KR100909523B1 - Separating device for metal and fibish of waste ink die semiconductor wafer - Google Patents

Separating device for metal and fibish of waste ink die semiconductor wafer Download PDF

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KR100909523B1
KR100909523B1 KR20080002509A KR20080002509A KR100909523B1 KR 100909523 B1 KR100909523 B1 KR 100909523B1 KR 20080002509 A KR20080002509 A KR 20080002509A KR 20080002509 A KR20080002509 A KR 20080002509A KR 100909523 B1 KR100909523 B1 KR 100909523B1
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South Korea
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waste ink
semiconductor wafer
metal
pvc
ink die
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KR20080002509A
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Korean (ko)
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KR20090076515A (en
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전찬욱
조헌창
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주식회사 제이빌텍
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/02—Separating plastics from other materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/02—Separating plastics from other materials
    • B29B2017/0213—Specific separating techniques
    • B29B2017/0217—Mechanical separating techniques; devices therefor
    • B29B2017/0224—Screens, sieves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/02—Separating plastics from other materials
    • B29B2017/0213—Specific separating techniques
    • B29B2017/0217—Mechanical separating techniques; devices therefor
    • B29B2017/0231—Centrifugating, cyclones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Abstract

본 발명은 폐잉크다이반도체웨이퍼의 메탈과 PVC 분리 추출장치에 관한 것으로, 모터(1)와, 모터(1)에 의해 회전력을 전동받아 회전하는 회전망(6)과 거름망(7)을 포함하여 구성되며, 회전망(6)의 외주로 둘러 싸는 드럼(3) 외부는 단열층(4)이 형성되고, 단열층(4) 안으로는 열코일(5)이 형성된 히팅층(35)이 형성되며, 히팅층(35) 안으로는 히팅층 보호판(99)과 회전망(6)이 형성되는 것을 특징으로 하며, 상기한 드럼(3)의 상부는 덮개(32)가 형성되고, 바닥에는 배출공(11)을 형되며, 측부에는 압력공기배출밸브(23)를 형성한 것을 특징으로 하며, 상기한 회전망(6) 안쪽으로는 거름망(7)을 설치하는 것을 특징으로 하며, 상기한 열코일(5)에 의한 히팅층(35)의 가열은 섭씨 120도 - 200도로 가열하는 것을 특징으로 한다.The present invention relates to a metal and PVC separation extraction apparatus of a waste ink die semiconductor wafer, including a motor (1), a rotating mesh (6) and a strainer (7) which are rotated by rotational force transmitted by the motor (1). The outer side of the drum (3) surrounding the outer periphery of the rotating net (6) is formed, the heat insulating layer 4 is formed, the heating layer 35 is formed with a thermal coil (5) is formed in the heat insulating layer 4, the heating layer (35) is characterized in that the heating layer protective plate 99 and the rotating net (6) is formed, the upper part of the drum (3) is formed with a cover (32), the bottom of the discharge hole (11) It is characterized in that the pressure air discharge valve 23 is formed on the side, characterized in that the filtering net (7) is installed inside the rotary net (6), by the thermal coil (5) The heating of the heating layer 35 is characterized in that the heating to 120 degrees Celsius-200 degrees.

폐잉크다이반도체 웨이퍼, PVC, 분리, 추출, 폐잉크다이 Waste Ink Die Semiconductor Wafer, PVC, Separation, Extraction, Waste Ink Die

Description

폐잉크다이반도체 웨이퍼의 메탈과 피브이시 분리 추출장치{METAL AND PVC SEPERATING APPARATUS OF WASTE-WAFER} Separating device for metal and fibish separation of waste ink die semiconductor wafers {METAL AND PVC SEPERATING APPARATUS OF WASTE-WAFER}

본 발명은 폐잉크다이반도체 웨이퍼(폐실리콘 웨이퍼) 에 부착된 대전방지용의 PVC 필름과 메탈의 분리장치에 관한 것이다The present invention relates to an antistatic PVC film and metal separating apparatus attached to a waste ink die semiconductor wafer (waste silicon wafer).

