KR100931254B1 - Fire detector - Google Patents

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KR100931254B1
KR100931254B1 KR1020080039499A KR20080039499A KR100931254B1 KR 100931254 B1 KR100931254 B1 KR 100931254B1 KR 1020080039499 A KR1020080039499 A KR 1020080039499A KR 20080039499 A KR20080039499 A KR 20080039499A KR 100931254 B1 KR100931254 B1 KR 100931254B1
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South Korea
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circuit board
printed circuit
temperature sensing
sensing element
light emitting
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KR1020080039499A
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Korean (ko)
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KR20090113659A (en
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이종길
원유성
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주식회사 유성반도체
이종길
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    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B17/00Fire alarms; Alarms responsive to explosion
    • G08B17/10Actuation by presence of smoke or gases, e.g. automatic alarm devices for analysing flowing fluid materials by the use of optical means
    • G08B17/103Actuation by presence of smoke or gases, e.g. automatic alarm devices for analysing flowing fluid materials by the use of optical means using a light emitting and receiving device
    • G08B17/107Actuation by presence of smoke or gases, e.g. automatic alarm devices for analysing flowing fluid materials by the use of optical means using a light emitting and receiving device for detecting light-scattering due to smoke
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B17/00Fire alarms; Alarms responsive to explosion
    • G08B17/06Electric actuation of the alarm, e.g. using a thermally-operated switch
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B5/00Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied
    • G08B5/22Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied using electric transmission; using electromagnetic transmission

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Business, Economics & Management (AREA)
  • Emergency Management (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Fire-Detection Mechanisms (AREA)
  • Fire Alarms (AREA)

Abstract

본 발명은 1차 온도감지소자와 2차 온도감지소자에 의해 차동식으로 화재를 감지하는 화재감지기에 관한 것으로, 베이스와, 이 베이스 내부에 설치되는 인쇄회로기판과, 이 인쇄회로기판을 지지하고 보호하는 커버로 이루어지고, 상기 인쇄회로기판에는 1,2차 온도감지소자와 동작표시수단이 설치되는 것에 있어서, 상기 2차 온도감지소자를 칩 타입의 2차 온도감지소자로 구성하여 인쇄회로기판의 회로인쇄층의 회로 상에 설치하여서 되는 특징과, 본 발명의 상기 동작표시수단은 칩 타입으로 된 발광소자와, 수광부와 발광부가 형성된 동작표시구와, 이 동작표시구를 베이스에 설치하기 위한 고정부로 이루어지는 다른 특징이 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fire detector which differentially detects a fire by means of a primary temperature sensor and a secondary temperature sensor. And a secondary temperature sensing element and an operation display means are provided on the printed circuit board, wherein the secondary temperature sensing element is configured as a chip type secondary temperature sensing element. The present invention is characterized in that it is provided on a circuit of a circuit printing layer, and the operation display means of the present invention includes a chip type light emitting element, an operation indicator formed with a light receiving portion and a light emitting portion, and a fixing portion for installing this operation indicator on a base. There are other features made up of.

Description

화재감지기{FIRE DETECTOR}Fire Detector {FIRE DETECTOR}

본 발명은 1차 온도감지소자와 2차 온도감지소자에 의해 차동식으로 화재를 감지하는 화재감지기에 관한 것으로, 더욱 상세하게는 상기 2차 온도감지소자를 개선하고 동작표시구의 구성도 개선하여 자동 라인에 의해 조립가능하게 한 화재감지기에 관한 것이다.The present invention relates to a fire detector which differentially detects a fire by a primary temperature sensor and a secondary temperature sensor, and more particularly, improves the secondary temperature sensor and improves the configuration of an operation indicator. A fire detector made to be assembled by means of.

종래의 화재감지기를 보면, 도 1 및 도 2와 같이 베이스(1)와, 상면에 온도감지회로장치(2a)가 설치된 인쇄회로기판(2)과, 커버(3)로 이루어진다.In the conventional fire detector, as shown in Figs. 1 and 2, a base 1, a printed circuit board 2 provided with a temperature sensing circuit device 2a on the upper surface, and a cover 3 are formed.

