KR100906612B1 - Case of electronic apparatus - Google Patents

Abstract

Disclosed are a case for an electronic device and a method of manufacturing the same, which can reduce cost and improve productivity by simplifying a work process. The electronic device case includes the steps of providing a case body, placing the case body inside the mold, injecting molten resin at high speed between the case body surface and the mold, and solidifying the molten resin to inject a thin film onto the surface of the case body. The layer can be produced by molding in double injection.

Case, double injection, case body, thin film injection layer, mold, temperature control line

Description

Case for electronic equipment {CASE OF ELECTRONIC APPARATUS}

The present invention relates to a case for an electronic device and a method for manufacturing the same, and more particularly, to a case for an electronic device using an ultra-fast dual injection method and a method for manufacturing the same.

In general, the case of the electronic device is used to protect the internal parts from external impact and to prevent foreign substances such as dust from entering the inside while forming an external appearance.

1 is a cross-sectional view showing the structure of a conventional electronic device case.

As shown in FIG. 1, the conventional case includes a case body 10 and a top coat layer 20 and a top coat layer 30 sequentially formed on the surface of the case body 10.

The case body 10 is formed by injection molding, and the undercoat coating layer 20 and the top coating layer 30 are formed by spraying a coating liquid or a coating liquid.

The undercoat coating layer 20 is formed on the surface of the case body 10 to substantially form the background color of the case, and the top coating layer 30 is formed on the surface of the undercoat coating layer 20 of a transparent material and the undercoat coating layer 20. Serves as a protective layer to protect the

However, in the related art, as the undercoat coating layer 20 and the top coating layer 30 constituting the case are each formed in a spray method, the work process is cumbersome and complicated, and thus the manufacturing cost is increased and workability and productivity are deteriorated. There is this.

In addition, in the structure in which the coating layers 20 and 30 are formed in a spray method, there is a problem in that the thickness of each coating layer 20 and 30 is not uniformly formed as a whole, and a large amount of coating liquid or coating liquid is unnecessary. There is a problem that is consumed.

In addition, the conventional case has a problem that when the top coat layer 30 and the bottom coat layer 20 are peeled off during use, the case body 10 having a different background color from the bottom coat layer 20 is directly exposed to the outside and the appearance becomes messy.

The present invention provides a case for a electronic device and a method of manufacturing the same, which can simplify a work process and reduce costs and improve productivity.

In particular, the present invention provides a case for an electronic device and a method of manufacturing the same, which can simplify a work process and reduce manufacturing costs by using an ultra-fast dual injection method.

In addition, the present invention provides a case for an electronic device and a method of manufacturing the same that can keep the appearance of the product neat.

According to a preferred embodiment of the present invention for achieving the above object of the present invention, a method for manufacturing a case for an electronic device is provided by the case body, disposing the case body in the mold, the case body surface and the molten between the mold Injecting the resin at a high speed, and solidifying the molten resin to mold the thin film injection layer on the surface of the case body by double injection.

In the step of injecting the resin at a high speed, the resin may be injected at an injection speed of 1000 to 1500 mm / s, and the thin film injection layer formed by double injection may be molded to a thickness of 0.2 to 0.6 mm.

As the resin, various kinds of resins may be used depending on the required conditions and product specifications. For example, a transparent resin such as an acrylic resin, a polycarbonate resin, or the like may be used. Alternatively, a material for improving the touch, that is, a rubber, urethane, silicone, or the like, which may form a so-called soft feeling (SF) coating layer, may be used.

In the step of injecting and solidifying the resin, a regulator for controlling the temperature of the mold may flow along a temperature control line formed in the mold. The regulator flows along the temperature control line provided along the contour of the molding part inside the mold, allowing the temperature of the mold to be maintained above a certain level when the resin is injected, and lowering the temperature of the mold when the resin is solidified. .

The regulator may be provided at the same temperature while the resin is injected and the resin is solidified, and the temperature conditions of the regulator may be freely changed depending on the type and properties of the resin. In some cases, the regulator may be provided at different temperatures while the resin is injected and while the resin is solidified.

