를 금형으로 사용하여 키돌출부를 성형시킴으로써 키패드의 포밍변형 및 표면 주름 발생을 방지하는 것을 특징으로 하는 키패드 러버의 제조방법을 제공한다.In addition, the present invention provides a film printing process for forming a print layer on the surface and the back of the film fabric, a forming process for forming a key projection by heating and pressing using a mold on the printed film fabric, and a liquid silicone on the bottom of the printed film After filling, the molding process of forming pressing protrusions, connecting ribs and contact protrusions on the bottom of the key protrusion through heating and pressing, the coating process of forming a coating layer on the film surface, and the cutting process of cutting the edges according to the shape of the product It is configured to include, wherein the forming process is a method of manufacturing a keypad rubber, characterized in that the forming of the key protrusion by using a silicon forming pad formed with a keypad forming pattern on the upper surface as a mold to prevent the deformation of the keypad and the occurrence of surface wrinkles To provide.

본 발명에 따른 키패드 제조용 실리콘 금형 및 이를 이용한 키패드 러버의 제조 방법은, 메탈금형의 열편차로 인해 발생되었던 포밍 변형 및 표면 주름 발생을 줄일 수 있으며, 필름원단이 금형에서 쉽게 분리되어 기존에 메탈금형과의 마찰로 인해 발생되는 필름원단의 스크래치 현상이 발생되지 않아 키패드 러버의 생산성 증대와 제품의 불량률을 감소시킬 수 있다. According to the present invention, a method for manufacturing a silicon mold for a keypad and a keypad rubber using the same can reduce the forming deformation and the surface wrinkles caused by the heat deviation of the metal mold, and the film fabric is easily separated from the mold, and thus the metal mold and Scratch of the film fabric caused by the friction of the does not occur, it is possible to increase the productivity of the keypad rubber and reduce the defective rate of the product.

더불어, 금속재를 절삭가공하여 제작되는 메탈 금형에 비해 실리콘은 단가가 저렴할뿐만 아니라 절삭가공이 용이하여 금형 제작에 소요되는 시간과 비용을 절감할 수 있는 효과가 있다.In addition, compared to the metal mold produced by cutting the metal material, the silicon is not only inexpensive, but also easy to cut, thereby reducing the time and cost required to manufacture the mold.

이하, 본 발명의 바람직한 실시예를 첨부 도면에 의거하여 상세하게 설명하기로 한다. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 일실시예에 따른 키패드 제조용 실리콘 금형의 개략적인 구성도이며, 도 3은 본 발명의 일실시예에 따른 키패드 제조용 실리콘 금형을 이용한 포밍 공정의 예시도이다.2 is a schematic configuration diagram of a silicone mold for manufacturing a keypad according to an embodiment of the present invention, Figure 3 is an illustration of a forming process using a silicone mold for manufacturing a keypad according to an embodiment of the present invention.

도 2에 도시된 바와 같이, 본 발명의 키패드 제조용 실리콘 금형은 크게 상단금형부(100)와 하단금형부(200)로 구성된다. As shown in FIG. 2, the silicone mold for manufacturing a keypad of the present invention is largely composed of an upper mold part 100 and a lower mold part 200.

상단금형부(100)는 상측부터 키패드 제조용 실리콘 금형의 온도 편차 유지관 리 및 포밍을 제어하는 포밍기(미도시)에 접속 고정되는 싱크(110)와, 상단 홀더(120), 상단 단열판(130), 상단 열히터판(140), 상단 열센서(160), 상단 다이(150)순으로 장착되고, 장착된 장치들을 고정 및 결합시키는 상단 가이드핀(170)을 포함하여 구성된다. The upper mold part 100 has a sink 110 connected to and fixed to a forming machine (not shown) for controlling temperature deviation management and forming of the silicon mold for keypad manufacturing from the upper side, the upper holder 120, and the upper insulation plate 130. ), The upper thermal heater plate 140, the upper thermal sensor 160, the upper die 150 is mounted in order, and comprises a top guide pin 170 for fixing and coupling the mounted devices.

