KR100951780B1 - Load factor measuring device and method for substrate wet equipment - Google Patents

Abstract

The present invention relates to an apparatus for measuring a load rate, and more particularly, to determine a driving state by measuring a load rate of a main driving part of a substrate processing equipment, and an apparatus and method for measuring a load ratio of a driving unit of a substrate processing equipment that can cope with the load condition appropriately. It is about. The present invention can significantly reduce the cost in measuring the load of the driving portion of the substrate processing equipment and predict the failure of the device in advance, and the driving unit of the substrate processing equipment to maximize the efficiency by connecting a plurality of drivers to one load rate measuring instrument Load rate measuring apparatus and method.

Load, motor unit, host control terminal, computer

Description

Load factor measuring device and method for substrate wet equipment

The present invention relates to an apparatus for measuring a load ratio, and more particularly, to an apparatus and method for measuring a load ratio of a driving unit of a substrate processing apparatus, which measures a load ratio of a main driving unit of a substrate processing apparatus to determine a driving state and appropriately cope with the load. It is about.

Generally, flat panel display devices, such as liquid crystal display (LCD) devices, have become larger in size and are capable of supporting high resolution. Technical issues such as high contrast and wide viewing angles have also been solved.

LCD devices are attracting attention in a variety of applications as new display means. LCD devices are manufactured by bonding a color filter substrate and a thin film transistor (TFT) substrate. After the predetermined process is performed on the color filter substrate and the TFT substrate, the substrates are attached to each other. In order to manufacture an LCD device, a process for forming a color filter, a transistor, or the like for each substrate is performed for each substrate before attaching the two substrates.

For example, in the process of forming a transistor on a TFT substrate, a substrate deposition process, an exposure and development process, an etching process, and a cleaning process are performed on the substrate. Among these, the etching process and the cleaning process are processes for removing unnecessary material films, photoresist patterns and various impurities from the substrate. In these processes, a dry process is increasingly used to automate the substrate processing process and shorten the process period, and in particular, a process using plasma is widely used. The plasma substrate processing step first activates the gas in a plasma state by applying energy such as RF to the substrate processing gas. The activated substrate processing gas becomes a plasma gas containing electrons and ions, and the plasma gas reacts with the film to be processed to generate volatile byproducts. In some cases, an electric field or a magnetic field may be applied to the plasma gas to have a high kinetic energy. The plasma substrate processing process is to perform a substrate processing process such as etching, cleaning and etching using the chemical energy and / or physical energy of the plasma gas.

In order to measure the load factor in the conventional substrate processing equipment for manufacturing the LCD was used a method using a servo motor.

In the load rate detection method using a servomotor, the load factor was estimated by measuring the current value of the servomotor or by measuring the speed. This method using the servo motor has a problem that can not be applied to the substrate cleaning equipment using a different type of motor.

Another method of measuring the load rate is to measure the load rate using a separate load detection device. In case of using such a separate load detection device, it is expensive and more efficient countermeasures are required.

In addition, conventionally, the load rate measuring device for each drive unit is used to measure the load rate of each drive unit, and accordingly, there is a problem that it is difficult to collectively grasp the load rate of each drive unit.

The present invention solves the above problems, the present invention can significantly reduce the cost in measuring the load ratio of the drive unit of the substrate processing equipment and predict the failure of the device in advance and connect a plurality of drivers to one load rate meter It is an object of the present invention to provide an apparatus and method for measuring a load ratio of a driving unit of a substrate processing equipment that maximizes efficiency as well as cost.

In addition, the present invention can display the load value measured by the driver in the device itself to predict the failure of the equipment in advance, can be automatically controlled by transferring the calculated load value to the host device, and handling of the substrate is very easy in case of emergency An object of the present invention is to provide an apparatus and a method for measuring a load ratio of a driving unit of equipment.

An apparatus of the present invention for achieving the above object is a driver unit for adjusting the speed and control voltage of the motor unit for driving the load stage and converting the control voltage into a load amount to provide a digital signal in the form of a pulse, and the driver unit A load rate monitoring unit comprising a load rate communication unit which receives the digital signal in the form of pulses, converts it into a load rate, converts it into a communication signal, and provides it to an upper control terminal; Receiving the load rate provided from the load rate communication unit of the load rate monitoring unit to grasp the operation of the motor unit, determine whether there is an abnormality, and adjust the operating speed and control voltage of the motor unit to control the operation state of the motor unit; It is characterized by including.

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In addition, the driver unit of the present invention is characterized in that it comprises a microcontroller for controlling the difference between the speed command and the actual speed of the motor unit by using a PI controller and by applying a control voltage to the motor unit.

In addition, the load rate communication unit connects a plurality of the driver parts and simultaneously receives and processes the load rates of the plurality of motor parts and provides them to the upper control terminal, and the driver part converts a control voltage applied to the motor part into a load amount to provide a digital signal in pulse form. It characterized in that provided to the load rate communication unit.