The temperature control line is preferably configured to include a plurality of control lines having different inlets and outlets and arranged on different areas so that the temperature of the mold can be uniformly adjusted as a whole. The number and arrangement of these control lines can also be changed in various ways depending on the requirements.

After the thin film injection layer is formed, a spray coating layer may be formed on the surface thereof by a spray method. In addition, a transfer in mold or a film insert may be provided on the surface of the case body in the process of forming the thin film injection layer.

On the other hand, while the thin film injection layer is molded by ultra-fast double injection, the protective window corresponding to the display unit of the electronic device may be molded together to be integrated with the thin film injection layer. To this end, the case body may be provided in a state including a window hole corresponding to the display unit of the electronic device, and the mold may be provided including a window blocking unit corresponding to the window hole. Therefore, in the step of molding the thin film injection layer by double injection, a protective window corresponding to the window hole may be formed together.

For reference, in the present invention, the electronic device may include all conventional electronic devices with or without a display window. Herein, the display window means a window disposed in front of the display unit for outputting various types of information as image information. For example, an electronic device may include a portable electronic device such as a personal digital assistant (PDA), a smart phone, a handheld PC, a mobile phone, an MP3 player, and the like. Electronic devices such as telephones may also be included.

According to the present invention can simplify the work process of the case, there is an effect that can reduce the cost and improve the productivity.

In particular, according to the present invention, by allowing the high-quality thin film injection layer to be molded by the ultra-fast double injection molding, it is possible to simplify the manufacturing process of the case, and to contribute to cost reduction and productivity improvement.

In addition, according to the present invention can maintain the appearance of the product clean and stable, there is an effect that can provide a consumer satisfaction.

In addition, according to the present invention, since the case can be manufactured by double injection molding, the defective rate can be significantly reduced, and unnecessary consumption of the resin can be prevented.

In addition, according to the present invention, since the thin film injection layer is molded and a protective window for protecting the display unit may be formed together, the manufacturing process may be simplified.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by quoting the contents described in other drawings under the above rules, and the contents repeated or deemed apparent to those skilled in the art may be omitted.

Figure 2 is a block diagram illustrating a method for manufacturing an electronic device according to the present invention, Figure 3 is a cross-sectional view showing the structure of the electronic device case according to the present invention.

4 and 5 are a perspective view and a plan view for explaining the structure of a mold used when manufacturing a case for an electronic device according to the present invention, Figures 6 to 8 is a structure of a case for an electronic device according to another embodiment of the present invention Each is a cross-sectional view.

As shown in these figures, the electronic device case according to the present invention is configured to be molded in ultra-fast double injection molding.

The general injection method (when the injection speed of the resin is around 500mm / s) has a problem that it is difficult to form a very thin film. That is, when molten resin flows into the mold, the fluidity is rapidly lost. If the injection speed of the resin is low, the melt viscosity rapidly decreases in a short time and the short shot and flow cannot completely fill the cavity of the mold. Problems such as a mark, a weld line, a poor surface gloss, and the like occur. Therefore, in order to mold a very thin film through injection molding, a particularly high injection speed and uniform temperature control of the mold are required.

In addition, the thickness of the product to be injection molded in the injection process occupies a large proportion in terms of production efficiency. That is, the thinner the thickness of the product to be injected, the shorter the cooling time. This consequently allows cycle time to be shortened and productivity to be improved. In addition, the reduction in the thickness of the product to be injection-molded can contribute to weight reduction, as well as to reduce the product cost.

Therefore, the present invention is configured so that a high quality thin film can be formed by ultra-fast double injection molding, which will be described in detail below.

As shown in these drawings, the case for an electronic device according to the present invention comprises the steps of providing a case body 110, disposing the case body 110 inside the mold 200, the surface of the case body 110 And injecting the molten resin between the mold 200 at high speed, and solidifying the molten resin to form the thin film injection layer 120 on the surface of the case body 110 by double injection. Can be.

First, the case body 110 is provided. The case body 110 may be formed by molding a conventional plastic resin through a general injection method. In some cases, the case body 110 may be formed of a metal material, or may be manufactured by other processing methods.

