KR100930440B1 - Connection part of bus bar for electricity - Google Patents

Abstract

The present invention relates to a connection portion of a bus bar for electricity delivery.

The present invention, in the connection portion of the bus bar for electricity contacting the face-to-face when interconnecting the bus bar, the aluminum bar; A metal intermediate layer plated on an outer surface of the aluminum bar; And a tin layer plated on an outer surface of the metal intermediate layer, wherein the metal intermediate layer can be firmly adhered to both the aluminum bar and the tin layer, and smooth conduction is made between the aluminum bar and the tin layer. It provides a connecting portion of the bus bar for electricity delivery, characterized in that made of an electrically conductive material.

According to the present invention, since the outermost layer of the connection part is plated with tin having a higher hardness and a lower purchase cost than silver, the production cost of the busbar is reduced and the center of the busbar is lower than the conventional one. The effect is to protect the aluminum bar more firmly.

Bus bar, aluminum bar, metal media layer, tin layer, silver (Ag), heating factor

Description

Joint part of bus bar

The present invention relates to a connection part of a bus bar for electricity supply, and more particularly, is formed at both ends of the bus bar that can transmit more electrical energy than a cable, and contacts the neighboring bus bar with a face-to-face when connected to the neighboring bus bar. It relates to a connection part.

Bus bars are vehicles that deliver electrical energy. In the past, cables have been used as a medium for delivering electrical energy, but in recent years, busbars have been used because of the advantages of busbars, that is, they can deliver more electrical energy in the same volume of conductors. It is widely used as a substitute.

In particular, the busbar is a structure that requires the installation of a large-scale electrical energy transmission system, for example, factories, buildings, apartments, large discount marts, officetels, research complexes, department stores, golf courses, tunnel semiconductors, LCD factories, chemistry, oil refining, steelmaking Its use is rapidly increasing in high-rise buildings, high-voltage substations, LNG takeover bases, new airports, and ports.

Hereinafter, the structure of the bus duct including the bus bar according to the prior art will be described, and the connection portion of the conventional bus bar will be described with reference to FIG. 1 is a perspective view illustrating a bus duct including a bus bar according to the related art, and FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1.

Generally, as shown in FIG. 1, the bus duct includes a housing 10 made of metal and a bus bar partially accommodated in the housing 10, the bus bar being face to face with another neighboring bus bar. And a contact portion 20 in contact. The connection part 20 is positioned to protrude out of the housing 10, and an insulating spacer 30 is positioned between the connection parts 20 to prevent electrical contact between the connection parts 20.

The connection part 20 of the bus bar includes an aluminum bar 22 provided at the center and a silver layer 24 plated on the surface of the aluminum bar 22 as shown in FIG. 2. When the two busbars are connected to each other, the connection part 20 and the connection parts of the other busbars adjacent to each other face to face. Accordingly, the electric energy flowing along the other busbars is transferred to the aluminum bar of the other busbar connection part, the silver layer of the other busbar connection part, the silver layer 24 of the connection part 20 and the aluminum bar 22 of the connection part 20. Passed sequentially through the connection portion 20 of the bus bar, the electrical energy delivered to the connection portion 20 is moved along the bus bar accommodated in the housing 10. Detailed description of the structure and function of the connection portion 20 of the busbar is disclosed in Korean Patent Publication No. 10-2005-38685.

According to the connecting portion 20 as described above, the silver layer 24 is formed on the surface of the aluminum bar 22. However, in such a case, firstly, the high purchase cost of silver is very expensive for the production of the busbars, and secondly, because the low hardness silver is plated on the surface of the aluminum bar, the busbar is moved or the busbar is moved to the housing. A problem arises in that the silver layer of the connection part exposed to the outside of the housing is very easily peeled off due to the scratches that may occur in the process of installing the spacers between the busbars or installed inside. When the silver layer is peeled off, the aluminum bar exposed to the peeled part is oxidized, so that the electrical conductivity of the aluminum bar is poor.

