KR100917253B1 - Light emmitting diode with cooling fluid for radiating heat - Google Patents

Abstract

An LED lamp is provided to maximize cooling efficiency by easily converting a gaseous cooling fluid into a liquid cooling fluid. A heat pipe(101) comprises a heat absorbing plate, a sealing plate(115), and a sidewall(107). The heat absorbing plate absorbs a heat emitted from an LED. The sidewall connects the heat absorbing plate to the sealing plate. A substrate is contacted with the heat absorbing plate of the heat pipe. The LED is mounted on the substrate. A first cooling fluid is stored inside the heat pipe. The cooling pipe provides a path of a second cooling fluid for cooling the heat pipe. A circulation pump(119) circulates the second cooling fluid flowing to the cooling pipe. A cooling device(121) cools the second cooling fluid by an air cooling mode.

Description

LED light emitting lamp for radiating heat by using a cooling fluid {light emmitting diode with cooling fluid for radiating heat}

The present invention relates to an LED light emitting lamp that makes it easy to heat dissipation using a cooling fluid.

Korean Patent Application No. 10-2007-10134 (name of the invention: LED lighting assembly having a cooling device using a heat pipe) discloses an LED lighting assembly with a heat pipe using a cooling fluid.

1 is a cross-sectional view of a LED light emitting lamp of Korean Patent Application No. 10-2007-10134.

The LED light emitting lamp disclosed in Korean Patent Application No. 10-2007-10134 has a cooling fluid in a sealed state, and has a cylindrical shape having an endothermic surface 12, a sealing surface 14, and a side surface 16. The heat pipe 10 and the at least one LED 21 formed with the through-hole by the inner side pipe member penetrating the surface 12 and the sealing surface 14, The heat pipe 10 LED coupled to the heat absorbing surface 12 of the heat pipe 12 to be transmitted to, the LED assembly 20 coupled to pass through the heat pipe 10 through the through-hole through the through hole (20), heat pipe ( 10 is coupled to the side of the heat dissipation unit 30 for dissipating heat transferred to the heat pipe to the outside and the wire 26 passed through the through hole of the heat pipe 10, to be coupled to an external electrical supply source Electrical connection can be made.

In the LED emitting lamp configured as described above, heat radiated from the LED 21 is transferred to the heat pipe 10 through the heat absorbing surface 12 of the heat pipe 10 to heat the cooling fluid inside the heat pipe 10. When the internal cooling fluid is heated, the heat pipe 10 is cooled while being vaporized, and the cooling fluid of the gaseous phase contacted with the cooled heat pipe 10 is converted into a liquid phase and vaporized again by LED heating. Heat dissipation is achieved by the cooling cycle.

This cooling circulation process increases the cooling efficiency when the portion where the cooling fluid is vaporized and the portion where the vaporized cooling fluid is liquefied again by cooling are clearly distinguished. However, in the conventional patent application shown in FIG. 1, the heat dissipation part 30 is formed over the entire length of the heat pipe, and heat absorbed by the heat absorbing plate is uniformly transmitted over the entire length of the heat pipe 10. Therefore, the cooling fluid vaporized once is difficult to be liquefied, so the cooling of the heat pipe 10 is cooled by the air cooling method of the heat dissipation unit 30 rather than cooling by vaporization heat, so the efficiency is extremely deteriorated.

The present invention is to solve such a problem, the problem of the present invention is to provide an LED light lamp for maximizing the cooling efficiency by making it easy to change the gas phase and liquid phase of the cooling fluid.

Solution to Problem The present invention for solving the above problems consists of a heat absorbing plate, a sealing plate spaced apart from the heat absorbing plate, the heat absorbing plate and the side wall coupled to the outer circumferential surface of the sealing plate, the first having a volatility therein A heat pipe in which a cooling fluid is stored; At least one or more LEDs disposed outside the heat absorbing plate; A heat dissipation blade radially formed on an outer circumferential surface of the side wall of the heat pipe in which the first cooling fluid maintains a gaseous state; It includes a supply means for supplying electricity to the LEDs.

In addition, another problem of the present invention consists of a heat absorbing plate, a sealing plate spaced apart from the heat absorbing plate, and a side wall coupling the outer peripheral surface of the heat absorbing plate and the sealing plate, the first cooling fluid having a volatility therein is Heat pipes stored; At least one or more LEDs disposed outside the heat absorbing plate; A cooling pipe forming a path of a second cooling fluid for cooling the side wall portion of the heat pipe in which the first cooling fluid maintains a gaseous state; It includes a circulation pump for forcibly circulating the second cooling fluid and a cooler for cooling the second cooling fluid.