하단금형부(200)는 하측부터 하단 홀더(210), 하단 단열판(220), 하단 열히터판(230), 하단 열센서(260), 하단 고정판(240), 포밍 금형판(250)으로 장착되고, 장착된 장치들을 고정 및 결합시키는 하단 가이드핀(270)을 포함하여 구성된다. 더불어 포밍 금형판(250)의 상면 중앙에는 실리콘이 절삭 가공되어 제작된 실리콘 포밍 패드(280)가 장착되어 있으며, 상단 다이(150)에는 필름원단을 가열압착하기 위해 상단금형부(100)가 하단금형부(200)에 안착될 때 하단에 장착된 실리콘 포밍 패드(280)가 상단 다이(150)에 들어갈 수 있도록 실리콘 포밍 패드 형태의 홈(180)이 형성되어 있다.The lower mold part 200 is mounted from the lower side to the lower holder 210, the lower heat insulation plate 220, the lower heat heater plate 230, the lower heat sensor 260, the lower fixing plate 240, and the forming mold plate 250. And a lower guide pin 270 that fixes and couples the mounted devices. In addition, a silicon forming pad 280 formed by cutting silicon is mounted at the center of the upper surface of the forming die plate 250, and the upper die part 150 has a lower end portion 100 on the upper die 150 to heat-compress the film fabric. When seated on the mold unit 200, a silicon forming pad groove 180 is formed to allow the silicon forming pad 280 mounted on the lower portion to enter the upper die 150.

실리콘 포밍 패드(280)는 실리콘으로 제작되며, 상면에는 원하는 키패드의 배열에 따라 필름원단에 철부형태의 키돌출부가 성형되어질 수 있도록 구성된 키패드 성형철부가 형성되어 있다. 따라서 도 3의 (a)에 도시된 바와 같이 필름원단(300)이 하단금형부 상면에 장착된 실리콘 포밍 패드(280)와 상단금형부의 상단 다이(150) 사이에서 도 3의 (b)에 도시된 바와 같이 가열압착 되어짐으로써 필름원단(300)에 철부형상의 키돌출부가 성형된다. The silicon forming pad 280 is made of silicon, and the upper surface is formed with a keypad-formed convex portion configured to form a convex-shaped key protrusion in the film fabric according to a desired arrangement of the keypad. Accordingly, as shown in FIG. 3A, the film fabric 300 is shown in FIG. 3B between the silicon forming pad 280 mounted on the upper surface of the lower mold and the upper die 150 of the upper mold. As described above, the iron protrusion-shaped key protrusion is formed on the film fabric 300 by being hot pressed.

상단 및 하단의 열센서(160, 260)는 각각 상단금형부(100)와 하단금형부(200)의 온도를 감지하여 포밍기로 전달하고, 포밍기는 전달받은 온도에 따라 상 단 및 하단의 열히터판(140, 230)의 온도를 조절함으로써 키패드 제조용 실리콘 금형의 온도를 유지관리한다.The upper and lower thermal sensors 160 and 260 sense the temperature of the upper mold part 100 and the lower mold part 200, respectively, and transmit the detected temperature to the forming machine, and the forming machine heats the upper and lower parts according to the received temperature. By controlling the temperature of the plate (140, 230) to maintain the temperature of the silicon mold for keypad manufacturing.

더불어, 키패드 제조용 실리콘 금형에 장착되는 포밍 금형판(250)의 네 모서리에는 상단 다이(150)에 형성된 핀구멍(190)에 끼워지는 세팅핀(290)이 사각형태를 이루며 분포되어 있다. 상기 세팅핀(290)은 필름원단을 가열압착하기 위해 상단금형부(100)가 하단금형부(200)에 안착될 때 정확한 위치에 안착되어질 수 있게 한다.In addition, at four corners of the forming die plate 250 mounted on the silicon mold for manufacturing a keypad, a setting pin 290 fitted into the pin hole 190 formed in the upper die 150 is distributed in a rectangular shape. The setting pin 290 may be seated in the correct position when the upper mold portion 100 is seated on the lower mold portion 200 to heat-compress the film fabric.