The present invention is to solve the problems as described above, firstly, it is possible to reduce the cost of the production compared to the conventional busbar connection, second, the member that occupies the largest proportion in the electrical energy transfer of the busbar. An object of the present invention is to provide a connection portion of a bus bar for electricity transmission that can more firmly protect the phosphorus aluminum bar than in the related art.

In order to achieve the above object, the present invention, in the connection portion of the bus bar for electricity contact in contact with the face-to-face when the bus bar is interconnected, aluminum bar; A metal intermediate layer plated on an outer surface of the aluminum bar; And a tin layer plated on an outer surface of the metal intermediate layer, wherein the metal intermediate layer can be firmly adhered to both the aluminum bar and the tin layer, and smooth conduction is made between the aluminum bar and the tin layer. It provides a connecting portion of the bus bar for electricity delivery, characterized in that made of an electrically conductive material.

이상이다. 상기 금속 매개층의 전기전도도가

이하인 경우, 서로 접속된 두 개의 부스바 간에 전기에너지가 전달되는 과정에서 상기 금속 매개층의 저항으로 인해 상기 금속 매개층의 온도가 과도하게 상승하는 문제가 발생한다. Preferably the electrical conductivity of the metal intermediate layer is

That's it. Electrical conductivity of the metal intermediate layer

In the following case, the temperature of the metal media layer is excessively increased due to the resistance of the metal media layer in the process of transferring electrical energy between the two bus bars connected to each other.

Preferably the thickness of the metal mediated layer is formed in the range of 0.5 micrometers to 5 micrometers. If the thickness of the metal mediation layer is less than 0.5 micrometer, the firm adhesion between the aluminum bar and the tin layer is not guaranteed, and if the thickness of the metal mediation layer is more than 5 micrometers, the material forming the metal mediation layer is excessively A problem arises and the resistance of the metal media layer increases in the process of the electrical energy is transferred between the two busbars, causing the temperature of the metal media layer to rise excessively.

Preferably the thermal expansion coefficient of the metal mediated layer has a value in the range of 54% to 150% of the thermal expansion rate of the aluminum bar. When the thermal expansion rate of the metal intermediate layer is less than 54% of the thermal expansion rate of the aluminum bar, cracks may occur in the metal intermediate layer by thermal expansion of the aluminum bar, and the thermal expansion rate of the metal intermediate layer is When the thermal expansion coefficient of the bar is greater than 150%, a gap may occur between the aluminum bar and the metal medial layer due to thermal expansion of the metal medial layer and cracks may occur in the tin layer.

Preferably the total amount of impurities (C, S, O) contained in the aluminum bar, the metal intermediate layer and the tin layer is 300 ppm or less. If the total amount of the impurities is greater than 300ppm, the impurities are vaporized due to the temperature rise of the connection part generated in the process of transferring the electrical energy between the two busbars. May cause cracks in the metal mediation layer and tin layer.

Preferably, the thickness of the upper and lower curved portions connecting both side planar portions of the tin layer is formed in the range of 3 micrometers to 18.75 micrometers. When the thickness of the upper and lower curved portions is less than 3 micrometers The upper and lower curved portions of the tin layer may be peeled off by physical friction or mechanical impact during the manufacturing operation of the busbar, when the thickness of the upper and lower curved portions is larger than 18.75 micrometers Comments are unnecessarily consumed.

Preferably, the value of the thickness rate (TR) of the tin layer defined by Equation 1 below has a value in the range of 0.4 to 2.5. If the value of TR is less than 0.4 or greater than 2.5, cracks may occur at the contact points between the both side planar portions and the upper curved part due to the weight of the both side planar portions and the weight of the lower curved portion.

Preferably, the thickness of each of the aluminum bar, the metal intermediate layer and the tin layer is formed such that the value of the heating factor defined by Equation 2 below has a value of 4.6 or less. If the value of the heating factor is greater than 4.6, excessive rise of the junction temperature is caused in the process of transferring electrical energy between the two busbars.