In addition, another object of the present invention is to provide a base plate comprising a substrate having a plurality of LEDs installed on one surface and an LED light lamp having a heat pipe radiating heat of the base plate: the heat pipe is a heat absorbing plate and And a sealing plate installed to be spaced apart from the heat absorbing plate, and a side wall coupled to the heat absorbing plate and an outer circumferential surface of the sealing plate to store a first cooling fluid having a volatility therein, and the first cooling fluid maintains a gaseous state. Cooling pipe which is a distribution path of the second cooling fluid for cooling the first cooling fluid is installed at the side wall of the space.

In the present invention, the side wall is installed on the upper portion of the lower cylindrical pipe and the lower cylindrical pipe and the upper cylindrical pipe having a larger diameter than the lower cylindrical pipe.

It is preferably formed.

Further, in the present invention, it is preferable that the upper end of the lower cylindrical pipe and the lower end of the upper cylindrical pipe are connected by a slope pipe made of a slope.

In addition, in the present invention, it is preferable that a heat radiating blade is radially installed on the outer circumferential surface of the side wall of the space in which the first cooling fluid is maintained in a gaseous state.

In addition, in the present invention, a plurality of heat pipes are installed, and cooling pipes installed in each heat pipe are interconnected by connecting pipes, and a second cooling fluid sequentially circulates the plurality of heat pipes. At least one of them is preferably provided with a circulation pump and a cooler.

In the present invention, the lower cylindrical pipe is preferably a thermal insulator.

Still another solution of the present invention includes a heat pipe for absorbing heat of the LED, a heat seal plate and a lower part of which is sealed by the heat absorbing plate, and a through hole in which the upper part is sealed by the sealing part; A first cooling fluid vaporized by heat of the heat absorbing plate stored in a lower portion of the through hole of the heat pipe; And a second cooling fluid stored in one or both of the side wall accommodating portion formed between the inner circumferential surface and the outer circumferential surface of the side wall of the heat pipe or the sealing accommodating portion formed between the outer circumferential surface and the inner circumferential surface of the sealing portion.

Further, in the present invention, it is preferable that both the side wall accommodating portion and the sealing accommodating portion are formed, and the side wall accommodating portion and the sealing accommodating portion are welded to each other.

In the present invention, the second cooling fluid is preferably forcedly circulated by the circulation pump.

According to the present invention having the above-mentioned problems and solutions, the part where the first cooling fluid is present in the liquid phase and the part present in the gas phase is clearly distinguished, and the part present in the gas phase is air-cooled, a second cooling fluid or a mixture thereof. By cooling by one method, it is possible to efficiently convert the gaseous first cooling fluid into the liquid phase, thereby increasing the cooling efficiency.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 2 is a perspective view illustrating an embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line AA ′ of FIG. 2.

2 and 3, the LED lighting lamp 100 according to the exemplary embodiment includes a heat absorbing plate 109 absorbing heat emitted from the LED 111, a sealing plate 115 and a heat absorbing plate 109 sealing the inside. The substrate 113 in which the heat pipe 101 formed of the side wall 107 connecting the sealing plate 115 and the heat absorbing plate 109 of the heat pipe 101 is installed in contact with the LED 111. And a heat dissipation blade 127 radially installed on an outer circumferential surface of the heat pipe 101, a first cooling fluid 129 introduced and stored in the heat pipe 101, and a vaporized first cooling fluid 129. A cooling pipe 117 which provides a circulation path of the second cooling fluid for forcibly cooling the heat pipe 101 and a circulation pump 119 for forcibly circulating the second cooling fluid flowing through the cooling pipe 117 to liquefy the heat pipe 101. And a cooler 121 for cooling the second cooling fluid by an air cooling method.

The side wall of the heat pipe 101 may be made of a cylindrical pipe of the same diameter for simplicity in the manufacturing process, but larger than the diameter of the lower cylindrical pipe 103 and the lower cylindrical pipe 103 to facilitate circulation of vaporization and liquefaction. It is preferable to form the upper cylindrical pipe 107 having a diameter and the slope pipe 105 connecting the lower cylindrical pipe 103 and the upper cylindrical pipe 107.

      In addition, the lower cylindrical pipe 103 is preferably made of a non-metal that is a thermal insulator so that heat from the heat absorbing plate 109 can be transferred to the first cooling fluid 129 and transferred only to the first cooling fluid.

In addition, the cooling pipe 117 is shown as being installed inside the side wall of the upper cylindrical pipe 107 which is a space in which the first cooling fluid is purely in the gas phase in order to cool the second cooling fluid in the gas phase and convert it into a liquid phase. However, the present invention is not limited thereto, and may be installed outside of the outer circumferential surface of the upper cylindrical pipe 107 or installed inside the inner circumferential surface. In addition, the second cooling fluid flowing through the cooling pipe 117 is connected by the circulation pump 119 and the cooler 121 and the connection pipe (not shown) and the heated second cooling fluid is forcedly circulated by the circulation pump 119. It is cooled by the cooler 121.