상기 인쇄회로기판(2)의 하부로부터 1차 온도감지소자(4)의 리드선(4a)을 상부로 관통하여 상부로 관통된 리드선(4a)은 납땜(4b) 처리하고, 2차 온도감지소자(5)의 리드선(5a)을 하부로부터 상부로 관통하여 그 끝을 납땜(5b) 처리한 다음 상기 2차 온도감지소자(5)를 에폭시 몰딩층(6)으로 밀봉처리한다. The lead wire 4a penetrating through the lead wire 4a of the primary temperature sensing device 4 from the lower portion of the printed circuit board 2 to the upper portion is subjected to soldering (4b), and the secondary temperature sensing element ( The lead wire 5a of 5) is penetrated from the bottom to the top, and the end thereof is soldered 5b, and then the secondary temperature sensing element 5 is sealed with the epoxy molding layer 6.

또, 회로기판(2)의 하면 모퉁이에는 LED(7)가 설치된다. 이 LED(7)도 역시 리드선(7a)을 상부로 관통하여 그 끝을 납땜(7b) 처리한다.In addition, an LED 7 is provided at the bottom corner of the circuit board 2. This LED 7 also penetrates the lead wire 7a upwards and solders the end thereof to the solder 7b.

상기와 같은 종래기술은 1차 온도감지소자가 소정온도이상의 열을 감지하여 그 신호를 제어부로 보내고 이어서 수 초 내지 수십 초(미리 설정되어 있는 시간) 후 소정온도이상 상승하면 2차 온도감지소자가 감지한 온도의 신호를 제어부로 보내고 제어부에서는 이들 신호를 분석하여 처리하는 것으로, 화재감지용으로 널리 사용되고 있다.In the prior art as described above, when the primary temperature sensing element senses heat above a predetermined temperature and sends a signal to the control unit, the secondary temperature sensing element is increased after a predetermined temperature after a few seconds to several tens of seconds (preset time). The signal of the sensed temperature is sent to the control unit, and the control unit analyzes and processes these signals and is widely used for fire detection.

그러나, 상기와 같은 종래기술은 다음과 같은 문제점이 있다.However, the prior art as described above has the following problems.

첫째, 2차 온도감지소자(5)의 리드선(5a)을 인쇄회로기판(2) 하부로부터 상부로 관통하여 인쇄회로기판(2)의 상면에서 납땜(5b)하는 일련의 작업이 자동 라인에서 이루어지지 않고 별도의 작업에 의해 이루어지기 때문에 제조공정이 추가된다.First, a series of operations are performed in the automatic line through which the lead wire 5a of the secondary temperature sensing element 5 penetrates from the lower part of the printed circuit board 2 to the upper part and is soldered 5b on the upper surface of the printed circuit board 2. The manufacturing process is added because it is carried out by a separate operation rather than being supported.

둘째, 2차 온도감지소자(5)의 설치상태가 인쇄회로기판(2)에 밀착되는 경우도 있고 약간 이격되는 경우도 있는 등 제품마다 일정하지 않기 때문에 2차 온도감지신호가 제품에 따라 달라질 수 있어 제어부에서 오작동을 일으킬 수 있다.Second, because the installation state of the secondary temperature sensing element 5 is not closely adhered to the printed circuit board 2 and may be slightly spaced apart, the secondary temperature sensing signal may vary depending on the product. Doing so may cause a malfunction in the control unit.

셋째, 2차 온도감지소자(5)를 덮고 있는 에폭시 몰딩층(6)을 수동으로 작업하기 때문에 그 두께가 일정하지않아 온도감응도 일정하지 않게 되어 제품마다 시차가 다른 신호를 보낼 수 있는 문제점이 있다.Third, since the epoxy molding layer 6 covering the secondary temperature sensing element 5 is manually operated, the thickness is not constant, so the temperature response is not constant. Therefore, the parallax may be different for each product. .

다섯째, LED(7)가 인쇄회로기판(2)의 하면에 설치되어 있어 이 LED(7)를 설치하기 위해서는 리드선(7a)을 납땜(7b)해야 하므로 별도의 제조공정을 추가해야 하는 문제점이 있다.Fifth, since the LED 7 is installed on the lower surface of the printed circuit board 2, in order to install the LED 7, the lead wire 7a must be soldered (7b), so there is a problem in that a separate manufacturing process must be added. .