The method of the present invention for achieving the above object is the step of detecting the load amount from the motor portion of the substrate cleaning apparatus in the driver portion of the load rate monitoring unit and transmitting the detected load amount to the load rate communication unit as a digital signal in the form of a pulse, and load rate communication The unit converts pulse-type digital signals into load ratios, converts them into communication signals, and transmits them to the upper control terminal and the computer, and the upper control terminal and the computer compare the received load data with reference data to determine the operation state in detail. Characterized in that it comprises a step.

The motor unit is characterized in that it comprises a brushless motor, a brush motor, a vector control motor.

The load rate monitoring unit of the present invention connects a plurality of drivers and motors to measure the load ratio of the drive unit of the substrate processing equipment, thereby significantly reducing the cost compared to the conventional method, and amplifying the efficiency of the load rate measuring apparatus.

In addition, the present invention can be identified by displaying the load value measured from the drive unit of the substrate equipment by itself, it is possible to predict the failure of the equipment in advance and can be automatically controlled because the load value is transmitted to the upper control device.

In addition, the present invention is capable of real-time control of the drive unit in the load fluctuation of the substrate equipment.

In addition, the present invention can monitor and control the operation of a plurality of motor units using one load rate monitoring unit, so that it is possible to simultaneously grasp and control the operating conditions of various substrate cleaning apparatuses.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

It should be noted that in the following description, only parts necessary for understanding the operation according to the present invention will be described, and descriptions of other parts will be omitted.

1 is a schematic configuration diagram of an apparatus for measuring a load ratio of a driver of a substrate processing apparatus of the present invention.

The driving part load ratio measuring device applied to the substrate processing equipment includes an upper control terminal 31, a computer 33, a load rate monitoring unit 35, and the load rate monitoring unit 35 is configured in detail in the load rate communication unit 51, The driver unit 53 and the motor unit 55 are included.

The load rate monitoring unit 35 of the present invention is connected to the operating substrate processing equipment to measure and determine and control the load rate.

When the load rate monitoring unit 35 is connected to the operating substrate processing equipment, the motor unit 55 detects and calculates the load of the motor and provides the calculated load to the upper control terminal 31 and the computer 33 through RS485 communication.

The upper control terminal 31 and the computer 33 monitor the load data transmitted from the load rate monitoring unit 35 to control the operation of the board equipment.

The upper control terminal 31 and the computer 33 can control the operation of the substrate cleaning equipment by dividing the load amount into detailed load level (%), which can drastically reduce the cost compared to the prior art and determine the abnormal operation of the equipment. can do.

In addition, the upper control terminal 31 and the computer 33 can determine how much load is applied to which load stage from the load rate information received through the load rate monitoring unit 35 to determine the operation situation and failure. It is very efficient and low-cost because it can identify and control the operation based on the appropriate load rate data for various substrate cleaning equipment.

A plurality of driver units 53 may be connected to the load rate communication unit 51 of the load rate monitoring unit 35 to simultaneously grasp the operation status of various substrate processing equipment.

The driver unit 53 is a motor unit used to rotate the conveyor of the substrate cleaning equipment (glass transfer), module oscillation for linear reciprocation, roll brush, and disk brush rotation. Drive control unit 55, the driver unit 53 measures the load amount of the motor unit 55 by measuring the voltage, and transmits the load amount data as a digital signal to the load rate communication unit 51 by using the detected load amount as a pulse. .

In addition, the driver unit 53 controls the speed of the motor unit 55 using a PI (Proportional Integral) controller.

The load rate communication unit 51 receives the received pulse type load amount as a digital signal, converts it into a load rate, converts it into a communication signal, and provides it to the upper control terminal 31 and the computer 33 by RS485 communication.

As described above, the upper control terminal 31 and the computer 33 can grasp how much load is applied to the load rate information received through the load rate monitoring unit 35 to determine the operation situation and failure. It can be determined and controlled based on the appropriate load rate data for various substrate cleaning equipment, so it is very efficient and low cost.

In addition, the present invention measures the load of the plurality of motor units using the load rate communication unit 51 of one load rate monitoring unit 35, thereby saving space and measurement cost.

RS485 is an extended version of RS232 and RS422 that allows all devices to transmit and receive data on the same line. It also supports both half duplex and full duplex communication. In addition, RS485 can be networked up to a maximum distance of 1.2km at a maximum speed of 10Mbps.

2 is a detailed configuration diagram of a load rate monitoring unit of the present invention.

The load rate monitoring unit 35 of the present invention includes a load rate communication unit 51, a driver unit 53, and a motor unit 55 in detail as described above.

The driver unit 53 of the load rate monitoring unit includes a microcontroller 61. The microcontroller 61 includes a PI (Proportional Integral) controller 63 and a space vector PWM unit (SVPWM) (Space Vector Pulse Width Modulation) 65. And an Intelligent Power Module (IPM) 67.

The PI (Proportional Integral) controller 63 commands the speed of the motor unit 55 and minimizes by controlling the speed and difference of the actual motor unit 55.