The cooler 121 may be configured in various forms, but preferably, the cooler 121 is configured to be cooled by air in a process in which the second cooling fluid flows through various flow paths.

In addition, the injection plate 123 is formed in the sealing plate 115 to inject the first cooling fluid 129 having volatility into the sealing plate 115 and to vacuum the inside of the heat pipe 101 below atmospheric pressure. When the injection of the cooling fluid and the vacuum is finished, the welding is performed to maintain the heat pipe 101 at a low pressure. It is also well known to those skilled in the art that the seal 123 can be configured as a valve.

Although the installation place of the cooler 121 and the circulation pump 119 is not particularly limited, it is preferable to be installed on the upper surface of the sealing plate 115, and a power connection part for supplying electricity to the LED is provided on the upper surface of the sealing plate 115. 125 is installed, and the power connection unit 125 and the substrate 113 are electrically connected by wires (not shown) to supply power to the LEDs 111.

In addition, the heat dissipation block is disposed on the portion where the first cooling fluid 129 maintains the liquid state.

It is preferable not to form the id 127 and to be formed only in a portion that maintains a gaseous state. The heat radiating blade 127 maintains the liquid state of the first cooling fluid 129

If it is connected to the portion to be vaporized by the heat transfer of the heat radiation blade 127 is promoted because the effect of cooling the heat flowing from the heat absorbing plate 109 is reduced.

In addition, in FIG. 3, the heat absorbing plate 109 and the substrate 113 are separately installed, but it is well known to those skilled in the art that they may be formed as one body.

In addition, the first cooling fluid may be an alcohol having a volatility even at low temperatures, but is not limited thereto.

4 is a plan view of another embodiment of the present invention.

The base plate 200 is installed in the lower portion of the base plate 200 of the LED light emitting lamp shown in Figure 4, the heat pipe for radiating heat generated from the LEDs in the upper portion of the base plate 200 (a) to (l) are provided. The heat pipes (a) to (l) have the same structure as the heat pipe 101 of the LED light lamp 100 of FIGS. 2 and 3, but the heat absorbing plate is bonded to the base plate 200 with the substrate omitted. The devices for circulating and cooling the second cooling fluid are not individually configured, but are integrally formed. Each of the heat pipes (a) to (l) is interconnected by a connecting pipe 201, and the circulation pump 203 and the cooler 205 in the connecting pipe connecting the heat pipe (g) and the heat pipe (k). ) Is installed.

The second cooling fluid pressurized by the circulation pump 203 is cooled in the cooler 205 and cools the heat pipe while sequentially flowing each heat pipe, and then flows back into the circulation pump 203.

In order to cool the lighting apparatus installed with a large number of LEDs, a heat pipe using the same structure as shown in FIGS. 2 and 3 or applied thereto is installed on the base plate 200, and a single circulation pump is provided. Cooling with a cooler can further save energy.

5 is a cross-sectional view of another embodiment of the present invention.

5, the LED emitting lamp 300 of the embodiment illustrated in FIG. 5 is a heat absorbing plate 109, a sealing part 303 and a lower part thereof are sealed by the heat absorbing plate 109, and an upper part thereof is sealed by the sealing part 303. A hole is formed and a lower portion of the through hole is formed of a heat pipe 301 consisting of a side wall 315 in which the first cooling fluid 129 is stored, and a substrate 113 disposed below the heat absorbing plate 109 of the heat pipe 301. ) And LEDs 111 installed under the substrate 113.

Further, a side wall accommodating portion 307 formed between the inner circumferential surface and the outer circumferential surface of the side wall 315 and a sealing accommodating portion 305 formed between the inner circumferential surface and the outer circumferential surface of the sealing portion 303 are formed.

In this case, the accommodating part 307 may be formed only in the sealing part 303, and may be formed only in a part of the side wall 315, and as illustrated in FIG. 5, the accommodating part of the sealing part 303 and the side wall 315 may be accommodated. The portions may be welded and connected to each other. The second cooling fluid 309 is stored in the side wall accommodating part 307 and the sealing accommodating part 305. The second cooling fluid 309 is for cooling and liquefying the vaporized first cooling fluid 129, and preferably cooling the upper portion of the heat pipe 301 so that the first cooling fluid 129 flows through the vaporized portion. Therefore, it is preferable to be formed in the upper part of a heat pipe.

In addition, the second cooling fluid is connected to the upper and lower portions of the side wall accommodating part 307 by a connection pipe 311, and the second cooling fluid 309 flowing through the connection pipe 311 is provided by a circulation pump 313. Forced circulation Unlike the case shown in FIG. 5, the connection pipe 311 may be circulated by connecting the hot portion and the cold portion to the second cooling fluid.