앞에서 설명한 바와 같이, 종래의 키패드 성형에 있어서는 포밍패드를 메탈 재질로 형성함으로써, 포밍패드를 구성하는 메탈 금형 내의 열편차가 매우 컸으며, 이와 같은 열편차가 그대로 필름원단에 전이되어 앞서 도시된 도 1의 (a)와 같이 포밍 변형 및 틀어짐이 발생되었다. 이에 비해 본 발명에서와 같이 실리콘으로 제조된 포밍 패드를 사용하여 포밍공정을 수행할 경우, 포밍 패드에 열이 전체적으로 균일하게 분포되어 열편차가 작으며, 이에 따라 도 1의 (b)에서와 같이 포밍 변형 및 표면 주름 발생을 최소화 할 수 있다. As described above, in the conventional keypad molding, by forming the forming pad with a metal material, the thermal deviation in the metal mold constituting the forming pad is very large, and the thermal deviation is transferred to the film fabric as it is, and thus, FIG. Forming deformation and distortion occurred as shown in (a). On the other hand, when the forming process is performed using a forming pad made of silicon as in the present invention, heat is uniformly distributed on the forming pad and the thermal deviation is small, thus forming as shown in FIG. Deformation and surface wrinkles can be minimized.

또한, 실리콘은 그 재질 자체가 다른 재료와의 상용성이 매우 작아, 결합력이 거의 없는 특성으로 인해, 필름원단이 실리콘 포밍 패드에서 쉽게 분리되며, 기존의 메탈금형과의 마찰로 인해 발생되었던 필름원단의 스크래치(Scratch) 발생현상 역시 현저하게 줄일 수 있다.In addition, the silicon itself has very low compatibility with other materials, and due to its little bonding force, the film fabric is easily separated from the silicon forming pad, and the film fabric generated by friction with the existing metal mold. Scratch occurrence of the can also be significantly reduced.

도 4는 본 발명의 일실시예에 따른 키패드 러버의 제조방법을 나타내는 순서 도이다. 4 is a flowchart illustrating a method of manufacturing a keypad rubber according to an embodiment of the present invention.

도 4에 도시된 바와 같이, 먼저 박판 형태의 필름원단 표면에 이형제층, 하드코팅층, 문자, 숫자 또는 문양의 형성을 위한 칼라층, 라이팅층, 접착층을 차례로 인쇄하는 필름인쇄공정이 수행된다(S310). 필름원단은 통상적으로 키패드 제조업계에서는 PET(polyester) 또는 PC(poly carbonate) 필름을 사용하고 있으나, 나일론수지, 폴리아미드수지, 폴리에스테르수지, EVOH(ethylene vinylalcohol copolymer) 수지, 폴리우레탄, 폴리에틸렌수지 또는 폴리프로필렌수지 등이 선택될 수 있다. 본 발명의 실시예에서는 필름원단으로 우레탄을 사용하였으며, 실크 스크린 방식으로 필름인쇄를 수행하였다.As shown in FIG. 4, first, a film printing process of printing a release layer, a hard coating layer, a color layer, a writing layer, and an adhesive layer in order to form a release agent layer, a hard coating layer, a letter, a number, or a pattern on a thin film form is performed (S310). ). Film fabrics generally use PET (polyester) or PC (poly carbonate) film in the keypad manufacturing industry, but nylon resin, polyamide resin, polyester resin, EVOH (ethylene vinylalcohol copolymer) resin, polyurethane, polyethylene resin or Polypropylene resin and the like can be selected. In the embodiment of the present invention, urethane was used as the film fabric, and film printing was performed by a silk screen method.

이어서 포밍공정을 통해 상기 인쇄된 필름원단을 실리콘 금형으로 가열압착하여, 필름원단에 원하는 키패드의 배열에 따른 철부형태의 키돌출부가 성형되도록 한다(S320). 포밍공정은 앞서 도시한 도 3의 (a)와 같이 필름원단(300)을 하단금형부 상면에 장착된 실리콘 포밍 패드(280)와 상단금형부의 상단 다이(150) 사이에서 도 3의 (b)에 도시된 바와 같이 가열압착 함으로써 필름원단(300)에 철부형상의 키돌출부를 성형한다. 이때, 상단금형부의 온도는 약 70℃~120℃, 하단금형부의 온도는 약 60℃~110℃로 유지한 상태에서 약 5~10초동안 포밍한다.Subsequently, the printed film fabric is heat-compressed with a silicon mold through a forming process, so that a key protrusion having a convex shape according to an arrangement of a desired keypad is formed on the film fabric (S320). In the forming process, as shown in FIG. 3A, the film fabric 300 is placed between the silicon forming pad 280 mounted on the upper surface of the lower mold part and the upper die 150 of the upper mold part. As shown in the figure, the iron protrusion-shaped key protrusions are formed on the film fabric 300 by heat pressing. At this time, the temperature of the upper mold portion is about 70 ℃ ~ 120 ℃, the temperature of the lower mold portion is maintained for about 5 ~ 10 seconds while maintaining the temperature of about 60 ℃ ~ 110 ℃.