본 발명은 상기와 같은 종래기술의 문제점을 해결하기 위하여 창안한 것으로, 2차 온도감지소자를 칩 타입으로 하여 인쇄회로기판의 상면에 설치함으로써 다른 소자들과 함께 자동 라인에서 설치가능하게 하고, 또 LED로 된 동작표시수단도 구조를 개선하여 역시 자동 라인에서 처리되게 한 화재감지기를 제공함에 그 목적이 있다.The present invention was devised to solve the problems of the prior art as described above. The second temperature sensing element is a chip type, which is installed on an upper surface of a printed circuit board, so that it can be installed in an automatic line together with other elements. Its purpose is to provide a fire detector that also has an LED display that improves its structure and is also handled by automatic lines.

상기와 같은 목적을 달성하기 위한 본 발명은, 베이스와, 이 베이스 내부에 설치되는 인쇄회로기판과, 이 인쇄회로기판을 지지하고 보호하는 커버로 이루어지고, 상기 인쇄회로기판에는 1,2차 온도감지소자와 동작표시수단이 설치되는 것에 있어서, 상기 2차 온도감지소자를 칩 타입의 2차 온도감지소자로 구성하여 인쇄회로기판의 회로 인쇄층의 회로 상에 설치하여서 되는 특징이 있다.The present invention for achieving the above object is composed of a base, a printed circuit board installed inside the base, and a cover for supporting and protecting the printed circuit board, the printed circuit board has a first and second temperature The sensing element and the operation display means are provided, characterized in that the secondary temperature sensing element is constituted by a chip type secondary temperature sensing element and provided on the circuit of the circuit printed layer of the printed circuit board.

또, 본 발명의 상기 동작표시수단은 칩 타입으로 된 발광소자와, 수광부와 발광부가 형성된 동작표시구와, 이 동작표시구를 베이스에 설치하기 위한 고정부로 이루어지는 다른 특징이 있다.In addition, the operation display means of the present invention has another feature comprising a light emitting element of a chip type, an operation indicator having a light receiving portion and a light emitting portion, and a fixing portion for installing the operation indicator on a base.

상기와 같은 해결수단을 지닌 본 발명은 2차 온도감지소자를 칩 타입으로 하 여 인쇄회로기판의 상부에 설치함으로써 자동 라인으로 설치가능하고, 2차 온도감지소자가 인쇄회로기판에 일정하게 설치되므로 온도감응이 제품마다 일정하게 되며, 에폭시 몰딩 처리작업이 생략되고 에폭시 몰딩층에 의해 발생 되는 불량한 온도 감응으로 인한 오작동을 방지하여 제품의 신뢰성을 얻게 되고, 동작표시수단을 자동으로 설치할 수 있어 종래에 비해 제조과정이 축소되어 제품의 경쟁력이 향상되는 효과가 있다.The present invention having the above-described solutions can be installed as an automatic line by installing a secondary temperature sensing element as a chip type on top of the printed circuit board, and the secondary temperature sensing element is constantly installed on the printed circuit board. Temperature sensitivity is constant for each product, the epoxy molding process is omitted, and malfunctions due to poor temperature response generated by the epoxy molding layer can be prevented, thereby obtaining reliability of the product, and operation display means can be automatically installed. In comparison, the manufacturing process is reduced, thereby improving the competitiveness of the product.

이하, 본 발명의 바람직한 실시 예를 도면에 의거하여 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

도 3은 본 발명에 따른 화재감지기의 분해 사시도이고, 도 4는 도 3의 조립단면도이다.3 is an exploded perspective view of a fire detector according to the present invention, Figure 4 is an assembled cross-sectional view of FIG.

또, 도 5는 본 발명에 따른 인쇄회로기판의 상부를 보여주는 사시도이고, 도 6은 도 5의 A-A의 단면도이며, 도 7은 본 발명에 따른 베이스와 동작표시구의 분해 사시도이다.5 is a perspective view showing an upper portion of a printed circuit board according to the present invention, FIG. 6 is a cross-sectional view of A-A of FIG. 5, and FIG. 7 is an exploded perspective view of the base and the operation indicator according to the present invention.