Next, the case body 110 is disposed in the mold 200. In this case, the case body 110 is disposed inside the mold 200 such that a predetermined gap is formed between the mold 200 and the surface of the case body 110. In this case, the case body 110 may be disposed inside the mold 200 such that the size of the gap between the surface of the case body 110 and the mold 200 is 0.2 to 0.6 mm.

As a method of disposing the case body 110 inside the mold 200, a conventional insert method may be used. When the insert method is used, the case body may be separately prepared in advance and then disposed in the mold.

Preferably, the case body is molded into the mold through the primary injection to simplify the overall manufacturing process, and then the upper case required for the second injection is replaced without removing the molded case body from the mold. The double injection method can be applied to arrange the body.

Next, the molten resin is injected at high speed into the gap between the surface of the case body 110 and the mold 200. Here, the resin is injected at a high speed means that the resin is injected at an injection speed of 1000 mm / s or more, preferably, the resin is injected at an injection speed of 1000 to 1500 mm / s, and more preferably 1500 to 2000. Resin is injected at an injection rate of mm / s.

As the resin, various kinds of resins may be used depending on the required conditions and product specifications. For example, a transparent resin such as an acrylic resin, a polycarbonate resin, or the like may be used as the resin. Alternatively, as the resin, a material for improving the touch, that is, a rubber, urethane, silicone, or the like, which may form a so-called soft feeling (SF) coating layer, may be used, as well as other opaque resins.

Next, the manufacturing of the case may be completed by solidifying the injected resin and molding the thin film injection layer 120 on the surface of the case body 110 by double injection. That is, in this step, the resin filled in the gap between the surface of the case body 110 and the mold 200 is solidified, so that the thin film injection layer 120 may be integrally formed on the surface of the case body 110 as shown in FIG. 3. have.

As such, the thin film injection layer 120 formed by the ultra-high speed double injection may be molded to a thickness of 0.2 to 0.6 mm, and preferably to a thickness of 0.2 to 0.3 mm.

On the other hand, during the step of double injection molding the thin film injection layer 120, that is, while the resin is injected and solidified for controlling the temperature of the mold 200 along the temperature control line 210 formed inside the mold 200 The regulator can be flowed.

That is, even if the resin is melted at a high temperature and injected into the mold 200 at a high speed, when the temperature of the mold 200 is lowered by a certain level or more, the resin flows between the surface of the case body 110 and the narrow gap between the mold 200. Could quickly lose liquidity. Therefore, when the resin is injected, the temperature of the mold 200 should be maintained at a predetermined level or more so as to prevent a decrease in fluidity of the resin.

In addition, if the temperature of the mold 200 is too high, there is a problem that the cooling time of the resin is longer and the cycle time is longer. Therefore, when the resin is solidified, the temperature of the mold 200 is lowered to shorten the cooling time of the resin. Should be able to give.

4 and 5, the temperature control line 210 may be provided inside the mold 200, and the temperature of the mold 200 may be adjusted along the temperature control line 210. Modifiers can be flowed. As such, the regulator flows along the temperature control line 210 inside the mold 200, and when the resin is injected, the temperature of the mold 200 can be maintained at a predetermined level or higher, and the mold ( 200) can be lowered.

In addition, the regulator may be provided at the same temperature while the resin is injected and solidified. For example, when a polycarbonate-based resin is used as the resin, the regulator may be provided at a temperature of approximately 120 ° C., and the temperature condition of such a regulator may be freely changed according to the type and properties of the resin. In some cases, the regulator may be provided at different temperatures while the resin is injected and while the resin is solidified.

As the regulator, a liquid phase regulator such as cooling water, warm oil, hot water, cooling oil, or the like may be used. Alternatively, a gas phase regulator such as steam may be used. The present invention is not limited or limited by the nature and type of such modulators.

