KR100903626B1 - 건식 식각 장치 - Google Patents
건식 식각 장치 Download PDFInfo
- Publication number
- KR100903626B1 KR100903626B1 KR1020070132699A KR20070132699A KR100903626B1 KR 100903626 B1 KR100903626 B1 KR 100903626B1 KR 1020070132699 A KR1020070132699 A KR 1020070132699A KR 20070132699 A KR20070132699 A KR 20070132699A KR 100903626 B1 KR100903626 B1 KR 100903626B1
- Authority
- KR
- South Korea
- Prior art keywords
- handler
- process chamber
- stage
- electrode
- lift member
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (7)
- 건식 식각 분위기를 형성하는 공정 챔버;상기 공정 챔버의 내측 상부에 구비되는 스테이지 및 제1 전극;상기 제1 전극에 마주하여 플라즈마를 발생시키도록 상기 공정 챔버의 내측 하부에 구비되는 제2 전극;상기 공정 챔버의 일측에 형성되는 투입구를 통하여 상기 제1 전극 및 상기 제2 전극 사이에 피식각체를 투입하여 상기 피식각체의 하면을 건식 식각하고, 공정 후, 상기 피식각체를 인출하는 핸들러; 및상기 핸들러에 놓인 상기 피식각체를 상승시켜 상기 스테이지에 밀착시키고, 공정 후, 상기 스테이지에 장착된 상기 피식각체를 상기 핸들러에 내려 놓는 리프트 부재를 포함하고,상기 핸들러는,상기 피식각체의 외곽에 대응하여 형성되는 링부, 및상기 링부에서 중심부로 돌출되어 상기 피식각체를 지지하는 지지부를 포함하는 건식 식각 장치.
- 삭제
- 제1 항에 있어서,상기 지지부는,상기 링부의 상면보다 낮은 상면을 가지는 건식 식각 장치.
- 제1 항에 있어서,상기 지지부는,상기 링부의 전체 둘레 중 일부에 대응하여 형성되는 건식 식각 장치.
- 제4 항에 있어서,상기 리프트 부재는,상기 지지부들 중 서로 이웃하는 상기 지지부들 사이에 대응하여 배치되는 건식 식각 장치.
- 제1 항에 있어서,상기 피식각체는 중앙 부분의 식각 대상부와 상기 식각 대상부를 둘러싸는 비식각 대상부로 구획되며,상기 리프트 부재는,상기 비식각 대상부에 대응하여 배치되는 복수로 형성되는 건식 식각 장치.
- 제1 항에 있어서,상기 지지부 상에서 상기 링부의 내면은 상기 피식각체의 외곽 둘레와의 사이에 간격을 유지하는 건식 식각 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070132699A KR100903626B1 (ko) | 2007-12-17 | 2007-12-17 | 건식 식각 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070132699A KR100903626B1 (ko) | 2007-12-17 | 2007-12-17 | 건식 식각 장치 |
Publications (1)
Publication Number | Publication Date |
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KR100903626B1 true KR100903626B1 (ko) | 2009-06-18 |
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ID=40982942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020070132699A KR100903626B1 (ko) | 2007-12-17 | 2007-12-17 | 건식 식각 장치 |
Country Status (1)
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KR (1) | KR100903626B1 (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060098046A (ko) * | 2005-03-08 | 2006-09-18 | 삼성전자주식회사 | 플라즈마 식각 장비 |
KR20070015757A (ko) * | 2005-08-01 | 2007-02-06 | 주식회사 에이디피엔지니어링 | 플라즈마 처리방법 |
KR20070066390A (ko) * | 2005-12-22 | 2007-06-27 | 주식회사 래디언테크 | 플라즈마 처리 장치 및 방법 |
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2007
- 2007-12-17 KR KR1020070132699A patent/KR100903626B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060098046A (ko) * | 2005-03-08 | 2006-09-18 | 삼성전자주식회사 | 플라즈마 식각 장비 |
KR20070015757A (ko) * | 2005-08-01 | 2007-02-06 | 주식회사 에이디피엔지니어링 | 플라즈마 처리방법 |
KR20070066390A (ko) * | 2005-12-22 | 2007-06-27 | 주식회사 래디언테크 | 플라즈마 처리 장치 및 방법 |
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