Preferably, the metal mediation layer is made of any one of copper, zinc, nickel, and alloys thereof, and more preferably, the metal mediation layer is a first mediation layer and the first mediation layer plated on an outer surface of the aluminum bar. A second media layer is plated on the outer surface of the first media layer is made of a zinc layer, the second media layer is made of any one of a copper layer, a nickel layer and an alloy layer of copper and nickel.

According to the present invention, since the outermost layer of the connection part is plated with tin having a higher hardness and a lower purchase cost than silver, the production cost of the busbar is reduced and the center of the busbar is lower than the conventional one. The effect is to protect the aluminum bar more firmly.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

3 is a cross-sectional view showing a first embodiment of the busbar connecting portion for power transmission according to the present invention, Figure 4 is a cross-sectional view showing the connecting portion shown in Figure 3, (a) is a TR value of the tin layer than 1 A small case is shown, (b) shows a case where the TR value of the tin layer is larger than 1, and FIG. 5 is a cross-sectional view showing a second embodiment of the bus bar connecting portion for power transmission according to the present invention.

As shown in FIG. 3, the connection part 100 according to the present invention includes an aluminum bar 110 positioned at the center, a metal mediation layer 130 plated on an outer surface of the aluminum bar 110, and the metal mediation. And a tin layer 150 plated on the outer surface of layer 130. Each of the aluminum bar 110, the metal interlayer 130, and the tin layer 150 includes both side planar portions 152 extending vertically in parallel with each other, and a curved portion 154 curved at a constant curvature. The two side surface portions 152 and the curved portion 154 contact each other at the contact point 156.

The outermost layer of the connection part 100 is composed of a tin layer 150 as described above. Since tin is very inexpensive compared to silver, the cost of manufacturing the busbars is reduced compared to the case where silver is plated on the outermost layer of the connection part. In addition, since tin has a higher hardness than silver, the aluminum bar 110 may be more firmly protected than silver is plated on the outermost layer of the connection part. That is, the scratches that may occur in the process of performing the operations included in the manufacturing process of the busbar, for example, moving the busbar, installing the busbar inside the housing, and installing the spacers between the busbars, etc. Since tin is peeled off less easily than silver, the connection part 100 of the present invention in which tin is plated on the outermost side can more firmly protect the aluminum bar 110 than the conventional connection plated on the outermost silver.

On the other hand, when the tin layer 150 is directly formed on the surface of the aluminum bar 110, the firm adhesion between the tin layer 150 and the aluminum bar 110 is not guaranteed. The metal intermediate layer 130 is to solve such a problem and to firmly bond between the tin layer 150 and the aluminum bar 110. Therefore, the metal intermediate layer 130 is made of a material that can not only firmly adhere to the tin layer 150 but also firmly adhere to the aluminum bar 110.

이상인 것이 바람직하다. 상기 금속 매개층(130)의 전기전도도가

이하인 경우, 전기적으로 상호 접속된 두 개의 부스바 간에 전기에너지가 전달되는 과정에서 상기 금속 매개층(130)의 저항으로 인해 상기 금속 매개층(130)의 온도가 과도하게 상승하는 문제가 발생한다. 상기 금속 매개층(130)의 온도가 과도하게 상승하면 상기 금속 매개층(130) 또는 이웃하는 층들이 용융될 수 있는 문제가 발생한다.In addition, since the metal interlayer 130 is provided as a moving passageway of electrical energy moving from one of the two busbars which are in contact with each other face to face to the other, the metal interlayer 130 is made of an electrically conductive material. It is composed. At this time, the electrical conductivity of the metal intermediate layer 130 is

It is preferable that it is above. The electrical conductivity of the metal intermediate layer 130

In the following case, a problem occurs that the temperature of the metal intermediate layer 130 is excessively increased due to the resistance of the metal intermediate layer 130 in the process of transferring electrical energy between two electrically interconnected busbars. If the temperature of the metal intermediate layer 130 is excessively raised, a problem may occur in which the metal intermediate layer 130 or neighboring layers may be melted.