본 발명은 베이스(10)와, 이 베이스(10) 내부에 설치되는 온도감지 인쇄회로기판(20)과, 이 인쇄회로기판(20)을 지지하고 1차 온도감지소자를 보호하는 커버(30)로 이루어진다.The present invention provides a base 10, a temperature sensing printed circuit board 20 installed inside the base 10, and a cover 30 supporting the printed circuit board 20 and protecting the primary temperature sensing element. Is made of.

상기 인쇄회로기판(20)은 하부에 1차 온도감지소자(40)가 설치되고 상부면인 회로인쇄층(21)에 2차 온도감지소자(50)와 동작표시수단의 일부 요소인 발광소자(60)가 칩 타입으로 되어 미리 정해진 회로 상에 납땜된다. 이것에 의해, 자동 라인에서 인쇄회로기판(20)의 회로인쇄층(21)에 각종 소자를 설치할 때, 2차 온도감지소자(50)와 발광소자(60)가 함께 장착되어, 2차 온도감지소자(50)와 발광소자(60)를 인쇄회로기판(20)에 장착하기 위한 별도의 공정이 요구되지 않는다.The printed circuit board 20 has a primary temperature sensing element 40 disposed below and a light emitting element which is a part of the secondary temperature sensing element 50 and an operation display means in the upper surface of the printed circuit layer 21. 60 is a chip type and soldered on a predetermined circuit. As a result, when various elements are installed in the printed circuit board 21 of the printed circuit board 20 in an automatic line, the secondary temperature sensing element 50 and the light emitting element 60 are mounted together, and the secondary temperature sensing is performed. A separate process for mounting the device 50 and the light emitting device 60 to the printed circuit board 20 is not required.

상기 베이스(10)의 소정 위치에는 고정부(11)가 마련되고 이 고정부(11)에는 동작표시구(70)가 설치되어 있다.A fixing part 11 is provided at a predetermined position of the base 10, and an operation indicator 70 is provided in the fixing part 11.

상기 동작표시구(70)는 수광부(71)와 발광부(72)가 형성되는 투명체로 이루어지고 상기 수광부(71)는 회로기판(20) 상에 설치된 발광소자(60)에 근접설치되어 있다. 이것에 의해, 발광소자(60)에서 투사된 빛을 수광부(71)가 받아들이면, 외부로 노출된 발광부(72)에서 빛을 투사하여, 외부로 본 발명에 따른 화재감지기가 작동되고 있음을 경고하게 된다.The operation indicator 70 is formed of a transparent body in which the light receiving unit 71 and the light emitting unit 72 are formed, and the light receiving unit 71 is disposed close to the light emitting element 60 provided on the circuit board 20. As a result, when the light receiving unit 71 receives the light projected from the light emitting device 60, the light is projected from the light emitting unit 72 exposed to the outside, and the fire detector according to the present invention is operated to the outside. You will be warned.

상기 동작표시수단은 인쇄회로기판(20)에 설치된 발광소자(60)와, 베이스(10)에 형성된 고정부(11)와, 고정부(11)에 설치되는 동작표시구(70)의 조합으로 이루어진다.The operation display means is a combination of a light emitting element 60 provided on the printed circuit board 20, a fixing part 11 formed on the base 10, and an operation display tool 70 provided on the fixing part 11. Is done.

상기 도 4, 도 5, 도 6에 도시되어 있는 회로기판(20)의 상면에는 인쇄된 회로 인쇄층(21)과 그 회로 상에 설치된 각종 소자들이 표현되어야 하나 이들은 모두 주지 관용된 것들로서 사실적으로 나타내야할 필요가 없다고 판단되어 생략하였다.The printed circuit printed layer 21 and the various elements installed on the circuit should be represented on the upper surface of the circuit board 20 shown in FIGS. 4, 5, and 6, but these are all commonly known ones. It was judged that there was no need to indicate and was omitted.

상기와 같이 구성되는 본 발명은 종래기술에서 별도로 작업했던 2차 온도감지소자와 발광소자를 칩 타입으로 하여 인쇄회로기판의 상부에 각종 소자들을 설치하는 자동 라인에서 같이 설치하는 것이 가능하므로 별도 작업이 불필요하게 되므로 화재감지기의 생산.판매에 대한 경쟁력이 크게 향상되는 이점이 있다. The present invention configured as described above is a separate operation because it is possible to install together in the automatic line for installing a variety of elements on the upper portion of the printed circuit board using the second temperature sensing element and the light emitting element that was worked separately in the prior art. Since it becomes unnecessary, there is an advantage that the competitiveness of the production and sale of fire detectors is greatly improved.