종래 폐잉크다이반도체 실리콘웨이퍼는 소각 폐기처리하는데 이 경우, 폐잉크다이반도체웨이퍼에는 대전방지용의 PVC 필름이 부착되어 있어 소각시 유독 가스가 발생하여 대기 오염을 야기시키며, 또한 매립으로 인한 환경오염의 원인이 된다Conventional waste ink die semiconductor silicon wafers are incinerated and disposed of.In this case, waste ink die semiconductor wafers are equipped with an antistatic PVC film, which causes toxic gases upon incineration, causing air pollution, and environmental pollution due to landfill. Cause

본 발명은 상기한 점을 감안하여 발명한 것으로, PVC를 분리 추출하여 환경오염을 방지하고, 분리수거한 메탁과 PVC를 재활용할 수 있도록 하는 장치를 제공함에 본 발명의 목적이 있다The present invention has been invented in view of the above points, and has an object of the present invention to provide a device for separating and extracting PVC to prevent environmental pollution, and to recycle the collected and methane and PVC.

상기한 본 발명의 목적을 달성하기 위한 본 발명의 주요 구성은, 모터(1) 와, 모터(1)에 의해 회전력을 전동받아 회전하는 회전망(6)과 거름망(7)을 구성하며, 회전망(6)의 외주로 둘러 싸는 드럼(3) 외부는 단열층(4)이 형성되고, 단열층(4) 안으로는 열코일(5)이 형성된 히팅층(35)이 형성되며, 히팅층(35) 안으로는 히팅층보호판(99)과 회전망(6)이 형성되는 것을 특징으로 하며, 상기한 드럼(3)의 상부는 덮개(32)가 형성되고, 바닥에는 배출공(11)을 형되며, 측부에는 압력공기배출밸브(23)를 형성한 것을 특징으로 하며, 상기한 회전망(6) 안쪽으로는 거름망(7)을 설치하는 것을 특징으로 하며, 상기한 열코일(5)에 의한 히팅층(35)의 가열은 섭씨 120도 - 200도로 가열하는 것을 특징으로 한다The main configuration of the present invention for achieving the above object of the present invention comprises a motor (1), a rotating net (6) and a sieve (7) rotating by receiving a rotational force by the motor (1), Outside of the drum (3) surrounding the periphery of the view (6), a heat insulating layer (4) is formed, a heating layer (35) formed with a heat coil (5) is formed inside the heat insulating layer (4), and inside the heating layer (35) The heating layer protective plate 99 and the rotating mesh 6 is formed, the upper portion of the drum 3 is formed with a cover 32, the bottom is formed with a discharge hole 11, the side It characterized in that the pressure air discharge valve 23 is formed, and the filtering net (7) is provided inside the rotary net (6), the heating layer 35 by the thermal coil (5) Heating) is characterized by heating 120 degrees Celsius-200 degrees Celsius.

본 발명에 의하면, 종래 폐잉크다이반도체웨이퍼의 폐기시 발생되는 대기와 토양의 환경오염을 방지할 수 있으며, 아울러 분리 추출한 메탈과 PVC를 재활용 가능하다According to the present invention, it is possible to prevent the environmental pollution of the air and soil generated during the disposal of the conventional waste ink die semiconductor wafer, and it is possible to recycle separated metal and PVC.

도 1 은 본 발명에 따른 장치를 나타낸다1 shows an apparatus according to the invention.

도시한 바와 같이, 모터(1)의 회전에 의해 소정의 전동장치(2)를 거쳐, 회전망(6)과 거름망(7)이 회전한다As shown, the rotary net 6 and the strainer 7 rotate through the predetermined transmission device 2 by the rotation of the motor 1.