Further, the thickness of the metal medium layer 130 is preferably formed in the range of 0.5 micrometers to 5 micrometers. When the thickness of the metal intermediate layer 130 is less than 0.5 micrometers, the firm adhesion between the aluminum bar 110 and the tin layer 150 is not guaranteed, and the thickness of the metal intermediate layer 130 is 5 micrometers. If larger, a problem occurs that the material constituting the metal intermediate layer 130 is consumed unnecessarily.

In addition, when the thickness of the metal intermediate layer 130 is greater than 5 micrometers, the resistance of the metal intermediate layer 130 is increased in the process of the electrical energy is transferred between the two busbars in electrical contact with the metal intermediate layer 130 The problem that the temperature of 130 rises excessively occurs. More specifically, the relationship between the thickness of the metal intermediate layer 130 and the resistance of the metal intermediate layer 130 will be described in detail. In general, the resistance of an object is inversely proportional to the cross-sectional area of a path through which electrical energy travels, and the length of the movement path As the thickness of the metal interlayer 130 increases, the moving length of the electric energy moving from one of the two electrically connected busbars to the other becomes longer. The resistance increases as the thickness of the metal intermediate layer 130 increases. On the other hand, if the resistance of the metal intermediate layer 130 increases, the temperature of the metal intermediate layer 130 also increases, and if the temperature rises too high, there is a problem that the metal intermediate layer 130 or neighboring layers melt. Will occur. Therefore, the upper limit of the thickness of the metal intermediate layer 130 may be referred to as a threshold that can prevent the metal intermediate layer 130 or neighboring layers from melting.

On the other hand, the thermal expansion coefficient of the metal intermediate layer 130 preferably has a value within the range of 54% to 150% of the thermal expansion rate of the aluminum bar 110. The aluminum bar 100, the metal interlayer 130, and the tin layer 150 generate heat while electrical energy is transferred between the two bus bars that are in electrical contact with each other. Thus, the aluminum bar 100, The metal intermediate layer 130 and the tin layer 150 are in thermal expansion. However, when the thermal expansion rate of the metal interlayer 130 is less than 54% of the thermal expansion rate of the aluminum bar 110, the metal media layer 130 may be cracked by thermal expansion of the aluminum bar 110. May occur, and when the thermal expansion rate of the metal interlayer 130 is greater than 150% of the thermal expansion rate of the aluminum bar 110, the aluminum bar 110 and the thermal expansion of the metal interlayer 130 may be formed. As a gap occurs between the metal interlayers 130, cracks may occur in the tin layer 150.

In addition, the total amount of impurities (C, S, O) included in the aluminum bar 110, the metal interlayer 130, and the tin layer 150 may be 300 ppm or less. As described above, in the process of moving electrical energy between two electrically connected busbars or in the process of moving electrical energy along a length direction within one busbar, the aluminum bar 110 and the metal intermediate layer ( 130 and the tin layer 150 generates heat, thereby causing the impurities (C, S, O) included in the aluminum bar 110, the metal interlayer 130, and the tin layer 150 to be vaporized. do. By the way, when the aluminum bar 110, the metal intermediate layer 130 and the tin layer 150 contains a large amount of impurities, the impurities are vaporized while the aluminum bar 110, the metal intermediate layer 130 and the tin layer ( May cause cracks. Therefore, the total amount of the impurities preferably has an upper limit as described above.

In addition, the thickness t1 of the curved portion 154 connecting the both side planar portions 152 of the tin layer 150 is preferably formed within the range of 3 micrometers to 18.75 micrometers. When the thickness t1 of the curved portion 154 is smaller than 3 micrometers, the curved portion 154 of the tin layer 150 may be peeled off by physical friction or mechanical impact during the manufacturing operation of the busbar. When the thickness t1 of the curved portion 154 is larger than 18.75 micrometers, the tin required to generate the tin layer 150 is unnecessarily consumed.