In addition, the temperature control line 210 preferably includes a plurality of control lines having different inlets and outlets and disposed on different regions. In addition, each control line is preferably formed in a curved shape along the contour of the molded part inside the mold (200). In this manner, the regulator is independently flowed through a plurality of specially designed and arranged control lines, and the temperature of the mold 200 can be controlled to be constant throughout, without a local temperature change of the mold 200. In the exemplary embodiment of the present invention, the temperature control line 210 is described with an example including two control lines disposed on different areas, but in some cases, three or more control lines may be provided. The arrangement may also be varied in accordance with the required conditions.

Meanwhile, after the thin film injection layer 120 is molded as illustrated in FIG. 6, the spray coating layer 130 may be formed on the surface of the thin film injection layer 120 by a spray method. The spray coating layer 130 may be formed by a spray method using a conventional spray gun, and formed on the surface of the thin film injection layer 120 to serve as a protective layer for protecting the thin film injection layer 120. It plays a role of maintaining beautiful appearance. The spray coating layer 130 may be formed of a glossy transparent material, alternatively, may be formed of an opaque material having a matte property.

In the above-described and illustrated embodiments of the present invention, the thin film injection layer 120 is directly formed on the surface of the case body 110. However, in some cases, the thin film injection layer 120 may be formed as shown in FIG. The transfer in mold 140 or the film insert may be provided on the surface of the case body 110 before the molding or during the process of forming the thin film injection layer 120.

The transfer in mold 140 or the film insert is interposed between the case body 110 and the thin film injection layer 120 to substantially determine the ground color and ground pattern of the case. The transfer in-mold 140 or the film insert may be coated with a variety of patterns and colors according to the required conditions, and in some cases a three-dimensional pattern may be engraved.

Meanwhile, as shown in FIG. 8, the protective window 122 corresponding to the display unit of the electronic device may be molded together with the thin film injection layer 120 while the thin film injection layer 120 is formed by ultra-high speed double injection. .

To this end, the case body 110 may be provided in a state including a window hole 112 corresponding to the display unit of the electronic device, and the mold 200 may include a window blocking unit corresponding to the window hole 112 ( 220) may be provided. Therefore, in the molding of the thin film injection layer 120 by double injection, the protective window 122 corresponding to the window hole 112 may be formed together.

Conventionally, the protective window 122 for protecting the display unit of the electronic device had to be manufactured and attached separately, but according to the present invention, since the protective window 122 may be formed at the same time as the thin film injection layer 120 is formed, the manufacturing process It can simplify the cost and reduce the cost.

As described above, although described with reference to the preferred embodiment of the present invention, those skilled in the art various modifications and variations of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

1 is a cross-sectional view showing the structure of a conventional electronic device case.

2 is a block diagram illustrating a method for manufacturing a case for an electronic device according to the present invention.

3 is a cross-sectional view showing the structure of a case for an electronic device according to the present invention.

4 and 5 are a perspective view and a plan view for explaining the structure of a mold used when manufacturing a case for an electronic device according to the present invention.

6 to 8 are cross-sectional views each showing a structure of a case for an electronic device according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

110: case body 112: window hole

120: thin film injection layer 122: protective window

130: spray coating layer 140: transfer in mold

200: mold 210: temperature control line

220: window blocking unit

Claims (6)

In the case for an electronic device having a display unit for outputting image information, A case body having a window hole for exposing the display unit to the outside and formed by injection molding; And The case body is placed inside the mold such that a void is formed between the outer surface of the case body and the inner wall of the mold, and the molten resin is 1000 to 1500 mm / s at the air gap between the case body outer surface and the mold. And a thin film injection layer formed integrally with the outer surface of the case body by solidification of the injected resin, and having a thickness of 0.2 to 0.6 mm. The thin film injection layer has an external appearance and is formed to have the same thickness as a whole, and the thin film injection layer has a protective window for covering an exposed surface of the display unit exposed through the window hole. The method of claim 1, The thin film injection layer is an electronic device case, characterized in that formed of a transparent resin. The method of claim 1, The thin film injection layer is an electronic device case, characterized in that formed of at least one of rubber, urethane and silicon. The method of claim 1, Case for an electronic device, characterized in that further comprising a spray coating layer formed on the surface of the thin film injection layer by a spray method. The method of claim 1, And a transfer in-mold or film insert interposed between the case body and the thin film injection layer. delete

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