이후, 성형 공정에서는 인쇄된 필름원단 저면에 액상 실리콘을 일정량 투입한 후 가열압착하여 필름원단에 형성된 키돌출부에 각각 대응하는 위치에 다수개의 누름돌기와 연결리브 및 접촉 돌기가 구비되도록 성형한다(S330).Subsequently, in the molding process, a predetermined amount of liquid silicone is added to the bottom surface of the printed film fabric, followed by heating and pressing to form a plurality of pressing protrusions, connecting ribs, and contact protrusions at positions corresponding to the key protrusions formed on the film fabric (S330). .

이어서 코팅공정을 통해 필름원단 표면에 내마모성 및 내열성을 갖는 코팅층 을 형성하고(S340), 컷팅 공정을 통해 성형된 키패드 러버를 제품의 형상에 따라 테두리를 절단한다(S350).Subsequently, a coating layer having abrasion resistance and heat resistance is formed on the surface of the film through the coating process (S340), and the edge of the keypad rubber molded through the cutting process is cut according to the shape of the product (S350).

이와 같이 구성된 본 발명에 의한 키패드 러버의 제조방법은 실리콘 포밍패드를 이용하여 포밍공정을 수행함으로써, 금형 내의 열분산 및 열편차가 작아 포밍 변형 및 표면 주름 발생이 쉽게 일어나지 않으며, 필름원단이 금형에서 쉽게 분리되고, 기존에 메탈금형과의 마찰로 인해 발생되는 필름원단의 스크래치(Scratch) 발생을 줄일 수 있게 된다. 따라서 기존 실리콘 성형 공정에서 발생될 수 있는 불량요소를 최소화 할 수 있게 된다. In the manufacturing method of the keypad rubber according to the present invention configured as described above by performing a forming process using a silicon forming pad, the heat dissipation and thermal deviation in the mold is small, forming deformation and surface wrinkles do not easily occur, the film fabric is easily in the mold It is separated, it is possible to reduce the scratch (scratch) of the film fabric generated by the friction with the existing metal mold. Therefore, it is possible to minimize the defects that can occur in the existing silicon molding process.

이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의해 한정되는 것은 아니며, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하다는 것은 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 명백하다 할 것이다.The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible in the art without departing from the technical spirit of the present invention. It will be clear to those of ordinary knowledge.

도 1은 포밍변형 및 표면 주름이 발생된 불량 키패드와 양호하게 성형된 키패드를 비교하여 보여주는 도면.1 shows a comparison of a poorly formed keypad with a forming deformation and surface wrinkles and a well formed keypad.

도 2는 본 발명의 일실시예에 따른 키패드 제조용 실리콘 금형의 개략적인 구성도.Figure 2 is a schematic configuration diagram of a silicon mold for keypad production according to an embodiment of the present invention.

도 3은 본 발명의 일실시예에 따른 키패드 제조용 실리콘 금형을 이용한 포밍 공정의 예시도.Figure 3 is an illustration of a forming process using a silicon mold for keypad production according to an embodiment of the present invention.

도 4는 본 발명의 일실시예에 따른 키패드 러버의 제조방법을 나타내는 순서도. Figure 4 is a flow chart showing a method of manufacturing a keypad rubber according to an embodiment of the present invention.