In addition, it is preferable that the value of the thickness rate (TR) of the tin layer 150 defined by Equation 1 below has a value in the range of 0.4 to 2.5. Here, the TR of the tin layer 150 means a ratio of the thickness t1 of the curved surface portion 154 of the tin layer to the thickness t2 of the planar side portions 152 of the tin layer. In the case, the cross-sectional shape of the connection part 100 is formed as shown in FIG. 4A, and when the TR value is larger than 1, the cross-sectional shape of the connection part 100 is formed as shown in FIG. 4B.

[Equation 1]

Meanwhile, as the TR value of the tin layer 150 decreases, the area of the contact point 156 where the two side surface portions 152 and the curved portion 154 meet is kept constant, while the two side surface portions 152 are maintained. The area of the cross section increases, thereby increasing the weight of both side planar portions 152. That is, as the TR value of the tin layer 150 decreases, the load acting on the contact point 156 is gradually increased. In this case, a crack may occur at the contact point 156. Therefore, the TR value of the tin layer preferably has a lower limit as described above.

In addition, as the TR value of the tin layer 150 increases, the area of the curved portion 154 is kept constant, while the area of the contact point 156 becomes small, and thus the load acting on the contact point 156 is reduced. In this case, a crack may occur at the contact point 156. In addition, as the TR value of the tin layer 150 increases, the thickness t2 of the both side planar portions 152 gradually decreases. In this case, the both side plane pillars 152 are very easily scratched. Can be peeled off. Therefore, the TR value of the tin layer preferably has an upper limit as described above.

The thickness of each of the aluminum bar 110, the metal intermediate layer 130, and the tin layer 150 is preferably formed such that the value of the heating factor defined by Equation 2 below has a value of 4.6 or less. In Equation 2 below, 'the maximum temperature of the connection part expected when the current is applied' is a temperature calculated during the design of the bus bar and is applied to the connection part 100 while preventing melting of each layer constituting the connection part 100 of the bus bar. Means the highest temperature possible. In addition, as described above, both side planar portions 152 and curved portions 154 of the tin layer 150 may have different thicknesses according to the TR value of the tin layer. In this case, Equation 2 below. In the 'thickness of the tin layer' means the thickest thickness of the tin layer 150. That is, when the TR value is less than 1, the thickness t2 of both side planar portions 152 is substituted in the 'thickness of the tin layer' of Equation 2 below, and when the TR value is greater than 1, the curved portion 154 The thickness t1 of is substituted.

[Equation 2]

On the other hand, when the value of the heating factor is greater than 4.6, the temperature of the connection part 100 is excessively increased in the process of transferring the electrical energy between the two busbars in electrical contact with each other, the aluminum bar 110 or the metal intermediate layer. 130 or the tin layer 150 may be melted.

The metal intermediate layer 130 is preferably made of any one of copper, zinc, nickel, and alloys thereof that satisfy the above-described limitations. When the metal intermediate layer 130 is configured in this way, the total purchase cost of the materials forming the metal intermediate layer 130 and the tin layer 150 is in a range of about 20% to 30% compared to silver (Ag). Because it is formed at, the cost of manufacturing busbars can be greatly reduced.

On the other hand, the metal intermediate layer 110 was configured as a single layer, but as an alternative, the metal intermediate layer 130 is plated on the outer surface of the aluminum bar 110 as shown in FIG. 5. The first media layer 132 and the second media layer 134 is plated on the outer surface of the first media layer 132. In this case, the first media layer 132 may maintain a firm bond with the aluminum bar 110, the second media layer 134 is firmly bonded with the first media layer 132 and the tin layer 150. It consists of a material that can maintain.