회전망(6)의 외주로 둘러 싸는 드럼(3)은 외부가 단열층(4)으로 이루어지고, 그 안쪽으로는 열코일(5)이 내장된다. 열코일(5)은 드럼 내부를 빙글빙글 둘러 감 는 형상으로 설치된다. 그 안쪽으로는 히팅층보호판(99)이 형성된다The drum 3 enclosed by the outer periphery of the rotary net 6 is made of a heat insulating layer 4 on the outside thereof, and a thermal coil 5 is embedded therein. The thermal coil 5 is installed in a shape that winds around the drum. Inside, a heating layer protective plate 99 is formed.

그 안으로는 회전망(6)이 설치된다. 회전망(6)은 내부에 고정되며 그 하단에는 밸런스스프링(13)을 설치하고, 그 안쪽으로는 별도로(추가로) 거름망(7)이 설치된다. 거름망(7)의 망 크기는 회전망(6)의 망보다 더 세밀하다Into it, a rotating net 6 is installed. The rotating net 6 is fixed inside, and the balance spring 13 is installed at the lower end thereof, and the filtering net 7 is installed inside (in addition) separately. The mesh size of the strainer (7) is finer than that of the rotating mesh (6)

거름망(7)은 교체 가능하므로 필요에 따라 원하는 사이즈의 거름망으로 교체 가능하다. 드럼(3)의 바닥(9)에는 배출공(11)을 형성하여 열로 녹은 PVC가 하부로 배출된다. 상단에는 압력게이지(33)와 온도게이지(38)가 설치된 덮개(32)가 설치되며, 드럼의 측부에는 안전용으로, 압력공기배출밸브(23)가 설치된다. 이 밸브는 드럼의 내부가 소정의 압력 이상이 되면 자동으로 개방되게 되어 있다. 상기한 측정게이지들은 컨트롤 박스(40)와 연결된다. 그리하여 콘트롤 박스에 의한 각종 제어 구성이 가능하다Since the strainer 7 is replaceable, it can be replaced with a strainer of a desired size. In the bottom 9 of the drum 3, a discharge hole 11 is formed, and the PVC melted with heat is discharged downward. The upper end of the cover 32 is provided with a pressure gauge 33 and a temperature gauge 38, the side of the drum for safety, the pressure air discharge valve 23 is installed. The valve is automatically opened when the inside of the drum is above a predetermined pressure. The measurement gauges are connected to the control box 40. Thus, various control configurations are possible by the control box.

상기한 구성에 의한 작동을 이하, 설명한다The operation by the above-described configuration will be described below.

먼저, 메탈의 크기에 따라, 메탈이 걸러 질 수 있는 정도의 망 사이즈를 갖는 거름방(7)을 설치하고, 열코일(5)을 히팅 작동시킨다. 섭씨 130도 전,후가 되면 PVC가 녹아 내리면 자동으로 모터(1)가 작동되어 축(31)이 회전되면 회전망(6)과 거름망(7)이 회전되어 녹아버린 PVC가 거름망(7)과 회전망(6)을 거쳐 흘러내리거나 히팅층보호판(99)의 외벽을 타고 아래로 흘러 내려와 바닥(9)의 배출공(11)을 통하여 PVC가 배출된다First, according to the size of the metal, the filter room 7 having a mesh size of the metal can be filtered, and the heating coil 5 is heated. When 130 degrees Celsius before and after the PVC melts, the motor (1) is automatically operated when the shaft 31 is rotated, the rotating mesh (6) and the strainer (7) is rotated melted PVC and the strainer (7) and PVC is discharged through the discharge net 11 of the bottom 9 by flowing down through the rotating net 6 or down the outer wall of the heating layer protection plate 99.

상기한 장치는 상기한 폐잉크다이반도체웨이퍼 뿐만 아니라 다른 전기전자 부품에도 적용 가능하다The above apparatus is applicable to not only the waste ink die semiconductor wafers described above but also other electrical and electronic components.