*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

100 : 상단금형부 110 : 싱크100: upper mold 110: sink

120 : 상단 홀더 130 : 상단 단열판120: upper holder 130: upper insulation plate

140 : 상단 열히터판 150 : 상단 다이140: upper heat heater plate 150: upper die

160 : 상단 열센서 170 : 상단 가이드핀160: upper thermal sensor 170: upper guide pin

180 : 홈 190 : 핀구멍180: groove 190: pin hole

200 : 하단 금형부 210 : 하단 홀더200: lower mold portion 210: lower holder

220 : 하단 단열판 230 : 하단 열히터판220: lower heat insulating plate 230: lower heat heater plate

240 : 하단 고정판 250 : 포밍 금형판240: lower fixing plate 250: forming mold plate

260 : 하단 열센서 270 : 하단 가이드핀260: lower thermal sensor 270: lower guide pin

280 : 실리콘 포밍 패드 280 : 세팅핀280: silicon forming pad 280: setting pin

Claims (4)

키패드 제조용 금형에 있어서,In the mold for keypad production, 열히터판과 열센서를 포함하여 구성된 상단금형부와;An upper mold part including a heat heater plate and a heat sensor; 열히터판과 열센서를 포함하여 구성된 하단금형부;A lower mold part including a heat heater plate and a heat sensor; 를 포함하여 구성되되,Consists of including 상기 하단금형부의 상면에는 실리콘으로 제조되어, 상면에 키패드 성형용 패턴이 형성된 실리콘 포밍 패드가 장착되고,The upper surface of the lower mold portion is made of silicon, the upper surface is equipped with a silicon forming pad formed with a pattern for forming a keypad, 상기 상단금형부의 하면에는 상기 하단금형부에 장착된 실리콘 포밍 패드에 형성된 키패드 성형용 패턴에 대응되는 형상의 홈이 형성되도록 구성함으로써, By forming a groove having a shape corresponding to the pattern for forming the keypad formed on the silicon forming pad attached to the lower mold portion on the lower surface of the upper mold portion, 실리콘 포밍 패드를 이용한 가열압착을 통해 키패드용 필름원단을 성형하는 것을 특징으로 하는 키패드 제조용 실리콘 금형.A silicone mold for keypad manufacturing, characterized in that the film fabric for keypad is formed by heat pressing using a silicon forming pad. 삭제delete 키패드 러버의 제조방법에 있어서,In the manufacturing method of the keypad rubber, 필름원단 표면 및 배면에 인쇄층을 형성하는 필름인쇄 공정과;A film printing step of forming a printing layer on the film fabric surface and back surface; 인쇄된 필름원단에 금형을 이용한 가열압착을 통해 키돌출부를 성형시키는 포밍공정과;A forming process of forming a key protrusion through heat pressing using a mold on the printed film fabric; 인쇄된 필름 저면에 액상 실리콘을 충진 한 후, 가열압착을 통해 키돌출부 저면에 누름돌기, 연결리브 및 접촉돌기를 형성하는 성형공정과;Forming a pressurized protrusion, a connecting rib, and a contact protrusion on the bottom of the key protrusion by heating and compressing the liquid silicon on the bottom of the printed film; 필름 표면에 코팅층을 형성하는 코팅공정과;A coating step of forming a coating layer on the film surface; 제품의 형상에 따라 테두리를 절단하는 컷팅공정;Cutting process for cutting the edge according to the shape of the product; 을 포함하여 구성되되,Consists of including 상기 포밍공정은, The forming process, 상면에 키패드 성형용 패턴이 형성된 실리콘 포밍 패드를 금형으로 사용하여 키돌출부를 성형시킴으로써 키패드의 포밍변형 및 표면 주름 발생을 방지하는 것을 특징으로 하는 키패드 러버의 제조방법.A method of manufacturing a keypad rubber, comprising: forming a key protrusion using a silicon forming pad having a keypad forming pattern formed on the upper surface thereof as a mold to prevent forming deformation and surface wrinkles of the keypad; 제 3항에 있어서,The method of claim 3, wherein 상기 포밍공정은,The forming process, 상단금형부, 하단금형부 및 상기 하단금형부 상면에 장착된 실리콘 포밍 패드를 이용하여 수행되되,It is performed using a silicon forming pad mounted on the upper mold, the lower mold and the upper surface of the lower mold, 상기 상단금형부의 온도는 70℃~120℃, 상기 하단금형부의 온도는 60℃~110℃로 유지한 상태에서 5~10초동안 수행되는 것을 특징으로 하는 키패드 러버의 제조방법.The temperature of the upper mold portion is 70 ℃ ~ 120 ℃, the temperature of the lower mold portion of the keypad rubber manufacturing method, characterized in that performed for 5 to 10 seconds in a state maintained at 60 ℃ ~ 110 ℃.
KR1020090093141A 2009-09-30 2009-09-30 Silicon mold and the method of manufacturing key pad rubber using the same KR100957068B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090093141A KR100957068B1 (en) 2009-09-30 2009-09-30 Silicon mold and the method of manufacturing key pad rubber using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090093141A KR100957068B1 (en) 2009-09-30 2009-09-30 Silicon mold and the method of manufacturing key pad rubber using the same