이상이고, 금속 매개층(130)의 열팽창률에 대한 한정에 있어서, 상기 제1매개층(132) 및 제2매개층(134) 각각의 열팽창률이 상기 알루미늄 바(110)의 열팽창률의 54% 내지 150%의 범위 내의 값을 갖으며, 수학식2에서 '매개층의 비저항과 매개층의 두께와의 곱'은 '제1매개층의 비저항과 제1매개층의 두께와의 곱'과 '제2매개층의 비저항과 제2매개층의 두께와의 곱'을 더한 값을 의미한다. 또한, 상기 금속 매개층(130)을 제1매개층(132)과 제2매개층(134)으로 구성할 경우, 상기 제1매개층(132)은 아연층으로, 상기 제2매개층(134)은 구리층, 니켈층 및 구리와 니켈의 합금층 중 어느 하나로 구성됨이 바람직하다. Even if the metal intermediate layer 130 is composed of the first mediation layer 132 and the second mediation layer 134, the above limitations on the busbars are still applied. However, in the limitation of the electrical conductivity of the metal intermediate layer 130, the electrical conductivity of each of the first mediation layer 132 and the second medial layer 134

In the above, the thermal expansion rate of each of the first and second mediation layers 132 and 134 is 54 of the thermal expansion rate of the aluminum bar 110. It has a value in the range of% to 150%, and the product of the resistivity of each layer and the thickness of the intermediate layer in Equation 2 is the product of the resistivity of the first layer and the thickness of the first layer. It means a value obtained by adding the product of the resistivity of the second mediated layer and the thickness of the second mediated layer. In addition, when the metal intermediate layer 130 is composed of the first intermediate layer 132 and the second intermediate layer 134, the first intermediate layer 132 is a zinc layer, the second intermediate layer 134 ) Is preferably composed of any one of a copper layer, a nickel layer, and an alloy layer of copper and nickel.

1 is a perspective view showing a bus duct including a bus bar according to the prior art.

FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1.

3 is a cross-sectional view showing a first embodiment of the busbar connecting portion for power transmission according to the present invention.

4 is a cross-sectional view showing the connecting portion shown in FIG. 3, (a) shows a case where the TR value of the tin layer is smaller than 1, and (b) shows a case where the TR value of the tin layer is larger than one. It is.

5 is a cross-sectional view showing a second embodiment of the busbar connecting portion for power transmission according to the present invention.

Claims (10)

In the connection part of the busbar for electricity bus bar which contacts face-to-face at the time of interconnection of bus bar, Aluminum bars; A metal intermediate layer plated on an outer surface of the aluminum bar; And Including; tin layer is plated on the outer surface of the metal medium layer, The metal intermediate layer may be firmly adhered to both the aluminum bar and the tin layer, and the connection part of the bus bar for electricity transmission, characterized in that made of an electrically conductive material so as to enable smooth conduction between the aluminum bar and the tin layer. The method of claim 1, The electrical conductivity of the metal intermediate layer is

The connection part of the bus bar for electricity delivery characterized by the above. The method of claim 1, The thickness of the metal intermediate layer is connected to the bus bar, characterized in that 0.5 micrometer to 5 micrometers. The method of claim 1, The thermal expansion coefficient of the metal medium layer is a bus bar connection portion, characterized in that 54% to 150% of the thermal expansion rate of the aluminum bar. The method of claim 1, Connection part of the bus bar for electricity, characterized in that the total amount of impurities (C, S, O) contained in the aluminum bar, the metal medium layer and the tin layer is 300ppm or less. The method of claim 1, The connecting portion of the bus bar for electricity delivery, characterized in that the thickness of the upper and lower curved portion connecting the both side plane portion of the tin layer is 3 micrometers to 18.75 micrometers. The method of claim 1, Connection portion of the bus bar for electricity, characterized in that the value of the thickness (TR) of the tin layer defined by the following equation (1) is 0.4 to 2.5. [Equation 1]

The method of claim 1, The thickness of each of the aluminum bar, the metal intermediate layer and the tin layer is connected to the bus bar, characterized in that the heat generation factor defined by Equation 2 below has a value of 4.6 or less. [Equation 2]

The method of claim 1, The metal intermediate layer is connected to the bus bar, characterized in that made of any one of copper, zinc, nickel and alloys thereof. The method of claim 1, The metal intermediate layer includes a first media layer plated on the outer surface of the aluminum bar and a second media layer plated on the outer surface of the first media layer, The first media layer is made of a zinc layer, the second media layer is connected to the bus bar, characterized in that any one of a copper layer, a nickel layer and an alloy layer of copper and nickel.

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