예를 들어, 컴퓨터 등의 관련 부품에서 금속물질과 합성수지 재료가 함께 부착된 부품들을, 상기와 같은 본 발명에 따른 장치에 투입하여, 가열 및 원심 분리 방식으로 합성수지류와 메탈을 분리하여 낼 수 있어 그 산업적 활용가치가 매우 높다For example, in a related part such as a computer, the metal material and the resin material are attached together to the device according to the present invention as described above, the synthetic resin and the metal can be separated by heating and centrifugal separation method. The industrial utilization value is very high

도 1 은 본 발명에 따른 장치에 대한 개략 구성도1 is a schematic configuration diagram of an apparatus according to the present invention;

Claims (4)

모터(1)와,Motor 1, 모터(1)에 의해 회전력을 전동 받아 회전하는 회전망(6)과,Rotating network (6) which rotates by receiving rotational force by motor (1), 회전망(6) 외주로 둘러 싸는 드럼(3)을 포함하여 구성되며,It consists of a drum (3) surrounding the rotating net (6) outer periphery, 드럼(3) 외부는 단열층(4)이 형성되고,Outside the drum 3 is formed with a heat insulating layer 4, 단열층(4) 안으로는 열코일(5)이 형성된 히팅층(35)이 형성되며, Inside the heat insulation layer 4, a heating layer 35 having a heat coil 5 is formed. 히팅층(35) 안으로는 히팅층보호판(99)이 형성되는 것을 특징으로 하는 폐잉크다이반도체 웨이퍼의 메탈과 PVC 분리 추출장치Separating device for separating metal and PVC from waste ink die semiconductor wafer, characterized in that a heating layer protection plate 99 is formed in the heating layer 35. 제 1 항에 있어서,The method of claim 1, 상기한 드럼(3)의 상부는 덮개(32)가 형성되고, 바닥에는 배출공(11)을 형되며, 측부에는 압력공기배출밸브(23)를 형성하며, 상기한 덮개(32)에는 압력게이지(33), 온도게이지(38)가 설치되어 콘트롤박스(40)와 연결된 것을 특징으로 하는 폐잉크다이반도체 웨이퍼의 메탈과 PVC 분리 추출장치The upper part of the drum (3) is formed with a cover 32, the bottom of the discharge hole 11 is formed, the side portion forms a pressure air discharge valve 23, the cover 32, the pressure gauge (33), the temperature gauge 38 is installed and separated from the metal and PVC extraction device of the waste ink die semiconductor wafer, characterized in that connected to the control box 40 제 1 항에 있어서,The method of claim 1, 상기한 회전망(6) 안쪽으로는 거름망(7)을 설치하는 것을 특징으로 하는 폐잉크다이반도체 웨이퍼의 메탈과 PVC 분리 추출장치Separation and extraction apparatus for metal and PVC of the waste ink die semiconductor wafer, characterized in that the filtering net (7) is installed inside the rotating net (6) 제 1 항에 있어서,The method of claim 1, 상기한 열코일(5)에 의한 히팅층(35)의 가열은 섭씨 120도 - 200도로 가열하는 것을 특징으로 하는 폐잉크다이반도체 웨이퍼의 메탈과 PVC 분리 추출장치Separation extraction device for metal and PVC of the waste ink die semiconductor wafer, characterized in that the heating of the heating layer 35 by the heat coil 5 is heated to 120 degrees-200 degrees Celsius
KR20080002509A 2008-01-09 2008-01-09 Separating device for metal and fibish of waste ink die semiconductor wafer KR100909523B1 (en)

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JPH11156850A (en) 1997-11-27 1999-06-15 Nkk Corp Method for granulating waste plastic film
US20040108281A1 (en) * 2001-03-28 2004-06-10 Heinkel Aktiengesellschaft Invertible filter centrifuge
KR20060129294A (en) * 2003-12-22 2006-12-15 캠브리지 유니버시티 테크니칼 서비스 리미티드 Microwave induced pyrolysis reactor and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11156850A (en) 1997-11-27 1999-06-15 Nkk Corp Method for granulating waste plastic film
US20040108281A1 (en) * 2001-03-28 2004-06-10 Heinkel Aktiengesellschaft Invertible filter centrifuge
KR20060129294A (en) * 2003-12-22 2006-12-15 캠브리지 유니버시티 테크니칼 서비스 리미티드 Microwave induced pyrolysis reactor and method

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