In addition, the second cooling fluid is preferably cooled while passing through a cooler (not shown) connected to the connection pipe 311.

In addition, an upper portion of the sidewall accommodating portion 307 is opened, and the opening is configured to have a structure suitable for sealing to the protrusion 317 of the sealing portion 303.

In addition, the sealing part 303 is provided with a valve for sealing after injecting the first cooling fluid into the through hole of the side wall and then vacuum. In addition, reference numeral 125 denotes a general power connector 125 connected to an external electric socket to supply power to the substrate 113, and 127 denotes a heat radiation blade installed on an outer circumferential surface of the side wall 315.

As such, the first cooling fluid 129 of the configured LED lighting lamp 300 is vaporized when the heat absorbing plate 109 is heated as the LED 111 emits light, and the vaporized fluid rises to the heat pipe 301. And the vaporized fluid is cooled by the side wall 315 and the sealing part 303 cooled by the second cooling fluid, liquefied again, and undergoes a circulation process of falling into the lower portion of the through hole. The heat absorbing plate 109 is cooled.

In addition, as described above, the substrate 113 and the heat absorbing plate 109 may be integrally formed, and in this structure, the heat absorbing plate directly absorbs heat of the LED.

In addition, it is well known that the receiving portion 307 may be formed of a tube that provides a circulation path of the second cooling fluid passing through the side wall 315 and the sealing portion 303.

1 is a cross-sectional view of a LED light emitting lamp of Korean Patent Application No. 10-2007-10134.

2 is a perspective view illustrating an embodiment of the present invention.

3 is a cross-sectional view taken along the line AA ′ of FIG. 2.

4 is a plan view illustrating another embodiment of the present invention.

5 is a cross-sectional view illustrating yet another embodiment of the present invention.

Claims (11)

delete A heat pipe comprising a heat absorbing plate, a sealing plate spaced apart from the heat absorbing plate, and a side wall coupling the outer circumferential surface of the heat absorbing plate and the sealing plate and storing a first cooling fluid having a volatility therein; At least one or more LEDs disposed outside the heat absorbing plate; A cooling pipe forming a path of a second cooling fluid for cooling the side wall portion of the heat pipe in which the first cooling fluid maintains a gaseous state; LED lighting lamp comprising a circulation pump for forcibly circulating the second cooling fluid and a cooler for cooling the second cooling fluid. In the LED emitting lamp having a base plate provided with a plurality of LEDs on one side and a heat pipe for dissipating heat of the base plate: The heat pipe includes a heat absorbing plate, a sealing plate spaced apart from the heat absorbing plate, a side wall coupled to the heat absorbing plate and an outer circumferential surface of the sealing plate, and stores a first cooling fluid having a volatility therein. LED lighting lamp, characterized in that the cooling pipe which is a distribution path of the second cooling fluid for cooling the first cooling fluid is installed on the side wall portion of the space in which the cooling fluid maintains the gaseous state. The LED lighting lamp according to claim 2 or 3, wherein the side wall is formed of a lower cylindrical pipe and an upper cylindrical pipe having a diameter larger than that of the lower cylindrical pipe and installed above the lower cylindrical pipe. The LED light lamp of claim 4, wherein an upper end of the lower cylindrical pipe and a lower end of the upper cylindrical pipe are connected by a slope pipe having a slope. The LED lighting lamp of claim 2, wherein a heat dissipation blade is radially installed on an outer circumferential surface of the side wall of the space in which the first cooling fluid is maintained in a gaseous state. The heat pipe of claim 3, wherein a plurality of heat pipes are installed, cooling pipes installed in each heat pipe are interconnected by connecting pipes, and a second cooling fluid sequentially circulates the plurality of heat pipes. LED lighting lamp, characterized in that at least one of the circulation pump and the cooler is installed. The LED light lamp of claim 4, wherein the lower cylindrical pipe is a thermal insulator. A heat pipe having a heat absorbing plate for absorbing heat of the LED, a sealing part, and a through hole in which the lower part is sealed by the heat absorbing plate and the upper part is sealed by the sealing part; A first cooling fluid vaporized by heat of the heat absorbing plate stored in a lower portion of the through hole of the heat pipe; And a second cooling fluid stored in one or both of the side wall accommodating portion formed between the inner circumferential surface and the outer circumferential surface of the side wall of the heat pipe or the sealing accommodating portion formed between the inner circumferential surface and the outer circumferential surface of the sealing portion. The LED lighting lamp of claim 9, wherein both the side wall accommodating part and the sealing accommodating part are formed, and the side wall accommodating part and the sealing accommodating part are welded to each other. The LED lighting lamp of claim 10, wherein the second cooling fluid is forcedly circulated by a circulation pump.

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