The Space Vector Pulse Width Modulation (SVPWM) 65 applies a control voltage to an Intelligent Power Module (IPM) 67 and applies an Intelligent Power Module (IPM) 67 using a space vector technique. The speed of the motor unit 55 is controlled by driving the switching element with the control voltage.

The driver unit 53 of the present invention constantly controls the speed of the motor unit 55 by the final control voltage in the space vector PWM unit 65 in the microcontroller 61, converts the final control voltage into a load amount, It is provided to the load rate communication unit 51 in the form of a spar.

The load rate communication unit 51 receives the received pulse type load amount as a digital signal, converts it into a load rate, converts it into a communication signal, and provides it to the upper control terminal 31 and the computer 33 by RS485 communication.

The upper control terminal 31 and the computer 33 can determine how much load is applied to the load rate information received through the load rate monitoring unit 35 to determine the operation situation and failure. The operation is identified and controlled based on the appropriate load factor data for various substrate cleaning equipment.

3 is an operation flowchart of a driving unit load ratio measuring apparatus of the substrate processing equipment of the present invention.

Motor unit 55 used to rotate the conveyor (Glass transfer) of substrate cleaning equipment, module oscillation for linear reciprocation, roll brush, and disk brush in step 311. The amount of load is detected by the driver unit 53 of the load rate monitoring unit 35.

In step 321, the driver unit 53 of the load rate monitoring unit 35 transmits the detected load amount to the load rate communication unit 51 as a digital signal in the form of a pulse.

In step 331, the load rate communication unit 51 converts the pulse-like digital signal into a load rate and converts the signal into a communication signal. In step 341, the load rate communication unit 51 transmits the digital signal to the upper control terminal 31 and the computer 33 through the line.

Dozens of driver units 53 may be connected in the load rate communication unit 51 to simultaneously identify the loads of the dozens of motor units 55 and accurately determine which load information of the motor unit 55 is provided.

In step 351, the upper control terminal 31 and the computer 33 may compare the load data received with the reference data to determine the operation state in detail, and to determine the load stage in which the speed of the motor unit 55 and the operation are poor. have.

In step 361, the manager requests the speed control of the motor unit 55 using the upper control terminal 31 or the computer 33 to control the operation efficiency of the substrate cleaning equipment driven by the motor unit 55.

In addition, the present invention can monitor and control the operation of a plurality of motor units by using one load rate monitoring unit, so that it is possible to simultaneously grasp and control the operation of various substrate cleaning equipment.

The present invention is applied to all controllable motors including a brushless motor, a brush motor, and a vector control motor to measure a load ratio and control the operation of the motor.

So far, the configuration and operation of the embodiment of the present invention have been described. The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the claims but also by the equivalents of the claims.

1 is a schematic configuration diagram of a driving unit load ratio measuring apparatus of the substrate processing equipment of the present invention.

Figure 2 is a detailed configuration of the load rate monitoring unit of the present invention.

Figure 3 is a flow chart of the operation of the drive unit load ratio measuring apparatus of the substrate processing equipment of the present invention.

<Description of Major Symbols in Drawing>

31: upper control terminal 33: computer

35: load rate monitoring unit 51: load rate communication unit

53: driver portion 56: motor portion

Claims (9)

delete delete A driver unit for adjusting the speed and control voltage of the motor unit driving the load stage and converting the control voltage into a load amount to provide a digital signal in the form of a pulse; A load rate monitoring unit comprising a load rate communication unit which converts the communication signal into a higher level control terminal; Receiving the load rate provided from the load rate communication unit of the load rate monitoring unit to grasp the operation of the motor unit, determine whether there is an abnormality, and adjust the operating speed and control voltage of the motor unit to control the operation state of the motor unit; Drive unit load ratio measuring apparatus of the substrate processing equipment comprising a. The method of claim 3, wherein The driver unit comprises a microcontroller for controlling the difference between the speed command and the actual speed of the motor unit by using a PI controller, and by applying a control voltage to the motor unit to drive the load factor of the substrate processing equipment. The method according to claim 3 or 4, And the driver unit converts a control voltage applied to the motor unit into a load amount to provide a digital signal in the form of a pulse to the load rate communication unit. Detecting a load amount from a motor part of the substrate cleaning device by a driver part of the load rate monitoring unit and transmitting the detected load amount to a load rate communication unit as a digital signal in pulse form; Converting, by the load rate communication unit, a digital signal in pulse form into a load rate, converting the digital signal into a communication signal, and transmitting the converted signal to a higher control terminal and a computer; And the upper control terminal and the computer determine the operation state in detail by comparing the received load data with reference data. The method of claim 6, The upper control terminal and the computer And controlling the operation efficiency of the motor unit by requesting control voltage or speed control through the load rate monitoring unit. The method of claim 6, The motor unit includes a brushless motor, a brush motor, a vector control motor. Method for measuring the load ratio of the driving unit of the substrate processing equipment. The method of claim 6, The load rate monitoring unit may be connected to a plurality of the driver to measure and control the load ratio of the plurality of the motor unit, characterized in that the driving unit load ratio measurement method of the substrate processing equipment.

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