도 1은 종래기술에 의한 화재감지기의 분해 사시도1 is an exploded perspective view of a fire detector according to the prior art

도 2는 종래기술에 의한 화재감지기의 인쇄회로기판의 부분단면도2 is a partial cross-sectional view of a printed circuit board of a fire detector according to the prior art.

도 3은 본 발명에 따른 화재감지기의 분해 사시도3 is an exploded perspective view of a fire detector according to the present invention;

도 4는 도 3의 조립단면도4 is an assembled cross-sectional view of FIG.

도 5는 본 발명에 따른 인쇄회로기판의 상부를 보여주는 사시도5 is a perspective view showing an upper portion of a printed circuit board according to the present invention.

도 6은 도 5의 A-A선 단면도6 is a cross-sectional view taken along the line A-A of FIG.

도 7은 본 발명에 따른 베이스와 동작표시구의 분해 사시도7 is an exploded perspective view of the base and the operation indicator according to the invention

<도면의 주요부분에 대한 부호설명><Code Description of Main Parts of Drawing>

10; 베이스 11; 고정부 20; 인쇄회로기판 21; 회로인쇄층10; Base 11; Fixing part 20; Printed circuit board 21; Circuit Print Layer

30; 커버 40; 1차 온도감지소자 50; 2차 온도감지소자 30; Cover 40; A primary temperature sensing element 50; Secondary temperature sensing element

60; 발광소자 70; 동작표시구 71; 수광부 72; 발광부60; Light emitting element 70; Operation indicator 71; Light receiver 72; Light emitting part

Claims (2)

베이스(10)와, 이 베이스(10) 내부에 설치되는 인쇄회로기판(20)과, 인쇄회로기판(20)을 커버하는 커버(30)로 이루어지고, 상기 인쇄회로기판에는 1,2차 온도감지소자와 동작표시수단이 설치되는 것에 있어서,A base 10, a printed circuit board 20 installed inside the base 10, and a cover 30 covering the printed circuit board 20. The printed circuit board includes first and second temperatures. In the sensing element and the operation display means is provided, 2차 온도감지소자(50)와 발광소자(60)가 칩 타입으로 구성되어, 인쇄회로기판(20)의 회로인쇄층(21)에 장착되고, 발광소자(60)의 작동을 외부로 알리기 위한 동작표시구(70)가 베이스(10)에 형성된 고정부(11)에 장착되어, 상기 동작표시구(70)의 수광부(71)가 발광소자(60)에 근접하게 배치되어, 발광소자(60)에서 투사된 빛을 수광부(71)가 받아들이면, 외부로 노출된 발광부(72)에서 빛을 투사하여, 화재를 경고하는 것을 특징으로 하는 화재감지기.The secondary temperature sensing element 50 and the light emitting element 60 are formed in a chip type, and are mounted on the circuit printing layer 21 of the printed circuit board 20 to inform the outside of the operation of the light emitting element 60. The operation indicator 70 is mounted on the fixing part 11 formed on the base 10, and the light receiving part 71 of the operation indicator 70 is disposed in close proximity to the light emitting element 60. When the light receiving unit 71 receives the light projected from the (), it is projected by the light emitting unit 72 exposed to the outside, the fire detector, characterized in that for warning the fire. 삭제delete
KR1020080039499A 2008-04-28 2008-04-28 Fire detector KR100931254B1 (en)

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KR102328707B1 (en) * 2019-11-26 2021-11-17 우용성 Fire detector

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001134862A (en) * 1999-11-08 2001-05-18 Hochiki Corp Differential type heat sensor
KR100495577B1 (en) 2004-04-12 2005-06-16 주식회사 씨엔 이지에스 Fire sensing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001134862A (en) * 1999-11-08 2001-05-18 Hochiki Corp Differential type heat sensor
KR100495577B1 (en) 2004-04-12 2005-06-16 주식회사 씨엔 이지에스 Fire sensing device

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