Publications (1)

Publication Number Publication Date
KR100957068B1 true KR100957068B1 (en) 2010-05-13

Family

ID=42281593

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090093141A KR100957068B1 (en) 2009-09-30 2009-09-30 Silicon mold and the method of manufacturing key pad rubber using the same

Country Status (1)

Country Link
KR (1) KR100957068B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101356045B1 (en) 2013-07-04 2014-01-28 노재완 Function keys on the remote control to cover the rubber plates 4 color rubber molding method for integrally
WO2020091245A1 (en) * 2018-11-01 2020-05-07 주식회사 플리츠미 Method for manufacturing lightweight thermal pleated fabric

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080103633A (en) * 2007-05-25 2008-11-28 주식회사다솔시스템 Jig for cellular phone keypad

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080103633A (en) * 2007-05-25 2008-11-28 주식회사다솔시스템 Jig for cellular phone keypad

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101356045B1 (en) 2013-07-04 2014-01-28 노재완 Function keys on the remote control to cover the rubber plates 4 color rubber molding method for integrally
WO2020091245A1 (en) * 2018-11-01 2020-05-07 주식회사 플리츠미 Method for manufacturing lightweight thermal pleated fabric
KR20200050116A (en) * 2018-11-01 2020-05-11 (주)플리츠미 Method of manufacturing for Wrinkled, light and warm fiber fabrics
KR102109389B1 (en) 2018-11-01 2020-05-12 (주)플리츠미 Method of manufacturing for Wrinkled, light and warm fiber fabrics

Similar Documents

Publication Publication Date Title
JP6205731B2 (en) Porous stamp manufacturing method, porous stamp, and porous stamp manufacturing apparatus
US20070031161A1 (en) Contoured capacitive touch control panel
US20150270076A1 (en) Keyboard cover and electronic apparatus
CN101459004B (en) Press-key panel construction for electronic device and method for manufacturing the press-key panel construction
CN102034633B (en) Full keyboard components, manufacturing method and full keyboard thereof
KR100957068B1 (en) Silicon mold and the method of manufacturing key pad rubber using the same
JPS61110582A (en) Information-supporting material and method and apparatus therefor
CN201773735U (en) Keypad and electronic equipment adopting the same
JPH0135749B2 (en)
US11289288B2 (en) Waterproof film and keyboard thereof
US20110127152A1 (en) Blind point keyswitch and input apparatus
JP2011192624A (en) Manufacturing method of key cap structure and keyboard equipped with key cap structure
US20100122898A1 (en) Key base and key seat
KR20110035051A (en) Key pad for mobile
KR200388966Y1 (en) wireless telephone keypad
KR101161734B1 (en) Manufacturing method of keypad
KR100709267B1 (en) Method for making Case plate
KR20020069081A (en) Key-pad manufacturing process of Cellular Phone to injection mold
JP2005050709A (en) Key sheet with resin key top
KR100820749B1 (en) Keypad of Mobile Phone and Method thereof
KR200282132Y1 (en) Key-pad for Cellular Phone
JP3715514B2 (en) Method for manufacturing key top member for pushbutton switch
KR100588263B1 (en) Three-dimensional keypad and manufacturing method thereof
CN101804693B (en) Combined type in-mould decorating printing film forming process and equipment
KR100786302B1 (en) Keypad single type housing manufacturing method and keypad single type housing

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130410

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20140501

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20150430

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20160212

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20170425

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20180807

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20190529

Year of fee payment: 10